CN210537201U

CN210537201U - Liquid cooling plate based on phase change liquid cooling and phase change liquid cooling heat dissipation system applying same

Info

Publication number: CN210537201U
Application number: CN201921181700.XU
Authority: CN
Inventors: 何昊
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-07-25
Filing date: 2019-07-25
Publication date: 2020-05-15
Anticipated expiration: 2029-07-25

Abstract

The utility model relates to a radiating equipment field, especially a liquid cooling board and use its phase transition liquid cooling system based on phase transition liquid cooling, the liquid cooling board is used in the radiating system of phase transition liquid cooling, increase the balanced interlayer of porous material and separate into main cavity and supplementary chamber with the runner chamber in the runner chamber of liquid cooling board, the balanced interlayer of porous material is made by porous material, and when it has the intensive heat transfer effect, still when the liquid cooling board is heated, it is more even to let the distribution of the liquid medium in main cavity and supplementary chamber, and the gas-liquid wraps up the degree of holding in the palm is littleer, and flow more steady, and then makes heat transfer between liquid cooling board and cooling medium is even more quick, more is applicable to the heat dissipation of the high component that generates heat density, can reduce the phenomenon of eliminating the local hot spot of the component that generates heat even completely moreover.

Description

Liquid cooling plate based on phase change liquid cooling and phase change liquid cooling heat dissipation system applying same

Technical Field

The utility model relates to a radiator equipment field, especially a liquid cooling board and use its phase transition liquid cooling system based on phase transition liquid cooling.

Background

With the development of electronic technology, the integration level of electronic equipment is higher and higher, and not only the heat productivity of a chip or a module in the electronic equipment is higher and higher, but also the electronic equipment has the characteristics of high local heat flux density and the like. Research shows that the local heat flow density is high, so that heat is locally gathered, local hot spots are generated on the surface of a chip or a module, the service performance and the working reliability of the chip or the module are influenced, and the service life of the chip or the module is shortened.

The heat sink of the electronic device mainly includes air-cooled heat sink and liquid-cooled heat sink, because of high heat capacity and high conductivity of the liquid, the liquid-cooled heat sink has heat-sinking capability stronger than air-cooled heat sink. At present, the existing electronic equipment usually adopts a liquid cooling plate directly contacting with a heat source as a liquid cooling heat dissipation device, the liquid cooling plate directly contacts with the heat source, heat of the heat source is transferred to liquid flowing inside the liquid cooling heat dissipation device, and the heat is taken away through circulation of the liquid. In the prior art, under the condition of high heat flow density, the liquid cooling plate is only a circular, square or other simple single flow channel type liquid cooling plate, and cannot meet the requirement of efficient heat transfer between the liquid cooling plate and a heat exchange medium, and the internal flow channel needs to be ribbed and reinforced, so that the contact area between the liquid cooling plate and the cooling medium is larger, and the larger heat transfer efficiency is realized. In order to achieve the enhancement effect, the technical scheme adopted by the existing liquid cooling plate mainly has several modes:

1. for the drilling liquid cooling plate or the friction welding liquid cooling plate, a flow passage arrangement encryption mode is adopted, but the processing difficulty of the cold plate is greatly increased, and the pressure-resistant and leakage-proof performance is reduced.

2. For the liquid cooling plate brazed or sealed by the sealing ring, a reinforcing column or a reinforcing rib is added from the substrate of the liquid cooling plate in the inner runner cavity of the liquid cooling plate; the effect of heat transfer enhancement and the surface area of the enhanced reinforcing column and the enhanced rib are in a positive function relationship, and in order to enhance the heat transfer to a greater extent, even a micro-channel with the width of 0.2mm is processed, the thinner the channel is, the more difficult the processing is.

3. Most of the existing equipment heat dissipation products are water-cooling heat dissipation products, phase-change liquid cooling heat dissipation is rarely used, and in the phase-change liquid cooling heat dissipation system, the liquid cooling plate also uses an internal structure which is not different from a common water-cooling heat dissipation cold plate and is similar to the common water-cooling heat dissipation cold plate in structure, so that the overall heat dissipation effect of the phase-change liquid cooling heat dissipation system is not ideal, and the heat dissipation requirement under the condition of overlarge heating density cannot be met.

Therefore, in the prior art, various solutions are also proposed, such as local channel optimization design of local multi-pipelines, so as to eliminate local hot spots of a high heat flow density device or a local heat concentration module, but because the size of a local high-density heat source is small, the space for channel optimization is small, but the phase-change liquid cooling heat dissipation effect of the liquid cooling plate application cannot be well improved, so that the prior art solutions cannot effectively eliminate the problem of the local hot spots of a heating component, and the heat dissipation effect is integrally improved.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned defect, the utility model aims to provide a liquid cooling board and use its phase transition liquid cooling system based on phase transition liquid cooling.

To achieve the purpose, the utility model adopts the following technical proposal:

a liquid cooling plate based on phase change liquid cooling comprises a liquid cooling plate body and a porous material balance interlayer; a runner cavity is arranged inside the liquid cooling plate body; the middle part of the runner cavity is provided with the porous material balance interlayer, and the runner cavity is divided into a main cavity and an auxiliary cavity by the porous material balance interlayer; the liquid inlet end of the main cavity is provided with an inlet part, and the liquid outlet end of the auxiliary cavity is provided with an outlet part; the porous material balance interlayer is made of a porous material.

Preferably, the liquid outlet end of the main cavity is provided with an outlet part, and the outlet part of the main cavity is communicated with the outlet part of the auxiliary cavity to form a discharge port; the liquid inlet end of the auxiliary cavity is provided with an inlet part, and the inlet part of the auxiliary cavity is communicated with the inlet part of the main cavity to form an inlet.

Preferably, the discharge port and the inflow port are respectively arranged at two ends of the flow passage cavity and are arranged in parallel and opposite to each other.

Preferably, the internal structure of the porous material is in a net shape, a porous shape or a honeycomb shape. The porous material has various types and specific structures, and only needs to have adsorption and permeability on a liquid medium and ensure that a gaseous medium passes through the porous material; specific porous materials include: the internal specific structure types of the multi-metal material, the porous metal and nonmetal composite material and the porous nonmetal material comprise a foam type, a lotus root type, a honeycomb type and the like; the surface tension characteristics of the porous structure materials are different, the operation environment is different, and the mesh number of the pores of the commonly used porous structure materials is preferably 20-200 PPI; in addition, the porous structure material can be uniform in porosity, layered or regionally uniform, and the porous material can be isotropic or anisotropic.

Preferably, the liquid cooling plate body is integrally formed, and the porous material is welded and fixed in the flow passage cavity.

Preferably, the liquid cooling plate body is formed by splicing a base and a cover plate, and the porous material is pressed and fixed in the runner cavity by the cover plate and the base.

Preferably, the main cavity, the auxiliary cavity and the porous material balance interlayer are uniform in thickness and same in height; the thickness of the main cavity is equal to that of the auxiliary cavity and ranges from 3 mm to 30mm, and the thickness of the porous material balance interlayer ranges from 3 mm to 10 mm.

Use as above a phase transition liquid cooling system based on liquid cold plate of phase transition liquid cooling, it includes: a heat exchanger, a gas conduit and a liquid conduit; the gas duct communicates the outlet portion of the liquid-cooled plate with the inlet end of the heat exchanger, and the liquid duct communicates the inlet portion of the liquid-cooled plate with the outlet end of the heat exchanger.

The utility model provides a liquid cooling board based on phase transition liquid cooling, it can be used in the radiating system of phase transition liquid cooling, increase the balanced interlayer of porous material in the runner chamber of liquid cooling board after, separate into main cavity and supplementary chamber with the runner chamber, the balanced interlayer of porous material is made by porous material, and when it has the effect of intensifying heat transfer, still when the liquid cooling board is heated, it is more even to let the distribution of the liquid medium of main cavity and supplementary intracavity, and the gas-liquid wraps up in the degree of holding under the arms is littleer, and flow more steady, and then makes heat transfer between liquid cooling board and cooling medium is even more quick, more is applicable to the heat dissipation of the high part that generates heat of density, can reduce or even eliminate the phenomenon of the part local hot spot that generates heat completely.

Drawings

Fig. 1 is a schematic cross-sectional view of an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of another embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of another embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of another embodiment of the present invention.

Wherein: liquid cooling plate 100, base 111, cover plate 112, inlet portion 110, outlet portion 120, porous material balance partition 130, main chamber 140, auxiliary chamber 150, and heat generating component 200.

Detailed Description

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

As shown in FIG. 1, a liquid cooling plate based on phase change liquid cooling comprises a liquid cooling plate body and a porous material balance interlayer 130; a runner cavity is arranged inside the liquid cooling plate body; the middle part of the runner cavity is provided with the porous material balance interlayer 130, and the runner cavity is divided into a main cavity 140 and an auxiliary cavity 150 by the porous material balance interlayer 130; the liquid inlet end of the main cavity 140 is provided with an inlet part 110, and the liquid outlet end of the auxiliary cavity 150 is provided with an outlet part 120; the porous material balance spacer 130 is made of a porous material; in this embodiment, when the liquid medium enters the main chamber 140 from the inlet portion 110 disposed at the liquid inlet end of the main chamber 140, a small amount of the liquid medium may enter the porous material balance partition 130 and even the auxiliary chamber 150, so as to maintain more liquid medium and pressure balance in the main chamber 140; after the liquid cooling plate 100 is heated, the liquid medium is vaporized to form a gaseous medium, the pressure of the main cavity 140 is rapidly increased, and the gaseous medium can partially enter the auxiliary cavity 150 with lower pressure through the porous interlayer, so that the entrainment of gas in the main cavity 140 is reduced, the effective contact area between a panel on one side of the main cavity 140, which is in contact with the heat generating component 200, and the liquid medium in the main cavity 140 is increased, the heat exchange effect of the liquid cooling plate 100 is enhanced, and the gaseous medium is discharged to an external pipeline through the outlet part 120 arranged at the liquid storage end of the auxiliary cavity 150.

Of course, the porous material balance interlayer 130 may have a plurality of blocks, the flow channel cavity of the liquid cooling plate 100 is divided into one or more groups of main cavities 140 and auxiliary cavities 150 according to requirements, the cavity of the liquid cooling plate 100 contacted by the heated panel is the main cavity 140, and the cavity of the liquid cooling plate 100 not contacted by the heated panel and separated by the porous material balance interlayer 130 on the other side is the auxiliary cavity 150. Because the porous material balance interlayer 130 has capillary adsorption and permeability, fluid flows in the porous material balance interlayer 130 with flow resistance, so that pressure difference can be formed between the flow channel cavities separated by the porous material balance interlayer 130; under different use conditions, the liquid medium can be more concentrated in the main cavity 140, so that the effective contact surface between the liquid medium in the main cavity 140 and the heat generating component 200 is larger, and the heat transfer is more uniform and rapid.

As shown in fig. 2, the outlet portion 120 is disposed at the liquid outlet end of the main chamber 140, and the outlet portion 120 of the main chamber 140 and the outlet portion 120 of the auxiliary chamber 150 are communicated to form an exhaust port; an inlet part 110 is arranged at the liquid inlet end of the auxiliary cavity 150, and the inlet part 110 of the auxiliary cavity 150 is communicated with the inlet part 110 of the main cavity 140 to form an inlet. The discharge port and the inflow port are respectively arranged at two ends of the flow channel cavity and are arranged in parallel and opposite to each other. In this embodiment, when the liquid medium enters the main chamber 140 and the auxiliary chamber 150 simultaneously, the liquid in the main chamber 140 is heated and vaporized. Under the condition of different inlet and outlet pressure differences, the gaseous medium may partially enter the auxiliary cavity 150, and most of the gaseous medium is remained in the main cavity 140, and the gaseous medium and the liquid medium flow together to the outlet; because the liquid medium in the main cavity 140 is reduced, the liquid medium in the auxiliary cavity 150 directly enters the main cavity 140 through the porous material interlayer, and the liquid medium reduced by vaporization in the main cavity 140 is supplemented, so that the liquid medium in the main cavity 140 is increased compared with the liquid medium in the main cavity 140 at the initial stage, the effective contact area between the panel on one side of the main cavity 140, which is in contact with the heat generating component 200, and the liquid medium in the main cavity 140 is increased, and meanwhile, the liquid medium directly supplemented from the auxiliary cavity 150 to the main cavity 140 through the porous material balance interlayer 130 has lower temperature and better cooling capacity, and further the heat exchange effect of the liquid cooling plate 100 is enhanced; by adopting the structure mode, the liquid medium can stably and uniformly flow through the liquid cooling plate 100 under the condition that the difference between the inlet and the outlet of the liquid cooling plate 100 is extremely low, so that the phase change process in the cold plate is stably realized, and the heat transfer effect of the cold plate is greatly improved.

Specifically, the internal structure of the porous material is in a net shape, a porous shape or a honeycomb shape. More preferably, the metal foam material has good adsorption capacity, and the liquid has thermal conductivity and corrosion resistance, and the porous material balance interlayer 130 is made of the metal foam material, so that the heat transfer effect of the cold plate can be improved, and the service life of the cold plate can be prolonged.

The production and manufacturing modes of the liquid cooling plate 100 are various, the production process is simple and convenient, and concretely, as shown in fig. 4, the liquid cooling plate 100 body is integrally formed and provided with a plurality of runner cavities, and one porous material is welded and fixed in each runner cavity. Or as shown in fig. 3, the liquid cooling plate 100 body is formed by splicing a base 111 and a cover plate 112, and the porous material is fixed between the main cavity 140 and the auxiliary cavity 150 by the cover plate 112 and the base 111 in a pressing manner, so that the porous material balance partition 130 is arranged in the flow channel cavity, and the production and assembly of the liquid cooling plate 100 are simpler and more convenient.

The main chamber 140, the auxiliary chamber 150 and the porous material balance partition 130 have uniform thickness and same height; the thickness of the main cavity 140 is equal to that of the auxiliary cavity 150 and is 3-30mm, and the thickness of the porous material balance partition 130 is 3-10 mm. Since the liquid-cooled panel 100 is in actual operation, the principle of phase change is applied. The specific size ranges of the main cavity 140, the auxiliary cavity 150 and the porous material balance interlayer 130 are limited, so as to ensure the phase change process of the cooling medium inside the liquid cooling plate 100, after the liquid medium is introduced into the liquid cooling plate, due to the existence of the pressure difference, the heat transfer effect of the liquid cooling plate 100 can be further improved.

The above-mentioned phase-change liquid cooling heat dissipation system using the liquid cooling plate 100 based on phase-change liquid cooling includes: the liquid cooling plate 100, the heat exchanger, the gas conduit and the liquid conduit; the gas conduit communicates the outlet portion 120 of the liquid-cooled plate 100 with the inlet end of the heat exchanger, and the liquid conduit communicates the inlet portion 110 of the liquid-cooled plate 100 with the outlet end of the heat exchanger. The heat exchanger may be specifically a copper tube fin heat exchanger or a microchannel heat exchanger, where a liquid medium flows out from an outlet end of the heat exchanger, the liquid medium flows into the flow channel cavity along the liquid conduit from the inlet portion 110 of the cold plate, the liquid cooling plate 100 is contacted with the heat generating component 200 and heated, the liquid medium is vaporized to form a gaseous medium, the gaseous medium returns to the heat exchanger along the gas conduit, and the heat sink dissipates heat in the gaseous medium, so that the gaseous medium is liquefied into the liquid medium and finally flows out from the heat sink, and the heat generated by the heat generating component 200 is rapidly transferred by such circulation, thereby ensuring normal operation of the electrical equipment.

The utility model provides a liquid cooling plate 100 based on phase transition liquid cooling, it can be used in the radiating system of phase transition liquid cooling, increase porous material balance interlayer 130 back in the runner chamber of liquid cooling plate 100, separate into main cavity 140 and supplementary chamber 150 with the runner chamber, porous material balance interlayer 130 is made by porous material, and when it has the effect of reinforceing the heat transfer, still when liquid cooling plate 100 is heated, let the distribution of the liquid medium in main cavity 140 and the supplementary chamber 150 more even, when liquid medium's import portion pressure is sufficient, the gaseous direct porous material balance interlayer 130 that is closest of the liquid medium vaporization production enters into supplementary chamber 150, and the degree that lets the gas-liquid parcel hold in the palm of the arm is littleer, and the liquid filling rate of main cavity 140 is high. When the pressure of the liquid medium inlet part is lower, the liquid medium in the auxiliary cavity 150 enters the main cavity 140 from the porous material balance partition 130 to replenish the liquid in the main cavity 140. Thereby reducing or avoiding the pulsation of the liquid supply of the phase-change liquid cooling heat dissipation system and enhancing the heat exchange effect between the liquid supply and the heating component; the liquid medium in the liquid cooling plate 100 flows more stably, so that the heat transfer between the liquid cooling plate 100 and the cooling medium is more uniform and faster, the liquid cooling plate is more suitable for heat dissipation of the heating component 200 with high heating density, and the phenomenon of local hot spots of the heating component 200 can be reduced or even completely eliminated.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims

1. A liquid cooling plate based on phase change liquid cooling is characterized by comprising a liquid cooling plate body and a porous material balance interlayer; a runner cavity is arranged inside the liquid cooling plate body; the middle part of the runner cavity is provided with the porous material balance interlayer, and the runner cavity is divided into a main cavity and an auxiliary cavity by the porous material balance interlayer; the liquid inlet end of the main cavity is provided with an inlet part, and the liquid outlet end of the auxiliary cavity is provided with an outlet part; the porous material balance interlayer is made of a porous material.

2. The liquid cooling plate based on the phase-change liquid cooling as claimed in claim 1, wherein an outlet portion is provided at the liquid outlet end of the main chamber, and the outlet portion of the main chamber and the outlet portion of the auxiliary chamber are communicated to form an outlet; the liquid inlet end of the auxiliary cavity is provided with an inlet part, and the inlet part of the auxiliary cavity is communicated with the inlet part of the main cavity to form an inlet.

3. The liquid cooling plate based on phase-change liquid cooling as claimed in claim 2, wherein the outlet and the inlet are respectively disposed at two ends of the flow channel chamber, and are disposed opposite to each other in parallel.

4. A liquid-cooled panel according to any one of claims 1 to 3, characterised in that the internal structure of the porous material is in the form of a mesh, cell or honeycomb.

5. The liquid cooling plate based on phase change liquid cooling of claim 4, wherein the liquid cooling plate body is integrally formed, and the porous material is welded and fixed in the flow passage cavity.

6. The liquid cooling plate based on phase-change liquid cooling of claim 4, wherein the liquid cooling plate body is formed by splicing a base and a cover plate, and the porous material is fixed in the runner cavity by the cover plate and the base in a pressing mode.

7. The liquid cooling plate based on phase change liquid cooling of claim 1, wherein the main chamber, the auxiliary chamber and the porous material balance interlayer are uniform in thickness and same in height; the thickness of the main cavity is equal to that of the auxiliary cavity and ranges from 3 mm to 30mm, and the thickness of the porous material balance interlayer ranges from 3 mm to 10 mm.

8. A phase change liquid cooling heat dissipation system, characterized in that it employs a liquid cooling plate based on phase change liquid cooling according to any one of claims 1 to 7; it still includes: a heat exchanger, a gas conduit and a liquid conduit; the gas duct communicates the outlet portion of the liquid-cooled plate with the inlet end of the heat exchanger, and the liquid duct communicates the inlet portion of the liquid-cooled plate with the outlet end of the heat exchanger.