CN202455719U - Radiator with heat sink structure - Google Patents
Radiator with heat sink structure Download PDFInfo
- Publication number
- CN202455719U CN202455719U CN201220036086XU CN201220036086U CN202455719U CN 202455719 U CN202455719 U CN 202455719U CN 201220036086X U CN201220036086X U CN 201220036086XU CN 201220036086 U CN201220036086 U CN 201220036086U CN 202455719 U CN202455719 U CN 202455719U
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- radiator
- heat sink
- cover plate
- fin
- capillary structure
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Abstract
The utility model discloses a radiator with a heat sink structure. The radiator comprises a shell 1 and a cover plate 2, wherein one end face of the shell is provided with a plurality of heat sink fins 3 integrated with the shell; the other end face of the shell is provided with a downwardly concave cavity 4; and the cover plate 2 is hermetically equipped on the end face with the downwardly concave cavity 4 in the shell 1 to form the radiator. The heat sink fins and the sealing shell are integrated, so that the problem that pores appear at a welding layer when a uniform temperature plate is welded with a radiating fin to result in increase of thermal resistance is solved. The radiator with the heat sink structure has the following technical effects: 1, the heat sink fins of the uniform temperature plate are integrated with the sealing shell, so that thermal resistance of the welding layer between the uniform temperature plate and the radiating fin is avoided; and 2, the radiator is simple to produce, low in cost, light in weight and good in structural strength.
Description
Technical field
The utility model relates to a kind of radiator, particularly a kind of radiator with heat sink structure.
Background technology
Along with the develop rapidly of industries such as IT, communication, LED (Light Emitting Diode, light-emitting diode), solar energy, the heating power of electronic devices and components is also improving constantly.Traditional heat radiation is many to be reached far-end and through heat exchange heat is discharged the outside mode of system through heat pipe with the thermal source radiation fin or with the heat of thermal source and dispel the heat.Current industry mainly adopts the heat radiation form of being made up of fin, heat pipe or VC (Vapor-Chamber, vacuum chamber soaking plate), fan, and its heat conduction path is following:
CPU (thermal source) → heat pipe or VC → fin (Fin) → by fan heat is taken away.
Fig. 1 is the fundamental diagram of the temperature-uniforming plate that provides of prior art, and as shown in Figure 1, temperature-uniforming plate generally includes three elements the most basic: seal casinghousing 11, capillary structure 12 and working solution.The tradition temperature-uniforming plate is with copper plate punch forming seal casinghousing 11, and through welding manners such as vacuum brazings housing seal welded together, with being pumped into 1.3 * (10 in the seal casinghousing 1
-1～10
-4) fill with an amount of working solution after the negative pressure of Pa, make to seal after being full of working solution in the capillary structure 12 of being close to cavity 13 inwalls.The wick of capillary structure 12 (wick) is many to be main with sintered powder (Sinter Powder), net (Mesh), groove structures such as (Groove) or composite construction.Working solution is high purity water mostly.One end of the cavity 13 of seal casinghousing 11 inside is that evaporation ends is also claimed fire end, and the other end is that condensation end is also claimed colling end.Working solution carburation by evaporation when evaporation ends is heated in the capillary structure 12, steam flow to colling end through the cavity 13 at seal casinghousing 11 centers under small pressure reduction, and emit heat and condense into liquid.Condensed liquid leans on the effect of capillary force to flow back to evaporation ends along capillary structure 12 again.So circulate endlessly, heat reaches the other end by an end of temperature-uniforming plate.
Existing temperature-uniforming plate has bigger area of dissipation, and bigger structural cavities can be provided, thereby increases the heat transfer amount, and the relative heat pipe of its capillary structure is more flexible in addition, can significantly promote density of heat flow rate, and the heat that satisfies high heat transmission and high heat flux passes demand.But because its complex manufacturing technology, and structural strength, material and reliability requirement, its cost is higher, and weight is bigger, and structural strength is relatively poor.So how satisfy high heat transfer property can the basis on, alleviate product weight, reducing cost is the important directions of temperature-uniforming plate research and development.
Fig. 2 is the perspective view of the heat radiation module that provides of prior art, and Fig. 3 is the front view of the heat radiation module that provides of prior art, and as shown in Figures 2 and 3, existing heat radiation module welds together through soldering with temperature-uniforming plate 21 and fin 22.Because the existence of weld layer 23 has increased by one section by the thermal resistance of temperature-uniforming plate 21 to fin 22; This section thermal resistance is because the soldering technological problems; Tend in weld layer 23, form spilehole; When especially temperature-uniforming plate 21 was with the welding of fin 22 large tracts of land, the probability that pore appears in weld layer 23 can significantly increase, and caused this section thermal resistance to increase.
The utility model content
The purpose of the utility model is to provide a kind of radiator with heat sink structure, and the problem that pore causes thermal resistance to increase appears in weld layer in the time of solving the welding of temperature-uniforming plate and fin better.
An aspect according to the utility model provides a kind of radiator with heat sink structure, and said radiator comprises:
Housing 1, one end have integrated a plurality of heat sink fins 3 with it, and its other end has recessed cavity;
Preferably, said radiator also comprises:
Be installed in formed steam void 5 on the end face that said housing 1 has recessed cavity 4 by 2 sealings of said cover plate;
Be injected into the working medium that is used for phase-change heat transfer in the said steam void 5;
Wherein, said cover plate 2 has capillary structure 6
Preferably, said radiator also comprises:
Be filled in the capillary structure 6 in said heat sink fin 3 inner chambers.
Preferably, said radiator also comprises:
Be compounded in the capillary structure 6 of heat sink fin 3 inner surfaces.
Preferably, capillary structure 6 centers that are compounded in said heat sink fin 3 inner surfaces have fin cavity 7, and said fin cavity 7 is communicated with said steam void 5.
Preferably, the end of said housing 1 with recessed cavity 4 has the sealed step 8 that is used for installing cover plate 2.
Preferably, said capillary structure 6 is sintered aluminium powder or foamed aluminium.
Compared with prior art, the beneficial effect of the utility model is:
1. heat transfer property can be excellent, and thermal diffusion effect is good, and is lower to heat sink thermal resistance from thermal source, and whole heat sink heat exchanger effectiveness promotes;
2. module weight reduces;
3. owing to reduced temperature-uniforming plate (or heat pipe) and heat sink welding sequence, can also effectively reduce module processing and fabricating cost.
4. because the easy technology of its housing moulding; So its structure is more flexible; Can design various special-shaped equalizing plate structures according to structural design and functional requirement, and can be according to designing requirement, when temperature-uniforming plate is made with the also disposable completion of mechanism's part; Thereby the increase structural reliability, and reduce cost.
Description of drawings
Fig. 1 is the fundamental diagram of the radiator that provides of prior art;
Fig. 2 is the perspective view of the heat radiation module that provides of prior art;
Fig. 3 is the front view of the heat radiation module that provides of prior art;
Fig. 4 is the perspective view of the radiator that provides of the embodiment of the invention;
Fig. 5 is the cutaway view of the radiator that provides of the embodiment of the invention one;
Fig. 6 is the cutaway view of the radiator that provides of the embodiment of the invention two.
Embodiment
Be elaborated below in conjunction with the preferred embodiment of accompanying drawing, should be appreciated that following illustrated preferred embodiment only is used for explanation and explains the utility model, and be not used in qualification the utility model the utility model.
Fig. 4 is the perspective view of the radiator that provides of the embodiment of the invention, and as shown in Figure 4, radiator comprises housing 1, cover plate 2.Wherein, an end face of housing 1 has integrated a plurality of heat sink fins 3 with it, and the other end has recessed cavity.Cover plate 2 sealing is installed on the end face that housing 1 has recessed cavity, to form radiator.
Fig. 5 is the cutaway view of the radiator that provides of the embodiment of the invention one, and as shown in Figure 5, said radiator comprises: housing 1, cover plate 2, steam void 5.One end face of housing 1 has integrated a plurality of heat sink fins 3 with it, and the inner chamber of heat sink fin 3 is filled with capillary structure 6, and the other end of housing 1 has recessed cavity 4.The end that housing 1 has recessed cavity 4 has the sealed step 8 that is used for installing cover plate 2.Cover plate 2 sealings are installed in said housing 1 to have on the end face of recessed cavity 4, and the inner surface of cover plate 2 is compounded with capillary structure 6.Form steam void 5 between the capillary structure 6 in the capillary structure of cover plate 2 and heat sink fin 3 inner chambers.The working medium that is used for phase-change heat transfer is injected in the steam void 5 through process duct 9.
The making flow process of radiator shown in Figure 5 is following: produce cover plate as shown in Figure 52 and the housing 1 with heat sink fin 3 with die casting or Cutting Process; Heat sink fin 3 is one-body molded with housing 1; The inside of housing 1 forms recessed cavity 4, forms the sealed step 8 of support cover plate 2 at an end of the recessed cavity 4 of having of housing 1.At the closely additional capillary structure 6 of the inner surface of cover plate 2, fill capillary structure 6 at the inner chamber of heat sink fin 3, said capillary structure is sintered aluminium powder or foamed aluminium, and capillary structure 6, housing 1, process duct 9, cover plate 2 are fitted together.Form a steam void 5 between the capillary structure 6 of the capillary structure 6 of heat sink fin 3 and cover plate 2 inner surfaces.The surface of housing that assembles 1 and cover plate 2 is cleaned, sprayed on its surface then or soak aluminum brazing flux, carry out the protection of sealed welding or nitrogen gas afterwards.After sealing detection, vacuumize through process duct 9, reach (being generally 1.5X10-2Pa) after the requirement vacuum degree, inject working medium (141b, acetone, ethylene glycol etc.) and seal, carry out Performance Detection at last.
The concrete operation principle of radiator shown in Figure 5 is following; When the thermal treatment zone (cover plate 2 outer surfaces) thermal source heats; It is gas that heat can make the Working fluid phase changing of the thermal treatment zone; Spread rapidly along the in-plane that is parallel to cover plate through steam void 5, and under small pressure reduction through steam void 5 along perpendicular to the direction of cover plate with the heat transferred capillary structure of heat sink fin 3 extremely, the capillary structure of heat sink fin 3 condenses into liquid with heat.Condensed liquid leans on the effect of capillary force to flow back to the capillary structure of cover plate 2 along the capillary structure of heat sink fin 3 again.So circulate endlessly, heat reaches heat sink fin end by radiator cover plate one end.Because heat is by the Working fluid phase changing transmission, so every fin of radiator all by even heating, can effectively promote the heat exchanger effectiveness of fin.And owing to adopt equal temperature technique, reduced welding thermal resistance, helped promoting the heat exchanger effectiveness of radiator by heat pipe or temperature-uniforming plate and fin with heat sink structure.
Fig. 6 is the cutaway view of the radiator that provides of the embodiment of the invention two; As shown in Figure 6; The difference of the radiator that radiator that embodiment two provides and embodiment one provide is the tight compound one deck capillary structure 6 of the inner surface of the heat sink fin 3 of each except that two ends among the embodiment two; Said capillary structure 6 centers have fin cavity 7, and said fin cavity 7 is communicated with said steam void 5, and the inner chamber of each heat sink fin 3 of the radiator among the embodiment one is filled full capillary structure 6.In addition, the structure of embodiment two and embodiment one is identical, therefore repeats no more here.
The concrete operation principle of radiator shown in Figure 6 is following; When the thermal treatment zone (cover plate 2 outer surfaces) thermal source heats; It is gas that heat can make the Working fluid phase changing of steam void 5, spreads rapidly with cover plate 2 levels and vertical direction through steam void 5 heat edges, and is passed to fin cavity 7; To the capillary structure of heat sink fin 3, the capillary structure of heat sink fin 3 condenses into liquid with heat then.Condensed liquid leans on the effect of capillary force to flow back to the capillary structure of cover plate 2 along the capillary structure of heat sink fin 3 again, and so circulation endlessly.
In sum; The utility model is through one-body molded with heat sink fin and seal casinghousing; The problem that pore causes thermal resistance to increase appears in weld layer when having solved the welding of temperature-uniforming plate and fin; Have following useful technique effect: the heat sink fin and the seal casinghousing of temperature-uniforming plate are one-body molded, have avoided the thermal resistance of weld layer between temperature-uniforming plate and fin.Two, manufacture craft is simple, and cost is lower, and weight is less, and structural strength is good.
Although preceding text specify the utility model, the utility model is not limited thereto, and those skilled in the art of the present technique can carry out various modifications according to the principle of the utility model.Therefore, all modifications of being done according to the utility model principle all are to be understood that to falling into the protection range of the utility model.
Claims (7)
1. the radiator with heat sink structure is characterized in that, said radiator comprises:
Housing (1), one end have integrated a plurality of heat sink fins (3) with it, and its other end has recessed cavity (4);
Cover plate (2), sealing is installed in said housing (1) to have on the end face of recessed cavity (4), to form radiator.
2. radiator according to claim 1 is characterized in that, said radiator also comprises:
Be installed in formed steam void (5) on the end face that said housing (1) has recessed cavity (4) by said cover plate (2) sealing;
Be injected into the working medium that is used for phase-change heat transfer in the said steam void (5);
Wherein, said cover plate (2) has capillary structure (6).
3. radiator according to claim 1 is characterized in that, said radiator also comprises:
Be filled in the capillary structure (6) in said heat sink fin (3) inner chamber.
4. radiator according to claim 1 is characterized in that, said radiator also comprises:
Be compounded in the capillary structure (6) of heat sink fin (3) inner surface.
5. radiator according to claim 4 is characterized in that,
Capillary structure (6) center that is compounded in said heat sink fin (3) inner surface has fin cavity (7), and said fin cavity (7) is communicated with said steam void (5).
6. radiator according to claim 1 is characterized in that,
The end that said housing (1) has recessed cavity (4) has the sealed step (8) that is used for installing cover plate (2).
7. according to each described radiator of claim 3 to 5, it is characterized in that,
Said capillary structure (6) is sintered aluminium powder or foamed aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220036086XU CN202455719U (en) | 2012-02-06 | 2012-02-06 | Radiator with heat sink structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220036086XU CN202455719U (en) | 2012-02-06 | 2012-02-06 | Radiator with heat sink structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202455719U true CN202455719U (en) | 2012-09-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220036086XU Expired - Lifetime CN202455719U (en) | 2012-02-06 | 2012-02-06 | Radiator with heat sink structure |
Country Status (1)
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| CN (1) | CN202455719U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008041A (en) * | 2012-12-03 | 2013-04-03 | 北京航空航天大学 | Aluminum-made vertical heat sink device with high temperature distribution uniformity |
| CN105578849A (en) * | 2016-03-11 | 2016-05-11 | 中国科学院光电研究院 | Sealed-type heat-dissipating device and manufacturing method thereof |
| CN106181277A (en) * | 2016-07-29 | 2016-12-07 | 苏州聚力电机有限公司 | A kind of molding heat radiator method having concealed temperature-uniforming plate |
| CN106329023A (en) * | 2016-09-18 | 2017-01-11 | 广东工业大学 | Battery module |
| CN106546116A (en) * | 2015-09-23 | 2017-03-29 | 迈萪科技股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN106659096A (en) * | 2017-02-23 | 2017-05-10 | 湖南中科泰通热能科技发展有限公司 | Heat exchange unit used for electrical equipment |
| CN109003954A (en) * | 2018-08-17 | 2018-12-14 | 大连恒能高导科技有限公司 | Radiator |
| CN111256505A (en) * | 2020-03-13 | 2020-06-09 | 上海合辰科新材料有限公司 | Special-shaped multi-dimensional phase change radiator |
| CN111975161A (en) * | 2020-08-19 | 2020-11-24 | 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) | Welding parting and preprocessing method for plate type pulsating heat pipe |
| CN115255536A (en) * | 2022-07-13 | 2022-11-01 | 旻芯半导体(嘉兴)有限公司 | Welding process of endoscope heat pipe assembly |
| WO2023246335A1 (en) * | 2022-06-24 | 2023-12-28 | 荣耀终端有限公司 | Vapor chamber and electronic apparatus |
-
2012
- 2012-02-06 CN CN201220036086XU patent/CN202455719U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008041A (en) * | 2012-12-03 | 2013-04-03 | 北京航空航天大学 | Aluminum-made vertical heat sink device with high temperature distribution uniformity |
| CN106546116A (en) * | 2015-09-23 | 2017-03-29 | 迈萪科技股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN105578849A (en) * | 2016-03-11 | 2016-05-11 | 中国科学院光电研究院 | Sealed-type heat-dissipating device and manufacturing method thereof |
| CN106181277A (en) * | 2016-07-29 | 2016-12-07 | 苏州聚力电机有限公司 | A kind of molding heat radiator method having concealed temperature-uniforming plate |
| CN106329023A (en) * | 2016-09-18 | 2017-01-11 | 广东工业大学 | Battery module |
| CN106659096A (en) * | 2017-02-23 | 2017-05-10 | 湖南中科泰通热能科技发展有限公司 | Heat exchange unit used for electrical equipment |
| CN109003954A (en) * | 2018-08-17 | 2018-12-14 | 大连恒能高导科技有限公司 | Radiator |
| CN111256505A (en) * | 2020-03-13 | 2020-06-09 | 上海合辰科新材料有限公司 | Special-shaped multi-dimensional phase change radiator |
| CN111975161A (en) * | 2020-08-19 | 2020-11-24 | 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) | Welding parting and preprocessing method for plate type pulsating heat pipe |
| WO2023246335A1 (en) * | 2022-06-24 | 2023-12-28 | 荣耀终端有限公司 | Vapor chamber and electronic apparatus |
| CN115255536A (en) * | 2022-07-13 | 2022-11-01 | 旻芯半导体(嘉兴)有限公司 | Welding process of endoscope heat pipe assembly |
| CN115255536B (en) * | 2022-07-13 | 2023-09-19 | 旻芯半导体(嘉兴)有限公司 | Welding process of endoscope heat pipe assembly |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120926 |