CN215453789U

CN215453789U - Heat radiator

Info

Publication number: CN215453789U
Application number: CN202122213491.6U
Authority: CN
Inventors: 佟薇; 韦立川; 蔡志强
Original assignee: Shenzhen Envicool Technology Co Ltd
Current assignee: Shenzhen Envicool Technology Co Ltd
Priority date: 2021-09-13
Filing date: 2021-09-13
Publication date: 2022-01-07
Anticipated expiration: 2031-09-13

Abstract

The utility model discloses a radiator, which comprises a cavity, a substrate covered on the cavity and a plurality of heat pipes arranged in the substrate in a penetrating way, wherein liquid working media are filled in the cavity, the substrate comprises a first side facing the liquid working media and a second side back to the liquid working media, each heat pipe comprises an evaporation end and a condensation end, the evaporation end is positioned at the first side of the substrate and at least partially immersed in the liquid working media, and the condensation end is positioned at the second side of the substrate.

Description

Heat radiator

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a heat radiator.

Background

With the continuous development of electronic technology, especially server chip technology, the performance of the electronic device is greatly improved, and the heat dissipation capacity and the heat dissipation density are increased. The air cooling technology is limited by the nature of air, the heat dissipation capability is close to the limit, and the heat dissipation requirement of the existing high-performance and high-power consumption electronic equipment cannot be met.

The two-phase immersion cooling technology utilizes latent heat generated when a low-boiling-point phase-changeable liquid working medium boils, can achieve higher heat dissipation heat flux density and heat exchange efficiency, and is considered as an effective alternative scheme for air cooling heat dissipation. The existing two-phase immersion cooling system is structurally a sealed system, heat of electronic equipment is taken away through circulation of heat absorption boiling-heat release condensation of a low-boiling-point liquid working medium inside, an effective condenser can guarantee stable system pressure and liquid saturation temperature, and steam is condensed into liquid to flow back to a cavity body timely and effectively.

The condenser that is used for two-phase submergence cooling system that is known at present is mostly the metal coil pipe condenser, installs in the gaseous phase district at cooling system top, and after the liquid working medium in the cavity of bottom absorbed the heat of electronic equipment such as chip, the boiling evaporation was gaseous and sent the gas phase district and coil pipe contact heat transfer that floats on certainly, and the liquid of coil pipe inner loop flow shifts the heat outside to cooling system. The condenser of above-mentioned structure seals inside cooling system, in order to provide effective heat transfer area, needs a large amount of coils, not only makes the tube coupling complicated, intraductal liquid leak the risk high, and the circulation flow of intraductal liquid needs extra pump to drive moreover, has increased cooling system's whole energy consumption and cost. In addition, the condenser of the structure finishes heat exchange through contact heat exchange of the coil pipe and the gaseous working medium, and the overall heat exchange efficiency is low.

Disclosure of Invention

In view of this, a heat sink with simple structure and good heat dissipation is provided.

A radiator comprises a cavity, a substrate arranged on the cavity in a covering mode and a plurality of heat pipes arranged in the substrate in a penetrating mode, wherein liquid working media are arranged in the cavity, the substrate comprises a first side facing the liquid working media and a second side facing away from the liquid working media, each heat pipe comprises an evaporation end and a condensation end, the evaporation ends are located on the first side of the substrate and at least partially immersed in the liquid working media, and the condensation ends are located on the second side of the substrate.

Further, the substrate is hermetically connected with the cavity.

Furthermore, a first fin group is further arranged on the first side of the base plate, the first fin group comprises a plurality of first fins which are arranged at intervals, and the first fins are thermally connected with the base plate and are spaced from the evaporation end of the heat pipe.

Furthermore, the plurality of heat pipes are arranged at intervals, the first fin group comprises a plurality of fins, and each first fin group is located between the evaporation ends of two adjacent heat pipes.

Further, the first fin is positioned above the liquid level of the liquid working medium; or the first fin part is immersed in the liquid working medium.

Further, the first fin and the substrate are of an integral structure or are welded into a whole after being respectively formed, and the shape of the first fin comprises at least one of a square sheet shape, a square column shape, a polygonal column shape, a cylindrical shape, a corrugated sheet shape or a corrugated column shape.

Further, the surface of the first fin is formed with a protrusion, a groove, a channel or a groove.

Furthermore, a second fin group is further arranged on the second side of the base plate and comprises a plurality of second fins arranged at intervals, and the second fins are thermally connected with the condensation end of the heat pipe.

Furthermore, the second fin is sleeved on the condensation end of the heat pipe, and grooves, bulges or corrugations are formed on the surface of the second fin.

Furthermore, a porous structure, a groove structure, a channel structure, a groove structure, a protrusion or a fin is formed on the outer surface of the evaporation end of the heat pipe.

Compared with the prior art, the heat radiator can reduce the temperature difference required by heat exchange by utilizing latent heat in the heat pipe, reduce the thermal resistance, quickly discharge a large amount of heat out of the system under a smaller temperature difference, and realize quick heat dissipation of electronic equipment; in addition, the utility model does not need to realize the transfer of the heat inside the cooling system to the outside through the circulating flow of liquid, does not have complicated pipeline arrangement and pipeline connection, has no risk of liquid leakage, does not need additional power equipment and power consumption, not only can simplify the structure and save the cost, but also can ensure the system safety and avoid the damage of electronic equipment.

Drawings

Fig. 1 is a schematic view of a heat sink according to an embodiment of the utility model.

Fig. 2 is an exploded view of the heat sink shown in fig. 1.

Fig. 3 is another angular view of the heat sink shown in fig. 2.

Fig. 4 is a cross-sectional view of the heat sink shown in fig. 1 taken along line IV-IV.

Detailed Description

To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. One or more embodiments of the present invention are illustrated in the accompanying drawings to provide a more accurate and thorough understanding of the disclosed embodiments. It should be understood, however, that the present invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein.

The same or similar reference numbers in the drawings correspond to the same or similar parts; in the description of the present invention, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms may be understood by those skilled in the art according to specific circumstances.

The utility model provides a radiator, which is mainly applied to a two-phase immersion cooling system of electronic equipment. Fig. 1-4 illustrate a heat sink according to an embodiment of the present invention, which includes a substrate 10, heat pipes 20 penetrating the substrate 10, a first fin set 30 disposed below the substrate 10, and a second fin set 40 disposed above the substrate 10.

The substrate 10 has a thin plate structure and is made of a material having a good thermal conductivity, such as pure copper, oxygen-free copper, aluminum alloy, stainless steel, and a high thermal conductivity composite material. The substrate 10 is provided with a through hole 12 for passing the heat pipe 20. In the figure, the heat pipes 20 are arranged in a plurality and array, specifically, in a 5 × 3 square matrix. Correspondingly, the through holes 12 on the substrate 10 are plural and distributed in an array, and two adjacent through holes 12 are spaced at an appropriate distance in the transverse direction and the longitudinal direction. It should be understood that the number and arrangement of the heat pipes 20 may be different according to the thermal load of the electronic device, and the size of the substrate 10, the number and distribution of the through holes 12 on the substrate 10 may be different correspondingly, and in some embodiments, the heat pipe 20 may also be a single heat pipe, which is not limited to a specific embodiment.

The middle part of each heat pipe 20 is fixedly inserted into a through hole 12 of the substrate 10, and preferably, the substrate 10 and the heat pipe 20 are fixedly connected by welding, tight fitting, and the like. The two ends of the heat pipe 20 form an evaporation end 22 and a condensation end 24, respectively, wherein the evaporation end 22 extends out a certain length from the lower side of the substrate 10, and the condensation end 24 extends out a certain length from the upper side of the substrate 10. The heat pipe 20 is filled with a certain amount of working medium with low boiling point, which absorbs heat and boils at the evaporation end 22, and then the working medium is converted from liquid state to gas state and flows upwards to the condensation end 24, as shown by the arrow in fig. 4. The gaseous working medium releases heat and condenses at the condensation end 24, and is converted into a liquid state from a gaseous state and flows back to the evaporation end 22, so that the continuous circulation realizes the rapid heat transfer. Preferably, the inner wall surface of the heat pipe 20 is formed with a capillary structure for promoting the backflow of the liquid working medium and avoiding dry burning of the evaporation end 22.

The first fin group 30 is disposed below the substrate 10 and thermally connected to the substrate 10, in an embodiment, the first fin group 30 and the substrate 10 may be formed separately and then welded together; in one embodiment, the first fin set 30 and the base plate 10 may be a unitary structure, so as to reduce the contact thermal resistance therebetween and enhance the thermal conduction efficiency. In the illustrated embodiment, there are a plurality of first fin groups 30, and each first fin group 30 is disposed between the evaporation ends 22 of two adjacent rows of heat pipes 20 and spaced from the evaporation ends 22 by a certain distance. The first fin group 30 includes a plurality of first fins arranged at intervals, and each first fin is vertically arranged, so that the condensed working medium can conveniently drop under the action of self gravity. In the illustration, the first fins are arranged perpendicular to the base plate 10, and the first flow channel 32 is formed between two adjacent first fins. The first flow channel 32 extends in a vertical direction, has an open bottom end, and has a closed top end by the base plate 10. In other embodiments, the first fin group 30 may be single.

The second fin group 40 is disposed above the substrate 10 and thermally connected to the condensation end 24 of the heat pipe 20, and preferably, the second fin group 40 is formed with a plurality of through holes 42 for inserting the condensation end 24, and the number and distribution of the through holes 42 are matched with those of the heat pipe 20. In the present embodiment, the heat pipe 20 is a vertical tubular structure, and the through holes 42 of the second fin group 40 are aligned with the through holes 12 of the substrate 10 one by one. In one embodiment, the through holes 42 are filled with solder to solder the condensing end 24 to the second fin group 40; in one embodiment, the condensation end 24 may be tightly fitted into the perforation 42. In the illustrated embodiment, the second fin group 40 includes a plurality of second fins arranged at intervals, each of the second fins is arranged parallel to the base plate 10, and a second flow channel 44 extending in the horizontal direction is formed between two adjacent second fins.

As shown in fig. 4, when the heat sink of the present invention is applied to a two-phase immersion cooling system, the edge of the substrate 10 is hermetically connected to the cavity 50 of the cooling system and forms a uniform temperature plate together, the first fin group 30 and the evaporation end 22 of the heat pipe 20 are sealed in the cavity 50, and the second fin group 40 and the condensation end 24 of the heat pipe 20 are exposed out of the cavity 50. The cavity 50 is filled with a certain amount of working medium with low boiling point, and the heat of the electronic equipment is quickly absorbed through the phase change of the working medium. The liquid level of the working medium in the cavity 50 is higher than the bottom end of the evaporation end 22 of the heat pipe 20 by a certain height, so that the evaporation end 22 is at least partially immersed in the working medium, and heat can be better absorbed from the working medium. Preferably, the liquid level of the working medium in the cavity 50 has a larger interval with the substrate 10, so that a larger space is formed in the sealed cavity 50 to accommodate the gaseous working medium after heat absorption and evaporation.

Preferably, the height of the first fin group 30 is less than the length of the evaporation end 22 of the heat pipe 20 extending downward relative to the base plate 10, so that the bottom end of the heat pipe 20 is lower than the bottom end of the first fin group 30, so that the liquid level of the working medium in the cavity 50 can be slightly lower than the bottom end of the first fin group 30, so that the working medium can freely flow on the liquid level after heat absorption and vaporization and smoothly enter each first flow channel 32 of the first fin group 30 and flow upward along the first flow channel 32, as shown by the arrows in fig. 4. The gaseous working medium exchanges heat with the first fin group 30 in the process of flowing upwards to transfer the absorbed heat to the first fin group 30. In some embodiments, the bottom ends of the first fin groups 30 may also be submerged below the liquid level, in which case each first flow channel 32 is relatively independent, but the gaseous working fluid may also flow up the first flow channels 32 and exchange heat with the first fin groups 30.

Preferably, the outer surface of the evaporation end 22 of the heat pipe 20 may be surface-treated to increase the surface area, that is, to increase the heat exchange area with the working medium in the cavity 50, so as to enhance the condensation of the working medium in the cavity 50 on the outer surface of the evaporation end 22. For example, a porous structure, a groove structure, a micro-channel structure, a micro-scale groove structure, a micro-scale protrusion structure, etc. may be formed on the outer surface of the evaporation end 22, or fins may be added on the outer surface of the evaporation end 22 to increase the heat exchange area.

Preferably, the first fin set 30 and the second fin set 40 are made of a material with good thermal conductivity, such as pure copper, oxygen-free copper, aluminum alloy, stainless steel, high thermal conductivity composite material, and the like. Preferably, each first fin of the first fin group 30 may be a square sheet, a square column, a polygonal column, a cylinder, a corrugated sheet, or a corrugated column, and the surface of the first fin may be added with a microstructure to increase the heat exchange area with the gaseous working medium, for example, a micro-scale protrusion, a micro-scale groove, a micro-channel, a micro-groove, etc. may be formed on the surface of the first fin by CNC, etching, laser etching, electrochemical deposition, high temperature sintering, etc. The surface of each second fin of the second fin group 40 may be provided with protrusions, grooves, corrugations, etc. to form an uneven structure to increase the heat exchange area with the ambient air. It should be understood that the shape, size, number, structure, etc. of the first fin and the second fin may be set as required, and are not limited to a specific embodiment.

When the radiator is used for radiating electronic equipment, firstly, working media in the cavity 50 quickly absorb heat of the electronic equipment through phase change, then, part of phase-changed working media are condensed to be in a liquid state due to the fact that the heat is absorbed by the heat pipe 20, the working media in the heat pipe 20 after absorbing the heat are evaporated and flow from the evaporation end 22 to the condensation end 24, the heat is brought to the condensation end 24 and is transferred to the second fin group 40 through a heat conduction mode, and finally, the heat is radiated to ambient air through the second fin group 40; a part of the phase-changed working medium flows upwards to exchange heat with the first fin group 30, the heat-exchanged working medium is condensed and flows back, and the heat of the heat-exchanged first fin group 30 is transferred to the substrate 10 in a heat conduction mode and is finally dissipated to the ambient air through the substrate 10 and the second fin group 40. Preferably, the heat sink of the present invention further includes a fan, the fan is disposed corresponding to the second flow channel 44 between the second fin sets 40, and the heat exchange between the second fin sets 40 and the ambient air is enhanced by the forced airflow, so that the heat can be rapidly dissipated to the ambient air.

The first fin group 30 and the heat pipe 20 are arranged to absorb heat of working media in the cavity 50, the heat pipe 20 is partially immersed below the liquid level, heat can be directly absorbed, condensation heat exchange efficiency is improved, temperature difference required by heat exchange can be reduced by using latent heat in the heat pipe 20, thermal resistance is reduced, a large amount of heat can be quickly discharged out of a system under small temperature difference, and quick heat dissipation of electronic equipment is realized. In addition, the condensation end 24 of the heat pipe 20 and the second fin group 40 are arranged outside the sealing structure of the cooling system, so that heat can be directly radiated to the external environment, the heat in the cooling system can be transferred to the outside without circulating flow of liquid, complex pipeline arrangement and pipeline connection are avoided, the risk of liquid leakage is avoided, additional power equipment and power consumption are not needed, the structure is simplified, the cost is saved, the system safety can be ensured, and the electronic equipment is prevented from being damaged.

It should be noted that the present invention is not limited to the above-mentioned embodiments, and other changes and modifications can be made by those skilled in the art according to the spirit of the present invention, and these changes and modifications made according to the spirit of the present invention should be included in the scope of the present invention as claimed.

Claims

1. A radiator is characterized by comprising a cavity, a substrate arranged on the cavity in a covering mode and a plurality of heat pipes arranged in the substrate in a penetrating mode, wherein liquid working media are arranged in the cavity, the substrate comprises a first side facing the liquid working media and a second side facing away from the liquid working media, each heat pipe comprises an evaporation end and a condensation end, the evaporation end is located on the first side of the substrate and at least partially immersed in the liquid working media, and the condensation end is located on the second side of the substrate.

2. The heat sink of claim 1, wherein the substrate is hermetically connected to the cavity.

3. The heat sink of claim 1, wherein the first side of the base plate is further provided with a first fin set, the first fin set comprising a plurality of first fins arranged at intervals, and the first fins are thermally connected to the base plate and spaced apart from the evaporation end of the heat pipe.

4. The heat sink as claimed in claim 3, wherein the plurality of heat pipes are arranged at intervals, and the first fin group comprises a plurality of fins, and each of the first fin groups is located between the evaporation ends of two adjacent heat pipes.

5. The heat sink of claim 3, wherein said first fin is positioned above a level of said liquid working medium; or the first fin part is immersed in the liquid working medium.

6. The heat sink as claimed in claim 3, wherein the first fin is integrally formed with the base plate or welded thereto after being separately formed, and the shape of the first fin includes at least one of a square sheet shape, a square column shape, a polygonal column shape, a cylindrical shape, a corrugated sheet shape, or a corrugated column shape.

7. The heat sink of claim 3, wherein the surface of the first fin is formed with projections, grooves, channels or grooves.

8. The heat sink according to any one of claims 1 to 7, wherein the second side of the base plate is further provided with a second fin group, the second fin group comprises a plurality of second fins arranged at intervals, and the second fins are thermally connected with the condensation end of the heat pipe.

9. The heat sink of claim 8, wherein the second fin is sleeved on the condensation end of the heat pipe, and a surface of the second fin is formed with a groove, a protrusion or a corrugation.

10. The heat sink of claim 1, wherein an outer surface of the evaporation end of the heat pipe is formed with a porous structure, a groove structure, a channel structure, a groove structure, a protrusion, or a fin.