M335720 八、新型說明： 種支撐結構，尤指一種用於均溫板 【新型所屬技術領域】 本創作係有關於一 之支撐結構及均溫板。 【先前技術】 甘隨著電腦之中央處理器（㈣的運算速度不斷提昇， • ;If:的毛熱里亦越來越高，以往由鋁擠型散熱器及風 羽（且、的散熱裝置，已不能滿足目前之中央處理器的使 用而求於是有業者陸續開發出具有更高導熱效能的熱管 么:pipe)及均溫板（vap〇r冰挪^)，並將其與散熱器作 、、且口，以有效地解決現階段的散熱問題；其中，又以均溫 板具有與發熱電子元件作大面積直接貼附接觸，而吸弓^ 多的相關業者投入此均溫板的研究。 瞻批雕般白用的均溫板，如第一圖所示，該均溫板係由一 ^體1〇a、一毛細組織2〇a、一支撐結構30a以及一工作 :體40a所組成。該殼體1〇a包含一下殼板及用以封 一、/下〃又板之一上殼板12a，該毛細組織20a係容設 亥a又脰l〇a内部且該毛細組織2〇a内部係形成有一容置 工間21a ’該支撐結構3〇a係容設於該容置空間2ia中， 用以支撐該毛細組織20a及該殼體l〇a，且該支撐結構 a係由一板體所構成，而該板體係經由例如衝壓技術而 =成有連續彎折之波浪狀之外型，以於該板體及該毛細組 、哉2〇a間形成有複數之間隔通道22a ;最後，將該上殼板 M335720 12a、 所需之 溫板者 該下殼板11a之四邊封合處 該工作流體40a後，再對内 予以焊接接合，並灌注 部抽真空，以形成該均 此成蛩您岣溫扳.田ί川杆 守’诉於該均溫板之一面 (上殼板12a)上設置有複數散埶餘 , ……θ片（未圖示），另一面 (下殼板11a)上則貼設於一發埶亓 如…、7^牛（例如CPU)(未圖M335720 VIII. New description: A kind of support structure, especially one for uniform temperature plate. [New technical field] This creation department has a support structure and a temperature equalization plate. [Prior Art] With the computer's central processing unit ((4), the computing speed is constantly increasing, • If: the hair is getting higher and higher, and the aluminum radiator type and the wind feather (and the heat sink) Can not meet the current use of the central processing unit and seek to develop a heat pipe with higher thermal conductivity: pipe) and temperature plate (vap〇r ice), and make it with the radiator And the mouth, in order to effectively solve the current heat dissipation problem; among them, the uniform temperature plate has a large area of direct contact with the heating electronic components, and the relevant industry of the suction bow has invested in the research of the average temperature plate. As shown in the first figure, the temperature equalizing plate is composed of a body 1〇a, a capillary structure 2〇a, a supporting structure 30a, and a working body 40a. The housing 1A includes a lower shell plate and an upper shell plate 12a for sealing one/or lower jaws, the capillary structure 20a is configured to accommodate the interior of the chamber and the capillary structure 2 The inside of the 〇a is formed with a receiving space 21a. The supporting structure 3〇a is received in the accommodating space 2ia. For supporting the capillary structure 20a and the casing 10a, and the supporting structure a is composed of a plate body, and the plate system is formed into a wavy shape with continuous bending by, for example, a punching technique. A plurality of spaced channels 22a are formed between the plate body and the capillary group and the 毛2〇a; finally, the upper plate M335720 12a and the required warm plate are sealed by the four sides of the lower plate 11a. After the working fluid 40a, the inside is welded and joined, and the infusion part is evacuated to form the one that is 蛩 蛩 岣 田 田 田 田 田 田 田 田 田 田 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉 诉The upper part is provided with a plurality of vacancies, ... θ pieces (not shown), and the other side (lower case 11a) is attached to a hairpin such as ..., 7^ cattle (for example, CPU) (not shown)
示）之表面，以使與該下殼板lla表面接觸之該毛細組織 20a内之该工作流體受熱汽化’並經由該等間隔通道孤 而通過該支撐結構3〇a之兩側邊與該殼體iQa間所 隙縫（未圖示）而流至與該上殼板12a表面接觸之該U 組織20a内，以將熱量傳遞至該等散熱鰭片中，而進一兮 發熱元件之導熱。 仃Μ 然而，上述均溫板之該工作流體4〇a必須經由長路徑 之該間隔通道22a，方能抵達與該上殼板12a表面接觸2 眷該毛細組織20a内，以進行該發熱元件之導熱，由於熱傳 導路徑係相當地長，故將導致該均溫板之熱傳導效率變、 差’進而影響該發熱元件之導熱效能，此外，因該間隔通 道22a之路徑係為甚長，易造成該均溫板之該支樓妹構 30a支撐該上殼板12a或該下殼板lla的支樓力不均句， 而使該殼體10a產生變形、塌陷之現象。 因此，如何克服前述先前技術之各種缺點，實為目^ 所盈待解決之課題。 【新型内容】 M335720 。有鑑於此’本創作之一目的係提供一種均溫板及其支 撐=，俾藉支撐結構之複數波浪片間的間隔通道設置， 以提昇均溫板之熱傳導效率。 本創作之另一目的係提供一種均溫板之支撐結構 可將該支撐結料以模減設計，以搭配㈣型式之均σ 板，而達到降低製作之成本者。 /里 本創作之又-目的係提供一種均溫板之支樓結構 由任一相郇波浪片之波峯段的彼此錯位配心 Α 士八女上人丨卞丨义㈠/皿板 又刀=勻，以避免均溫板產生塌陷而變形。 ♦以，本創作係提供一種均溫板，該均溫板係由一殼 版、毛細組織、一支撐結構以及一工作流 =組織係佈設於储_;較撐結構絲置於該毛細 、、且識内部’以支撐該毛細組織，該支撐結構包含 連接於該二側板間之複數波浪片，該波浪片係㈣數波峯 1 波谷段所構設而成，且任二相鄰該波浪片之該波 峯&係被此錯位配置；紅作流體係設於該殼體内部。 此外本創作亦提供一種均溫板之支撐結構，該支撐 結f系由二側板及複數波浪片所構成。該等波浪片係連接 板間’該波浪片係由複數波峯段及複數波谷段所 ^而成’且任二相鄰該波浪片之該波峯段係彼此錯位配 置。 相較於習知技術而言，本創作 ^ μ Α，„ 个則忭之忒支撐結構係藉由該 等波浪片的間隔設置，而形成嗜簟 ， 一 取巧寺間隔通這，以克服習知 技術之間隔通道路徑長所導致的、wa surface such that the working fluid in the capillary structure 20a in contact with the surface of the lower shell 11a is vaporized by heat' and passes through the spacers and the sides of the support structure 3a A gap (not shown) between the bodies iQa flows into the U-structure 20a in contact with the surface of the upper casing 12a to transfer heat to the heat-dissipating fins to further conduct heat conduction to the heat-generating elements.仃Μ However, the working fluid 4〇a of the above-mentioned temperature equalizing plate must pass through the long-distance path 22a to reach the surface of the upper casing 12a in contact with the capillary structure 20a to perform the heating element. The heat conduction is long because the heat conduction path is relatively long, which causes the heat conduction efficiency of the temperature equalizing plate to be changed and poorly, thereby affecting the heat conduction performance of the heat generating element. Further, because the path of the interval channel 22a is long, it is easy to cause The branch structure 30a of the temperature equalizing plate supports the unevenness of the support of the upper shell plate 12a or the lower shell plate 11a, and causes deformation and collapse of the casing 10a. Therefore, how to overcome the various shortcomings of the prior art described above is actually a problem to be solved. [New content] M335720. In view of the fact that one of the purposes of the present invention is to provide a temperature equalizing plate and its support =, the spacing between the plurality of wave plates of the supporting structure is set to improve the heat transfer efficiency of the temperature equalizing plate. Another object of the present invention is to provide a support structure for a temperature equalizing plate which can be designed with a die reduction to match the (four) type of σ plate to achieve a reduction in the cost of production. / Liben's creation--the purpose is to provide a structure of the floor plate of the uniform temperature plate. The peaks of the wave segments of any phase of the wave plate are misaligned with each other. The eight women are arrogant (1) / the plate and the knife = uniform, Avoid the deformation of the uniform temperature plate and deformation. ♦ The present invention provides a temperature equalizing plate which is provided by a shell plate, a capillary structure, a supporting structure and a working flow = tissue system in the storage _; the struts are placed in the capillary, And the inner portion is configured to support the capillary structure, and the support structure comprises a plurality of wave plates connected between the two side plates, wherein the wave plate system is formed by a plurality of peaks and 1 wave trough segments, and any two adjacent wave plates are formed. The peak & is configured by this misalignment; the red flow system is disposed inside the casing. In addition, the present invention also provides a support structure for a uniform temperature plate, which is composed of two side plates and a plurality of wave plates. The wave plates are connected between the plates. The wave plate is formed by a plurality of peak segments and a plurality of valley segments, and the peak segments of any two adjacent wave plates are misaligned with each other. Compared with the prior art, the creation of the ^ Α „ „ 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒The length of the technology is caused by the long path of the channel, w
S ’双岣，盤板之熱傳導效率變差之 M335720 缺點。因此，應用本創作 同時，本創作之該支 之该波峯段的彼此錯位配 以避免該均溫板產生塌陷 值〇 可達到提昇熱傳導效率的效果。 才牙結構係藉由任二相鄰該波浪片 置，俾使該殼體受力分布均勻， 而、交形，實具極高之產業利用價 【實施方式】S ‘ double 岣, the heat dissipation efficiency of the disk plate is worse. Therefore, when the present application is applied, the peak segments of the branch of the creation are misaligned to avoid the collapse of the temperature equalizing plate, and the heat transfer efficiency can be improved. The structure of the teeth is made by any two adjacent waves, so that the shell is evenly distributed, and the cross-section is extremely high in industrial utilization price.
之觀點，但 有以下之實施例係進—步詳細說明本創作 非以任何觀點限制本創作之範_。 構成 明翏閱第一圖至第五圖，本創作之均溫板係由一殼體 10 : -毛細組織20、一支撐結構30、以及一工作流體4〇所 该殼體1G係包含-下殼板n及封合連接於該下殼板^ 之一上殼板12，該下殼板丨丨係由一底板lu及圍設於該底 板111四周之複數圍板112所構設而成，其中一該圍板 112係β又有填充除氣管113 ，該填充除氣管113係連通 該殼體10之内外部。 該毛細組織20係佈設於該殼體10内，且該毛細組織2〇 係包含一下層毛細組織21及連接於該下層毛細組織21上之 上層毛細組織22，該上層毛細組織22係貼設於該上殼板 12表面，該下層毛細組織21則貼設於該下殼板丨丨表面，而 該上層毛細組織22連接於該下層毛細組織21上後係形成有 一各置空間23 ;此外，該毛細組織20係可為一金屬編織 網0 M335720 " °亥支撐結構30係容置於該毛細組織20之該容置空間23 内卩支才牙5玄毛細組織2〇 ’ 亥支撐結構3〇包含至少二側板 31及連接於該二侧板31間之複數波浪片犯，該波浪片犯係 由複數波峯段321及複數波谷段322所構設而成，且任二 相4 »亥波浪片32之该波|段321係、彼此錯位配置，相對地 該波谷段322亦彼此錯位配置，而任二相鄰該波浪片％係 間隔設置並形成有—間隔通道微；其中，該等波茶段 鲁321係高出該侧板31頂^，而該等波谷段322則低於該側 板31底面。 該工作流體40係填注於該殼體1〇内部，且該工作流體 40係可為純水者；最後將該上殼板12、該下殼板u之四邊 封合處予以焊接接合，並經由該填充除氣管113灌注所需 之該工作流體4〇至該殼體1〇内後，再對該殼體1〇内部抽真 空’以完成本創作均溫板。 修 使用本創作時，係先於該均溫板之上殼板12表面上設 置有複數散熱鰭片（未圖示）後，再將該均溫板的下殼板 11表面貼設於一發熱元件（例如cpu)(未圖示）表面上， 以使與該下殼板11表面接觸之該毛細組織2〇内之工作流體 40受熱汽化，並經由該等間隔通道324而快速直接地流至 與该上殼板12表面接觸之該毛細組織2〇内，以縮短熱傳導 之路徑，並將熱量傳遞至該等散熱鰭片中，而進行該發熱 元件之導熱，故使用本創作時，具有熱傳導路徑短之特 點；因此，可提昇本創作之熱傳導效率。 此外，藉由任二相鄰該波浪片32之該波峯段321的彼 M335720 λ錯位配置’俾使該均溫板承受該散熱鰭片或該發熱元件 之力刀布均勻，以避免該均溫板產生塌陷或變形。 請參閱第六圖及第七圖，本實施例與前一實施例之差 別在於該支撐結構50係由複數側板51及連接於各該二側板 曰 1之複數波浪片52所組成，該波浪片52係由至少一波峯 段521及至少一波谷段522所構設而成，且任二相鄰該波 浪片52之.亥波峯段521係彼此錯位配置；而於製作上可將 |亥支撐、、、Hx縱向或橫向裁切為複數個模組化的支撐結 構以格配不同型式及大小的均溫板，且因該支撑結構如 =結構設計關係，以便可大量之生產，而達降低製作之成 本’因此，本創作於製作上具有節省成本之效果。 綜上所述，應用本創作可達成節省成本及提昇敎 效率之效果，且可避免均溫板產生塌陷與變形 知技術之種種缺失，實已具備高度產㈣用價值。、 =上所述之具體實施例，僅㈣以例釋本創作之 ”，、占及功效，而非用以限定本創作 士 :離:_上揭之精神與技術範，下，任 ::::蓋成?等效改變及㈣，均仍應為下述之心 【圖式簡單說明】 第圖係為習知均溫板之剖視圖。 第二圖係為本創作之立體分解示意圖。 第三圖係為第二圖的支撐結構之Αιι域局部放大圖 λ M335720 第四圖係為第二圖的支撐結構容設於下殼板内之俯視 =五圖係為第四圖蓋合上蓋體後之5-5剖面示意圖。 第/、圖係為本創作另一實施例圖。 第七圖係為第六圖之B區域局部放大圖。In view of the above, the following examples are presented in more detail. This creation does not limit the scope of this creation by any point of view. Constituting the first to fifth figures, the mean temperature plate of the present invention consists of a casing 10: a capillary structure 20, a support structure 30, and a working fluid 4, which is contained in the casing 1G. The shell plate n and the sealing member are connected to the upper shell plate 12, and the lower shell plate is formed by a bottom plate lu and a plurality of surrounding plates 112 surrounding the bottom plate 111. One of the panels 112 is further filled with a degassing pipe 113 that communicates with the inside and outside of the casing 10. The capillary structure 20 is disposed in the casing 10, and the capillary structure 2 comprises a lower layer capillary structure 21 and an upper layer capillary structure 22 connected to the lower layer capillary structure 21, and the upper layer capillary structure 22 is attached to the capillary structure a surface of the upper shell 12, the lower layer of capillary structure 21 is attached to the surface of the lower shell, and the upper layer of capillary structure 22 is connected to the lower layer of capillary structure 21 to form a space 23; The capillary structure 20 can be a metal woven mesh 0 M335720 " °H support structure 30 is accommodated in the accommodating space 23 of the capillary structure 20 卩 才 才 5 5 玄 玄 玄 玄 玄 玄 玄 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥The utility model comprises at least two side plates 31 and a plurality of wave plates connected between the two side plates 31. The wave plate is composed of a plurality of peak segments 321 and a plurality of trough segments 322, and any two phases 4 » Hai wave tablets 32 of the wave|segment 321 are arranged offset from each other, and the trough sections 322 are also arranged offset from each other, and any two adjacent wave pieces are spaced apart and formed with a spacing channel micro; wherein the wave tea Duan Lu 321 is higher than the top plate 31 top ^, Such trough segment 322 below the bottom surface 31 of the side plate. The working fluid 40 is filled in the interior of the casing 1 , and the working fluid 40 can be pure water; finally, the upper shell 12 and the lower shell u are sealed at four sides, and After the filling of the working fluid 4 into the casing 1 via the filling degassing pipe 113, the inside of the casing 1 is evacuated to complete the creation of the temperature equalizing plate. When the present invention is used, a plurality of heat dissipating fins (not shown) are disposed on the surface of the shell plate 12 above the temperature equalizing plate, and then the surface of the lower shell plate 11 of the temperature equalizing plate is attached to a heat. a surface (e.g., cpu) (not shown) on the surface such that the working fluid 40 in the capillary structure 2 in contact with the surface of the lower shell 11 is vaporized by heat and flows directly and directly to the via passage 324 The capillary structure 2 接触 in contact with the surface of the upper shell 12 is used to shorten the path of heat conduction and transfer heat to the heat dissipating fins to conduct heat conduction of the heat generating component, so that heat conduction is used when the present invention is used. The short path is characteristic; therefore, the heat transfer efficiency of the creation can be improved. In addition, the M335720 λ misalignment configuration of the peak segment 321 adjacent to the wave plate 32 is such that the temperature equalizing plate is evenly received by the heat dissipation fin or the heating element to avoid the temperature uniformity. The plate is collapsed or deformed. Referring to FIG. 6 and FIG. 7 , the difference between the embodiment and the previous embodiment is that the support structure 50 is composed of a plurality of side plates 51 and a plurality of wave plates 52 connected to the two side plates 1 . The 52 series is formed by at least one peak segment 521 and at least one trough segment 522, and any of the two wave segments 52 adjacent to the wave plate 52 are arranged offset from each other; , Hx longitudinal or horizontal cutting into a plurality of modular support structures to match different types and sizes of temperature equalization plates, and because of the support structure such as = structural design relationship, so that a large number of production, and reduce production The cost's, therefore, the creation has a cost-saving effect on production. In summary, the application of this creation can achieve the effect of saving cost and improving the efficiency, and can avoid the various defects of the knowledge of the collapse and deformation of the uniform temperature plate, and it has the high value of production. , the specific embodiment described above, only (4) to explain the creation of this creation, and accountability, rather than to limit the creation of the writer: from: _ the spirit and technical paradigm of the above, below,: ::The cover is equivalent to the equivalent change and (4), and should still be the following: [Simple description of the drawing] The figure is a cross-sectional view of the conventional uniform temperature plate. The second figure is a three-dimensional decomposition diagram of the creation. The three figures are the enlarged view of the Αιι field of the support structure of the second figure. λ M335720 The fourth figure is the top view of the support structure accommodated in the lower shell plate. The top view is the fourth figure. FIG. 5 is a partial enlarged view of the B region of the sixth drawing.
【主要元件符號說明】 【習知】[Main component symbol description] [Practical]
l〇a · · • •殼體 lla · · ••下殼板 2〇a .. ••毛細組織 22a .. ••間隔通道 3〇a .. ••支撐結構 40a .. ••工作流體 【本創作 ] 10 ... •殼體 11 ... •下殼板 112 .. •圍板 12 ... •上殼板 20 ·.. •毛細組織 21 -.. •下層毛細組織 23 ... •容置空間 12a · · · ·上殼板 21a · · · ·容置空間 111 · · ·底板 113 · · ·填充除氣管 22 上層毛細組織 M335720 30 · · ••支撐結構 31 · · ••侧板 32 · · · •波浪片 321 · ••波峯段 322 · · •波谷段 324 · ••間隔通道 40 · · ••工作流體 50 · · ••支撐結構 51 · · ••侧板 52 · · · ••波浪片 521 · ••波峯段 522 · · ••波谷段 12L〇a · · • • Housing lla · · • • Lower shell 2〇a.. ••Capillary structure 22a .. •• Interval channel 3〇a.. ••Support structure 40a .. ••Working fluid [ This creation] 10 ... • housing 11 ... • lower shell plate 112 .. • coaming plate 12 ... • upper shell plate 20 ·.. • capillary structure 21 -.. • lower layer capillary structure 23 .. • accommodating space 12a · · · · upper casing 21a · · · · accommodating space 111 · · · bottom plate 113 · · · filling degassing tube 22 upper layer capillary structure M335720 30 · · •• support structure 31 · · •• Side plate 32 · · · • Wave plate 321 · ••Crest segment 322 · · • Valley segment 324 · •• Spacer channel 40 · ·••Working fluid 50 · ·••Support structure 51 · · •• Side plate 52 · · · •• Wave plate 521 · ••Crest section 522 · · •• Valley section 12