US20050241806A1 - Radiator plate rapid cooling apparatus - Google Patents

Radiator plate rapid cooling apparatus Download PDF

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Publication number
US20050241806A1
US20050241806A1 US10834913 US83491304A US2005241806A1 US 20050241806 A1 US20050241806 A1 US 20050241806A1 US 10834913 US10834913 US 10834913 US 83491304 A US83491304 A US 83491304A US 2005241806 A1 US2005241806 A1 US 2005241806A1
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Prior art keywords
radiator plate
passages
cooling apparatus
rapid cooling
base deck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US10834913
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US6966359B1 (en )
Inventor
I-Ming Liu
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THERMASOL TECHNOLOGY Co Ltd
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I-Ming Liu
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A radiator plate rapid cooling apparatus includes a base deck and radiation fins located thereabove formed integrally by extrusion, forging or soldering. The base deck is located at the bottom end of the radiator plate and has passages formed by machining that house a capillary device placed therein or integrally formed by extrusion to become a double-layer passage loop. After being vacuumized, the loop is filled with a liquid or gas heat dissipation medium to the amount of 10% to 70% of the internal volume capacity of the passages. The base deck is in contact with a contact surface of a computer heat generating element. Heat may be concentrated on a heat absorption end of the base deck, transferred to the radiation fins, and be dispelled by a fan to improve heat dissipation.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a radiator plate rapid cooling apparatus adopted for use on personal or notebook computers, projectors and plasma television sets and the like that have heat generating sources.
  • BACKGROUND OF TILE INVENTION
  • Nowadays computer applications have been widely adopted in almost every aspect of people's life. With the data processing speed of the computer increased constantly, heat generated by computer elements during operation also increases. Timely heat dissipation has become an issue that must be resolved satisfactorily for normal computer operation. The radiator for the present personal or notebook computer that is widely used today generally includes a metal base deck with a plurality of fin type radiator plates mounting thereon in an upright manner. The lower side of the base deck is a flat surface. For installation, the radiator is coupled on a computer heat generating element by means of an eccentric fixture to make the lower flat surface in contact tightly with the heat generating element. A radiation fan is mounted above the radiator plates. When the computer is in operation, according to heat transfer principle, the heat generated by the computer element passes through the flat contact surface of the radiator to the base deck and the radiator plates, and the fan generates airflow to carry the heat away. Such a heat dissipation method is simply based on metal heat conduction. Heat dissipation efficiency depends on the heat conductive capability of the material that forms the radiator. As the solid substance has limited heat transfer capability, heat dissipation effect of the conventional radiators also is limited.
  • SUMMARY OF THE INVENTION
  • In view of the aforesaid disadvantages occurred to the conventional radiators that have limited heat dissipation capability, the present invention aims to provide a radiator plate structure to improve heat dissipation effect. The radiator plate structure according to the invention includes a base deck and radiation fins that may be fabricated and connected together, or the base deck may be used independently.
  • The main features of the invention are on the base deck and the radiation fins. They may be integrally formed by extrusion, forging or soldering. The base deck at the bottom end of the radiator plate has passages formed by machining. The passages house a capillary means which is integrally formed to become a double-layer passage loop. After being vacuumed, the loop is filled with a liquid or gas heat dissipation medium to the amount about 10% to 70% of the internal volume capacity of the passages. Thus heat may concentrate on a heat absorption end of the base deck and pass through the radiation fins and be dispelled by the fan to achieve heat dissipation effect.
  • Compared with the conventional radiators, the invention can achieve a lot of advantages, notably:
  • The base deck at the bottom end of the radiator plates has loops consisting of double-layer passages that contain integrated capillary means formed by extrusion or placed therein. And a liquid or gas heat dissipation medium is filled in the loop. The heat dissipation medium can be transformed from liquid phase to vapor phase and to the liquid phase again. And during this cyclical phase transformation the heat dissipation medium absorbs heat, releases heat and absorbs heat again. The contact surface of the base deck of the radiator plates can absorb operation heat of the computer elements and release the heat to the radiation fins. Thus heat dissipation capability of the radiator plates improves, and heat dissipation efficiency of the radiator plates increases.
  • The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1A is an exploded view of a first embodiment of the present invention.
  • FIG. 1B is a cross section taken on line 1B-1B in FIG. 1A.
  • FIG. 2 is a schematic view of circulating heat dissipation of the heat dissipation medium according to FIG. 1A.
  • FIG. 3 is a schematic view of heat dissipation medium circulation according to a second embodiment of the invention.
  • FIG. 4 is an exploded view of a third embodiment of the present invention.
  • FIG. 5 is an exploded view of a fourth embodiment of the present invention.
  • FIG. 6 is an exploded view of a fifth embodiment of the present invention.
  • FIG. 7 is a schematic view of heat dissipation medium circulation according to a sixth embodiment of the invention.
  • FIG. 8 is a schematic view of heat dissipation medium circulation according to a seventh embodiment of the invention.
  • FIG. 9 is a schematic view of an eighth embodiment of the invention coupled in series.
  • FIG. 10 is a schematic view of a ninth embodiment of the invention coupled in series.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please referring to FIGS. 1A and 1B, the radiator plate 1 according to the invention includes a base deck 10 and radiation fins 11 located above the base deck 10 that are integrally formed from aluminum or copper by extrusion, forging or soldering. The base deck 10 has passages 102 formed therein. The passages 102 house a capillary means 12 that is integrally formed with the passages by extrusion to become a double-layer passage loop. The radiator plate 1 thus formed may be used on personal or notebook computers, projectors and plasma television sets and the like that have heat generating sources for heat dissipation.
  • The base deck 10 is in contact with a heat generating element of the computer to absorb heat. The passages 102 in the base deck 10 are formed by machining to become a closed loop. The passages 102 house the integrated capillary means 12 that is formed by extrusion or placed therein. In addition, the base deck 10 and the radiation fins 11 may be coupled to become one body for use. It also may be used independently on a small computer element.
  • The radiation fins 11 are mounted on the base deck 10 which has a heat absorption end to transfer heat to the radiation fins 11, then the heat is dispelled by a fan.
  • The capillary means 12 is integrally formed with the passages 102 of the base deck 10 by extrusion. The capillary means 12 includes a circular tube 120 with at least one spacer 121 formed on the periphery. The capillary means 12 may be cut to a selected length to suit different computer elements.
  • Referring to FIG. 2, the passages 102 in the base deck 10 house the extruded capillary means 12 therein to form a double-layer passage loop. Each of the passages 102 has exits on both ends sealed respectively by a plug 103 so that the passage 102 forms a closed loop. After being vacuumized, the passages 102 are filled with a liquid or gas heat dissipation medium 101 to the amount of 10% to 70% of the internal volume capacity of the passages 102 (indicated by arrows in FIG. 2).
  • The radiator plate 1 has a flat surface in intimate contact with a computer element (or other heat generating element) after installation. Heat generated by the computer element during operation passes through the contact surface to the radiator plate 1. On the one hand, the base deck 10 transfers the heat by conduction to the radiation fins 11. On the other hand the heat dissipation medium 101 contained in the passages 102 absorbs heat from the high temperature contact surface and is transformed from liquid phase to vapor phase, and absorbs the heat transferred from the computer element (or other heat generating element). The vapor phase heat dissipation medium 101 is cooled by the lower temperature radiation fins 11 and transformed from the vapor phase to the liquid phase and releases heat to the radiation fins 11. Thus the heat dissipation medium 101 repeatedly goes through the phase transformation cycle of liquid phase-vapor phase-liquid phase to perform heat transfer process of heat absorption-heat release-heat absorption again. Finally the fan generates airflow to dispel the heat from the radiation fins 11. The process set forth above provides double heat dissipation and can greatly improve heat dissipation efficiency of the radiator plate 1.
  • Refer to FIG. 3 for another embodiment of the invention. It is largely, like the one shown in FIG. 1A. The difference is that the passages 102 a in the base deck 10 a are formed longitudinally by extrusion. They also contain integrated capillary means 12 a formed by extrusion. And the exit ends of the passages 102 a are sealed by plugs 103 a.
  • Refer to FIG. 4 for yet another embodiment of the invention. It is largely like the one shown in FIG. 1A. The difference is that the passages 102 b in the base deck 10 b are formed by machining to contain integrated capillary means 12 b formed by extrusion (or mesh and barrel type capillary means 12 b′ as shown in FIG. 5) to become a double-layer passage loop, and the exit ends of the passages 102 b are sealed by plugs 103 b.
  • Refer to FIG. 6 for still another embodiment of the invention. It is largely like the one shown in FIG. 4. The difference is that the radiator plate 1 c has a base deck 10 c of the same height as that shown in FIG. 4, the radiation fins 11 c are formed with different heights and density according to the space size available around the heat generating element. The base deck 10 c further has longitudinal passages 104 c on two sides of the passages 102 c that contain a partition plate 105 c with a plurality of conical and staggered spacers 106 c located thereon to partition the passages 102 c to become a single loop.
  • Refer to FIG. 7 for another embodiment of the invention. It is largely like the one shown in FIG. 1A. The difference is that the base deck 10 d at the bottom end of the radiator plate id contains reciprocal passages 102 d formed by machining or extrusion that have two ends communicating with one another. Each reciprocal passage 102 d contains an integrated capillary means 12 d placed therein or formed by extrusion. The exits of the reciprocal passages 102 d are sealed by plugs 103 d. After being vacuumed, the passages 102 d are filled with the heat dissipation medium 101 (shown by arrows in FIG. 7) to the amount of 10% to 70% of the internal volume capacity of the reciprocal passages 102 d.
  • Refer to FIG. 8 for another embodiment of the invention. It is largely like the one shown in FIG. 7. The difference is that the base deck 10 e at the bottom end of the radiator-plate 1 e contains reciprocal passages 102 e formed by machining or extrusion that have two ends communicating with one another. Each reciprocal passage 102 e contains an integrated capillary means 12 e placed therein or formed by extrusion. There are longitudinal passages 104 e on two sides of the passages 102 e that contain a partition plate 105 e with a plurality of conical and staggered spacers 106 e located thereon to partition the reciprocal passage 102 e to become a single loop. The exit ends of the passages are sealed by plugs 103 e. After being vacuumized, the reciprocal passages 102 e are filled with the heat dissipation medium 101 (shown by arrows in FIG. 8) to the amount of 10% to 70% of the internal volume capacity of the reciprocal passages 102 e.
  • Refer to FIG. 9 for another embodiment of the invention. It is largely like the one shown in FIG. 1A. The difference is that the base deck 10 f has an exit connection end and an inlet connection end to couple with the passages, and other end to connect to an external heat exchange circulation system to form an open loop 10 f. Depending on the space available on the heat generation source, two or more base decks 10 f may be coupled in series to form an open loop.
  • Refer FIG. 10 for another embodiment of the invention. It is largely like the one shown in FIG. 1A. The difference is that the base deck 10 g has transverse passages 104 g located on two sides of longitudinal passages 100 g that communicate with one another. And each of the transverse passages 104 g contains a partition plate 105 g with a plurality of conical and staggered spacers 106 g located thereon. Depending on space available on the heat generation source, two or more base decks 10 g may be coupled in series to form a single loop of closed passages.

Claims (17)

  1. 1. A radiator plate rapid cooling apparatus comprising a base deck and radiation fins located above the base deck, the base deck having passages formed therein that contain a capillary means formed by extrusion to form a closed loop of double-layer passages, the closed loop being vacuumized and filled with a heat dissipation medium, the base deck having a heat absorption end to transfer heat to the radiation fins located thereabove to allow the heat to be dispelled by a fan to achieve heat dissipation effect, the passages are reciprocal and have two ends which communicate with one another and house the capillary means which is placed therein or formed by integrated extrusion.
  2. 2. The radiator plate rapid cooling apparatus of claim 1, wherein the radiator plate is adopted for use on personal or notebook computers, projectors and plasma television sets and other devices that have heat generating sources.
  3. 3. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck and the radiation fins are formed in an integrated manner by extrusion, forging or soldering.
  4. 4. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck and the radiation fins are selectively made from aluminum or copper.
  5. 5. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck is mountable independently on a heat generating element.
  6. 6. The radiator plate rapid cooling apparatus of claim 1, wherein the capillary means has a round tube in the center with spacers formed on the periphery thereof.
  7. 7. The radiator plate rapid cooling apparatus of claim 1, wherein the heat dissipation medium is selectively liquid or gas.
  8. 8. The radiator plate rapid cooling apparatus of claim 1, wherein the heat dissipation medium is filled to the amount of 10% to 70% of the internal volume capacity of the passages.
  9. 9. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck has longitudinal passages formed therein.
  10. 10. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck is located on the bottom end of the radiator plate and has the passages formed therein, the passages housing the capillary means which is placed therein or formed by integrated extrusion to form a loop of double-layer passages.
  11. 11. The radiator plate rapid cooling apparatus of claim 10, wherein the capillary means is formed in a mesh and barrel fashion.
  12. 12. The radiator plate rapid cooling apparatus of claim 10, wherein the radiator plate includes a base deck of a same height and radiation fins of varying heights and densities according to the space size of a heat generating source.
  13. 13. (canceled)
  14. 14. The radiator plate rapid cooling apparatus of claim 1, further having longitudinal passages located at two ends of the reciprocal passages, the longitudinal passages housing a partition plate to partition the reciprocal passages to become a single loop.
  15. 15. The radiator plate rapid cooling apparatus of claim 14, wherein the partition plate is made by integrated plastic injection and has conical spacers formed on the periphery thereof.
  16. 16. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck has an exit connection end an inlet connection end that have one end connecting to the passage and other end connecting to an external heat exchange circulation system to form an open loop being connectable in series.
  17. 17. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck is coupled in series to form a closed loop and has transverse passages containing a partition plate to form a single loop.
US10834913 2004-04-30 2004-04-30 Radiator plate rapid cooling apparatus Expired - Fee Related US6966359B1 (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010081475A2 (en) * 2009-01-13 2010-07-22 Noise Limit Aps Evaporator, cooling device and method of manufacture
US20120138281A1 (en) * 2010-12-06 2012-06-07 Transistor Devices, Inc. D/B/A Tdi Power Heat Exchanger for Electronic Assemblies
CN102970849A (en) * 2011-08-31 2013-03-13 株式会社安川电机 Electronic component cooling unit and power converting device
CN103509124A (en) * 2012-06-14 2014-01-15 河南永昌飞天淀粉糖有限公司 New dextrin drying tower tail gas recovery process
EP2687319A1 (en) * 2012-01-05 2014-01-22 Huawei Technologies Co., Ltd. Gravity circuit heat pipe radiator, condenser and preparation process
US9295185B2 (en) 2013-03-13 2016-03-22 Transistor Devices, Inc. Sealed enclosure for power electronics incorporating a heat exchanger
US20160216048A1 (en) * 2015-01-28 2016-07-28 Cooler Master Co., Ltd. Liquid cooling heat sink structure and cooling circulation system thereof
US9445526B2 (en) 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
US9516794B2 (en) 2014-10-31 2016-12-06 Transistor Devices, Inc. Modular scalable liquid cooled power system
US20170146300A1 (en) * 2014-06-19 2017-05-25 Flint Engineering Ltd. Heat Transfer Apparatus
US9980415B2 (en) 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling

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US7212406B2 (en) * 2004-09-01 2007-05-01 Rockwell Automation Technologies, Inc. Cooling of electrical components with split-flow closed-end devices
JP4080479B2 (en) * 2004-11-03 2008-04-23 福華電子股▲ふん▼有限公司 Cooler liquid-cooling type cooling device
US20070285894A1 (en) * 2006-04-25 2007-12-13 Mehdi Hatamian Heat sink
US20080035310A1 (en) * 2006-08-09 2008-02-14 Hul-Chun Hsu Isothermal Plate Module
EP2124008A1 (en) * 2006-12-19 2009-11-25 Taiyo Nippon Sanso Corporation Heat exchanger
US7712325B2 (en) * 2007-08-18 2010-05-11 Leonid A Shapiro Modular semi-conservative and self-scaling electronics cooling system
US8081462B2 (en) 2007-09-13 2011-12-20 Rockwell Automation Technologies, Inc. Modular liquid cooling system
US8919426B2 (en) * 2007-10-22 2014-12-30 The Peregrine Falcon Corporation Micro-channel pulsating heat pipe
CN101754654A (en) * 2008-12-08 2010-06-23 富准精密工业(深圳)有限公司;鸿准精密工业股份有限公司 Heat transfer substrate and heat dissipation device provided with same
US8960038B2 (en) * 2011-10-01 2015-02-24 Hiwin Technologies Corp. Motion transmission module with a cooling device
US20130081497A1 (en) * 2011-10-01 2013-04-04 Yueh-Ling Chiu Motion transmission module with a cooling device
US20130180688A1 (en) * 2012-01-16 2013-07-18 Cooler Master Co., Ltd. Heat-dissipating module and method for manufacturing the same
US20150237762A1 (en) * 2014-02-20 2015-08-20 Raytheon Company Integrated thermal management system

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010081475A3 (en) * 2009-01-13 2010-12-16 Noise Limit Aps Evaporator, cooling device and method of manufacture
WO2010081475A2 (en) * 2009-01-13 2010-07-22 Noise Limit Aps Evaporator, cooling device and method of manufacture
US20120138281A1 (en) * 2010-12-06 2012-06-07 Transistor Devices, Inc. D/B/A Tdi Power Heat Exchanger for Electronic Assemblies
CN102970849A (en) * 2011-08-31 2013-03-13 株式会社安川电机 Electronic component cooling unit and power converting device
EP2687319A1 (en) * 2012-01-05 2014-01-22 Huawei Technologies Co., Ltd. Gravity circuit heat pipe radiator, condenser and preparation process
EP2687319A4 (en) * 2012-01-05 2015-05-20 Huawei Tech Co Ltd Gravity circuit heat pipe radiator, condenser and preparation process
CN103509124A (en) * 2012-06-14 2014-01-15 河南永昌飞天淀粉糖有限公司 New dextrin drying tower tail gas recovery process
US9295185B2 (en) 2013-03-13 2016-03-22 Transistor Devices, Inc. Sealed enclosure for power electronics incorporating a heat exchanger
US20170146300A1 (en) * 2014-06-19 2017-05-25 Flint Engineering Ltd. Heat Transfer Apparatus
US9516794B2 (en) 2014-10-31 2016-12-06 Transistor Devices, Inc. Modular scalable liquid cooled power system
US9445526B2 (en) 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
US20160216048A1 (en) * 2015-01-28 2016-07-28 Cooler Master Co., Ltd. Liquid cooling heat sink structure and cooling circulation system thereof
US9980415B2 (en) 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling

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