CN104613801B - Evaporator and heat dissipation device for loop heat pipe - Google Patents
Evaporator and heat dissipation device for loop heat pipe Download PDFInfo
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- CN104613801B CN104613801B CN201510093372.8A CN201510093372A CN104613801B CN 104613801 B CN104613801 B CN 104613801B CN 201510093372 A CN201510093372 A CN 201510093372A CN 104613801 B CN104613801 B CN 104613801B
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Abstract
The invention relates to an evaporator for a loop heat pipe. The evaporator comprises a heat removing body and liquid sucking cores, wherein accommodating spaces are arranged in the heat removing body and are used for placing the liquid sucking cores; joints are arranged on the two sides of the heat removing body and are respectively used for connecting a steam pipeline and a liquid pipeline; the heat removing body is square; the cross sections of the accommodating spaces are round or ellipse. Because the heat removing body is square and can be tightly adhered to a quadrate (cube or cuboid) of a common electronic chip, the true fusion is realized. Meanwhile, the cross sections of the accommodating spaces of the heat removing body are round or ellipse, so that the sealing between the liquid sucking cores and the heat removing body is easily realized, and the safe operation of the evaporator under a high heating flux density condition can be truly realized; the shell of the evaporator is made of commonly-used aluminum materials, so that evaporator has the characteristics of light weight, low cost, excellent heat transfer performance and the like. The invention also provides a heat dissipation device for the loop heat pipe.
Description
Technical field
The invention belongs to electronic product radiating technical field, the specially evaporator and heat abstractor of loop circuit heat pipe.
Background technology
The cooling of great-power electronic chip is a very important technology in electronics, computer, communication and optoelectronic device
Link.Include for the conventional method of high-power electronic device radiating in the market following several：(1) fan+radiator；
(2) fan+heat pipe+radiator；(3) fan+liquid refrigeration technique.Although this several method can solve high-power to a certain extent
The heat dissipation problem of device, but still suffer from following shortcoming：(1) fan+radiator, in order to strengthen the heat-sinking capability of heat abstractor,
Only by increasing the area of radiating fin and improving rotation speed of the fan, caused result is big noise, and heat abstractor volume is big
And it is thick and heavy, it is unfavorable for installing and very big pressure can be produced to electronic device；(2) fan+heat pipe+radiator, though can be with
Shortcoming in solution 1, but itself can increase mechanical complications, and the design and installation of heat pipe are frequently subjected to actual knot
The limitation of structure, and under limited heat pipe effect, its heat-sinking capability is still still limited；3) liquid refrigeration technique, surpasses in performance
The potentiality of more both the above mode, and liquid-cooling heat radiation technology are very high, a small-sized liquid-cooling heat radiators, if by
Performance optimizes, and under the premise of noise is controlled, the heat for distributing 1kW has been able to realize that (liquid cooling heat radiator overall thermal resistance can be low
To 0.12 DEG C/below W).But liquid refrigeration technique has that mechanism is extremely complex, its is increased drive liquid working substance circulation pump and
There is presently no a kind of pipeline connection technology that can be completely secured and not leak, will all actually making for liquid-cooling heat radiator be had influence on
With the life-span, the also cost highest of liquid-cooling heat radiator is more than 3 times (under same heat-sinking capabilities) of general heat pipe radiator.
Also this, that is, have a kind of generation of the loop circuit heat pipe technology that can solve above-mentioned all missings.Loop circuit heat pipe technology is sent out
Bright and to be widely applied to aerospace field in 1974, loop circuit heat pipe technology progressed into heat dissipation of electronic chip in recent years
Field.Loop circuit heat pipe is to have gathered the advantage of heat pipe and liquid-cooling heat radiation technology while having abandoned a kind of radiating of respective shortcoming
Mode, with liquid refrigeration technique sample, a compact small loop circuit heat pipe of type can easily realize the radiating of 500W and the above to radiating potentiality
(loop circuit heat pipe overall thermal resistance can be low to 0.15 DEG C/below W), while its cost is far below liquid refrigeration technique.Loop heat pipe heat dissipation
Device has further the advantage that：(1) performance is affected by gravity less than general heat pipe；Planform can be with variation, and meeting difference makes
With demand etc..Because loop circuit heat pipe manufacturing process is similar with general heat pipe, therefore its reliability and service life and general heat pipe
Can equally be widely used in during some requirements compare harsh environment.
Traditional loop heat pipe radiator mainly includes the evaporator with capillary structure, there is provided the steaming of working media circulation
Steam pipe road and fluid pipeline and heat is discharged into the condenser of environment.During work, evaporator bottom surface is received from heater members
The heat that (for example, electronic chip) is passed over, working media evaporates inside capillary structure, and steam leaves evaporator, passes through
Jet chimney flows to the condenser with fin, and steam passes through in condenser, heat is discharged into environment Jie for flowing through condenser
In matter (such as air), steam is changed into liquid after forcing cooling through natural cooling or fan, and liquid is in the presence of capillary force
Via fluid pipeline Returning evaporimeter, a thermodynamic cycle is completed, moved in circles accordingly, continuously heat from heating
Device is discharged into surrounding air.
Also there are some loop circuit heat pipes at present using the patent in electronic radiation field product, such as Chinese Patent Application No. is：
Disclosed in the patent documents such as 01259718.X, 200810028106.7 and 200910077583.7.Existing patent is related to evaporation
The design of device, its basic structure includes following two forms substantially：(1) columnar structured (cylindertype)；(2) flat board knot
Structure (flatplatetype).Wherein, it is columnar structured be conventional loop heat pipe basic structure.Slab construction has two kinds at present
Form：(1) disk plates form (disktype)；(2) flat type (ZL01259718.X) being made using micro-processing technology；
(3) base plate adds the split type flat type (ZL200910077583.7) of superstructure.
Because the shape of ordinary electronic chip is essentially square (square or cuboid), cylindrical shape evaporator is because of circle
Bobbin footpath is unfavorable for being contacted with the flat surface of chip, and heat-transfer effect is poor.The flat type evaporator being made up of micro-processing technology
The heat dispersion of loop circuit heat pipe be all also not reaching to the requirement that uses of business.And existing disk plates form is then because of evaporator
Complex manufacturing process, and additional space can be taken when mounted.Wherein base plate adds the split type flat board knot of superstructure
Structure, it is not only high to machining accuracy and installation requirement, and also air-tightness also easily goes wrong.
The content of the invention
The technical problem to be solved in the present invention is：There is provided a kind of simple structure, easy to process, air-tightness good loop circuit heat pipe
Evaporator.
While above-mentioned loop heat pipe evaporator is provided, the present invention also provides a kind of heat abstractor of loop circuit heat pipe.
In order to solve the above-mentioned technical problem, the present invention provides a kind of evaporator of loop circuit heat pipe, including takes hot body and imbibition
Core, described to take hot body and be provided with accommodation space, the accommodation space is used to install the liquid-sucking core, and the both sides for taking hot body are set
There is interface, be respectively used to connect steam pipework and liquid line, the profile for taking hot body is square, the horizontal stroke of the accommodation space
Section is circular or oval.
Optionally, it is provided with steam drain passage on the accommodation space wall for taking hot body or on the liquid-sucking core.
Optionally, the section of the steam drain passage is arch, rectangle, zigzag, similar round, honeycomb or polygonal
Shape.
Optionally, the steam drain passage is two or more, and connection is provided between described two passages
Conduit.
Optionally, the cross section of the liquid-sucking core is circular or oval, and the liquid-sucking core takes the accommodating of hot body with described
Space wall interference fit.
Optionally, the liquid-sucking core at least includes two-layer, the capillary aperture of the outermost layer with respect to other layers of the liquid-sucking core
Or passage is finer and close.
Optionally, zigzag or sharp knife shape steam drain passage are provided with the accommodation space wall for taking hot body, work as institute
State liquid-sucking core and be assembled to described when taking the accommodation space of hot body, the wall trench of the steam drain passage is partially submerged into the liquid-sucking core
Outermost layer.
Optionally, one end of the liquid-sucking core is provided with base, and the base section girth is horizontal more than the liquid-sucking core
Perimeter of section, is provided with step on the accommodation space wall for taking hot body one end, the base of the liquid-sucking core is arranged on described taking
Hot object table it is stepped into cavity in.
Optionally, the cross section of the base of the liquid-sucking core is circular or oval, and the base takes hot body with described
Accommodation space wall interference fit.
Optionally, the evaporator also includes bottom, and the bottom is arranged on and described takes hot body near the liquid-sucking core bottom
One end of seat, the bottom, liquid-sucking core base and described taking be provided with liquid storage cylinder between hot body accommodation space wall.
Optionally, the evaporator also includes bottom, and the bottom is arranged on and described takes hot body near the liquid-sucking core bottom
One end of seat, liquid storage cylinder is provided between the bottom and liquid-sucking core base.
Optionally, the evaporator also includes bottom, and the bottom is arranged on and described takes hot body near the liquid-sucking core bottom
One end of seat, liquid storage cylinder is provided with the bottom.
Optionally, it is additionally provided with heat insulation between the liquid-sucking core base and the liquid storage cylinder.
Optionally, it is additionally provided with insulated cavity between the heat insulation and the liquid-sucking core base.
Optionally, it is provided with the interface being connected with the liquid line on the bottom.
Optionally, the bottom is taken hot body and fixed by welding, screw and/or screw thread with described.
Optionally, the evaporator also includes top cover, and the top cover is arranged on and described takes what hot body was connected with steam pipework
Side, is provided with the interface being connected with the steam pipework on the top cover.
Optionally, the porous material that the liquid-sucking core is made up of metal dust, wire netting or ceramic powders.
Optionally, the liquid-sucking core is shaped as rotary part.
Optionally, the liquid-sucking core is provided with blind hole near its base side, and one end of the liquid line is arranged on institute
In stating blind hole.
Optionally, the top of the liquid-sucking core is provided with spill liquid storage cylinder.
Optionally, the case material of the evaporator is aluminium material.
Present invention also offers a kind of heat abstractor of loop circuit heat pipe, including steam pipework, liquid line, condenser and on
The evaporator described in any one is stated, the evaporator both sides pass through steam pipework and liquid line and the condenser phase respectively
Even, closure heat-radiation loop is formed.
The evaporator of the loop circuit heat pipe that the present invention is provided, including takes hot body and liquid-sucking core, it is described take hot body be provided with it is accommodating
Space, the accommodation space is used to install the liquid-sucking core, and the both sides for taking hot body are provided with interface, is respectively used to connect steam
Pipeline and liquid line, the profile for taking hot body are square, and the cross section of the accommodation space is circular or oval.Due to
The profile for taking hot body uses square, and it can tightly be pasted with the cubic body (square or cuboid) of ordinary electronic chip
Close, realize real fusion.Meanwhile, take the cross section of hot body accommodation space using circular or oval, easily realize liquid-sucking core with
Take the sealing between hot body.Convenient processing, it is easy to industrialization, can really realize the safe operation under high heat flux.This steaming
Hair device can realize that evaporator is in the lower section of whole cooling system, incline 15 °, or even 45 °, and 60 ° are waited requirement, realize thermal control system
The requirement of system compact conformation.
In further technical scheme, the cross section of the liquid-sucking core can be circular or oval, the liquid-sucking core
With the accommodation space wall interference fit for taking hot body, can be realized by machining.To realize that liquid-sucking core is housed with hot body is taken
It is fully sealed without gas leakage between the wall of space.
In another further technical scheme, liquid-sucking core can at least include two-layer, and the outermost layer of the liquid-sucking core is relative
The capillary aperture of other layers or passage use finer and close structure, to produce enough capillary heads.In the appearance for taking hot body
Being empty on partition can be provided with zigzag or sharp knife shape steam drain passage, and described hot body is taken when the liquid-sucking core is assembled to
During accommodation space, the wall trench of the steam drain passage is partially embedded into the outermost layer of the liquid-sucking core, so also ensures that
Liquid-sucking core and it is fully sealed without gas leakage between taking hot body accommodation space wall.
In further technical scheme, one end of the liquid-sucking core is provided with base, and the base section girth is big
In the liquid-sucking core section girth, step, the bottom of the liquid-sucking core are provided with the accommodation space wall for taking hot body one end
Seat be arranged on it is described take hot object table it is stepped into cavity in, the base and the accommodation space wall interference fit for taking hot body.
Reservoir is arranged on the base outside, can so realize that liquid-sucking core is fully sealed without gas leakage with reservoir, so as to overcome
Liquid-sucking core is fully sealed the contradiction without gas leakage with the accommodation space wall, liquid-sucking core and the reservoir that take hot body so that the loop heat
Pipe evaporator has thermal control performance higher, while also achieve that organically blending for hot body and electronic chip is taken, it is real to realize height
Safe operation under heat flow density.
In further technical scheme, it is also provided between the liquid-sucking core base and the liquid storage cylinder heat-insulated
Block.Further, it is also provided with insulated cavity between the heat insulation and the liquid-sucking core base.Can so avoid
The heat transfer in hot body accommodation space is taken to formation leakage heat in liquid storage cylinder, causes the rising of fluid temperature in liquid storage cylinder, so that
Radiating effect is reduced, the collapse of system is even resulted in, failed.
In further technical scheme, the top of the liquid-sucking core can be provided with spill liquid storage cylinder.In loop circuit heat pipe
When not actuated, be stored with liquid refrigerant in the spill liquid storage cylinder.After loop circuit heat pipe starts, evaporator temperature is raised, not
Before forming the Efficient Cycle of working medium, the liquid refrigerant stored in the spill liquid storage cylinder can be supplemented liquid-sucking core, kept away
Exempt from the Efficient Cycle that evaporator temperature is raised and can not form working medium always, even result in by the damage of radiating object.
The heat radiation device for loop heat pipe that the present invention is provided is due to the evaporator including above-mentioned loop circuit heat pipe, it may have corresponding
Technique effect.
Brief description of the drawings
Fig. 1 is to represent the evaporator longitudinal section involved by present embodiment；
Fig. 2 is to represent the evaporator cross-sectional view involved by present embodiment；
Fig. 3-Fig. 7 is the sectional view for representing the liquid-sucking core not of the same race involved by present embodiment；
Fig. 8 is to represent another evaporator cross-sectional view involved by present embodiment；
Fig. 9-Figure 11 is to represent the other several evaporator cross-sectional views involved by present embodiment；
Figure 12 is the structure chart of the heat abstractor for representing the loop circuit heat pipe involved by present embodiment.
In figure：
1 takes the interface of 11 accommodation space of hot body, 110 step 12
The outermost layer of the liquid-sucking core of 13 steam drain passage, 14 conduit, 2 liquid-sucking core 21
The steam pipework of 22 liquid-sucking core base, 23 blind hole, 24 spill liquid storage cylinder 3
The heat insulation of 4 liquid line, 5 bottom, 6 liquid storage cylinder 7
The condenser of 8 insulated cavity, 9 top cover, 100 evaporator 200
Specific embodiment
The present invention will be described in detail below in conjunction with the accompanying drawings, and the description of this part is only exemplary and explanatory, should not
There is any restriction effect to protection scope of the present invention.Additionally, description of the those skilled in the art according to presents, can be right
Feature in presents in embodiment and in different embodiments carries out respective combination.
Fig. 1 to Figure 12 is referred to, wherein Fig. 1 and Fig. 2 is the section of the evaporator of loop circuit heat pipe involved by present embodiment
Figure.The evaporator of the loop circuit heat pipe includes taking hot body 1 and liquid-sucking core 2, and accommodation space can be provided with described taking in hot body 1
11, the accommodation space 11 is used to install the liquid-sucking core 2, and the both sides for taking hot body 1 are provided with interface 12, is respectively used to connection
Steam pipework 3 and liquid line 4 (as shown in Figure 9), the profile for taking hot body 1 for square, the accommodation space 11 it is transversal
Face is circular or oval.Evaporator has the part of serrated slot and heater to pass through heat conductive silica gel and screw threads for fastening, for absorbing
The heat that heater is distributed.And the evaporator of loop circuit heat pipe is usually used in the cooling system of electronic chip, due to general electronic chip
Profile be tetragonal body, existing columnar structured evaporator or slab construction evaporator, it is impossible to realization take hot body and liquid-sucking core
With merging completely for heater.And the profile for taking hot body 1 of the present invention uses square, it can be with the four directions of ordinary electronic chip
Body (square or cuboid) is tightly fitted, and realizes real fusion.Meanwhile, the cross section for taking the accommodation space 11 of hot body sets
Circular or ellipse is counted, liquid-sucking core is so also easily realized and is taken the sealing between hot body, also realize merging completely such that it is able to
The real safe operation realized under high heat flux.Preferably, the liquid-sucking core 2 can be by metal dust, wire netting or pottery
Porous material that porcelain powder is made, such as copper powders or aluminium powder etc..In addition, the appearance profile of liquid-sucking core 2 can be tied for revolution
Structure, such as cylinder or class cylinder, so easily realize assembling, and be more beneficial for taking the fitted seal between hot body.
Refer to shown in Fig. 2 to Fig. 5, in the present embodiment, can be on the accommodation space wall for taking hot body 1 or institute
State and steam drain passage 13 is set on liquid-sucking core 2.After evaporator is heated, the liquid working substance in it undergoes phase transition into steam state, vapour
State working medium can be transferred to steam pipework 3 by the steam drain passage 13.Preferably, the steam drain passage 13
Section can be the shapes such as arch, rectangle, zigzag, similar round, honeycomb or polygonal.The number of the steam drain passage 13
Amount can be two or more, and the conduit 14 of connection is also provided between described two passages.So more
Be conducive to the circulation of steam state working medium, because when steam state working medium circulates in the steam drain passage 13, if wherein there is bubble, just
Channel blockage problem can occur, due to being provided with the conduit 14 of connection, bubble will stop at conduit 14, vanish, thus may be used
See that the conduit 14 of setting can prevent that channel blockage occurs because there is bubble in steam drain passage 13.Need
Bright, the liquid working substance can be the working medium under normal temperature and pressure for liquid, such as water, acetone, methyl alcohol and ethanol；Can also be
It is gaseous working medium, such as freon R11, R22, R-134a under normal temperature and pressure, liquefied ammonia etc., it is of course possible to be foregoing two or more
The composition of liquid refrigerant.As long as it is appreciated that using with environment and heat sink material compatible：With temperature control ability, i.e.,
(such as 50 DEG C or so evaporations) can realize that the liquid refrigerant of larger heat flow density heat absorption all may be used under relatively low operating temperature
Working medium is filled as the system.Certainly, working medium and its filling weight, also can produce influence to heat abstractor, such as may shadow
Ring the stability to heat abstractor, to the adaptability of environment, and safe operation performance etc..It is therefore desirable to according to specific
Corresponding working medium species is selected the need for environment, while the filling weight of working medium is controlled in a rational scope, to improve
The stability of heat abstractor.
In the present embodiment, the cross section of the liquid-sucking core 2 can be circular or ellipse, the liquid-sucking core 2 and institute
State and take the accommodation space wall of hot body 1 and use interference fit, usual this interference fit can be realized by being machined.So may be used
So that steam state working medium is only capable of being flowed to steam pipework 3 by steam drain passage 13, and prevent steam state working medium from passing through the He of liquid-sucking core 2
The clearance backflow between the accommodation space wall of hot body 1 is taken, causes confusion and play a reversed role that steam flows.
Refer to shown in Fig. 7, Fig. 8 and Figure 11, in the present embodiment, the liquid-sucking core 2 can at least include two-layer, institute
The outermost layer 21 for stating liquid-sucking core is finer and close with respect to the capillary aperture of other layers or passage, to produce enough capillary heads.As inhaled
The outermost layer 21 of wick-containing is made of softer material.And the outermost layer 21 of liquid-sucking core can use more large aperture or have more
The material or structure of imbibition ability, can so improve the imbibition ability of the liquid-sucking core 2.Preferably, the hot body 1 of taking
Zigzag or sharp knife shape steam drain passage 13 are provided with accommodation space wall, described hot body 1 is taken when the liquid-sucking core 2 is assembled to
Accommodation space 11 when, the wall trench of the steam drain passage 13 is partially embedded into the outermost layer 21 of the liquid-sucking core.So
The interference fit between liquid-sucking core 2 and the accommodation space wall for taking hot body 1 is realized in structure, processing cost is reduced, and air-tightness is more
It is good.Simultaneously because the wall trench of the steam drain passage 13 is partially embedded into the outermost layer 21 of the liquid-sucking core, in liquid-sucking core
Liquid also can faster, more be transferred in the wall trench of the steam drain passage 13, further improve cooling system
Radiating efficiency.
Refer to shown in Fig. 6, Fig. 7 and Fig. 9, in the present embodiment, one end of the liquid-sucking core 2 is provided with base, institute
Base section girth is stated more than the section girth of the liquid-sucking core 2, is provided with the accommodation space wall for taking the one end of hot body 1
Step 110, the liquid-sucking core base 22 be arranged on it is described take hot object table it is stepped into cavity in.Due to being provided with step 110, because
This liquid-sucking core base 22 and take air-tightness between hot body 1 can be more preferable, can so prevent steam state working medium from liquid-sucking core base 22
Leakage.Preferably, the cross section of the liquid-sucking core base 22 is circular or oval, and the liquid-sucking core base 22 takes with described
The accommodation space wall interference fit of hot body 1.So can further improve liquid-sucking core base 22 and take the sealing between hot body 1
Energy.
Refer to shown in Fig. 9, Figure 10 and Figure 11, in the present embodiment, the evaporator can also include bottom 5, institute
State bottom 5 and be arranged on the hot body 1 that takes near one end of the liquid-sucking core base 22, the bottom 5, liquid-sucking core base 22 and institute
State to take and be provided with liquid storage cylinder 6 between the accommodation space wall of hot body 1.So, in the course of the work, liquid-sucking core 2 can constantly from institute
State liquid storage cylinder 6 and draw liquid refrigerant, by micro- liquid film evaporation, produce decalescence.The evaporator of intermediate ring road heat pipe of the present invention, inhales
Interference fit between wick-containing 2 and bottom 5 and the accommodation space wall for taking hot body 1, steam state working medium by steam drain passage 13 with
Steam pipework 3 is communicated, and liquid-sucking core 2 and/or bottom 5 separate steam drain passage in the liquid storage cylinder 6 completely, so as to realize work
Make medium one-way flow inside evaporator.In the bottom 5 and can also be inhaled in another implementation method of the invention
Liquid storage cylinder 6 shown in being set between wick-containing base 22, or the liquid storage cylinder 6 is set in the bottom 5.
It is shown in Figure 6, in the present embodiment, between the liquid-sucking core base 22 and the liquid storage cylinder 6 can be with
It is provided with heat insulation 7.Preferably, it is additionally provided with insulated cavity 8 between the heat insulation 7 and the liquid-sucking core base 22
(as shown in figure 11).This way it is possible to avoid the heat transfer of high temperature steam state working medium in accommodation space 11 is to the liquid in liquid storage cylinder 6
Body working medium, causes liquid working substance temperature to raise, and reduces radiating efficiency.Furthermore it is possible to by the bottom 5 by welding, screw
And/or screw thread is fixed with the hot body 1 that takes.With existing bottom 5 and the sealing between hot body 1 is taken, while also allowing for dismounting.
Shown in Figure 9, in the present embodiment, the evaporator can also include top cover 9, and the top cover 9 is set
The side that hot body 1 is connected with steam pipework 3 is taken described, the interface being connected with the steam pipework 3 is provided with the top cover 9
12.The interface 12 being connected with the liquid line 4 is provided with the bottom 5.Such company of steam pipework 3 and liquid line 4
Connecing can all be more convenient with installation.
Refer to shown in Fig. 6 and Fig. 7, in the present embodiment, the liquid-sucking core 2 can be provided near its base side
Blind hole 23, one end of the liquid line 4 is arranged in the blind hole 23.So liquid refrigerant can be delivered directly to liquid-sucking core
In 2 blind hole, it is more beneficial for liquid-sucking core and absorbs liquid working substance, the moment keeps liquid-sucking core to be in moisture state, at any time to heating surface
Feed flow is carried out, so as to improve radiating efficiency.
Shown in Figure 10, in the present embodiment, the top of the liquid-sucking core 2 is also provided with spill liquid storage cylinder
24.So when loop circuit heat pipe is not actuated, be stored with liquid refrigerant in the spill liquid storage cylinder 24.After loop circuit heat pipe starts,
Evaporator temperature is raised, and before the Efficient Cycle for not forming working medium, the liquid refrigerant stored in the spill liquid storage cylinder 24 can
Supplemented with to liquid-sucking core, it is to avoid evaporator temperature is raised and can not form the Efficient Cycle of working medium always, even result in by
The damage of radiating object.
It should be noted that the vapo(u)rization system of loop circuit heat pipe is the key link in loop circuit heat pipe technology, on the one hand to have
Heat-transfer capability very high, this not only needs, and the heat conductivility of housing is relative will to get well, and core body will be involutory with the assembly performance of housing
Reason；Meanwhile, also to take into account toxicity, the friendly to environment, excellent heat transfer property and itself and housing, core in working medium selection
The requirement such as compatibility of body；On the other hand, the price of vapo(u)rization system is also whether this loop circuit heat pipe technology expanded can be applied,
Obtain market accreditation key, therefore, this evaporator case material selection on, using common aluminium material.
It is shown in Figure 12, a kind of heat abstractor of loop circuit heat pipe, including steam pipework 3, liquid line 4 and condenser
200, and above-mentioned evaporator 100, the both sides of the evaporator 100 pass through steam pipework 3 respectively and liquid line 4 is cold with described
Condenser 200 is connected, and forms closure heat-radiation loop.Operationally, evaporator 100 receives the heat passed over from heater members,
Working media is evaporated inside evaporator, and steam leaves evaporator 100, and condenser 200 is flowed to by steam pipework 3, and steam exists
Condenser 200 passes through, and heat is discharged into the surrounding medium for flowing through condenser 200 (such as air), and steam is through natural cooling
Or fan etc. force cooling after be condensed into liquid, effect of the liquid in capillary force (providing this active force by the liquid-sucking core of evaporator)
Under via the Returning evaporimeter 100 of liquid line 3, complete secondary thermodynamic cycle, move in circles accordingly, continuously heat
It is discharged into surrounding air from heater members.Simultaneously as a kind of heat abstractor of loop circuit heat pipe of the present invention have it is above-mentioned
The evaporator of loop circuit heat pipe, it is also possible to produce corresponding technique effect, will not be repeated here.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (19)
1. a kind of evaporator of loop circuit heat pipe, it is characterised in that：Including taking hot body and liquid-sucking core, it is described take hot body be provided with it is accommodating
Space, the accommodation space is used to install the liquid-sucking core, and the both sides for taking hot body are provided with interface, is respectively used to connect steam
Pipeline and liquid line, the profile for taking hot body are square, and the cross section of the accommodation space is circular or oval；It is described
Take on the accommodation space wall of hot body or steam drain passage is provided with the liquid-sucking core；The steam drain passage be two or
Two or more, is provided with the conduit of connection between two steam drain passages；
The outermost layer of the liquid-sucking core is made of softer material；Zigzag is provided with the accommodation space wall for taking hot body
Or sharp knife shape steam drain passage, when the liquid-sucking core be assembled to it is described take the accommodation space of hot body when, the steam excretion is logical
The wall trench in road is partially submerged into the outermost layer of the liquid-sucking core.
2. evaporator according to claim 1, it is characterised in that the section of the steam drain passage is arch, sawtooth
Shape, similar round, honeycomb or polygonal.
3. evaporator according to claim 2, it is characterised in that the cross section of the liquid-sucking core be it is circular or oval,
The liquid-sucking core and the accommodation space wall interference fit for taking hot body.
4. evaporator according to claim 1, it is characterised in that the liquid-sucking core at least includes two-layer, the liquid-sucking core
Outermost layer it is finer and close with respect to the capillary aperture of other layers or passage.
5. evaporator according to claim 1, it is characterised in that one end of the liquid-sucking core is provided with base, the bottom
Seat section girth is more than the liquid-sucking core section girth, and step is provided with the accommodation space wall for taking hot body one end,
The base of the liquid-sucking core be arranged on it is described take hot object table it is stepped into cavity in.
6. evaporator according to claim 5, it is characterised in that the cross section of the base of the liquid-sucking core is circular or ellipse
Circle, the base and the accommodation space wall interference fit for taking hot body.
7. evaporator according to claim 6, it is characterised in that the evaporator also includes bottom, the bottom is set
Hot body is taken near one end of the liquid-sucking core base described, the bottom, liquid-sucking core base and described takes hot body accommodation space
Liquid storage cylinder is provided between wall.
8. evaporator according to claim 6, it is characterised in that the evaporator also includes bottom, the bottom is set
Hot body is taken near one end of the liquid-sucking core base described, and liquid storage cylinder is provided between the bottom and liquid-sucking core base.
9. evaporator according to claim 6, it is characterised in that the evaporator also includes bottom, the bottom is set
Hot body is taken near one end of the liquid-sucking core base described, and liquid storage cylinder is provided with the bottom.
10. the evaporator according to any one of claim 7 to 9, it is characterised in that the liquid-sucking core base and the storage
Heat insulation is additionally provided between sap cavity.
11. evaporators according to claim 10, it is characterised in that between the heat insulation and the liquid-sucking core base also
It is provided with insulated cavity.
12. evaporator according to any one of claim 7 to 9, it is characterised in that be provided with the bottom with it is described
The interface of liquid line connection.
13. evaporators according to claim 12, it is characterised in that the bottom by welding, screw and/or screw thread with
It is described to take hot body and fix.
14. evaporator according to any one of claim 7 to 9, it is characterised in that the evaporator also includes top cover,
The top cover takes the side that hot body is connected with steam pipework described in being arranged on, and is provided with the top cover and the steam pipework connects
The interface for connecing.
15. evaporators according to claim 14, it is characterised in that the liquid-sucking core is by metal dust, wire netting or pottery
The porous material that porcelain powder is made.
16. evaporators according to claim 15, it is characterised in that the liquid-sucking core is shaped as rotary part.
17. evaporators according to claim 16, it is characterised in that the liquid-sucking core is provided with blind near its base side
Hole, one end of the liquid line is arranged in the blind hole.
18. evaporators according to claim 1, it is characterised in that the top of the liquid-sucking core is provided with spill liquid storage cylinder.
A kind of 19. heat abstractors of loop circuit heat pipe, including steam pipework, liquid line and condenser, it is characterised in that also include
Evaporator any one of claim 1 to 18, the evaporator both sides respectively by steam pipework and liquid line with
The condenser is connected, and forms closure heat-radiation loop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510093372.8A CN104613801B (en) | 2015-03-03 | 2015-03-03 | Evaporator and heat dissipation device for loop heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510093372.8A CN104613801B (en) | 2015-03-03 | 2015-03-03 | Evaporator and heat dissipation device for loop heat pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104613801A CN104613801A (en) | 2015-05-13 |
| CN104613801B true CN104613801B (en) | 2017-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510093372.8A Expired - Fee Related CN104613801B (en) | 2015-03-03 | 2015-03-03 | Evaporator and heat dissipation device for loop heat pipe |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105403086A (en) * | 2015-12-24 | 2016-03-16 | 中国航空工业集团公司北京航空制造工程研究所 | Storage tank and device for filling of alkali-metal heat pipe as well as method for filling heat pipe with alkali metal |
| CN105841527A (en) * | 2016-03-28 | 2016-08-10 | 天津商业大学 | Phase change drive loop heat pipe with evaporator of annular structure |
| CN106500536A (en) * | 2016-12-30 | 2017-03-15 | 张海娟 | Heat-pipe radiator |
| CN113434030B (en) * | 2021-06-16 | 2023-03-21 | 华南理工大学 | Loop heat pipe radiator for server CPU radiation and use method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010008025A (en) * | 2008-06-30 | 2010-01-14 | Fujitsu Ltd | Loop heat pipe and electronic device |
| CN101830531A (en) * | 2010-04-27 | 2010-09-15 | 武汉大学 | Low-temperature residual heat seawater desalinizing system |
| CN101839662A (en) * | 2009-03-21 | 2010-09-22 | 富瑞精密组件（昆山）有限公司 | Heat pipe |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101592450B (en) * | 2008-05-28 | 2012-03-28 | 阳杰科技股份有限公司 | Evaporator and loop heat pipe using same |
| CN103344143B (en) * | 2013-06-08 | 2015-05-20 | 北京航空航天大学 | Evaporator and liquid reservoir used for loop heat pipe and application thereof |
| CN103712498B (en) * | 2013-12-19 | 2015-05-20 | 华中科技大学 | Double-capillary-core evaporator applied to flat-type LHP system |
| CN204923989U (en) * | 2015-03-03 | 2015-12-30 | 中国科学院工程热物理研究所 | Evaporimeter and heat abstractor of loop heat pipe |
-
2015
- 2015-03-03 CN CN201510093372.8A patent/CN104613801B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010008025A (en) * | 2008-06-30 | 2010-01-14 | Fujitsu Ltd | Loop heat pipe and electronic device |
| CN101839662A (en) * | 2009-03-21 | 2010-09-22 | 富瑞精密组件（昆山）有限公司 | Heat pipe |
| CN101830531A (en) * | 2010-04-27 | 2010-09-15 | 武汉大学 | Low-temperature residual heat seawater desalinizing system |
Non-Patent Citations (1)
| Title |
|---|
| C P L复合毛细芯流动性能及工质特性分析;宣益民等;《工程热物理学报》;20031130;第24卷(第6期);第1007-1009页，图1 * |
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| CN104613801A (en) | 2015-05-13 |
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