CN116193813A

CN116193813A - Three-dimensional phase change radiator

Info

Publication number: CN116193813A
Application number: CN202211706265.4A
Authority: CN
Inventors: 杨清静; 王烨
Original assignee: Shenzhen Envicool Technology Co Ltd
Current assignee: Shenzhen Envicool Technology Co Ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-05-30

Abstract

The invention discloses a three-dimensional phase-change radiator, which comprises: the fin module comprises a plurality of fins which are respectively provided with a plurality of fin flow channels which are not communicated with each other; the first surface of the substrate is contacted with the heat source, and the second surface of the substrate opposite to the first surface is provided with a substrate runner; the substrate runner comprises a plurality of runner sections which are not communicated with each other; the cover plate is covered on the second surface to seal the substrate flow channel, and is provided with a plurality of communication holes, and each communication hole can be used for communicating a fin flow channel and a corresponding flow channel section to form a pulsating heat pipe loop; the pulsating heat pipe loop is pre-filled with phase change working medium. According to the radiator provided by the invention, all phase-change working media can participate in phase-change circulation, so that the space of the fins can be fully utilized for heat exchange, the heat exchange efficiency is improved, the installation of a heat source is not limited, and the problem that the heat dissipation effect is poor when the heat source is positioned above the heat siphon radiator in the vertical arrangement of the heat siphon radiator in the prior art can be effectively solved.

Description

Three-dimensional phase change radiator

Technical Field

The invention relates to the field of heat dissipation equipment, in particular to a three-dimensional phase change radiator.

Background

In order to meet the heat dissipation requirement of high-power electronic components, thermosiphon heat dissipaters are introduced in the market, fins and the inside of a substrate of the thermosiphon heat dissipater are cavities which are mutually communicated, working media capable of performing phase change are arranged in the cavities, and heat exchange efficiency can be effectively improved through phase change heat exchange and two-phase flow of the working media. However, because the two-phase circulation is driven by gravity completely, when the radiator is vertically arranged and the heat source is positioned above the radiator, the phase-change working medium can be deposited at the lower part of the cavity, so that the liquid working medium below cannot participate in the phase-change circulation, the space above the fins cannot be fully utilized for heat exchange, the heat exchange efficiency is affected, and the heat dissipation effect is poor.

Disclosure of Invention

The invention aims to provide a three-dimensional phase-change radiator so as to solve the problem that the radiating effect is poor when a thermosiphon radiator is vertically arranged and a heat source is positioned above the thermosiphon radiator in the prior art.

In order to achieve the above purpose, the present invention provides the following technical solutions:

a three-dimensional phase change heat sink comprising:

the fin module comprises a plurality of fins which are respectively provided with a plurality of fin flow channels which are not communicated with each other;

the heat source device comprises a substrate, a heat source and a heat source, wherein a first surface of the substrate is contacted with the heat source, and a second surface of the substrate opposite to the first surface is provided with a substrate flow channel; the substrate runner comprises a plurality of runner sections which are not communicated with each other;

the cover plate is covered on the second surface to seal the substrate flow channel, the cover plate is provided with a plurality of communication holes, and each communication hole can be used for communicating one fin flow channel and a corresponding flow channel section to form a pulsating heat pipe loop; the pulsating heat pipe loop is filled with a phase change working medium in advance.

Optionally, the method further comprises:

and the liquid filling pipe is communicated with one fin runner or one runner section so as to fill the phase change working medium into the pulsating heat pipe loop.

Optionally, each fin runner has a first opening and a second opening formed at side edges of a corresponding fin, each fin runner extends from one first opening to a corresponding second opening, and the first opening and the second opening are respectively communicated with different runner sections.

Optionally, the fin runner is U-shaped.

Optionally, the substrate runner includes circulation runner section and a plurality of transition runner section, each transition runner section all communicates in two adjacent fin runners, the both ends of circulation runner communicate respectively in two of the two fins of edge position one corresponding fin runner.

Optionally, each fin includes a first plate body and a second plate body, at least one of the first plate body and the second plate body is provided with a runner groove, and the first plate body and the second plate body are connected to form the fin runner.

Optionally, a plurality of heat source connection holes are formed on the substrate, and the heat source connection holes can be used for connecting the heat sources.

Optionally, the second surface of the substrate is provided with a plurality of connecting columns at positions corresponding to the heat source connecting holes, the connecting columns can be connected with the heat source in a matched manner, the connecting columns protrude out of the surface of the second surface of the substrate, the cover plate is provided with a plurality of positioning holes, and the connecting columns are positioned in a matched manner with the positioning holes.

Optionally, a plurality of mounting grooves are formed in the cover plate, each fin is mounted in a corresponding mounting groove, and the communication hole is formed in a position corresponding to the opening of the fin runner in the mounting groove.

Optionally, the base plate and the cover plate and the fins are fixed by welding.

The three-dimensional phase-change radiator provided by the invention comprises: the fin module comprises a plurality of fins which are respectively provided with a plurality of fin flow channels which are not communicated with each other; the heat source device comprises a substrate, a heat source and a heat source, wherein a first surface of the substrate is contacted with the heat source, and a second surface of the substrate opposite to the first surface is provided with a substrate flow channel; the substrate runner comprises a plurality of runner sections which are not communicated with each other; the cover plate is covered on the second surface to seal the substrate flow channel, the cover plate is provided with a plurality of communication holes, and each communication hole can be used for communicating one fin flow channel and a corresponding flow channel section to form a pulsating heat pipe loop; the pulsating heat pipe loop is filled with a phase change working medium in advance. According to the three-dimensional phase-change radiator provided by the invention, the pulsating heat pipe loop is formed based on the substrate flow channel, the communication holes and the fin flow channel, when the high-power electronic component, namely the heat source is in contact with the first surface and the heat source is operated, the phase-change working medium in the pulsating heat pipe loop absorbs heat to generate a phase-change reaction, and under the action of pressure difference, the phase-change working medium can reciprocate in the pulsating heat pipe loop, so that the circulating flow of the phase-change working medium is realized, therefore, all the phase-change working medium can participate in the phase-change circulation, the space of the fins can be fully utilized for heat exchange, the heat exchange efficiency is improved, the heat dissipation effect on the high-power electronic component is better, the heat source is not limited, and the problems that the heat dissipation effect is poor when the heat source is vertically arranged and the heat source is positioned above the heat siphon radiator in the prior art can be effectively improved. On the other hand, the three-dimensional phase-change radiator provided by the invention has the advantages that the substrate flow channel comprises the flow channel sections which are not communicated with each other, so that the channels for the phase-change working medium to flow are arranged at a plurality of positions of the substrate, the heat transfer path from the heat source to the phase-change working medium is shortened, the working medium can be in closer contact with the heat source, the threshold for starting the pulsating heat pipe is reduced, the starting is easier, and the heat can be fully diffused at each position of the radiator through the reciprocating oscillation movement of the internal working medium, the temperature uniformity of the radiator is improved, and the performance of the radiator is effectively improved.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the overall structure of a three-dimensional phase-change radiator according to an embodiment of the present invention;

FIG. 2 is an exploded schematic view of the three-dimensional phase-change heat sink of FIG. 1;

FIG. 3 is a schematic diagram of the positional relationship between fins and a substrate in the three-dimensional phase change heat sink shown in FIG. 1;

wherein: a substrate 100; a substrate flow path 101; a circulation flow path segment 101-1; a transition flow path segment 101-2; connecting the runner segments 101-3; a heat source connection hole 102; a cover plate 200; a communication hole 201; positioning holes 202; a mounting groove 203; a fin module 300; the fin flow channels 301; a liquid charging tube 400.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

With the rapid development of the electronic information industry, the requirements on the performance of the electronic information equipment are higher and higher, and meanwhile, the power of electronic elements is also greatly increased. Therefore, how to quickly conduct the heat generated by the high-power electronic component to achieve the heat dissipation purpose is a current urgent problem to be solved.

In the prior art, the traditional radiator transfers heat to the external fins by means of heat conduction, and utilizes enough heat dissipation area to dissipate heat, so that the traditional radiator has the advantages of good reliability, easiness in processing, lower cost and the like. However, the conventional radiator has low heat dissipation efficiency and poor effect due to large weight, and is difficult to meet the heat dissipation requirement of the novel high-power electronic component.

In order to meet the heat dissipation requirement of high-power electronic components, thermosiphon heat dissipaters are introduced in the market, fins and the inside of a substrate of the thermosiphon heat dissipater are cavities which are mutually communicated, working media capable of performing phase change are arranged in the cavities, and heat exchange efficiency can be effectively improved through phase change heat exchange and two-phase flow of the working media. However, because the two-phase circulation is completely driven by gravity, namely the working medium circulation of the thermosiphon radiator is completely driven by gravity, when the thermosiphon radiator is vertically arranged and the heat source is positioned above the thermosiphon radiator, the phase-change working medium can be deposited at the lower part of the cavity, so that the liquid working medium at the lower part cannot participate in the phase-change circulation, namely the phase-change working medium deposited at the lower part of the cavity cannot participate in the phase-change circulation, thereby the space of the fins cannot be fully utilized for heat exchange, namely the space above the fins cannot be fully utilized for heat exchange, the heat exchange efficiency is affected, and the heat dissipation effect is poor.

Therefore, how to improve the heat dissipation effect of the heat sink on the high-power electronic component is not good is a technical problem that needs to be solved by the skilled person. It is understood that vertically placing the thermosiphon radiator means that the thermosiphon radiator is arranged along the direction of gravity so that the working medium in the cavity can circulate along a path parallel to the direction of gravity.

Based on the characteristics of the pulsating heat pipe, the three-dimensional phase-change radiator provided by the invention has certain anti-gravity capacity. When the heat source is positioned above the radiator, the phase change working medium cannot be affected by gravity to be deposited in the lower space of the radiator, the liquid working medium in the lower space of the radiator can participate in phase change circulation, the space of the fins can be fully utilized for heat exchange, the heat exchange efficiency is improved, the problem that the traditional radiator cannot meet the heat dissipation requirement of high-power electronic components can be solved, the problem that the heat siphon radiator has poor heat dissipation effect on the high-power electronic components when the radiator is vertically arranged and the heat source is positioned above the radiator can be solved, the distance between the phase change working medium of the three-dimensional phase change radiator and the heat source is shorter, the heat dissipation effect is better, and the heat dissipation requirement of the high-power electronic components can be better met.

Referring to fig. 1 to 3, fig. 1 is a schematic diagram illustrating an overall structure of a three-dimensional phase-change radiator according to an embodiment of the present invention; FIG. 2 is an exploded schematic view of the three-dimensional phase-change heat sink of FIG. 1; fig. 3 is a schematic diagram of a positional relationship between a fin and a substrate in the three-dimensional phase-change radiator shown in fig. 1.

In this embodiment, the three-dimensional phase change heat sink includes:

the fin module 300 comprises a plurality of fins respectively provided with a plurality of fin flow channels 301 which are not communicated with each other; it can be understood that the fin module 300 may have a part of fins provided with the fin flow channels 301, and another part of fins not provided with the fin flow channels 301, that is, the fin module 300 may be partially made of solid fins, and of course, the fin module 300 may also have all fins provided with the fin flow channels 301, and may be configured according to requirements; when all fins of the fin module 300 are fins provided with the fin flow channels 301, the heat dissipation effect is optimal;

a substrate (100), wherein a first surface of the substrate (100) is in contact with a heat source, and a second surface of the substrate (100) opposite to the first surface is provided with a substrate flow channel (101); the substrate runner 101 comprises a plurality of runner segments which are not communicated with each other; it can be appreciated that the heat source may be directly mounted on the first surface of the substrate 100 to increase the contact area with the first surface of the substrate 100, so as to improve the heat exchange efficiency; the flow channel sections which are not communicated with each other refer to that the flow channel sections are not directly communicated with each other, and the flow channel sections can be used for flowing the phase-change working medium, namely, a plurality of positions of the substrate are provided with channels for flowing the phase-change working medium, so that the heat transfer path from a heat source to the phase-change working medium can be shortened, and the working medium can be in closer contact with the heat source;

the cover plate 200 is covered on the second surface to seal the substrate flow channel 101, the cover plate 200 is provided with a plurality of communication holes 201, and each communication hole 201 can be used for communicating a fin flow channel 301 and a corresponding flow channel section to form a pulsating heat pipe loop; it can be understood that the substrate flow channel 101 is directly machined on one surface (the second surface) of the substrate 100, and the cover plate 200 can seal the substrate flow channel 101 to ensure that the phase change working medium flows in the substrate flow channel 101;

the pulsating heat pipe loop is pre-filled with a phase change working medium, and when the heat source is in contact with the first surface and the heat source operates, the phase change working medium reciprocates in the pulsating heat pipe loop. It is understood that the heat source may be a high power electronic component, and is not limited herein.

The three-dimensional phase-change radiator provided by the invention is based on the substrate flow channel 101, the communication holes 201 and the fin flow channels 301 to form the pulsating heat pipe loop, when a high-power electronic component, namely a heat source is in contact with the first surface and the heat source operates, phase-change working medium in the pulsating heat pipe loop absorbs heat to generate phase-change reaction, under the action of pressure difference, the phase-change working medium can reciprocate in the pulsating heat pipe loop to realize the circulation flow of the phase-change working medium, so that all the phase-change working medium can participate in the phase-change circulation, the space of the fins can be fully utilized for heat exchange, the heat exchange efficiency is improved, the heat dissipation effect on the high-power electronic component is better, the heat source is not limited, and the problems that the heat dissipation effect is poor when the thermosiphon radiator is vertically arranged and the heat source is positioned above the thermosiphon radiator in the prior art can be effectively solved. On the other hand, the three-dimensional phase-change radiator provided by the invention has the advantages that the substrate flow channel comprises the flow channel sections which are not communicated with each other, so that the channels for the phase-change working medium to flow are arranged at a plurality of positions of the substrate, the heat transfer path from the heat source to the phase-change working medium is shortened, the working medium can be in closer contact with the heat source, the threshold for starting the pulsating heat pipe is reduced, the starting is easier, and the heat can be fully diffused at each position of the radiator through the reciprocating oscillation movement of the internal working medium, the temperature uniformity of the radiator is improved, and the performance of the radiator is effectively improved.

Further, the three-dimensional phase change radiator further includes:

the liquid filling pipe 400 is communicated with a fin runner 301 or a runner section to fill the pulsating heat pipe loop with phase change working substance. Of course, the gas in the pulsating heat pipe loop or the phase change working substance in the pulsating heat pipe loop can be pumped out through the liquid filling pipe 400.

The base plate 100 and the cover plate 200 and the fins of the fin module 300 are fixed by welding.

It will be appreciated that in one particular embodiment, a three-dimensional phase change heat sink includes:

a plurality of fins, each fin is provided with a plurality of intermittently arranged fin flow channels 301 respectively, namely each fin is provided with a plurality of non-communicated fin flow channels 301 respectively, and the fins are arranged in a certain sequence to form a fin module 300; wherein, the positions of the fin flow channels 301 close to the edges of the corresponding fins are provided with openings;

a substrate 100, wherein a first surface of the substrate 100 is in contact with a heat source, and a second surface of the substrate 100 opposite to the first surface is provided with a substrate flow channel 101; the substrate runner 101 comprises a plurality of runner sections which are not communicated with each other, the plurality of runner sections which are not communicated with each other comprise a plurality of transition runner sections 101-2 and a plurality of connecting runner sections 101-3, each transition runner section 101-2 and each connecting runner section 101-3 are arranged intermittently, a single transition runner section 101-2 is respectively communicated with a corresponding fin runner 301 on different fins, and a single connecting runner section 101-3 is respectively communicated with different fin runners 301 on the same fin;

the cover plate 200 is used for positioning fins, the cover plate 200 is covered on the second surface, a plurality of communication holes 201 are formed in the cover plate 200, and fin flow channels 301 are communicated with the transition flow channel section 101-2 or the connecting flow channel section 101-3 through the communication holes 201 to form pulsating heat pipe flow channels, so that the pulsating heat pipe loop is formed; further, the cover plate 200 may be further used to seal the substrate flow channel 101 on the substrate 100, since the substrate flow channel 101 is directly machined on the surface of the substrate 100, the cover plate 200 may seal the substrate flow channel 101 to ensure that the phase change working medium flows in the substrate flow channel 101, and only the communication holes 201 remain on the cover plate 200 to realize the communication between the fins and the substrate 100, and after the cover plate 200 is positioned with the substrate 100, the periphery of the cover plate 200 and the periphery of the substrate 100 need to be welded and fixed.

The liquid filling pipe 400 is used for filling phase change working medium into the fin runner 301, the transition runner section 101-2 or the connecting runner section 101-3 and is communicated with one fin runner 301 or one runner section.

Specifically, as shown in fig. 1, the cover plate 200 is located between the fins and the base plate 100, the fins are mounted on the cover plate 200, and the openings of the fin flow channels 301 on the fins are located at the side edges of the fins; each fin comprises a fin main body and a fin cover plate, a heat source can be arranged at the upper part, the middle part or the lower part of the base plate 100, each transition flow passage section 101-2 can be used for connecting fin flow passages 301 on different fins, and each transition flow passage section 101-2 and each connecting flow passage section 101-3 are independently arranged and are arranged intermittently; the cover plate 200 is used for positioning fins on one hand and communicating the fin flow channels 301 with the base plate flow channels 101 on the other hand, so that the fin flow channels 301 and the base plate flow channels 101 form a pulsating heat pipe loop after being communicated; the liquid filling pipe 400 is communicated with the fin runner 301 or the substrate runner 101, and for convenience in arrangement, the liquid filling pipe 400 is preferably communicated with the substrate runner 101, so as to introduce a phase change working medium into a pulsating heat pipe loop formed by the fin runner 301 and the substrate runner 101; the substrate flow channel 101 is disposed only on one side of the substrate 100 facing the cover plate 200, i.e., the substrate flow channel 101 is disposed only on the second surface of the substrate 100.

According to the three-dimensional phase-change radiator provided by the invention, the transition flow passage section 101-2 and the connecting flow passage section 101-3 are arranged on the substrate 100, so that the distance between the substrate flow passage 101 and a heat source is closer, the heat transfer path from the heat source to a phase-change working medium is shortened, the threshold for starting a pulsating heat pipe is reduced, and the starting is easier, thereby effectively improving the performance of the radiator; each fin runner 301 on a single fin is communicated by using the connecting runner segment 101-3, so that the fin runners 301 and the connecting runner segment 101-3 are alternately arranged, thereby realizing cold and hot alternation of the phase-change working medium and further improving the heat dissipation effect of the radiator.

Specifically, the three-dimensional phase-change radiator is designed and connected with the flow channels of the fins through the base plate 100, a three-dimensional flow path which is mutually communicated is formed in the radiator, the three-dimensional flow path forms a pulsating heat pipe loop, before the phase-change working medium is injected, the pulsating heat pipe flow channel is vacuumized, then the phase-change working medium is added, gas-liquid alternate distribution is formed, and the influence of gravity on the phase-change working medium is reduced; the heat of the heat source is rapidly extracted by boiling and exchanging heat by utilizing the liquid working medium in the pulsating heat pipe flow channel; then the heat is quickly transferred to the whole three-dimensional phase-change radiator by utilizing a two-phase gas-liquid plug flowing mode; and finally, condensing the gaseous working medium to release heat, and releasing the heat to the environment through the outer surfaces of the fins, so that the efficient heat taking, heat transfer and heat release processes of the whole radiator are realized, the overall temperature uniformity of the radiator is improved, and the heat radiation efficiency is improved.

In some embodiments, as shown in fig. 2, the openings include a first opening and a second opening, each of the first opening and the second opening being located at a side edge of the fin, each of the fin runners 301 having a first opening and a second opening formed at a side edge of a corresponding fin, each of the fin runners 301 extending from a first opening to a corresponding second opening, the first opening and the second opening of a single fin runner 301 being in communication with different connecting runner segments 101-3, respectively. Specifically, a plurality of mutually non-communicated fin flow channels 301 are arranged on a single fin, and phase change working media flowing into the fin flow channels 301 sequentially pass through the fin flow channels 301 and the connecting flow channel sections 101-3 and then return to the next fin flow channel 301 until flowing in the whole fin 300 is completed, enter the transition flow channel section 101-2 and then enter the corresponding fin flow channel 301 of the next fin, so that heat exchange and cyclic reciprocating actions are realized. According to the arrangement, the transition flow passage sections 101-2 are utilized to communicate the fin flow passages 301 on different fins 300, the inflow and outflow of the phase-change working medium on each fin flow passage 301 are realized through the first opening and the second opening, the fin flow passages 301 extend from the first opening to the corresponding second opening, the structural form of the pulsating heat pipe flow passage is formed, the influence of gravity on the phase-change working medium is reduced, and the reliability and the heat dissipation stability of the radiator are ensured.

In some embodiments, the fin runners 301 extend from the first opening to the second opening in a U shape, that is, the fin runners 301 are in a U shape, each fin runner 301 forms a meandering extending structure together through the cooperation of the connecting runner segments 101-3, so that the arrangement is to match the working principle of the pulsating heat pipe, and the fin runners 301 extend along an arc shape at the turning part, so that the phase change working medium can flow conveniently.

In some embodiments, the fin module 300 includes a first fin, a second fin … and an nth fin, the base plate 100 is further provided with a circulating runner segment 101-1, the transitional runner segment 101-2 is communicated with the fin runner 301 on the adjacent fin, and two ends of the circulating runner segment 101-1 are respectively communicated with a first opening of the fin runner 301 on the first fin and a first opening of the fin runner 301 on the nth fin. It can be understood that the substrate flow channel comprises a circulating flow channel section 101-1, a plurality of transition flow channel sections 101-2 and a plurality of connecting flow channel sections 101-3, wherein each transition flow channel section 101-2 is communicated with two adjacent fin flow channels 301, and two ends of the circulating flow channel 101-1 are respectively communicated with one corresponding fin flow channel of two fins at the edge positions. Specifically, the connecting runner segment 101-3 is used for connecting different fin runners 301 on the same fin, the transition runner segment 101-2 is used for connecting the fin runners 301 on two adjacent fins, the alternate arrangement of the fin runners 301 on different fins and the transition runner segment 101-2 is realized, and the circulating runner segment 101-1 is used for communicating the fin runners 301 on the whole fin with the substrate runner 101 to form a circulating channel.

In some embodiments, as shown in fig. 3, the plurality of transition runner segments 101-2 includes an upper transition runner segment and a lower transition runner segment, the number of the upper transition runner segment and the number of the lower transition runner segment are all a plurality, two ends of the upper transition runner segment are respectively communicated with a first opening of a fin runner 301 located at an upper side in an adjacent fin, two ends of the lower transition runner segment are respectively communicated with a second opening of a fin runner 301 located at a lower side in the adjacent fin, and the upper transition runner segment and the lower transition runner segment are arranged in a staggered manner. That is, the upper and lower transition flow path sections are connected between different two fins, thereby connecting the fin flow paths 301 to form a pulsating heat pipe loop.

In some embodiments, the upper transition runner section, the lower transition runner section and the connecting runner section 101-3 are all linear, are intermittently arranged, are convenient to process, and improve the frequency of cold and hot alternation, and of course, the upper transition runner section, the lower transition runner section and the connecting runner section 101-3 can be in other shapes, such as curves.

In some embodiments, the circulation runner segment 101-1 is U-shaped, the circulation runner segment 101-1 spans across the entire base plate 100, thereby enabling the first opening of one of the fin runners 301 on the first fin to communicate with the first opening of one of the fin runners 301 on the nth fin, such that all of the runners form a pulsating heat pipe loop.

In some embodiments, the upper transition flow channel section and the lower transition flow channel section are each arranged in sequence along the lateral direction of the substrate 100, the connecting flow channel sections 101-3 have a plurality of columns, and each connecting flow channel section 101-3 in each column of connecting flow channel sections 101-3 is arranged in sequence along the longitudinal direction of the substrate 100; the extension direction of the transition flow path segment 101-2 is perpendicular to the extension direction of the connecting flow path segment 101-3.

In some embodiments, the fin includes a first plate body and a second plate body, at least one of the first plate body and the second plate body is provided with a fin runner 301, the first plate body and the second plate body can form the fin runner 301 after being connected, and the first plate body and the second plate body are mounted on the cover plate 200 after being bonded and fixed. It can be understood that the surfaces of the first plate body and the second plate body can be provided with flow channel grooves, and the fin flow channels 301 can be formed after the first plate body is connected with the second plate body; of course, the flow channel groove can be formed on the surface of one of the first plate body and the second plate body, and then the other plate body is bonded and connected with the plate body to form the fin flow channel 301, so that the flow channel of the phase-change working medium is formed.

In some embodiments, a plurality of heat source connection holes 102 are provided on the substrate 100, and the heat source connection holes 102 may be used to connect a heat source. Specifically, the heat source connection hole 102 may be detachably connected to the cover plate 200. Alternatively, the heat source is mounted on the first surface of the substrate 100 using bolts sequentially passing through the heat source and the heat source connection holes 102.

In some embodiments, the second surface of the substrate 100 is provided with connecting posts corresponding to the heat source connecting holes 102, the connecting posts can be connected with the heat source in a matching manner, the connecting posts protrude out of the surface of the second surface of the substrate 100, the cover 200 is provided with a plurality of positioning holes 202, and the connecting posts can be positioned in a matching manner with the positioning holes 202. Specifically, the connecting column is preferably a threaded column and can be directly matched with the screw rod; by arranging the connecting columns, the substrate 100 and the cover plate 200 can be rapidly positioned, so that the fin flow channels 301, the communication holes 201 and the substrate flow channels 101 are accurately matched.

In some embodiments, the cover 200 is provided with a plurality of mounting grooves 203, each fin is mounted in a corresponding mounting groove 203, and the communication holes 201 are formed in positions corresponding to the openings of the fin flow channels 301 in the mounting groove 203, that is, the communication holes 201 are formed in positions corresponding to the first openings of the fin flow channels 301 in the mounting groove 203. Alternatively, the mounting grooves 203 are arranged in parallel, so that the fins 300 are arranged in parallel, thereby reducing the space occupied by the fins, and a greater number of fins can be placed, thereby improving the heat dissipation effect.

In some embodiments, the substrate 100 and the cover plate 200 and the fins 300 are welded and fixedly connected. When the radiator is assembled, the positioning holes 202 of the cover plate 200 are matched with the connecting columns to realize the rapid positioning of the cover plate 200 and the base plate 100, then the cover plate 200 and the base plate 100 are welded and fixed, the connecting columns are penetrated through by bolts and then connected with a heat source, the fins 300 are placed in the mounting grooves 203, and then the fins 300 and the cover plate 200 are welded and fixed.

In some embodiments, fin 300 may be manufactured in a wide variety of ways, such as by machining, stamping, and inflation.

In some embodiments, the cross-sectional shapes of the fin flow channels 301 and the substrate flow channels 101 may be various such as circular, semicircular, rectangular, triangular, etc., and the cross-sectional shape of the pulsating heat pipe has a great influence on the flow pattern conversion and distribution of the phase-change working medium in the pulsating heat pipe, especially when the cross-sectional shape is not circular, the influence of the sharp corner region on the flow pattern is very obvious, and under the capillary action of the sharp corner region, the phase-change working medium forms a layer of liquid film in the sharp corner region, so that the burning phenomenon caused by the incapability of timely backflow of the liquid plug of the pulsating heat pipe is effectively prevented.

In some embodiments, the phase change working medium may be selected from a plurality of working media such as R134a refrigerant, R22 refrigerant, R1233zd refrigerant, fluoridized liquid, etc.

Here, the three-dimensional phase-change radiator may be combined with other radiators of the same structure or different structures to form a new radiator.

This three-dimensional phase change radiator has utilized the characteristic of pulsation heat pipe, before adding the phase change working medium, first with the runner evacuation, then add the phase change working medium can, this radiator possesses certain antigravity, when the heat source is in the radiator top, the phase change working medium can circulate through the runner, can not receive gravity influence and deposit in radiator below space, the liquid phase change working medium in radiator below space can participate in the phase change circulation, can make full use of the space of fin carries out the heat transfer, improve heat transfer efficiency, can satisfy novel high-power electronic components's heat dissipation demand well.

Specifically, in one embodiment, the heat sink includes a base plate 100, a cover plate 200, and a plurality of fins, where a first surface of the base plate 100 is connected to a heat source, a second surface of the base plate 100 opposite to the first surface of the base plate is connected to the first surface of the cover plate 200, and a second surface of the cover plate 200 opposite to the first surface of the cover plate is used for installing the fins, and the plurality of fins are arranged on the second surface of the cover plate 200 according to an arrangement direction; the fins are all composed of two plate bodies, a plurality of mutually non-communicated fin flow channels 301 are respectively arranged in the two plate bodies, the fin flow channels 301 are arranged on at least one plate body of each fin, when the two plate bodies of the fin 300 are combined together, working medium flow channels are formed, phase-change working medium can flow in the fin flow channels, a plurality of communication holes 201 are formed in the cover plate 200, a base plate flow channel 101 is also formed in the base plate 100, the fins are communicated with the flow channels of the base plate 100 through the communication holes 201 in the cover plate 200, and the flow channels between adjacent fins are mutually communicated to form a three-dimensional pulsating heat pipe radiator.

When the heat pipe structure works, phase change working media are injected into the pulsating heat pipe flow channels, namely cavities formed by the fin flow channels 301 of the fins and the substrate flow channels 101 of the substrate 100, the phase change working media are distributed in the pulsating heat pipe loops communicated with the substrate 100 and the fins, and the phase change working media distributed in the pulsating heat pipe loops are in a state that gas plugs and liquid plugs are randomly distributed at intervals under the combined action of surface tension. When the heat of the heat source is transferred to the cavity through the substrate 100, the liquid phase change working medium in the cavity is heated, namely, the liquid phase change working medium in the pulsating heat pipe loop absorbs heat in the evaporation section to generate bubbles, rapidly expands and boosts, and pushes the liquid plug to move to the condensation section. After the gaseous phase change working medium reaches the condensation section, droplets are formed after the condensation on the wall surfaces of the fin flow channels 301 of the fins, and heat is released. Because of the pressure difference between the evaporation section, the condensation section and the adjacent pipelines, the pressure drops after the air bubble is contracted, and liquid drops formed after the gaseous phase-change working medium is condensed return to the evaporation section and the bottom of the substrate 100, so that the processes of reciprocating oscillation movement and heat transfer of the phase-change working medium are formed. The three-dimensional phase-change radiator utilizes certain antigravity of the pulsating heat pipe, and the phase-change working medium in the cavity can circularly flow when the radiator is vertically placed. And the substrate 100 is designed by extending the flow channels, so that the flow channel sections are arranged at all positions of the substrate 100, the heat transfer path from the heat source to the phase-change working medium is shortened, the phase-change working medium can be in closer contact with the heat source, the threshold for starting the pulsating heat pipe is reduced, and the starting is easier, so that the performance of the radiator is improved.

The three-dimensional phase-change radiator has the following beneficial effects:

1. the fins are internally provided with the cavities formed by the fin flow channels 3011, so that the heat exchange efficiency can be improved, and the weight of the radiator can be reduced. 2. When the heat source is located above the radiator, the phase-change working medium can circulate through the flow channel, and cannot be affected by gravity to be deposited below the cavity, the liquid phase-change working medium in the space below the radiator can participate in the phase-change circulation, the space of the fins can be fully utilized for heat exchange, the heat exchange efficiency is improved, and the heat dissipation requirement of the novel high-power electronic component is met. 3. The substrate 100 of the pulsating heat pipe radiator, namely the three-phase variable heat pipe radiator, is provided with the flow passage sections at all positions of the substrate 100 through the extended flow passage design, so that the heat transfer path from a heat source to a phase-change working medium is shortened, the phase-change working medium can be in closer contact with the heat source, the threshold for starting the pulsating heat pipe is reduced, and the performance of the radiator is improved. 4. Through the arrangement of the plurality of connecting runner segments 101-3, each fin runner 301 and each connecting runner segment 101-3 on the same fin are alternately arranged, so that the flow of the phase change working medium from the fin to the substrate 100 for many times is realized, the frequency of cold and hot alternation is further improved, and the heat exchange efficiency is further improved.

Furthermore, the three-dimensional runner phase-change radiator provided by the invention utilizes a certain anti-gravity capacity of the pulsating heat pipe, working medium in a cavity can circularly flow when the radiator is vertically placed, each fin 300 is communicated with a corresponding substrate runner 101 on the substrate 100 to form a pulsating heat pipe runner, and the runners of the whole radiator form a complete pulsating heat pipe loop by a plurality of pulsating heat runners; with this structure, when the radiator is heated, the bends at the evaporation ends of the fin flow channels 301 in each fin are all located on the base plate 100, and the working medium flow path is in a fin-base plate 100-fin circulation mode; the working medium does not need to flow from the initial end to the tail end in the fin flow channels 301 and then to the substrate 100, and the working medium enters the fin flow channels 301 of the fins from the substrate 100 to perform cold and hot alternate circulation flow, so that the heat transfer path of the working medium at the hot end is shortened, the working medium can be in closer contact with a heat source, and the pulsating heat pipe is easier to start, thereby improving the performance of the radiator. In addition, the effective operation of the pulsating heat pipe flow channel is mainly realized by the reciprocating oscillation of the gas plug and the liquid plug in the pipe, and the size of the internal diameter of the pulsating heat pipe can have great influence on the initial distribution of the gas plug and the liquid plug and the flow of working media; in the pulsating heat pipe loop formed by the fin flow channels 301 of the fins and the substrate flow channels 101 of the substrate 100, only the inner diameter of the pulsating heat pipe flow channels, namely the pipe diameter size of the pulsating heat pipe, is small enough, and the surface tension of working media in the pulsating heat pipe can overcome the self gravity effect to form a state that gas-liquid plugs are randomly distributed; the pipe diameter is too small, the resistance of the working medium can be increased sharply along with the reduction of the inner diameter of the channel, and the working medium cannot oscillate due to the overlarge resistance, so that the heat transfer capacity is reduced;

the relationship between surface tension and gravity can be expressed by a criterion number Bo or Eo:

when Bo is less than or equal to 2 or 1.84, stable gas-liquid plug alternate distribution state can be formed in the pulsating heat pipe loop; the calculation formula of the critical pipe diameter D of the pulsating heat pipe flow channel is as follows:

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wherein σ is the surface tension; ρ _l Is the density of the liquid; ρ _g Is the steam density; g is gravitational acceleration.

The inner diameter of the channel is also related to the type of the filled working medium, and the working medium can be selected from a plurality of working mediums such as R134a refrigerant, R22 refrigerant, R1233zd refrigerant, fluoridized liquid and the like, and the densities of the working mediums at different temperatures are different, so that the inner diameter of the flow channel needs to be calculated according to the parameters of the specific working medium to select the optimal value. The number of the elbows of the pulsating heat pipe flow channel has a certain critical value, and the successful start and operation under the horizontal or even antigravity can be realized under certain conditions. The critical value of the elbow is related to parameters such as pipe diameter, pipe length, operation condition and physical properties of the working medium of the pulsating heat pipe. The cross section of the pulsating heat pipe flow channel is in various forms such as a circle, a triangle, a square and the like, the cross section has great influence on the conversion and distribution of the flow pattern of the working medium in the pulsating heat pipe, and particularly when the cross section is not a circle, the influence of the sharp corner area on the flow pattern is quite obvious. Under the capillary action of the sharp corner region, the working medium can form a layer of liquid film in the sharp corner region, so that the phenomenon that the pulsating heat pipe burns out due to the fact that the liquid plug cannot flow back in time is effectively prevented.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The three-dimensional phase-change radiator provided by the invention is described in detail above. The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.

Claims

1. A three-dimensional phase change heat sink, comprising:

the fin module (300) comprises a plurality of fins which are respectively provided with a plurality of fin flow channels (301) which are not communicated with each other;

a substrate (100), wherein a first surface of the substrate (100) is in contact with a heat source, and a second surface of the substrate (100) opposite to the first surface is provided with a substrate flow channel (101); the substrate runner (101) comprises a plurality of runner sections which are not communicated with each other;

the cover plate (200) is covered on the second surface to seal the substrate flow channel (101), the cover plate (200) is provided with a plurality of communication holes (201), and each communication hole (201) can be used for communicating one fin flow channel (301) and a corresponding flow channel section to form a pulsating heat pipe loop; the pulsating heat pipe loop is filled with a phase change working medium in advance.

2. The three-dimensional phase-change heat sink of claim 1, further comprising:

and the liquid filling pipe (400) is communicated with one fin runner (301) or one runner section so as to fill the phase change working medium into the pulsating heat pipe loop.

3. The three-dimensional phase-change heat sink according to claim 1, wherein each of the fin flow channels (301) has a first opening and a second opening formed at side edges of a corresponding fin, each of the fin flow channels (301) being formed extending from one of the first openings to a corresponding second opening, the first opening and the second opening being respectively in communication with different ones of the flow channel segments.

4. A three-dimensional phase change heat sink according to claim 3, characterized in that the fin runners (301) are U-shaped.

5. A three-dimensional phase change radiator according to claim 3, wherein the substrate flow channel (101) comprises a circulating flow channel section (101-1) and a plurality of transition flow channel sections, each transition flow channel section (101-2) is communicated with two adjacent fin flow channels (301), and two ends of the circulating flow channel (101-1) are respectively communicated with one corresponding fin flow channel (301) of two fins at edge positions.

6. The three-dimensional phase-change radiator according to claim 1, wherein each fin comprises a first plate body and a second plate body, at least one of the first plate body and the second plate body is provided with a flow channel groove, and the first plate body and the second plate body form the fin flow channel (301) after being connected.

7. The three-dimensional phase-change radiator according to claim 1, characterized in that a plurality of heat source connection holes (102) are provided on the substrate (100), the heat source connection holes (102) being adapted to connect the heat source.

8. The three-dimensional phase-change radiator according to claim 7, wherein a plurality of connecting columns are arranged on the second surface of the substrate (100) at positions corresponding to the heat source connecting holes (102), the connecting columns can be connected with the heat source in a matched mode, the connecting columns protrude out of the second surface of the substrate (100), a plurality of positioning holes (202) are arranged on the cover plate (200), and the connecting columns are positioned in a matched mode with the positioning holes (202).

9. The three-dimensional phase-change radiator according to any one of claims 3 to 5, wherein the cover plate (200) is provided with a plurality of mounting grooves (203), each fin is mounted in a corresponding mounting groove (203), and the communication hole (201) is formed in a position corresponding to an opening of the fin runner (301) inside the mounting groove (203).

10. The three-dimensional phase-change heat sink according to claim 1, wherein the base plate (100) and the cover plate (200) and the fins are fixed by welding.