CN105916359A - Spontaneous heating electric heat dissipating device for electronic device and optimization method therefor - Google Patents

Abstract

The invention relates to a spontaneous heating electric heat dissipating device for an electronic device and an optimization method therefor. The electric heat dissipating device comprises a heat pipe, a heat pipe evaporation end substrate, a heat pipe condensation end substrate and a fan, wherein the heat pipe is mounted between the heat pipe evaporation end substrate and the heat pipe condensation end substrate; heat dissipation fins are respectively mounted on the heat pipe evaporation end substrate and the heat pipe condensation end substrate, the heat dissipation fins on the heat pipe evaporation end substrate and the heat dissipation fins on the heat pipe condensation end substrate are arranged in a staggered manner, the heat pipe evaporation end substrate is connected with a thermoelectric power generation sheets that are connected with the electronic device via a heat extension block, refrigeration sheets are inlaid on the heat pipe condensation end substrate and are electrically connected with a control device, and the control device is electrically connected with the thermoelectric power generation sheets and the fan. Via use of the spontaneous heating electric heat dissipating device and the optimization method therefor, heat dissipation can be accelerated, temperature of cold sides of refrigeration sheets can be lowered, heat bridge phenomena can be effectively prevented via the refrigeration sheets, heat dissipating effects can be improved, and convenience of installation as well as marked dissipating effects are realized.

Description

Electronic equipment spontaneous-heating type electric radiator and optimization method thereof

Technical field

The invention belongs to technical field of electronic equipment, relate to a kind of electronic device heat abstractor, specifically, relate to a kind of energy Reach spontaneous driving the electric radiator accurately lowered the temperature and optimization method thereof.

Background technology

Along with the fast development of encapsulation electronic technology, various electronic device products (such as: CPU, LED, sensor etc.) present Going out miniaturization, integrated development trend, the heat flow density causing electronic device is increasing.Electronic device normally works Reliability the most sensitive to temperature, research shows, electronic device more than 55% damages and all causes due to temperature change, Meanwhile, electronic device material often raises 10 DEG C, and the reliability of electronic device just reduces by 2%.As can be seen here, electronic device is to work The requirement making temperature is the strictest.Owing to people are increasing to the demand of electronic device commodity, the development of high hot-fluid device increases The probability that electronic device is lost because temperature is too high, to further result in electronic device product can not effectively work.At present, electronics Device is widely used in the every field such as automobile, space flight, military affairs, therefore, it is necessary to consider the thermal design aspect requirement of electronic device To ensure the normal work of electronic device.

Electronic-device radiator both domestic and external mostly is air-cooled radiator and water-filled radiator, also has some by cooling piece and water-cooled, wind The heat abstractor of cold combination, has good radiating effect.But, above-mentioned electronic-device radiator is active heat radiation side Formula, needs outside energy to drive, and outwardly discharges substantial amounts of heat, has both caused the secondary of heat to waste, and may produce again heat Pollute.Additionally, due to heat-sinking capability is limited, the electronic device excessive for some heat flow densities cannot meet cooling requirements.

Spontaneous-heating type heat dissipation technology is to utilize the heat energy of electronic device itself to be converted into electric energy, and electrical energy drive spreads thermal work, tool Respond fast, energy-conserving and environment-protective and the strong advantage of temperature control effect ability.Spontaneous-heating type electric radiator technology is by thermo-electric generation sheet and electricity Sub-device heating source is connected, and forms the temperature difference at the two ends of thermo-electric generation sheet, generating sheet absorb from hot junction generating after heat store or Person resupplies heat abstractor.When utilizing this technology to dissipation from electronic devices, owing to energy source is in electronic device itself, a side Wearing away the heat energy of high-temperature electronic device and realize cooling, on the other hand from the perspective of energy, heat energy is converted to electric energy, subtracts The little thermal pollution discharged into the atmosphere because of heat, serves positive impetus to energy-saving and emission-reduction cause.

Existing spontaneous-heating type radiator, converts heat energy into electric energy owing to thermo-electric generation sheet directly contacts with electronic device, can shape Become heat bridge phenomenon to reduce generating efficiency, and only with heat pipe or fin during heat radiation, need to consume external energy at radiation processes, Radiating effect is the most notable.

Authorization Notice No. is that the Chinese utility model patent of CN 203014716 U discloses a kind of high heat flux device waste-heat power generation Device, including high heat flux heater members 1, soaking plate 2, temperature-difference power generation module 3, heat-pipe radiator 4 and battery 5, its Middle high heat flux heater members 1 is arranged on below soaking plate 2 and is in close contact with soaking plate 2；Described thermo-electric generation mould Block 3 is arranged on the top of soaking plate 2；The evaporation ends of described heat-pipe radiator 4 is closely coupled with temperature-difference power generation module 3, heat Tube radiator 4 condensation end is arranged in the environment, and uses fin mode enhanced heat exchange.This Patent design has temperature-difference power generation module, Being connected with high heat flux heater members by soaking plate, convert heat into electric energy and store, the electric energy after storage can be sharp again With, the used heat flowing through semi-conductor thermo-electric generation module 3 is real by arranging after the evaporation ends of heat-pipe radiator 4, condensation end in air The function of existing waste heat discharge.The heat-pipe radiator used in this patent is to form combined by a series of single parallel heat pipes, heat pipe Version is capillary heat pipe, gravity assisted heat pipe, pulsating heat pipe, at the condensation end of heat pipe equipped with enhanced heat exchange fin, although can Realize the function of heat radiation, but its radiating effect is the most notable.

Need not external energy accordingly, it is considered to design a kind of not only having can guarantee that, but also the spontaneous-heating type radiator of heat-sinking capability can be increased, Realize the heat radiation to high hot-fluid electronic equipment.

Summary of the invention

Present invention aims to that the radiating effect that existing radiating device for electronic equipment exists is poor, cause secondary waste etc. above-mentioned Problem, it is provided that a kind of electronic equipment spontaneous-heating type electric radiator and optimization method thereof.The heat utilizing electronic equipment generates electricity, Power to cooling piece and fan, both can guarantee that and need not external energy, can increase again and spread heat energy power, good heat dissipation effect, decrease Secondary is wasted.

According to one embodiment of the invention, it is provided that a kind of electronic equipment spontaneous-heating type electric radiator, including heat pipe, heat pipe evaporation End group plate, condensation end of heat pipe substrate and fan, heat pipe is installed between heat pipe evaporation ends substrate and condensation end of heat pipe substrate, heat pipe Evaporation ends substrate connects thermo-electric generation sheet, and thermo-electric generation sheet is connected with electronic equipment by hot extension block, condensation end of heat pipe substrate Upper connection has cooling piece, one end that cooling piece is connected with condensation end of heat pipe substrate to be referred to as the cold end of cooling piece, and the other end of cooling piece claims For cooling piece hot junction, heat pipe evaporation ends substrate and cooling piece hot junction are mounted on radiating fin, the heat radiation on heat pipe evaporation ends substrate Radiating fin on fin and cooling piece hot junction is interlaced arrangement；Cooling piece is electrically connected with controller, controller respectively with the temperature difference Generating sheet and fan electrical connection.When electronic equipment temperature is too high, heat is passed to one end of thermo-electric generation sheet by hot extension block, The two ends making thermo-electric generation sheet form the temperature difference, produce electric energy, and electric energy is transferred to controller, controller supply to cooling piece and fan Electricity, cooling piece quickening heat transmission in heat pipe, fan produces air-flow and takes away the heat in radiating fin, it is ensured that heat energy Enough it is pulled away rapidly.Radiating fin is interlaced arrangement, effectively expands heat exchange area, strengthens heat transfer effect.

Further, in the electric radiator provided according to the above embodiment of the present invention, described heat pipe is provided with one or more, When heat pipe is provided with multiple, multiple heat pipes are arranged side by side, and the radiating fin that adjacent heat pipe is corresponding is interlaced arrangement, it is simple to heat radiation.

Further, for the ease of heat pipe and the connection of controller, in the electric radiator provided according to the above embodiment of the present invention, Described electric radiator is additionally provided with for connecting heat pipe and the connecting plate for static controller.

As preferably, in the electric radiator provided according to the above embodiment of the present invention, heat pipe is set to U-tube, heat pipe curved Tube portion is embedded on connecting plate.

As preferably, in the electric radiator provided according to the above embodiment of the present invention, controller is fixed on the bottom of connecting plate.

Further, in the electric radiator provided according to the above embodiment of the present invention, controller connects thermocouple wire, thermoelectricity Amphitene is installed between hot extension block and electronic equipment.When electronic equipment temperature is too high exceed limiting temperature time, thermocouple wire can be by Temperature information is transferred to controller, and controller is started working according to temperature information, thus carries out temperature control.

As preferably, in the electric radiator provided according to the above embodiment of the present invention, fan is fixed on hot extension block and heat pipe cold On solidifying end group plate.

As preferably, in the electric radiator provided according to the above embodiment of the present invention, described radiator is additionally provided with thermal insulation board, heat Pipe evaporation ends substrate and condensation end of heat pipe substrate are installed on thermal insulation board, it is to avoid heat radiation.

According to one embodiment of the invention, it is provided that the optimization method of a kind of electronic equipment spontaneous-heating type electric radiator, the steps include: Under conditions of electronic equipment surface fixed temperature or fixing heat dissipation capacity, optimize cooling piece hot junction by optimizing formula (1)-(8) Heat transfer property parameter UA, condensation end of heat pipe substrate area thickness is than f, fan inlet flow V, described condensation end of heat pipe substrate Area x thickness is defined as A than f_e/L_e, wherein, A_eRepresent the surface area of condensation end of heat pipe substrate, L_eRepresent condensation end of heat pipe substrate Thickness, the expression formula of described optimization formula (1)-(8) is as follows:

$COP=\frac{{\mathrm{K\ϵQ}}_C}{S^2{I}^2{T}_{hc}-\frac{1}{2}{\mathrm{SI}}^{3}R-SI\[SI(1-{\mathrm{\σ}}_{TE})(\frac{1}{M_{hc}{C}_{hc}}+R_c)+1\]Q_C+{\mathrm{KI}}^{2}R}---\left(2\right)$

T_hs=Qc (R_hp+R_ex+2R_int)+T_hc (4)

$\begin{array}{ccc}{R}_c=(\frac{L_e}{K_e{A}_e}+R_{\mathrm{int}})& (1-{\mathrm{\σ}}_{ex})=(\frac{1}{K_{e}f}+R_{\mathrm{int}})& (1-{\mathrm{\σ}}_{ex})\end{array}---\left(5\right)$

${\mathrm{\ϵ}}_h=1-\exp (-\frac{U_h{A}_h}{C_h})---\left(7\right)$

C_h=c ρ V (8)

In formula, Q_CRepresenting the refrigerating capacity of the cold end of cooling piece, COP represents the radiating efficiency in cooling piece hot junction, T_hcRepresent condensation end of heat pipe Substrate surface temperature, K, S, R represent the thermal conductivity of cooling piece, Seebeck coefficient, resistance respectively, and I represents the control of cooling piece Electric current, U_hA_hRepresent the heat transfer property parameter in cooling piece hot junction, C_hRepresent air specific heat capacity parameter, M_hc、C_hcRepresent heat respectively The quality of pipework condensation end group plate and thermal content parameter, ε,Represent the efficiency parameters of efficiency elements method, σ_TE、σ_exRepresent respectively Cooling piece loss coefficient, cooling piece warm end losses coefficient, R_cRepresent the thermal resistance between the cold end of cooling piece and condensation end of heat pipe substrate, T_inRepresent wind inlet of fan temperature, T_hsRepresent the temperature on electronic equipment surface, R_hpRepresent heat pipe thermal resistance, R_exRepresent hot extension block Thermal resistance, R_intRepresent thermal contact resistance, K_eRepresenting the thermal conductivity factor of condensation end of heat pipe substrate, c, ρ, V represent air respectively Specific heat, density, flow.

The electronic equipment spontaneous-heating type electric radiator that the above embodiment of the present invention provides, simple and compact for structure, rationally distributed, body Long-pending little.Compared with existing electric radiator, the electronic equipment spontaneous-heating type electric radiator that the present invention provides, utilize electronic equipment originally The heat of body, passes to one end of thermo-electric generation sheet by hot extension block, makes the two ends of thermo-electric generation sheet form the temperature difference, produces electricity Can, and powered to cooling piece and fan by controller, heat pipe and radiating fin need not external energy in radiation processes, Can dispel the heat by spontaneous-heating type, energy-conserving and environment-protective；Interlaced arrangement fin in limited space, area of dissipation expands more than 2 times, and Being optimized the structural behaviour of cooling piece, can effectively accelerate heat dissipation capacity and reduce cooling piece cold junction temperature, cooling piece can have simultaneously Effect avoids heat bridge phenomenon, improves radiating effect, easy for installation and radiating effect is notable.

Accompanying drawing explanation

Fig. 1 is the structural representation of the specific embodiment of the invention one electronic equipment spontaneous-heating type electric radiator.

Fig. 2 is the A-A sectional view of Fig. 1 of the present invention.

Fig. 3 is the top view of the specific embodiment of the invention one electronic equipment spontaneous-heating type electric radiator.

Fig. 4 is the structural representation of the specific embodiment of the invention two electronic equipment spontaneous-heating type electric radiator.

Fig. 5 is heat transfer property parameter U in different cooling piece hot junctions in the specific embodiment of the invention three_hA_hUnder the conditions of the cold end system of cooling piece Cold Q_CWith electric current I changing trend diagram.

Fig. 6 is heat transfer property parameter U in different cooling piece hot junctions in the specific embodiment of the invention three_hA_hUnder the conditions of condensation end of heat pipe table Surface temperature T_hcWith electric current I changing trend diagram.

Fig. 7 is cooling piece cold end refrigerating capacity Q under the conditions of different condensation end of heat pipe substrate thickness L in the specific embodiment of the invention three_CWith Condensation end of heat pipe substrate area thickness is than f changing trend diagram.

Fig. 8 is condensation end of heat pipe surface temperature T under the conditions of different condensation end of heat pipe substrate thickness L in the specific embodiment of the invention three_hc With condensation end of heat pipe substrate area thickness than f changing trend diagram.

Fig. 9 be in the specific embodiment of the invention three different condensation end of heat pipe substrate area length than condensation end of heat pipe surface under the conditions of f Temperature T_hcHeat transfer property parameter U with cooling piece hot junction_hA_hChanging trend diagram.

Figure 10 is different condensation end of heat pipe substrate area length end colder than cooling piece under the conditions of f refrigeration in the specific embodiment of the invention three Amount Q_CHeat transfer property parameter U with cooling piece hot junction_hA_hChanging trend diagram.

1, heat pipe, 2, heat pipe evaporation ends substrate, 3, condensation end of heat pipe substrate, 4, fan, 5, radiating fin, 6, the temperature difference Generating sheet, 7, hot extension block, 8, cooling piece, 9, controller, 10, connecting plate, 11, screw hole, 12, thermal insulation board, 13, Thermocouple wire.

Detailed description of the invention

The detailed description of the invention of the present invention is described below in conjunction with the accompanying drawings:

Embodiment one: seeing Fig. 1, a kind of electronic equipment spontaneous-heating type electric radiator, including heat pipe 1, heat pipe evaporation ends substrate 2, condensation end of heat pipe substrate 3 and fan 4, heat pipe 1 is installed between heat pipe evaporation ends substrate 2 and condensation end of heat pipe substrate 3, Heat pipe evaporation ends substrate 2 and condensation end of heat pipe substrate 3 are mounted on radiating fin 5, the radiating fin on heat pipe evaporation ends substrate 2 Sheet is interlaced arrangement with the radiating fin on condensation end of heat pipe substrate 3, and heat pipe evaporation ends substrate 2 connects thermo-electric generation sheet 6, Thermo-electric generation sheet 6 is connected with electronic equipment by hot extension block 7, and condensation end of heat pipe substrate 3 is inlaid with cooling piece 8, refrigeration Sheet 8 is electrically connected with controller 9, and controller 9 electrically connects with thermo-electric generation sheet 6 and fan 4 respectively.When electronic equipment temperature mistake Gao Shi, heat is passed to one end of thermo-electric generation sheet by hot extension block, makes the two ends of thermo-electric generation sheet form the temperature difference, produces electric energy, Electric energy is transferred to controller, controller power to cooling piece and fan, and cooling piece accelerates heat transmission in heat pipe, fan Produce air-flow and take away the heat in radiating fin, it is ensured that heat can be pulled away rapidly.Radiating fin is interlaced arrangement, effectively Expand heat exchange area, strengthen heat transfer effect.

In the electric radiator provided according to the above embodiment of the present invention, seeing Fig. 2, described heat pipe 1 is provided with three, three Heat pipe is arranged side by side, and the radiating fin that adjacent heat pipe is corresponding is interlaced arrangement, it is simple to heat radiation.

Further, for the ease of heat pipe and the connection of controller, Fig. 1 is seen, provide according to the above embodiment of the present invention In electric radiator, described electric radiator is additionally provided with for connecting heat pipe 1 and the connecting plate 10 for static controller 9.

In the electric radiator that the present embodiment provides, seeing Fig. 1, heat pipe 1 is set to U-tube, the bent tube section edge of heat pipe 1 It is embedded on connecting plate 10.

In the electric radiator that the present embodiment provides, seeing Fig. 1 and Fig. 2, controller 9 is fixed on the bottom of connecting plate 10.

In the electric radiator that the present embodiment provides, see Fig. 1 and Fig. 2, hot extension block 7 and condensation end of heat pipe substrate 3 set Screw hole 11, fan 4 is had to be fixed on hot extension block 7 and condensation end of heat pipe substrate 3 by screw hole 11.

In the electric radiator that the present embodiment provides, see electric radiator described in Fig. 1 and be additionally provided with thermal insulation board 12, heat pipe evaporation end group Plate 2 and condensation end of heat pipe substrate 3 are installed on thermal insulation board 12, it is to avoid heat radiation.

The electronic equipment spontaneous-heating type electric radiator that the present embodiment provides, its operation principle is as follows:

After electronic equipment heating, heat is delivered to one end of thermo-electric generation sheet by hot extension block, makes thermo-electric generation sheet two ends be formed The temperature difference, it is possible to producing electric energy and export to controller, controller one end is connected by electrical wiring to cooling piece, to its power supply to accelerate Heat transmission in heat pipe, the cold end of cooling piece absorbs the energy from condensation end of heat pipe substrate, and is transported to radiating fin Sheet；The other end of controller is connected with fan, makes fan produce air-flow and takes away the heat in staggered radiating fin, it is ensured that heat Can be pulled away rapidly.

Embodiment two: unlike specific embodiment one, a kind of electronic equipment spontaneous-heating type electricity provided at the present embodiment dissipates In hot device, seeing Fig. 4, controller 9 connects has thermocouple wire, thermocouple wire to be installed between hot extension block and electronic equipment. When electronic equipment temperature is too high exceed limiting temperature time, temperature information can be transferred to controller by thermocouple wire, and controller is according to temperature Degree information is started working, thus carries out temperature control.

Its operation principle is with embodiment one, but in the present embodiment, the electric energy that thermo-electric generation sheet produces can not only be divided by controller Wen Ding not power to cooling piece and fan, it is ensured that cooling piece and the normal work of fan, controller can be with Intelligent control electric simultaneously The surface temperature of subset, by being arranged on the thermocouple wire between electronic equipment and hot extension block by the surface temperature of electronic equipment Feeding back to controller, temperature reaches ceiling temperature, and controller is started working, and reduces the surface temperature of electronic equipment.

Embodiment three: the optimization method of a kind of electronic equipment spontaneous-heating type electric radiator, the steps include: on electronic equipment surface Under conditions of fixed temperature or fixing heat dissipation capacity, optimize the heat transfer property parameter in cooling piece hot junction by optimizing formula (1)-(8) UA, condensation end of heat pipe substrate area thickness are than f, fan inlet flow V, and described condensation end of heat pipe substrate area thickness is more fixed than f Justice is A_e/L_e, wherein, A_eRepresent the surface area of condensation end of heat pipe substrate, L_eRepresent condensation end of heat pipe substrate thickness, described optimization The expression formula of formula (1)-(8) is as follows:

$COP=\frac{{\mathrm{K\ϵQ}}_C}{S^2{I}^2{T}_{hc}-\frac{1}{2}{\mathrm{SI}}^{3}R-SI\[SI(1-{\mathrm{\σ}}_{TE})(\frac{1}{M_{hc}{C}_{hc}}+R_c)+1\]Q_C+{\mathrm{KI}}^{2}R}---\left(2\right)$

T_hs=Qc (R_hp+R_ex+2R_int)+T_hc (4)

$\begin{array}{ccc}{R}_c=(\frac{L_e}{K_e{A}_e}+R_{\mathrm{int}})& (1-{\mathrm{\σ}}_{ex})=(\frac{1}{K_{e}f}+R_{\mathrm{int}})& (1-{\mathrm{\σ}}_{ex})\end{array}---\left(5\right)$

${\mathrm{\ϵ}}_h=1-\exp (-\frac{U_h{A}_h}{C_h})---\left(7\right)$

C_h=c ρ V (8)

In formula, Q_CRepresenting the refrigerating capacity of the cold end of cooling piece, COP represents the radiating efficiency in cooling piece hot junction, T_hcRepresent condensation end of heat pipe Substrate surface temperature, K, S, R represent the thermal conductivity of cooling piece, Seebeck coefficient, resistance respectively, and I represents the control of cooling piece Electric current, U_hA_hRepresent the heat transfer property parameter in cooling piece hot junction, C_hRepresent air specific heat capacity parameter, M_hc、C_hcRepresent heat respectively The quality of pipework condensation end group plate and thermal content parameter, ε,Represent the efficiency parameters of efficiency elements method, σ_TE、σ_exRepresent respectively Cooling piece loss coefficient, cooling piece warm end losses coefficient, R_cRepresent the thermal resistance between the cold end of cooling piece and condensation end of heat pipe substrate, T_inRepresent wind inlet of fan temperature, T_hsRepresent the temperature on electronic equipment surface, R_hpRepresent heat pipe thermal resistance, R_exRepresent hot extension block Thermal resistance, R_intRepresent thermal contact resistance, K_eRepresenting the thermal conductivity factor of condensation end of heat pipe substrate, c, ρ, V represent air respectively Specific heat, density, flow.

Above-mentioned eight optimize in formula, and formula (1)-(4) represent refrigerating capacity Q of the cold end of cooling piece_CWith electronic equipment surface temperature The optimization formula of degree, the derived expression of parameter in formula (5)-(8) representation formula (1)-(4).

In fixing surface temperature T_hsUnder restriction, formula (1), (2) and formula (4)-(7) can be passed through and solve optimum Refrigerating capacity Q of the cold end of cooling piece_C, air air quantity V, heat transfer property parameter U in cooling piece hot junction_hA_h。

Refrigerating capacity Q at the cold end of fixing cooling piece_CUnder restriction, formula (2)-(7) can be passed through and solve optimum electronic equipment table Surface temperature T_hs, air air quantity V, heat transfer property parameter U in cooling piece hot junction_hA_h.Wherein, formula (4) indicates electronics and sets Standby surface temperature T_hsWith condensation end of heat pipe substrate surface temperature T_hcBecome positive line sexual intercourse, therefore T_hsAnd T_hcThere is corresponding relation.

Its Optimizing Flow is as follows:

Refrigerating capacity Q of the cold end of cooling piece is set_C, electronic equipment surface temperature T_hsInitial value be respectively Q₀、T₀, can arbitrarily select Fixed, Q_stAnd T_stFor the maximum cooling capacity allowed under the operating mode of needs and minimum electronic equipment surface temperature.

Assume refrigerating capacity Q of the given cold end of cooling piece_CLimit, given parameters K, S, R, T_in, by optimize formula (2), (3), (4) are drawn, and are determined parameter I, f, U_hA_hEnd refrigerating capacity Q cold to cooling piece_CImpact, given arbitrarily refrigeration Amount Q₀, Fig. 5, Fig. 7, Fig. 9 draw in cooling piece cold end refrigerating capacity Q_CUnder the conditions of optimized parameter I, f, the U that can meet_hA_h, COP, T is calculated by formula (2), (3), (4)_hcAnd T_hs, simultaneously by parameter K, S, R, T_in、T_hcSubstitute into formula (1) Q is solved_C, the Q obtained will be solved_CAnd T_hsWith the maximum cooling capacity allowed under the operating mode needed and minimum electronic device table Surface temperature Q_stAnd T_stContrast, if meeting Q_C≥Q_st、T_hs≤T_st, the most exportable obtain parameter I, f, U_hA_h, Choose arrangement, the condition that arranges of inlet air and the service condition of cooling piece finally by the Optimal Parameters obtained, assemble Electric radiator.

Assume surface temperature T of given electronic equipment_hsLimit, given parameters K, S, R, T_in, by optimize formula (2), (3), (4) are drawn, and are determined parameter I, f, U_hA_hOpposite heat tube condensation end substrate surface temperature T_hcImpact, given appoint Expectation surface temperature T₀, Fig. 6, Fig. 8, Figure 10 draw in cooling piece cold end refrigerating capacity Q_CUnder the conditions of can meet optimized parameter I, f、U_hA_h, formula (1), (2), (4) calculate Q_C, COP and T_hs, simultaneously by parameter K, S, R, T_in、Q_C Substitute into formula (3) and solve T_hc, the Q obtained will be solved_CAnd T_hsWith the maximum cooling capacity allowed under the operating mode needed and minimum electronics Device surface temperature Q_stAnd T_stContrast, if meeting Q_C≥Q_st、T_hs≤T_st, the most exportable obtain parameter I obtained, f、U_hA_h, choose arrangement, the condition that arranges of inlet air and the operation of cooling piece finally by the Optimal Parameters obtained Condition, assembles electric radiator.

See Fig. 5, in heat transfer property parameter U in different cooling piece hot junctions_hA_hUnder the conditions of, cooling piece cold end refrigerating capacity Q_CWith electric current I increases the variation tendency in first increases and then decreases.

See Fig. 6, in heat transfer property parameter U in different cooling piece hot junctions_hA_hUnder the conditions of, condensation end of heat pipe surface temperature T_hcWith electricity Stream I increases in first reducing the variation tendency increased afterwards.

See Fig. 7, under the conditions of different condensation end of heat pipe substrate thickness L, cooling piece cold end refrigerating capacity Q_CWith condensation end of heat pipe base The plate area x thickness increase than the f variation tendency in first increases and then decreases.

See Fig. 8, under the conditions of different condensation end of heat pipe substrate thickness L, condensation end of heat pipe surface temperature T_hcWith condensation end of heat pipe Substrate area thickness increasing in first reducing the variation tendency increased afterwards than f.

See Fig. 9, under the conditions of different condensation end of heat pipe substrate area thickness are than f, condensation end of heat pipe surface temperature T_hcWith refrigeration Heat transfer property parameter U in sheet hot junction_hA_hIncrease in first strongly reducing the variation tendency tended to be steady to certain value.

See Figure 10, under the conditions of different condensation end of heat pipe substrate area thickness are than f, cooling piece cold end refrigerating capacity Q_CWith refrigeration Heat transfer property parameter U in sheet hot junction_hA_hIncrease in the variation tendency that to certain value tend to be steady first is increased dramatically.

From Fig. 5, Fig. 7, Fig. 9, in given minimum electronic equipment surface temperature T_hcTime, there is optimum electric current in it Make refrigerating capacity Q of the cold end of cooling piece_CReach maximum.Meanwhile, along with the area x thickness of condensation end of heat pipe substrate increases than f, system Refrigerating capacity Q of cold cold end_CFirst increases and then decreases, and be about 0.44 to have at the area x thickness of condensation end of heat pipe substrate than f Refrigerating capacity Q of the cold end of bigger cooling piece_C, the area x thickness of condensation end of heat pipe substrate directly affects heat conduction than f, when area is excessive Time, owing to the surface area of cooling piece limits, heat can not effectively derive, and time too small, the hot junction of cooling piece can not and heat pipe cold Solidifying end group plate preferably contacts, and therefore affects heat conduction.And heat transfer property parameter U to cooling piece hot junction_hA_h, only 50W/K with In, optimal value occurs, has continued to increase heat transfer property parameter U in cooling piece hot junction_hA_h, the refrigerating capacity of end cold to cooling piece Q_CNot having any impact, this is due to this body structure of device and the restriction of cooling piece power consumption, causes radiating mode the most inoperative, Therefore so that refrigerating capacity Q of the cold end of cooling piece_CReach heat transfer property parameter U in the cooling piece hot junction of maximum_hA_hIt is i.e. to arrange Required thermal resistance structure, expands heat transfer property parameter U in cooling piece hot junction according to staggered-mesh_hA_h。

From Fig. 6, Fig. 8, Figure 10, in given refrigeration power consumption one timing, it yet suffers from optimal current and electronics is set Standby surface temperature T_hcMinimum.Meanwhile, along with the area x thickness of condensation end of heat pipe substrate increases than f, its electronic equipment surface temperature T_hcFirst reduce and increase afterwards, and be about 0.4 to have relatively low condensation end of heat pipe table at the area x thickness of condensation end of heat pipe substrate than f Surface temperature T_hc.For there being the electronic equipment of fixing power consumption requirements, its select condensation end of heat pipe substrate size tackle its surface area and Thickness and thermal conductivity factor account for.

The control electric current I of parameter cooling piece that is given according to Fig. 5 to Figure 10, the area x thickness of condensation end of heat pipe substrate are than f, system Heat transfer property parameter U in cold hot junction_hA_hOn cooling piece refrigerating capacity and the impact of condensation end of heat pipe surface temperature.The present embodiment is above-mentioned Optimization method to including that cooling piece running current and radiating fin, air quantity are optimized, makes the present invention according to above-mentioned optimization formula Above-mentioned radiator can reach optimum working condition.

As the extension of above-described embodiment, to this optimization method about and thermal contact resistance R_int, heat pipe thermal resistance R_hpDeng based on this optimization Optimization method within formula is all within the method.

As the extension of above-described embodiment, heat pipe can be provided with 1 or two and more than three, dissipates with specific reference to electricity The volume size of hot device arranges the number of heat pipe.

Above-described embodiment is used for explaining the present invention rather than limiting the invention, in spirit and claims of the present invention In protection domain, any modifications and changes that the present invention is made, both fall within protection scope of the present invention.

Claims (9)

1. an electronic equipment spontaneous-heating type electric radiator, it is characterised in that: include heat pipe, heat pipe evaporation ends substrate, heat pipe cold Solidifying end group plate and fan, heat pipe is installed between heat pipe evaporation ends substrate and condensation end of heat pipe substrate, heat pipe evaporation ends substrate Connecting and have thermo-electric generation sheet, thermo-electric generation sheet is connected with electronic equipment by hot extension block, and condensation end of heat pipe substrate connects Having cooling piece, one end that cooling piece is connected with condensation end of heat pipe substrate to be referred to as the cold end of cooling piece, the other end of cooling piece is referred to as Cooling piece hot junction, heat pipe evaporation ends substrate and cooling piece hot junction are mounted on radiating fin, dissipating on heat pipe evaporation ends substrate Radiating fin on hot fin and cooling piece hot junction is interlaced arrangement；Cooling piece is electrically connected with controller, and controller is respectively Electrically connect with thermo-electric generation sheet and fan.

2. electronic equipment spontaneous-heating type electric radiator as claimed in claim 1, it is characterised in that: described heat pipe is provided with 1 Or multiple, when heat pipe is provided with multiple, multiple heat pipes are arranged side by side, and the radiating fin that adjacent heat pipe is corresponding is interlaced arrangement.

3. the electronic equipment spontaneous-heating type electric radiator as described in claim 1 or 2 any one, it is characterised in that: described Electric radiator is additionally provided with for connecting heat pipe and the connecting plate for static controller.

4. electronic equipment spontaneous-heating type electric radiator as claimed in claim 3, it is characterised in that: heat pipe is set to U-tube, The bent tube section of heat pipe is embedded on connecting plate.

5. electronic equipment spontaneous-heating type electric radiator as claimed in claim 3, it is characterised in that: controller is fixed on connecting plate Bottom.

6. electronic equipment spontaneous-heating type electric radiator as claimed in claim 1, it is characterised in that: controller connects thermocouple Line, thermocouple wire is installed between hot extension block and electronic equipment.

7. electronic equipment spontaneous-heating type electric radiator as claimed in claim 1, it is characterised in that: fan is fixed on hot extension block With on condensation end of heat pipe substrate.

8. electronic equipment spontaneous-heating type electric radiator as claimed in claim 1, it is characterised in that: described electric radiator is additionally provided with Thermal insulation board, heat pipe evaporation ends substrate and condensation end of heat pipe substrate are installed on thermal insulation board.

9. the electronic equipment optimization method of spontaneous-heating type electric radiator, it is characterised in that: the steps include: at electronic equipment table Under conditions of face fixed temperature or fixing heat dissipation capacity, optimize the conductivity of heat in cooling piece hot junction by optimizing formula (1)-(8) Energy parameter UA, condensation end of heat pipe substrate area thickness are than f, fan inlet flow V, described condensation end of heat pipe substrate area Thickness is defined as A than f_e/L_e, wherein, A_eRepresent the surface area of condensation end of heat pipe substrate, L_eRepresent condensation end of heat pipe substrate Thickness, the expression formula of described optimization formula (1)-(8) is as follows:

$COP=\frac{{\mathrm{K\ϵQ}}_C}{S^2{I}^2{T}_{hc}-\frac{1}{2}{\mathrm{SI}}^{3}R-SI\[SI(1-{\mathrm{\σ}}_{TE})(\frac{1}{M_{hc}{C}_{hc}}+R_c)+1\]Q_C+{\mathrm{KI}}^{2}R}---\left(2\right)$

T_hs=Qc (R_hp+R_ex+2R_int)+T_hc (4)

$\begin{array}{ccc}{R}_c=(\frac{L_e}{K_e{A}_e}+R_{\mathrm{int}})& (1-{\mathrm{\σ}}_{ex})=(\frac{1}{K_{e}f}+R_{\mathrm{int}})& (1-{\mathrm{\σ}}_{ex})\end{array}---\left(5\right)$

${\mathrm{\ϵ}}_h=1-\exp (-\frac{U_h{A}_h}{C_h})---\left(7\right)$

C_h=c ρ V (8)

In formula, Q_CRepresenting the refrigerating capacity of the cold end of cooling piece, COP represents the radiating efficiency in cooling piece hot junction, T_hcRepresent condensation end of heat pipe Substrate surface temperature, K, S, R represent the thermal conductivity of cooling piece, Seebeck coefficient, resistance respectively, and I represents the control of cooling piece Electric current, U_hA_hRepresent the heat transfer property parameter in cooling piece hot junction, C_hRepresent air specific heat capacity parameter, M_hc、C_hcRepresent heat respectively The quality of pipework condensation end group plate and thermal content parameter, ε,Represent the efficiency parameters of efficiency elements method, σ_TE、σ_exRepresent respectively Cooling piece loss coefficient, cooling piece warm end losses coefficient, R_cRepresent the thermal resistance between the cold end of cooling piece and condensation end of heat pipe substrate, T_inRepresent wind inlet of fan temperature, T_hsRepresent the temperature on electronic equipment surface, R_hpRepresent heat pipe thermal resistance, R_exRepresent hot extension block Thermal resistance, R_intRepresent thermal contact resistance, K_eRepresenting the thermal conductivity factor of condensation end of heat pipe substrate, c, ρ, V represent air respectively Specific heat, density, flow.