CN101754653A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN101754653A CN101754653A CN200810306034A CN200810306034A CN101754653A CN 101754653 A CN101754653 A CN 101754653A CN 200810306034 A CN200810306034 A CN 200810306034A CN 200810306034 A CN200810306034 A CN 200810306034A CN 101754653 A CN101754653 A CN 101754653A
- Authority
- CN
- China
- Prior art keywords
- structure layer
- capillary structure
- radiator
- heat
- absorber plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The present invention relates to a radiator comprising a heat-absorbing plate, a heat-releasing plate combined with the heat-absorbing plate, a first capillary structure layer attached on the heat-releasing plate and a second capillary structure layer attached on the heat-absorbing plate, wherein a chamber is formed between the heat-absorbing plate and the heat-releasing plate; working fluid is filled in the chamber; the first structure layer and the second capillary structure layer are in the chamber; a supporting body is arranged between the heat-absorbing plate and the heat-releasing plate; and the supporting body is arranged in an up-and-down wave shape to support the first capillary structure layer and the second capillary structure layer. Compared with the prior art, the supporting body is arranged in the radiator between the heat-absorbing plate and the heat-releasing plate, and is communicated with the first capillary structure layer and the second capillary structure layer; and thus, the supporting body can supply forceful support to the two capillary structure layers, the heat-absorbing plate and the heat-releasing plate, and prevent the radiator from deforming under the functions of internal and external force.
Description
Technical field
The present invention relates to a kind of radiator, particularly a kind of phase-varying radiator that is used to electronic component to dispel the heat.
Background technology
Electronic component produces a large amount of heats usually in running, normally move for guaranteeing electronic component, and these caloric requirements are in time dispelled the heat away, installs a radiator on this electronic component usually additional and is its heat radiation.This radiator generally includes an absorber plate and is arranged at radiating fin on this absorber plate.This absorber plate is made by heat conductivity good metal materials such as copper, aluminium, but metallic plate is limited by the limited heat conductivity of material itself, if to the electronic component of golf calorific value, tangible thermal resistance can be produced and good heat radiating can't be reached, influence the operation stability of electronic component.
For promoting the efficient of radiator, industry also adopts a cavity is set in absorber plate, is sealed with working fluids such as water, ethanol in this cavity, utilizes the phase change of working fluid to improve heat transfer rate.During work, working fluid is in the heat release zone of the heat absorption district of absorber plate endothermic gasification arrival absorber plate, cooling liquid then.For making workflow physical efficiency after the liquefaction be back to the heat absorption district of absorber plate sooner, this absorber plate is provided with a kind of capillary structure in the cavity periphery.Capillary structure generally is divided into three kinds of powder sintered capillary structures, netting twine capillary structure, groove capillary structure.Working fluid after the liquefaction is back to the heat absorption district and participates in the phase change circulation in capillary structure.Yet in the process of using, the absorber plate of this radiator is being subjected to occurring the product distortion easily from outside and pressure inside effect, even causes the capillary structure in the absorber plate to come off, and has had a strong impact on the radiating efficiency and the stability of radiator.
Summary of the invention
In view of this, be necessary in fact the phase-varying radiator that provides a kind of structure firm.
A kind of radiator, comprise an absorber plate, a heat liberation board that combines with this absorber plate, be attached to one first capillary structure layer on this heat liberation board and be attached to second capillary structure layer of 1 on the absorber plate, form a cavity between this absorber plate and the heat liberation board, be filled with working fluid in this cavity, described first and second capillary structure layer is positioned at this cavity, be provided with a supporter between this absorber plate and the heat liberation board, this supporter is fluctuating in cavity wavyly arranges and supports this first capillary structure layer and second capillary structure layer.
Compared with prior art, be provided with supporter in the radiator of the present invention, this supporter is between absorber plate and heat liberation board and be communicated with first capillary structure layer and second capillary structure layer, can provide strong support to two capillary structure layer, absorber plate and the heat liberation board of its both sides, prevent that radiator from deforming under the effect of inside and outside power.
Below with reference to accompanying drawing, in conjunction with the embodiments the present invention is further described.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of one embodiment of the invention radiator.
Fig. 2 is the three-dimensional exploded view of radiator among Fig. 1.
Fig. 3 is the enlarged drawing of the supporter of Fig. 2.
Fig. 4 be among Fig. 1 radiator along the cutaway view of IV-IV line.
Fig. 5 is the enlarged diagram of Fig. 4 centre circle V part.
Embodiment
As shown in Figures 1 and 2, one embodiment of the invention radiator comprises an absorber plate 10, a heat liberation board 20 that combines with this absorber plate 10, is arranged on one first capillary structure layer 30 in the heat liberation board 20, is arranged on one second capillary structure layer 40 at absorber plate 10 tops and is interposed in the supporter 50 of 30,40 of first and second capillary structure layer.
Please be simultaneously with reference to Fig. 4 and Fig. 5, this heat liberation board 20 comprises a tank 22 and the flanging 24 that extends from the outside one of tank 22 bottom peripheral edge.Four sidewalls 224 that the head and the tail that this tank 22 has a rectangle cover plate 222 and edge extends downward vertically around this cover plate 222 connect.The periphery sealing of above-mentioned absorber plate 10 posts this flanging 24, thereby forms an airtight cavity 26 between absorber plate 10 and heat liberation board 20.Be filled with a certain amount of working fluid (not label) in this cavity 26.
This first capillary structure layer 30 comprises that a body 32 reaches from four sidepieces 34 of this body 32 straight head and the tail connection of extending of marginal lappet all around downwards.The body 32 of this first capillary structure layer 30 is sticked in cover plate 222 inboards of above-mentioned tank 22.This first capillary structure layer 30 is formed by metal powder sintered, is appreciated that ground, and this first capillary structure layer 30 also can be worked out by mesh wire.
This second capillary structure layer 40 comprises that a body 42 reaches from four sidepieces 44 of this body 42 straight upwardly extending head and the tail connection of marginal lappet all around.The body 42 of this second capillary structure layer 40 is sticked at above-mentioned absorber plate top to should cavity 26 parts, four sidepieces, 44 outsides of this second capillary structure layer 40 are sticked mutually with four sidewalls, 224 inboards of above-mentioned tank 22, the inboard of four sidepieces 44 of this second capillary structure layer 40 then is sticked mutually with the outside of four sidepieces 34 of first capillary structure layer 30, thereby this second capillary structure layer 40 is connected and first capillary structure layer 30 is contained in second capillary structure layer 40 with above-mentioned first capillary structure layer 30, working fluid can pass back into second capillary structure layer 40 from first capillary structure layer 30.This second capillary structure layer 40 is worked out by mesh wire, is appreciated that ground, and this second capillary structure layer 40 also can be formed or be formed by ditch groove on four sidewalls, 224 inboards of these absorber plate 10 tops and above-mentioned heat liberation board 20 tanks 22 by metal powder sintered.Among the present invention, first capillary structure layer 30 can be identical with second capillary structure layer 40, also can be different.
Please be simultaneously with reference to Fig. 3, above-mentioned supporter 50 places in the above-mentioned cavity 26 and is interposed between first and second capillary structure layer 30,40.This supporter 50 is processed to form by a plate body one, and it has certain intensity, provides strong support with two capillary structure layer 30,40, absorber plate 10 and heat liberation board 20 to its both sides, prevents that radiator is out of shape under the effect of inside and outside power.This supporter 50 roughly is the wavy of continuous fluctuating and arranges in above-mentioned cavity 26.This supporter 50 comprises some some times butting sections 54 of going up butting sections 52, compressing mutually with second capillary structure layer 40 that compress mutually with first capillary structure layer 30 and the some connecting portions 56 that are connected described upper and lower butting section 52,54.All last butting sections 52 all are on the same horizontal plane, fully to contact with the body 32 of first capillary structure layer 30; All following butting sections 54 all are on the same horizontal plane, and fully contacting with the body 42 of second capillary structure layer 40, thereby all upper and lower butting sections 52,54 are separated into cavity 26 chamber 260 of some spaces.Offer some spaced rectangular openings 560 on each connecting portion 56, to be communicated with each chamber 260 and to be that the working fluid of gaseous state flows to heat liberation board 20 paths are provided.
During use, the absorber plate 10 of radiator is close to thermal source (figure does not show) heat absorption, working fluid in the cavity 26 is that the rise rectangular opening 560 that passes supporter 50 of steam arrives the cover plate 222 of above-mentioned heat liberation board 20 tanks 22 from these absorber plate 10 endothermic gasifications, the working fluid of gaseous state is met at this cover plate 222 places and is coldly emitted heat and be cooled to liquid state, this heat and then be passed to cover plate 222 outer distributing.Liquid working fluid flows back to absorber plate 10 by first capillary structure layer 30, second capillary structure layer 40 and carries out the phase change circulation.
Compared with prior art, be provided with supporter 50 in the radiator of the present invention, this supporter 50 is between the cover plate 222 of absorber plate 10 and heat liberation board 20 and be communicated with first capillary structure layer 30 and second capillary structure layer 40, can provide strong support to two capillary structure layer 30,40, absorber plate 10 and the heat liberation board 20 of its both sides, prevent that radiator from deforming under the effect of inside and outside power. In addition, the some rectangular openings 560 that arrange on this supporter 50 can pass for the working fluid from absorber plate 10 endothermic gasifications the cover plate 222 that arrives heat liberation board 20, thereby have guaranteed carrying out smoothly of working fluid phase change circulation.
Claims (9)
1. radiator, comprise an absorber plate, a heat liberation board that combines with this absorber plate, be attached to one first capillary structure layer on this heat liberation board and be attached to second capillary structure layer of 1 on the absorber plate, form a cavity between this absorber plate and the heat liberation board, be filled with working fluid in this cavity, described first capillary structure layer and second capillary structure layer are positioned at this cavity, it is characterized in that: be provided with a supporter between this absorber plate and the heat liberation board, this supporter is wavy and arranges and support this first capillary structure layer and second capillary structure layer in cavity.
2. radiator as claimed in claim 1 is characterized in that: described supporter is integrally formed by a plate body, offers some through holes on it, and working fluid can pass this some through holes in the cavity.
3. radiator as claimed in claim 2 is characterized in that: described supporter is divided into the chamber at some intervals with cavity, and these some chambers communicate with each other by the through hole on the supporter.
4. as claim 2 or 3 described radiators, it is characterized in that: described supporter comprises some first butting sections of compressing mutually with first capillary structure layer, some second butting sections that compress mutually with second capillary structure layer and the some connecting portions that are connected described first butting section and second butting section, and described some through holes are formed on described some connecting portions.
5. radiator as claimed in claim 4 is characterized in that: described first capillary structure layer is contained in second capillary structure layer and with second capillary structure layer and is communicated with.
6. radiator as claimed in claim 5, it is characterized in that: described heat liberation board comprises that a tank reaches from the outward extending flanging of tank notch periphery, this tank comprises that a cover plate reaches from the vertically extending sidewall of this cover plate periphery one side, the periphery sealing of described absorber plate posts this flanging, described first capillary structure layer and second capillary structure layer include a body and reach from a side vertically extending sidepiece of this body periphery to body, the body of described first capillary structure layer and second capillary structure layer is sticked respectively on the cover plate and absorber plate of heat liberation board, the sidepiece of described second capillary structure layer is sticked on the sidewall of heat liberation board, and the sidepiece of described first capillary structure layer is sticked on the sidepiece of second capillary structure layer.
7. radiator as claimed in claim 1 is characterized in that: described first capillary structure layer is made by metal powder sintered.
8. radiator as claimed in claim 1 is characterized in that: described second capillary structure layer is made by mesh wire.
9. as claim 1 described radiator, it is characterized in that: described first capillary structure layer is different from second capillary structure layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810306034A CN101754653A (en) | 2008-12-08 | 2008-12-08 | Radiator |
| US12/436,785 US20100139894A1 (en) | 2008-12-08 | 2009-05-07 | Heat sink with vapor chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810306034A CN101754653A (en) | 2008-12-08 | 2008-12-08 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101754653A true CN101754653A (en) | 2010-06-23 |
Family
ID=42229775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810306034A Pending CN101754653A (en) | 2008-12-08 | 2008-12-08 | Radiator |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100139894A1 (en) |
| CN (1) | CN101754653A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102155858A (en) * | 2011-04-07 | 2011-08-17 | 大连金三维科技有限公司 | Radiator |
| CN103419922A (en) * | 2013-07-24 | 2013-12-04 | 中国人民解放军国防科学技术大学 | Plywood type front edge structure of flying machine |
| CN103940266A (en) * | 2014-03-26 | 2014-07-23 | 上海应用技术学院 | Capillary tube type heat exchanging device |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM335720U (en) * | 2008-02-14 | 2008-07-01 | Celsia Technologies Taiwan Inc | Homeothermy plate and support structure thereof |
| US20100006268A1 (en) * | 2008-07-14 | 2010-01-14 | Meyer Iv George Anthony | Vapor chamber and supporting structure of the same |
| US20100326629A1 (en) * | 2009-06-26 | 2010-12-30 | Meyer Iv George Anthony | Vapor chamber with separator |
| US20110027738A1 (en) * | 2009-07-30 | 2011-02-03 | Meyer Iv George Anthony | Supporting structure with height difference and vapor chamber having the supporting structure |
| CN102003904B (en) * | 2009-09-03 | 2013-08-07 | 富准精密工业(深圳)有限公司 | Flat type heat pipe and manufacturing method thereof |
| US20120148967A1 (en) * | 2010-12-13 | 2012-06-14 | Thomas Thomas J | Candle wick including slotted wick members |
| US10018427B2 (en) * | 2016-09-08 | 2018-07-10 | Taiwan Microloops Corp. | Vapor chamber structure |
| US11131508B2 (en) * | 2018-03-19 | 2021-09-28 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
| US20190285357A1 (en) * | 2018-03-19 | 2019-09-19 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
| WO2019230911A1 (en) * | 2018-05-30 | 2019-12-05 | 大日本印刷株式会社 | Vapor chamber and electronic device |
| CN110740611A (en) * | 2018-07-20 | 2020-01-31 | 深圳富泰宏精密工业有限公司 | Radiator and electronic device with same |
| TWI690684B (en) * | 2019-01-31 | 2020-04-11 | 雙鴻科技股份有限公司 | Vapor chamber and heat dissipation device having the same |
| CN116635687A (en) * | 2021-02-25 | 2023-08-22 | 尼得科株式会社 | Heat conduction member and heat exchange device |
| WO2022181632A1 (en) * | 2021-02-25 | 2022-09-01 | 日本電産株式会社 | Thermally conductive member and heat exchange device |
| WO2022181631A1 (en) * | 2021-02-25 | 2022-09-01 | 日本電産株式会社 | Thermally conductive member and heat exchange device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3697935A (en) * | 1970-12-04 | 1972-10-10 | Kulka Electric Corp | Terminal junction |
| US20020020518A1 (en) * | 2000-05-22 | 2002-02-21 | Li Jia Hao | Supportive wick structure of planar heat pipe |
| JP4354270B2 (en) * | 2003-12-22 | 2009-10-28 | 株式会社フジクラ | Vapor chamber |
| US7032652B2 (en) * | 2004-07-06 | 2006-04-25 | Augux Co., Ltd. | Structure of heat conductive plate |
| US8176972B2 (en) * | 2006-08-31 | 2012-05-15 | International Business Machines Corporation | Compliant vapor chamber chip packaging |
| CN101309573A (en) * | 2007-05-18 | 2008-11-19 | 富准精密工业(深圳)有限公司 | Even heating board and heat radiating device |
| US8356410B2 (en) * | 2007-06-13 | 2013-01-22 | The Boeing Company | Heat pipe dissipating system and method |
| US20090025910A1 (en) * | 2007-07-27 | 2009-01-29 | Paul Hoffman | Vapor chamber structure with improved wick and method for manufacturing the same |
| US7770631B2 (en) * | 2008-03-19 | 2010-08-10 | Chin-Wen Wang | Method for manufacturing supporting body within an isothermal plate and product of the same |
-
2008
- 2008-12-08 CN CN200810306034A patent/CN101754653A/en active Pending
-
2009
- 2009-05-07 US US12/436,785 patent/US20100139894A1/en not_active Abandoned
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102155858A (en) * | 2011-04-07 | 2011-08-17 | 大连金三维科技有限公司 | Radiator |
| CN103419922A (en) * | 2013-07-24 | 2013-12-04 | 中国人民解放军国防科学技术大学 | Plywood type front edge structure of flying machine |
| CN103419922B (en) * | 2013-07-24 | 2015-11-25 | 中国人民解放军国防科学技术大学 | A kind of laminated board type leading edge structure of aircraft |
| CN103940266A (en) * | 2014-03-26 | 2014-07-23 | 上海应用技术学院 | Capillary tube type heat exchanging device |
| CN103940266B (en) * | 2014-03-26 | 2016-02-10 | 上海应用技术学院 | Capillary type heat-exchange device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100139894A1 (en) | 2010-06-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100623 |