CN106403674A - Plate-shaped temperature equalization device - Google Patents
Plate-shaped temperature equalization device Download PDFInfo
- Publication number
- CN106403674A CN106403674A CN201510444504.7A CN201510444504A CN106403674A CN 106403674 A CN106403674 A CN 106403674A CN 201510444504 A CN201510444504 A CN 201510444504A CN 106403674 A CN106403674 A CN 106403674A
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- China
- Prior art keywords
- rib
- temperature equalization
- capillary material
- equalization system
- bracing frame
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Abstract
The invention relates to a plate-shaped temperature equalization device. The plate-shaped temperature equalization device comprises an upper housing, a lower housing, a support frame, a capillary material and moving fluid. A plurality of ribs are connected with each other to form the support frame, a plurality of enclosed spaces which are arranged regularly are formed among the ribs, two ends of each rib are respectively defined as an upper support end and a lower support end, the upper support end of each rib is arranged above the lower support ends of two ribs, and the lower support end of each rib is arranged under the upper support ends of two ribs. By means of the connection relationship between the upper support ends and the lower support ends of the ribs, each rib is in an inclined state that one end is higher than the other end, furthermore a subspace is formed under the body portion, of the rib, being close to the upper support end, a subspace is formed above the body portion, of the rib, being close to the lower support end, and the subspaces are communicated with the enclosed spaces in space.
Description
Technical field
The present invention is relevant with heat dissipation technology, particularly relates to be internally provided with capillary structure and vacuum chamber and is available for
Carry out liquid gas phase exchange as hydrodynamic, and then reach a kind of tabular temperature equalization system of even temperature effect.
Background technology
No. 201331538 patents of TaiWan, China TW, the creation of present inventor, this case discloses one
Plant the temperature equalization system of no liquid injection pipe, it can reach good reliability and heat dispersion.
However, in aforementioned prior art, the structure of its bracing frame, from its Fig. 9, has the portion of supportive
Dividing is by this rack upwardly or downwardly punching press bending lamellar body out, produced of such bending lamellar body
Support force road still has some deficits.Due to temperature equalization system use when it will usually thermal source is attached at this temperature equalization system
Simultaneously, and by fin (heat sink) it is attached at the another side of this temperature equalization system, and in order that to amplexiform effect good
Good it will usually using fixture (clamp) (not shown), this fin is exerted a force so that its stress and be attached at
The surface of this temperature equalization system, therefore, when actually used, its two sides is the extruding that can be under pressure to temperature equalization system
's.And then understand, if the supportive of this bracing frame is not enough, the thickness of whole temperature equalization system may be because
Lead to for the effect of external force thinning, and then inner space is reduced, be heated as hydrodynamic and be changed into steam
The flowing space is deficiency, and then the effect of overall samming heat conduction can be led to be deteriorated.The support of aforementioned prior art
Frame, when being under pressure effect it is possible to bending, therefore its supportive still has some deficits its bending lamellar body again.
Content of the invention
The main object of the present invention is in that to provide a kind of tabular temperature equalization system, and the structure of its bracing frame can provide
Enough supportives are it can be ensured that this tabular temperature equalization system will not be flattened by normal external force, and then can keep equal
The effect of warm heat conduction will not reduce or reduce.
According to a kind of tabular temperature equalization system provided by the present invention, include：One upper body and a lower body,
Therebetween form an accommodation space each other so that edge is connected；One bracing frame, is placed in this accommodation space, should
Bracing frame is connected with each other by multiple ribs and is formed, and multiple the enclosing of formation rule arrangement between this rib
Space, and the two ends of each this rib are respectively defined as a top end and once contact end, respectively this rib
Top end is located on the lower contact end of two this ribs, and respectively the lower contact end of this rib is located at two this ribs
Top end under；One capillary material, is arranged in this accommodation space, and this capillary material is in banding with flat ring
Shape around the top of this bracing frame, lower section and both sides, this capillary material above this bracing frame partly fixed
Justice is top, and the part of this capillary material below this bracing frame is defined as bottom, and sintering is amplexiformed on this top
In the bottom surface of this upper body, the top surface being sintered in this lower body is then amplexiformed in this bottom；And one make hydrodynamic, note
Enter this accommodation space and adsorbed by this capillary material；Wherein, this bracing frame is formed by its multiple rib
This top end and this lower contact end be resisted against this capillary material and support to arrive in this capillary material in this upper shell bottom surface
And this lower house top surface, and by this rib top end each other and lower contact end annexation,
This rib is presented for this bracing frame one end is high and the low askew status in one end, and then make each
This rib all forms a son below the body portion of this top end and above the body portion at this lower contact end
Space, this subspace is spatially connected with this enclosed space.
Wherein, this rib is integrally formed to each other.
Wherein, positioned at this two rib of the lower section of the top end of respectively this rib, with its lower contact end phase each other
Connect；It is located at this two rib of the respectively top at lower contact end of this rib, be connected to each other with its top end.
Wherein, this lower house is plate-shaped；This upper shell has a plate body, and is extended downwardly by this plate body periphery
One wall, then by this wall outwards horizontal-extending scapulet；This upper shell adheres on this lower house with this scapulet
Top surface, and by open welding mode weld the edge that this scapulet is contacted with this lower house top surface, and
Form the seamless state being connected.
Wherein, this upper body and the edge of this lower body weld by the mode phase that open welds, and are formed
The seamless state being connected.
Wherein, the mode of this open welding is high heat input weld method, and is electron beam welding method, high-frequency argon
Arc-welding connection or the one of which of method of laser welding.
Wherein, this capillary material is copper mesh or copper powder sintering forms.
Wherein, this enclosed space is enclosed by four this ribs and is formed.
Whereby, respectively this top end of this bracing frame is jointly formed about one with lower contact end below and all pushes up
To the physical objects of this capillary material, and provide quite powerful supportive it can be ensured that this tabular temperature equalization system not
Can be flattened by normal external force, and then the effect of samming heat conduction can be kept will not to reduce or reduce.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as to the present invention's
Limit.
Brief description
Fig. 1 is the explosive view of the present invention first preferred embodiment.
Fig. 2 is the combination stereogram of the present invention first preferred embodiment.
Fig. 3 is the cross-sectional schematic of the present invention first preferred embodiment.
Fig. 4 is the partial component stereogram of the present invention first preferred embodiment, the structure of display bracing frame.
Fig. 5 is the cross-sectional schematic of the 5-5 hatching line along along Fig. 4.
Fig. 6 is the use state figure of the present invention first preferred embodiment.
10 tabular temperature equalization systems
11 upper shell, 111 plate body 112 wall
113 scapulet, 12 accommodation space 21 lower house
31 bracing frame, 32 rib 321 top end
322 times contact ends, 33 subspace 34 enclosed space
41 capillary material, 42 top 44 bottom
91 thermal source 99 fin
S physical objects
Specific embodiment
Technical characterstic in order to describe the present invention in detail is located, and hereby lifts following preferred embodiment and coordinates schema
After illustrating such as, wherein：
As shown in Figures 1 to 5, a kind of tabular temperature equalization system 10 that a preferred embodiment of the present invention is provided,
Mainly hydrodynamic institute is made by a upper shell 11, a lower house 21, a bracing frame 31, a capillary material 41 and
Composition, wherein：
This upper shell 11 therebetween forms an accommodation space each other with this lower house 21 so that edge is connected
12.In the present embodiment, this lower house 21 is plate-shaped；This upper shell 11 has a plate body 111, and by
This plate body 111 periphery extends downwardly a wall 112, then by this wall 112 outwards horizontal-extending scapulet 113；
This upper shell 11 adheres on the top surface of this lower house 21, and the side by open welding with this scapulet 113
Formula welds the edge that this scapulet 113 is contacted with this lower house 21 top surface, and forms the seamless state being connected.
The mode of aforesaid open welding is high heat input weld method, and is electron beam welding method, high frequency argon arc welding
Method or the one of which of method of laser welding.
This bracing frame 31, is placed in this accommodation space 12, and this bracing frame 31 is connected with each other institute by multiple ribs 32
Formed, and between this rib 32 formation rule arrangement multiple enclosed spaces 34, and respectively this rib 32
Two ends are respectively defined as a top end 321 and once contact end 322, the respectively top end of this rib 32
On the 321 lower contact ends 322 being located at two this ribs 32, and respectively the lower contact end 322 of this rib 32 is then
Under the top end 321 of two this ribs 32.In the present embodiment, this rib 32 one to each other
Shape；Additionally, being located at this two rib 32 of the respectively lower section of top end 321 of this rib 32, with it
Contact end 322 is connected to each other, and is located at this two rib of the respectively top at lower contact end 322 of this rib 32
32, it is connected to each other with its top end 321.Be can be seen that by Fig. 4 of the application, respectively this enclosed space 34
Enclosed by four this ribs 32 and formed, and generally assumed quadrangle or rhombus.
This capillary material 41, is arranged in this accommodation space 12, and this capillary material 41 is in banding and is enclosed with flat ring-type
Around the top of this bracing frame 31, lower section and both sides, positioned at the portion of this capillary material 41 of this bracing frame 31 top
Divide and be defined as top 42, the part positioned at this capillary material 41 of this bracing frame 31 lower section is defined as bottom 44,
The bottom surface being sintered in this upper shell 11 is amplexiformed on this top 42, and this bottom 44 is then amplexiformed and is sintered in this lower house
21 top surface.In the present embodiment, this capillary material 41 is copper mesh or copper powder sintering forms.As shown in figure 1,
When this capillary material 41 is copper mesh, this bracing frame 31 is wound in the banding copper mesh with preset width, lays equal stress on
Repeatedly severing after certain length, thus, you can form top around this bracing frame 31, lower section and both sides
State.
This makees hydrodynamic, flows into this accommodation space 12 and is adsorbed by this capillary material 41.Wherein, due to
Represent in schema by this capillary material adsorbed to make hydrodynamic difficult, and as the existing element of hydrodynamic system, because
This hold not with graphic representation it.
Wherein, this bracing frame 31 is formed by multiple ribs 32 this top end 321 and this lower contact
End 322 is resisted against this capillary material 41 and supports to arrive in this capillary material 41 in this upper shell 11 bottom surface and this lower casing
Body 21 top surface, and the connection by this rib 32 top end 321 each other and lower contact end 322
Relation so that this rib 32 assumes for this bracing frame 31 that one end is high and the low askew status in one end,
And then so that respectively this rib 32 is below the body portion of this top end 321 and near this lower contact end 322
Body portion above all form a subspace 33, this subspace 33 is spatially connected with this enclosed space 34.
It is explained above the framework of the present embodiment, next the use state of the present embodiment is described.
Referring again to Fig. 6, before use, by the tabular temperature equalization system 10 of the present invention and a thermal source 91 (for example
Computer chip) and a fin 99 assemble, so that this thermal source 91 is amplexiformed in this fin of this lower house 21
99 amplexiform in this upper shell 11.
As shown in Figures 3 to 5, due to this top end 321 and this lower top of the bracing frame 31 of the present embodiment
Support end 322 to support to arrive in this capillary material 41 in this upper shell 11 bottom surface and this lower house 21 top surface, and should
Top end 321 is located at the top at this lower contact end 322 again, and therefore, respectively this top end 321 is and it
The lower contact end 322 of lower section is jointly formed physical objects S of about one all this capillary material 41 of contact, this entity
Thing S will not be flattened by external force, is thus provided that quite powerful supportive, the tabular of the sustainable present invention
Temperature equalization system 10 also will not become more flat under the effect of normal external force, and normal external force herein refers to affiliated technology
The pressure that the normal fixture of fin or fastener apply is clamped in field.Thus, you can guarantee the present invention
The samming heat-conducting effect of tabular temperature equalization system 10 will not reduce or reduce.
Additionally, when using, this is heated as hydrodynamic when being vaporizated into steam, encloses with this by this subspace 33
Space 34 connected relation spatially, can make this make the steam of hydrodynamic any in this accommodation space 12
Mobile, and the tabular temperature equalization system 10 of the present invention can be made to have the effect of quick samming heat conduction.
Remaining operation principle of the tabular temperature equalization system of the present invention, for example, make the vaporization of hydrodynamic and condensation is formed
Heat conduction or radiating effect, be to be same as prior art, therefore repeat no more.
In the present invention, respectively this top end of bracing frame is jointly formed about one all with lower contact end below
The physical objects of this capillary material of contact, and provide quite powerful supportive it can be ensured that this tabular temperature equalization system
Will not be flattened by normal external force, and then the effect of samming heat conduction can be kept will not to reduce or reduce.
Certainly, the present invention also can have other various embodiments, in the feelings spiritual and its substantive without departing substantially from the present invention
Under condition, those of ordinary skill in the art can make various corresponding changes according to the present invention and deform, but this
Change accordingly a bit and deform the protection domain that all should belong to the claims in the present invention.
Claims (8)
1. a kind of tabular temperature equalization system is it is characterised in that include：
One upper body and a lower body, therebetween form an accommodation space each other so that edge is connected；
One bracing frame, is placed in this accommodation space, and this bracing frame is connected with each other by multiple ribs and is formed, and in
Multiple enclosed spaces of formation rule arrangement between this rib, and the two ends of each this rib are respectively defined as on one
Contact end and once contact end, respectively the top end of this rib be located at two this ribs lower contact end on,
Respectively the lower contact end of this rib is located under the top end of two this ribs；
One capillary material, is arranged in this accommodation space, and this capillary material is in banding with flat ring-type around this support
The top of frame, lower section and both sides, the part of this capillary material above this bracing frame is defined as top, position
The part of this capillary material below this bracing frame is defined as bottom, and this top is amplexiformed and is sintered in this upper body
Bottom surface, the top surface being sintered in this lower body is then amplexiformed in this bottom；And
One makees hydrodynamic, flows into this accommodation space and is adsorbed by this capillary material；
Wherein, this bracing frame is resisted against with this lower contact end by this top end that its multiple rib is formed
This capillary material and this capillary material is supported to arrive in this upper shell bottom surface and this lower house top surface, and by this rib
Top end each other and lower contact end annexation are so that this rib is in for this bracing frame
Existing one end is high and the low askew status in one end, so make respectively this rib below the body portion of this top end
And all forming a subspace above the body portion at this lower contact end, this subspace and this enclosed space are in sky
Between on be connected.
2. tabular temperature equalization system according to claim 1 is it is characterised in that this rib to each other
Body shapes.
3. tabular temperature equalization system according to claim 1 is it is characterised in that be located at respectively this rib
This two rib of the lower section of top end, is connected to each other with its lower contact end；It is located at the lower top of respectively this rib
Support this two rib of the top at end, be connected to each other with its top end.
4. tabular temperature equalization system according to claim 1 is it is characterised in that this lower house is plate-shaped；
This upper shell has a plate body, and extends downwardly a wall by this plate body periphery, then by the outside level of this wall
Extend a scapulet；This upper shell adheres on the top surface of this lower house with this scapulet, and by open welding
Mode welds the edge that this scapulet is contacted with this lower house top surface, and forms the seamless state being connected.
5. tabular temperature equalization system according to claim 1 it is characterised in that this upper body with this under
The edge of body welds by the mode phase that open welds, and forms the seamless state being connected.
6. the tabular temperature equalization system according to claim 4 or 5 is it is characterised in that this open welds
The mode connecing is high heat input weld method, and is electron beam welding method, high frequency argon arc welding method or method of laser welding
One of which.
7. tabular temperature equalization system according to claim 1 is it is characterised in that this capillary material is copper mesh
Or copper powder sintering forms.
8. tabular temperature equalization system according to claim 1 it is characterised in that this enclosed space by
Four this ribs are enclosed to be formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510444504.7A CN106403674B (en) | 2015-07-27 | 2015-07-27 | Plate temperature equalization system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510444504.7A CN106403674B (en) | 2015-07-27 | 2015-07-27 | Plate temperature equalization system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106403674A true CN106403674A (en) | 2017-02-15 |
| CN106403674B CN106403674B (en) | 2019-01-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510444504.7A Active CN106403674B (en) | 2015-07-27 | 2015-07-27 | Plate temperature equalization system |
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| Country | Link |
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| CN (1) | CN106403674B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108716871A (en) * | 2018-07-09 | 2018-10-30 | 奇鋐科技股份有限公司 | Heat dissipation element and its manufacturing method |
| CN109104841A (en) * | 2017-06-21 | 2018-12-28 | 神讯电脑(昆山)有限公司 | Thermal conduction plate with electro-magnetic screen function |
| US11029097B2 (en) | 2018-07-22 | 2021-06-08 | Asia Vital Components Co., Ltd. | Heat dissipation component |
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| CN202869351U (en) * | 2012-09-07 | 2013-04-10 | 浙江中博光电科技有限公司 | Inner support body of uniform temperature plate and uniform temperature plate using the same |
| TW201331538A (en) * | 2012-01-19 | 2013-08-01 | Acmecools Tech Ltd | Manufacturing method of a uniform temperature device free of liquid injection tube and the product made thereby |
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| WO2007124028A2 (en) * | 2006-04-18 | 2007-11-01 | Celsia Technologies Korea, Inc. | Support structure for planar cooling devices and methods |
| US20110168359A1 (en) * | 2010-01-08 | 2011-07-14 | Cooler Master Co., Ltd. | Heat-dissipating plate |
| CN102374808A (en) * | 2010-08-26 | 2012-03-14 | 富准精密工业(深圳)有限公司 | Flat-plate type vapor chamber |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109104841A (en) * | 2017-06-21 | 2018-12-28 | 神讯电脑(昆山)有限公司 | Thermal conduction plate with electro-magnetic screen function |
| CN108716871A (en) * | 2018-07-09 | 2018-10-30 | 奇鋐科技股份有限公司 | Heat dissipation element and its manufacturing method |
| CN108716871B (en) * | 2018-07-09 | 2020-11-06 | 奇鋐科技股份有限公司 | Heat dissipation element and manufacturing method thereof |
| US11029097B2 (en) | 2018-07-22 | 2021-06-08 | Asia Vital Components Co., Ltd. | Heat dissipation component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106403674B (en) | 2019-01-04 |
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Effective date of registration: 20211229 Address after: Taichung Road, Taichung, Taiwan, China, No. 5, building 184, 3 Patentee after: Jin Jide Address before: The British Virgin Islands holding investment rudderow Cheng Maine Jie Fat Building 3 floor jeep Patentee before: ACMECOOLS TECH. Ltd. |