CN202025740U - Plate sintering heat pipe - Google Patents
Plate sintering heat pipe Download PDFInfo
- Publication number
- CN202025740U CN202025740U CN2011201052289U CN201120105228U CN202025740U CN 202025740 U CN202025740 U CN 202025740U CN 2011201052289 U CN2011201052289 U CN 2011201052289U CN 201120105228 U CN201120105228 U CN 201120105228U CN 202025740 U CN202025740 U CN 202025740U
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- coverboard
- casing
- capillary structure
- working fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of electronic radiating devices, in particular to a plate sintering heat pipe, which comprises a casing, a capillary organization, a support structure and working fluid. The casing includes a lower casing plate and an upper casing plate connected onto the lower casing plate in enclosed mode. The capillary organization is arranged on the inner wall of the casing. The support structure is arranged inside the casing and formed by a plurality of hollow net structures and a plurality of copper cylinders. The working fluid is filled in the casing. Heat of a heating element leads the working fluid in the capillary organization to be heated to evaporate, and the vapor passes through the hollow net structures and transfers the heat to outer radiating fins through the casing, thereby realizing radiation of the heating element. The route of heat conduction is greatly shortened, therefore efficiency of the plate sintering heat pipe is greatly improved, and heat conducting performance of the heating element is optimized. In addition, the copper cylinders can evenly support the upper casing plate and the lower casing plate, thereby ensuring that the casing does not deform or sink.
Description
Technical field:
The utility model relates to electronic radiation device technique field, refers in particular to a kind of being applied in the electronic wafer cooling system, can reduce the wafer working temperature greatly, increase work efficiency, prolongs the flat sintered heat pipe in wafer life-span.
Background technology:
Along with the fast development of electronic chip technology, the heat dissipation problem of electronic equipment becomes more and more important.At present, there is following outstanding feature in the heat dissipation problem of electronic equipment:
1, local heat flux density is increasing, and heat focuses in the part easily, causes local temperature too high;
2, density of heat flow rate skewness, high heat flux mostly just are confined in the very little scope;
3, in the electronic equipment start-up course, occur instantaneous power easily and " rise violently ", burn out electronic equipment.
Therefore, the heat dissipation problem cooling that solves electronic equipment is an important means, and the key of electronic equipment cooling is how fast heat to be derived, and it is too high to reduce local temperature, prevents focus and causes equipment fault.For this reason, the insider has developed vapor chamber (flat sintered heat pipe) successively, and itself and radiator are made up, with the heat dissipation problem of effective solution present stage electronic equipment.
The structure of general known flat sintered heat pipe is made up of housing A, capillary structure B, supporting construction C and working fluid D as shown in Figure 1.The last coverboard A2 of coverboard A1 and this time of involution coverboard under this housing A comprises, this capillary structure B places in this housing A and capillary structure B inside is formed with clearance space B1, this supporting construction C places this clearance space B1, in order to support capillary structure B and this housing A, supporting construction C is formed by plate stamping, form the wave profile of bending continuously, between capillary structure B, form two or more septal pathways B2; With this time coverboard A1, last coverboard A2 four side weld joints, and after pouring into required working fluid D, inside is vacuumized, form this flat sintered heat pipe.
When above-mentioned flat sintered heat pipe uses, for example go up coverboard A2 outer surface in its one side a plurality of radiating fins are set, following coverboard A1 then is attached at the surface of heater element, the heat of heater element makes down the interior working fluid D of capillary structure B of coverboard A1 surface contact be subjected to thermal evaporation, steam is via these septal pathwayses B2, formed slit between the dual-side by this supporting construction C and this housing A, flow in the capillary structure B that contacts with last coverboard A2 surface, with with heat transferred to radiating fin, thereby carry out the heat radiation of heater element.
Yet the working fluid D of above-mentioned flat sintered heat pipe must be via the septal pathways B2 in long path, just can arrive at should go up the surperficial capillary structure B that contacts of coverboard A2 in, to carry out heat exchange.Because heat conduction path is quite long, therefore will causes the inefficiency of this flat sintered heat pipe, and then influence the heat conduction efficiency of this heater element.In addition, especially long because of the path of this septal pathways B2, easily cause coverboard A2 in the supporting construction C support or the support force of coverboard A1 is inhomogeneous down, make housing A produce the phenomenon of distortion, depression.
Another kind of known flat sintered heat pipe structure as shown in Figure 2, its with earlier figures 1 in unique difference of known flat sintered heat pipe structure be that supporting construction is different, for single copper post as support.Its defective is difficult for assembling for producing, and causes production efficiency low.
Therefore, how to overcome the above-mentioned existing existing shortcoming of known flat sintered heat pipe, be the problem that needs to be resolved hurrily at present.
The utility model content:
Technical problem to be solved in the utility model overcomes existing deficiency in the present like product exactly, provides to be applied in the electronic wafer cooling system, can reduce the wafer working temperature greatly, increase work efficiency, prolongs the flat sintered heat pipe in wafer life-span.
For solving the problems of the technologies described above, the utility model has adopted following technical scheme: comprise housing, capillary structure, supporting construction and working fluid; Coverboard and involution were connected in the described last coverboard of coverboard down under housing comprised; This capillary structure is laid in inner walls; This supporting construction places enclosure interior, and supporting construction is made up of the network structure and the copper post of a plurality of hollow outs; Working fluid is filled in the housing.
The utility model can be that the described coverboard inner surface sintering of going up has one deck capillary structure.
The utility model can also be that described upward coverboard, the following equal sintering of coverboard inner surface have one deck capillary structure.
Concrete, described capillary structure is the metal dust capillary structure.
More specifically, described copper post embeds in the capillary structure.
Further, the two ends of described copper post lay respectively at cancellated both sides.
Further, it is netted that described network structure is spliced into the plane by the triangle of a plurality of hollow outs, and wherein, each splice point place all has the copper post.
In sum, the utility model supporting construction is made up of the network structure and the copper post of a plurality of hollow outs; The heat of heater element makes the working fluid in the capillary structure be subjected to thermal evaporation, and steam is via the network structure of the hollow out of this supporting construction, by housing with heat transferred to external heat fins, thereby carry out the heat radiation of heater element.Because working fluid need not just can go out heat conduction via longer path, heat conduction path shortens greatly, so the efficient of this flat sintered heat pipe promoted greatly, optimizes the heat conduction efficiency of this heater element.In addition, the copper post of supporting construction correspondence can evenly support coverboard and reach coverboard down, guarantees that housing can not produce the phenomenon of distortion, depression; It is more efficient to conduct heat, and can boost productivity greatly.
Description of drawings:
Fig. 1 is the sectional view that known flat sintered heat pipe adopts wave profile supporting construction;
Fig. 2 is the sectional view that known flat sintered heat pipe adopts single copper post supporting construction;
Fig. 3 is the three-dimensional exploded view of the utility model embodiment one;
Fig. 4 is the profile of the utility model embodiment one;
Fig. 5 is the E place partial enlarged drawing among Fig. 4;
Fig. 6 places down the interior vertical view of coverboard for supporting construction among the utility model embodiment one;
Fig. 7 is the supporting construction stereogram of the utility model embodiment one;
Fig. 8 is the F place partial enlarged drawing among Fig. 7;
Fig. 9 is the three-dimensional exploded view of the utility model embodiment two;
Figure 10 is the profile of the utility model embodiment two;
Figure 11 is the G place partial enlarged drawing among Figure 10;
Figure 12 is the profile of the utility model embodiment three.
Description of reference numerals:
The A housing
Coverboard under the A1
The last coverboard of A2
The B capillary structure
The B1 clearance space
The B2 septal pathways
The C supporting construction
The D working fluid
The a housing
Coverboard under the a1
The last coverboard of a2
The b capillary structure
The b1 accommodation space
The b2 septal pathways
The c supporting construction
C1 copper post
The c2 network structure
The d working fluid
Embodiment:
Embodiment one
Seeing Fig. 3---Fig. 6, present embodiment comprises: be made up of housing a, capillary structure b, supporting construction c and working fluid d.The last coverboard a2 of coverboard a1 and this time of involution coverboard a1 under this housing a comprises, this capillary structure b places in this housing a, following coverboard a1 inner surface sintering has one deck capillary structure b, last coverboard a2 inner surface also sintering has one deck capillary structure b, simultaneously, capillary structure b inside is formed with accommodation space b1, forms two or more septal pathways b2 between capillary structure b; This supporting construction c places this accommodation space b1, in order to support capillary structure b and this housing a;
See shown in Fig. 7,8 that supporting construction c is made up of the network structure c 1 and the copper post c2 of a plurality of hollow outs, supporting construction c has a plurality of copper post c2, and the two ends of copper post c2 lay respectively at the both sides of network structure c1; Especially, in the present embodiment, it is netted that network structure c1 is spliced into the plane by the triangle of a plurality of hollow outs, wherein, each splice point place all has copper post c2, and the two ends of this copper post c2 lay respectively at the both sides of network structure c1, support capillary structure b and this housing a by copper post c2;
With this time coverboard a1, last coverboard a2 four side weld joints, and after pouring into required working fluid d, inside is vacuumized, form this flat sintered heat pipe, working fluid d can be water, alcohols, or other phase-change liquids.
When the flat sintered heat pipe of present embodiment uses, for example go up coverboard a2 outer surface in its one side a plurality of radiating fins are set, following coverboard a1 then is attached at the surface of heater element, the heat of heater element makes down the interior working fluid d of capillary structure b of coverboard a1 surface contact be subjected to thermal evaporation, steam is via these septal pathwayses b2, the network structure c1 of the hollow out by this supporting construction c, flow in the capillary structure b that contacts with last coverboard a2 surface, with with heat transferred to radiating fin, thereby carry out the heat radiation of heater element.
Because the working fluid d of present embodiment flat sintered heat pipe need not be via in the capillary structure b that longer path just can be arrived at upward coverboard a2 surface contacts, to carry out heat exchange, heat conduction path shortens greatly, therefore the efficient of this flat sintered heat pipe is promoted greatly, optimizes the heat conduction efficiency of this heater element.In addition, the copper post c2 of supporting construction c correspondence evenly distributes, and can evenly support coverboard a2 and reach coverboard a1 down, guarantees that housing a can not produce the phenomenon of distortion, depression.
In addition, after supporting construction c adopts copper powder and the moulding of plastic cement mixed injection molding, high temperature sintering and making again, plastic cement volatilizees and only stays the copper post c2 of capillary structure during sintering, and the length of copper post c2 can be made different size respectively according to the actual gap of upper and lower coverboard.
Embodiment two
See Fig. 9---Figure 11, the structure of present embodiment is identical with embodiment one basically, and difference is that last coverboard a2 inner surface does not have sintering one deck capillary structure b.
When the flat sintered heat pipe of present embodiment was placed to above the euthermic chip, the working fluid d that is filled in the housing a came into operation, and low-temperature evaporation under the condition of vacuum is taken away the heat that euthermic chip produces; Working fluid d is dredging down, flow to rapidly housing a around, make the heat of euthermic chip be evenly distributed to each position of housing a.Regelation becomes liquid after working fluid d steam is met cold release latent heat, and liquid can rely on the capillary absorption affinity suction of porous capillary structure to return evaporation ends along the copper post c2 of supporting construction; So, then can form the cyclic process of working fluid d.
Identical with embodiment one, since the working fluid d of present embodiment flat sintered heat pipe need not via longer path just can flow to rapidly housing a around, make the heat of euthermic chip be evenly distributed to each position of housing a to carry out heat exchange, heat conduction path shortens greatly, therefore the efficient of this flat sintered heat pipe is promoted greatly, optimizes the heat conduction efficiency of this heater element.The copper post c2 of supporting construction c correspondence evenly distributes, and can evenly support coverboard a2 and reach coverboard a1 down, guarantees that housing a can not produce the phenomenon of distortion, depression.
Embodiment three
When the flat sintered heat pipe need have been made boss structure, existing structure will cause can not effectively the be supported support of structure of lug boss position, bear under the external force situation, deform easily, cave in.See Figure 12, in the present embodiment, the following coverboard a1 of flat sintered heat pipe has boss structure, only needs the corresponding height of increasing the copper post c2 of lug boss position, just can solve aforementioned support problem, makes housing a not deform, cave in.
Structure described in previous embodiment one, the embodiment two all can be applicable to embodiment three.
The operation principle of present embodiment three is identical with the operation principle of previous embodiment one or embodiment two, does not give unnecessary details at this.
Certainly; the above only is embodiment of the present utility model; be not to limit the utility model practical range; all equivalences of doing according to the described structure of the utility model claim, feature and principle change or modify, and all should be included in the utility model patent protection scope.
Claims (7)
1. a flat sintered heat pipe is characterized in that: comprise housing, capillary structure, supporting construction and working fluid; Coverboard and involution were connected in the described last coverboard of coverboard down under housing comprised; This capillary structure is laid in inner walls; This supporting construction places enclosure interior, and supporting construction is made up of the network structure and the copper post of a plurality of hollow outs; Working fluid is filled in the housing.
2. a kind of flat sintered heat pipe according to claim 1 is characterized in that: the described coverboard inner surface sintering of going up has one deck capillary structure.
3. a kind of flat sintered heat pipe according to claim 2 is characterized in that: described upward coverboard, the following equal sintering of coverboard inner surface have one deck capillary structure.
4. a kind of flat sintered heat pipe according to claim 1 is characterized in that: described capillary structure is the metal dust capillary structure.
5. a kind of flat sintered heat pipe according to claim 1 is characterized in that: described copper post embeds in the capillary structure.
6. a kind of flat sintered heat pipe according to claim 1, it is characterized in that: the two ends of described copper post lay respectively at cancellated both sides.
7. a kind of flat sintered heat pipe according to claim 6 is characterized in that: it is netted that described network structure is spliced into the plane by the triangle of a plurality of hollow outs, and wherein, each splice point place all has the copper post.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201052289U CN202025740U (en) | 2011-04-12 | 2011-04-12 | Plate sintering heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201052289U CN202025740U (en) | 2011-04-12 | 2011-04-12 | Plate sintering heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202025740U true CN202025740U (en) | 2011-11-02 |
Family
ID=44850682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201052289U Expired - Fee Related CN202025740U (en) | 2011-04-12 | 2011-04-12 | Plate sintering heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202025740U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103841803A (en) * | 2012-11-23 | 2014-06-04 | 金在珍 | Heat sink equipped with thin chamber using thick burnt deposits and boiling |
| CN104754926A (en) * | 2015-04-14 | 2015-07-01 | 厦门烯成科技有限公司 | Heat-conducting sheet and production method of base plate thereof |
| CN106403674A (en) * | 2015-07-27 | 2017-02-15 | 极致科技股份有限公司 | Plate-shaped temperature equalization device |
| CN107509381A (en) * | 2017-09-15 | 2017-12-22 | 维沃移动通信有限公司 | A kind of preparation method of screening cover, screening cover and mobile terminal |
| TWI638129B (en) * | 2017-11-29 | 2018-10-11 | 財團法人工業技術研究院 | Flow channel structure for heat exchanger |
| CN109253641A (en) * | 2018-08-30 | 2019-01-22 | 桂林电子科技大学 | A kind of polyimide flex flat-plate heat pipe |
| TWI652443B (en) | 2018-07-24 | 2019-03-01 | 奇鋐科技股份有限公司 | Heat dissipation unit |
| WO2019056506A1 (en) * | 2017-09-19 | 2019-03-28 | 华为技术有限公司 | Thin type heat uniformizing plate formed by stamping process |
| US11910574B2 (en) | 2018-08-05 | 2024-02-20 | Asia Vital Components Co., Ltd. | Heat dissipation unit |
| CN117870424A (en) * | 2024-01-16 | 2024-04-12 | 华南理工大学 | Soaking plate with stamping supporting structure and manufacturing method thereof |
-
2011
- 2011-04-12 CN CN2011201052289U patent/CN202025740U/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103841803A (en) * | 2012-11-23 | 2014-06-04 | 金在珍 | Heat sink equipped with thin chamber using thick burnt deposits and boiling |
| CN104754926A (en) * | 2015-04-14 | 2015-07-01 | 厦门烯成科技有限公司 | Heat-conducting sheet and production method of base plate thereof |
| CN104754926B (en) * | 2015-04-14 | 2017-11-14 | 厦门烯成石墨烯科技有限公司 | A kind of preparation method of thermal sheet and its bottom plate |
| CN106403674A (en) * | 2015-07-27 | 2017-02-15 | 极致科技股份有限公司 | Plate-shaped temperature equalization device |
| CN106403674B (en) * | 2015-07-27 | 2019-01-04 | 极致科技股份有限公司 | Plate temperature equalization system |
| CN107509381A (en) * | 2017-09-15 | 2017-12-22 | 维沃移动通信有限公司 | A kind of preparation method of screening cover, screening cover and mobile terminal |
| WO2019056506A1 (en) * | 2017-09-19 | 2019-03-28 | 华为技术有限公司 | Thin type heat uniformizing plate formed by stamping process |
| TWI638129B (en) * | 2017-11-29 | 2018-10-11 | 財團法人工業技術研究院 | Flow channel structure for heat exchanger |
| TWI652443B (en) | 2018-07-24 | 2019-03-01 | 奇鋐科技股份有限公司 | Heat dissipation unit |
| US11910574B2 (en) | 2018-08-05 | 2024-02-20 | Asia Vital Components Co., Ltd. | Heat dissipation unit |
| CN109253641A (en) * | 2018-08-30 | 2019-01-22 | 桂林电子科技大学 | A kind of polyimide flex flat-plate heat pipe |
| CN117870424A (en) * | 2024-01-16 | 2024-04-12 | 华南理工大学 | Soaking plate with stamping supporting structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111102 Termination date: 20120412 |