CN101738120B - Sensible heat-latent heat compound thermal storage device - Google Patents
Sensible heat-latent heat compound thermal storage device Download PDFInfo
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- CN101738120B CN101738120B CN2010101052556A CN201010105255A CN101738120B CN 101738120 B CN101738120 B CN 101738120B CN 2010101052556 A CN2010101052556 A CN 2010101052556A CN 201010105255 A CN201010105255 A CN 201010105255A CN 101738120 B CN101738120 B CN 101738120B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
- F28D20/023—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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Abstract
The invention relates to a sensible heat-latent heat compound thermal storage device based on silicon carbide ceramics. The compound thermal storage device comprises a ceramic support framework (1) of the compound thermal storage device, a detachable silicon carbide ceramic cover plate (6), a silicon carbide ceramic heat exchange pipeline (7) and a silicon carbide foam ceramic framework (8); and the ceramic support framework (1) of the compound thermal storage device, the detachable silicon carbide ceramic cover plate (6), the silicon carbide ceramic heat exchange pipeline (7) and the silicon carbide foam ceramic framework (8) commonly constitute a thermal storage container by integral forming. A phase change material (9) is injected into the silicon carbide foam ceramic framework (8) for realizing latent heat thermal storage. A phase change energy-storing material expansion space (2) and the detachable silicon carbide ceramic cover plate (6) are arranged at the upper part of the compound thermal storage device. The sensible heat-latent heat compound thermal storage device can realize the compound thermal storage of silicon carbide ceramic sensible heat below 1600 DEG C and the phase change material (9) latent heat.
Description
Technical field
The present invention relates to a kind of thermal storage device, particularly based on the compound thermal storage device of silicon carbide ceramics.
Background technology
Solar energy is inexhaustible, nexhaustible regenerative resource, and the today of reduce year by year at fossil fuel, the international energy situation is severe day by day, development and use solar energy is one of important channel of realizing energy supply diversification, assurance energy security.And solar energy has the noncontinuity characteristics, and the heat reservoir of the suitable solar energy heat utilization field of exploitation is significant.
Sensible heat, latent heat and three kinds of heat accumulation modes of chemical energy are arranged at present.The sensible heat heat-storage technology is the simplest with the most ripe, uses wider.Sensible heat heat accumulating commonly used has water, oil, masonry and cement etc.The latent heat heat accumulation is called phase-change thermal storage again, utilizes material when phase transformation, to absorb or discharges latent heat of phase change and fill heat and heat release, and material is in constant temperature or is changing in the narrow temperature scope very much in phase transition process, is the heat accumulation mode the widest, that research is more of using at present.The chemical energy heat accumulation is bigger than the unit volume quantity of heat storage of sensible heat heat accumulation and latent heat heat accumulation, and can long term storage, but because technology is comparatively complicated, cost is high, does not still have application in the industry.Aspect compound heat accumulation, sensible heat-sensible heat heat accumulation is arranged, promptly adopt different sensible heat heat accumulation working medium, utilize variations in temperature store heat separately.Usually the sensible heat heat-storing device that contains the metal heat exchanger tube all belongs to this type heat accumulation, as is embedded with the concrete thermal storage device of metal tube; Sensible heat-latent heat heat accumulation is about to the use that is combined with each other of phase-change heat-storage material and sensible heat material, like the phase-change material micro-capsule material; U.S. Pat 005709945A is encapsulated in organic phase change materials such as paraffin in the capsule material, forms the microcapsules of 1-10mm; Capsule material does not undergo phase transition in the use, utilizes self sensible heat store heat, and solid-liquid phase change then takes place phase-change materials such as paraffin; Discharge or absorb latent heat; This kind thermal energy storage material only can use in the environment below 100 ℃ at present, and because the damaging problem of microcapsules has limited its service life.Patent WO2009/138771A2 has reported and has a kind ofly utilized multiple phase-change material to realize that many potential temperatures fill the method for heat-heat release; Difference according to solar radiation or hot-fluid temperature; Store the heat under the different potential temperatures; This technology is mainly used in refrigeration and heats the aspect, therefore is mainly used in the heat of 15 ℃ of-65 ℃ of left and right sides temperature of storage.Chinese patent CN100999657A has reported the technology of preparing of organic matter/expanded graphite composite phase-changing heat storage material; Utilize self the sensible heat heat accumulation and the organic solid-liquid phase change of expanded graphite to carry out the latent heat heat accumulation; Form thermal energy storage material, be used for fields such as electronic equipment cooling, because the restriction of organic phase change material; This technological serviceability temperature is confined to can't be applied to the high temperature field between 60 ℃-75 ℃.Phase-change materials such as inorganic salts and ceramic based material are combined with each other; Utilize the liquid salt of the capillary force absorption inorganic salts solid-liquid phase change process formation of ceramic base; Its heat accumulation mechanism is that ceramic based material is a matrix material, plays the effect of carrying-absorption inorganic salts, utilizes the thermal capacitance of self to carry out heat accumulation simultaneously; And the inorganic salts material undergoes phase transition, and discharges or absorb latent heat.Like Chinese patent CN1328107A; The preparation process that has related to said material; Its serviceability temperature can reach 850 ℃-1000 ℃; But because that the water imbibition of inorganic salts makes at the medium-term and long-term stability in use of atmospheric environment is relatively poor, the preparation technology of this kind material is comparatively complicated in addition, has limited it and has used more widely.
Summary of the invention
The objective of the invention is to overcome that existing sensible heat-not high, the long-term stability in use of latent heat thermal energy storage material serviceability temperature is poor, complicated process of preparation, charge and discharge deficiencies such as thermal process efficient is lower, a kind of thermal storage device and compound heat-storing method of sensible heat-latent heat based on silicon carbide ceramics is provided.
The compound thermal storage device of the present invention comprises parts such as compound thermal storage device ceramic support skeleton, phase-change material expansion space, detachable silicon carbide ceramics cover plate, silicon carbide ceramics heat exchange pipeline, foam silicon carbide ceramics skeleton.Compound thermal storage device ceramic support skeleton, detachable silicon carbide ceramics cover plate and silicon carbide ceramics heat exchange pipeline are processed with compact silicon carbide ceramic, and the compact silicon carbide ceramic thermal conductivity is high, mechanical property is excellent, and be suitable to structural material.The foam silicon carbide ceramics skeleton is processed by foam silicon carbide ceramics, and foam silicon carbide ceramics is the porous ceramic bodies with high porosity of three dimensions grid structure.Compound thermal storage device ceramic support skeleton, silicon carbide ceramics heat exchange pipeline and foam silicon carbide ceramics skeleton are one-body molded, form the compound thermal storage device of sensible heat-latent heat.It is peripheral that compound thermal storage device ceramic support skeleton is positioned at described compound thermal storage device; The silicon carbide ceramics heat exchange pipeline is interspersed in compound thermal storage device ceramic support skeleton with the foam silicon carbide ceramics skeleton that is used for heat accumulation.Inject phase-change material in the foam silicon carbide ceramics skeleton, like organic matter, Nitrates, carbonate and liquid metal alloy etc. carry out heat accumulation.Foam silicon carbide ceramics has the three-dimensional pore space structure, has guaranteed that phase-change material is in intraskeletal even distribution of foam silicon carbide ceramics and efficient transfer of heat.Compound thermal storage device ceramic support skeleton is positioned at the top of compound thermal storage device, and compound thermal storage device ceramic support skeleton below is provided with the phase-change material expansion space, guarantees that phase-change material has sufficient expansion space by solid-state changing in the liquid process.Detachable silicon carbide ceramics cover plate is equipped with on compound thermal storage device ceramic support skeleton top, guarantees the sealing inner to compound thermal storage device.Have on the compound thermal storage device ceramic support skeleton and vacuumize hole and phase-change material inlet.In order to realize and the enhanced heat exchange on heat transfer stream side that the silicon carbide ceramics heat exchange pipeline can be light pipe or have the interior heat exchange pipeline of inserting thing, inserts thing in it and can be like band iron, fried dough twist iron, the tie etc. that intersects.Compound thermal storage device periphery is provided with heat-insulation layer, can reduce thermal loss, and the sealed composite thermal storage device.
Compact silicon carbide ceramic and foam silicon carbide ceramics all do not undergo phase transition among the present invention, in whole heat transfer process, utilize self variations in temperature storage sensible heat, and the phase-change material of adding carries out the solid-liquid phase change diabatic process, discharges or absorb latent heat, realizes the latent heat heat accumulation.The thermal conductivity factor of foam silicon carbide ceramics skeleton is greater than 100W/ (mK); And heat transfer medium between carry out in the process of heat exchange; The high temperature that local heat absorption forms can be through three-dimensional porous skeleton to conduction rapidly all around; Simultaneously, through the three-dimensional pore space structure of design 1-6mm, can fill heat, rate of heat release to the solid-liquid phase change material design of different heat transfer characteristic.Thyrite and most organic phase change material, inorganic salts, liquid metal alloy etc. all have the better chemical compatibility; Can avoid the corrosion of phase-change material to container and heat exchange pipeline; In addition; Through to the heat vessel extracting vacuum, can phase-change material evenly be encapsulated in the heat vessel, guarantee that foam silicon carbide ceramics fully contacts with phase-change material.Phase-change material holds at internal tank, and use keeps sealing fully, and is isolated with the outside air environment, can avoid the moisture absorption of phase-change material such as inorganic salts to destroy.Compound thermal storage device periphery is coated with heat-insulation layer, not only can reduce thermal loss but also can play sealing function.Compact silicon carbide ceramic that the compound thermal storage device of the present invention is used and foam silicon carbide ceramics and phase-change material produced by separation, technology is simple, and is easy to implement.
The course of work of the present invention is following:
The compound thermal storage device of sensible heat-latent heat of the present invention is with compact silicon carbide ceramic and the integrated container that is loaded with phase-change working substance of foam silicon carbide ceramics; Have the function of heat exchanger concurrently; Its use is heat-transfer fluid and the direct heat transfer of compact silicon carbide ceramic heat exchanger tube, the heat efficient transfer is given the phase-change working substance of inner splendid attire through the foam silicon carbide ceramics skeleton.Filling thermal process, the high temperature heat transfer fluid flows through in the heat exchanger tube that compact silicon carbide ceramic constitutes, and through forced convection heat transfer, compact silicon carbide ceramic heat exchanger tube temperature raises; Heat passes to phase-change working substance to internal delivery rapidly through foam silicon carbide ceramics simultaneously, and temperature raise after solid-state phase changes working medium absorbed heat; Realize solid-state sensible heat heat accumulation, wait to reach and begin after the phase transition temperature to melt, absorb latent heat of phase change; This moment, temperature changed in narrower scope, realized the latent heat heat accumulation, treated all to melt for after the liquid state; Temperature continues to raise, and realizes liquid sensible heat heat accumulation, and whole process high temperature heat transfer fluid is cooled; At exothermic process, low temperature heat transfer fluid flows through in the heat exchanger tube that compact silicon carbide ceramic constitutes, through forced convection heat transfer; Compact silicon carbide ceramic heat exchanger tube temperature reduces, and the heat of phase-change working substance passes to the compact silicon carbide ceramic heat exchanger tube rapidly through foam silicon carbide ceramics, and temperature reduces after the liquid phase-change working medium release heat; Realize liquid sensible heat heat release, begin to solidify after waiting to reach phase transition temperature, discharge latent heat of phase change; This moment, temperature changed in narrower scope, realized the latent heat heat release, treat all to be solidified as solid-state after; Temperature continues to reduce, and realizes solid-state sensible heat heat release, and whole process low temperature heat transfer fluid is heated.
The three-dimensional pore space architectural feature of foam silicon carbide ceramics makes has bigger heat transfer area between phase-change material and foamed ceramics, and can realize three-dimensional enhanced heat exchange, and heat transfer efficiency is higher.The choose reasonable equivalent diameter can increase the heat exchange area between phase-change material and skeleton in aperture size and structure, the raising porosity of the silicon carbide foam ceramic material between 1-6mm; Improve heat transfer efficiency; But the raising of porosity can reduce the mass fraction of phase-change working substance, reduces total quantity of heat storage of system.The thermal conductivity factor of compact silicon carbide ceramic and foam silicon carbide ceramics is an important parameter, selects high thermal conductivity materials to help improving heat transfer stream side heat transfer efficiency.
The present invention is simple in structure; Self has high melt point thyrite; According to the difference of phase-change working substance character, can be at room temperature to 1600 ℃ following steady operation, thyrite can keep chemical property stable under the multiple heat transfers such as gas under most inorganic salts, metal, the oxidizing atmosphere, heat accumulation working medium interact; Adaptability is strong, uses wide.
Description of drawings
The compound thermal storage device structural representation of Fig. 1 sensible heat-latent heat of the present invention;
The compound thermal storage device left view of Fig. 2 sensible heat-latent heat of the present invention;
Insert the compact silicon carbide ceramic heat exchange pipeline of halved belt in Fig. 3;
Among the figure: 1 compound thermal storage device ceramic support skeleton, 2 phase-change material expansion spaces, 3 vacuumize hole, 4 heat-insulation layers, 5 phase-change material inlets, 6 detachable silicon carbide ceramics cover plates, 7 silicon carbide ceramics heat exchange pipelines, 8 foam silicon carbide ceramics skeletons, 9 phase-change materials, 10 hot fluids, 11 cold fluids.
The specific embodiment
Further specify the present invention below in conjunction with the accompanying drawing and the specific embodiment.
Shown in Figure 1 for the structural representation of the compound thermal storage device of silicon carbide ceramics sensible heat-latent heat of the present invention.The compound thermal storage device of the present invention comprises compound thermal storage device ceramic support skeleton 1, phase-change material expansion space 2, vacuumizes hole 3, heat-insulation layer 4, phase-change material inlet 5, detachable silicon carbide ceramics cover plate 6, silicon carbide ceramics heat exchange pipeline 7, foam silicon carbide ceramics skeleton 8 and phase-change material 9.Compound thermal storage device ceramic support skeleton 1, detachable silicon carbide ceramics cover plate 6 and silicon carbide ceramics heat exchange pipeline 7 are processed with compact silicon carbide ceramic.Compound thermal storage device ceramic support skeleton 1, silicon carbide ceramics heat exchange pipeline 7 and foam silicon carbide ceramics skeleton 8 are one-body molded, form the compound thermal storage device of sensible heat-latent heat.It is peripheral that compound thermal storage device ceramic support skeleton 1 is positioned at compound thermal storage device, constitutes the external structure of compound thermal storage device; Silicon carbide ceramics heat exchange pipeline 7 is interspersed in compound thermal storage device ceramic support skeleton with foam silicon carbide ceramics skeleton 8.Inject phase-change material 9 in the foam silicon carbide ceramics skeleton 8 and carry out heat accumulation.Foam silicon carbide ceramics has the three-dimensional pore space structure, has guaranteed even distribution and the efficient transfer of heat of phase-change material 9 in foam silicon carbide ceramics skeleton 8.Compound thermal storage device ceramic support skeleton 1 is positioned at the top of compound thermal storage device, and the below of compound thermal storage device ceramic support skeleton 1 is provided with phase-change material expansion space 2, guarantees that phase-change material has sufficient expansion space by solid-state changing in the liquid process.Detachable silicon carbide ceramics cover plate 6 is equipped with on the top of compound thermal storage device ceramic support skeleton 1, guarantees the sealing inner to compound thermal storage device.Have on the compound thermal storage device ceramic support skeleton 1 and vacuumize hole 3 and phase-change material inlet 5.Guarantee to be in vacuum state in the compound thermal storage device through vacuumizing hole 3, help the liquid phase-change material and fully enter into compound thermal storage device through phase-change material inlet 5.In order to realize and the enhanced heat exchange on heat transfer stream side that silicon carbide ceramics heat exchange pipeline 7 can be light pipe or have the interior heat exchange pipeline of inserting thing, inserts thing in it and can be like band iron, fried dough twist iron, the tie etc. that intersects.Phase-change material 9 can be an organic matter, Nitrates, carbonate and liquid metal alloy etc.Compound thermal storage device periphery is provided with heat-insulation layer, can reduce thermal loss and sealing.
Shown in Figure 2 for the left view of the compound thermal storage device of silicon carbide ceramics sensible heat-latent heat of the present invention.Offer phase-change material inlet 5 on the compound thermal storage device ceramic support skeleton 1.Phase-change material inlet 5 runs through whole compound thermal storage device.
Insert the compact silicon carbide ceramic heat exchange pipeline of halved belt in the band of using for the compound thermal storage device of silicon carbide ceramics sensible heat-latent heat of the present invention shown in Figure 3.Fluid gets into compact silicon carbide ceramic heat exchange pipeline 7, in the middle of interior slotting thing, produces flow-disturbing, reaches the effect of augmentation of heat transfer.
During work; Before charging into phase-change material 9; Through vacuumizing hole 3 compound thermal storage device is evacuated to vacuum state; Under suction function, be injected in the thermal storage device, after waiting to be full of detachable silicon carbide ceramics cover plate 6 covered, accomplish the making of thermal storage device through the phase-change material 9 of phase-change material inlet 5 with liquid state.With the high-temperature water vapor is hot fluid 10, and water is cold fluid 11, carbonate be phase-change material 9 specify present embodiment fill heat and exothermic process.
Fill the hot stage, hot fluid 10 flows in the silicon carbide ceramics heat exchange pipeline of being made up of compact silicon carbide ceramic 7, carries out the forced-convection heat transfer process with foam silicon carbide ceramics skeleton 8 and phase-change material 9.Whole heat transfer process is divided into three phases.After hot fluid 10 enters into compound thermal storage device; Foam silicon carbide ceramics skeleton 8 and solid-state carbonate phase-change material 9 absorb the heat of hot fluids 10 and heat up, and foam silicon carbide ceramics skeleton 8 and carbonate phase-change material 9 carry out the sensible heat heat accumulation stage that sensible heat heat accumulation and water vapour carry out the sensible heat heat release.Along with the carrying out of heat exchange, carbonate reaches melting temperature, by the solid-state liquid state that becomes, realizes the latent heat heat accumulation, and foam silicon carbide ceramics skeleton 8 still is the sensible heat heat accumulation.10 carrying out along with heat exchange of hot fluid, temperature constantly reduces, and becomes subcooled water steam or aqueous water, and sensible heat heat release or latent heat heat release take place.This stage has been realized the sensible heat/latent heat heat accumulation of compound thermal storage device.Liquid phase-change material 9 and foam silicon carbide ceramics skeleton 8 through with the heat exchange of water at low temperature steam or aqueous water, temperature continues to raise, and realizes the sensible heat heat accumulation of liquid phase-change material 9 and foam silicon carbide ceramics skeleton 8.Latent heat heat release or sensible heat heat release take place through heat exchange in subcooled water steam or aqueous water, and cold fluid 11 flows out from compound thermal storage device with the aqueous water form, accomplish the thermal process of filling of thermal storage device.Because the density of solid-state phase changes material is higher than liquid refrigerant, in filling thermal process, solid absorbs heat and melts, and volume expands immediately and becomes big, and whole thermal storage device volume is confirmed according to the volume of liquid phase-change working medium.
Exothermic phase, cold fluid 11 flows in the silicon carbide ceramics heat exchange pipeline of being made up of compact silicon carbide ceramic 7, carries out the forced-convection heat transfer process with foam silicon carbide ceramics skeleton 8 and phase-change material 9, and whole exothermic process is divided into three phases.Cold fluid 11 flows in the silicon carbide ceramics heat exchange pipeline of being made up of compact silicon carbide ceramic 7, absorbs the heat that foam silicon carbide ceramics skeleton 8 and phase-change material 9 store.The temperature of cold fluid 11 raises, and becomes high-temperature water, and phase-change material 9 passes through release heat with foam silicon carbide ceramics skeleton 8, and the sensible heat heat release takes place.High-temperature water is through heat exchange, and temperature continues to raise, and becomes superheated water or water vapour, and phase-change material 9 reaches freezing point temperature along with the reduction of temperature, becomes the solid carbonate class, realize the latent heat heat release, and foam silicon carbide ceramics skeleton 8 still is the sensible heat exothermic process.In the phase III of heat release, solid phase change material 9 is emitted the sensible heat of self storing with foam silicon carbide ceramics makes superheated water or water vapour become high-temperature water vapor.Hot fluid 10 flows out from heat exchanger tube with the form of high-temperature vapor, accomplishes the exothermic process of compound thermal storage device.
Filling in heat and the exothermic process of compound thermal storage device; All realized the latent heat heat accumulation and the heat release of phase-change material, according to the characteristic of heat exchanging fluid, heat exchanging fluid undergoes phase transition under certain condition simultaneously; Become liquid at exothermic process by gaseous state, become gaseous state by liquid state at exothermic process.
Claims (4)
1. one kind based on the compound thermal storage device of silicon carbide ceramics sensible heat-latent heat, it is characterized in that described compound thermal storage device comprises compound thermal storage device ceramic support skeleton (1), detachable silicon carbide ceramics cover plate (6) and silicon carbide ceramics heat exchange pipeline (7) and foam silicon carbide ceramics skeleton (8); Compound thermal storage device ceramic support skeleton (1), detachable silicon carbide ceramics cover plate (6), silicon carbide ceramics heat exchange pipeline (7) and the one-body molded common composition heat vessel of foam silicon carbide ceramics skeleton (8); Silicon carbide ceramics heat exchange pipeline (7) is interspersed in compound thermal storage device ceramic support skeleton (1) with foam silicon carbide ceramics skeleton (8); Compound thermal storage device ceramic support skeleton (1) is positioned at the periphery of described compound thermal storage device; The below of compound thermal storage device ceramic support skeleton (1) is provided with phase-change material expansion space (2), and detachable silicon carbide ceramics cover plate (6) is equipped with on ceramic support skeleton (1) top of compound thermal storage device; Described compound thermal storage device outside is added with heat-insulation layer (4).
2. according to the compound thermal storage device of the said silicon carbide ceramics sensible heat-latent heat of claim 1, it is characterized in that silicon carbide ceramics heat exchange pipeline (7) is the compact silicon carbide ceramic light pipe, insert thing in being provided with or not being provided with in the silicon carbide ceramics heat exchange pipeline (7).
3. according to the compound thermal storage device of the said silicon carbide ceramics sensible heat-latent heat of claim 1, it is characterized in that having on the compound thermal storage device ceramic support skeleton (1) and vacuumize hole (3) and phase-change material inlet (5); Phase-change material inlet (5) runs through whole compound thermal storage device; Described compound thermal storage device makes the inner negative pressure that forms of foam silicon carbide ceramics (8) through vacuumizing hole (3), through phase-change material inlet (5) liquid phase-change material (9) is filled in the foam silicon carbide ceramics skeleton (8) equably.
4. according to the compound thermal storage device of the said silicon carbide ceramics sensible heat-latent heat of claim 3, the said liquid phase-change material (9) that it is characterized in that being used for heat accumulation is an organic matter, or Nitrates or carbonate or liquid metal alloy.
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| CN101922796B (en) * | 2010-07-14 | 2012-06-20 | 中国科学院电工研究所 | High-temperature air resistance furnace using silicon carbide foamed ceramic to enhance radiation absorption |
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2010
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