CN110678038A - Heat abstractor and air conditioner frequency conversion module structure - Google Patents
Heat abstractor and air conditioner frequency conversion module structure Download PDFInfo
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- CN110678038A CN110678038A CN201910885514.2A CN201910885514A CN110678038A CN 110678038 A CN110678038 A CN 110678038A CN 201910885514 A CN201910885514 A CN 201910885514A CN 110678038 A CN110678038 A CN 110678038A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
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Abstract
The application provides a heat abstractor and air conditioner frequency conversion module structure belongs to heat dissipation technical field. The heat dissipation device comprises a heat sink, a radiator and a heat transfer working medium, the radiator is communicated with the heat sink and forms a circulation loop, and the heat transfer working medium can be arranged in the circulation loop in a flowing mode. The heat sink is heated to convert the liquid heat transfer working medium into a vapor state, and the radiator dissipates heat to convert the vapor heat transfer working medium into the liquid state. The liquid heat transfer working medium and the vapor heat transfer working medium exist in the whole circulation loop, and the self circulation of the heat transfer working medium in the circulation loop is realized through the temperature difference between the heat sink and the radiator without external power. The heat dissipation device realizes high-efficiency heat transfer by strengthening phase change heat transfer, and has the heat transfer characteristics of high heat, high heat flow density, low thermal resistance, high reliability and the like; and the structure is simple, and the process cost is low.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation device and an air conditioner frequency conversion module structure.
Background
At present, when an electrical element (such as an air conditioner frequency conversion module) is radiated, an aluminum extruded section radiator is generally adopted for radiating by a radiating device, but the section heat conductivity coefficient is not high, and the rib efficiency is low, so that the radiating performance is poor, the temperature rise of the electrical element is too high, and overheating protection is caused to reduce the frequency, stop or even fail.
Disclosure of Invention
The embodiment of the application provides a heat dissipation device and an air conditioner frequency conversion module structure, so as to solve the problem of poor heat dissipation performance.
In a first aspect, an embodiment of the present application provides a heat dissipation apparatus, including a heat sink, a heat spreader, and a heat transfer working medium;
the radiator is communicated with the heat sink and forms a circulation loop;
the heat transfer working medium is arranged in the circulating loop in a flowing manner;
the heat sink is heated to convert the liquid heat transfer working medium into a vapor state;
the heat radiator can convert the vapor heat transfer working medium into liquid through heat dissipation.
In the technical scheme, the heat sink and the radiator form a circulation loop, after the heat sink is heated, the liquid heat transfer working medium in the heat sink is converted into a vapor state, and after the vapor heat transfer working medium flows to the radiator, the radiator radiates heat to condense the vapor heat transfer working medium into the liquid state. The liquid heat transfer working medium and the vapor heat transfer working medium exist in the whole circulation loop, and the self circulation of the heat transfer working medium in the circulation loop is realized through the temperature difference between the heat sink and the radiator without external power. The heat dissipation device realizes high-efficiency heat transfer by strengthening phase change heat transfer, and has the heat transfer characteristics of high heat, high heat flow density, low thermal resistance, high reliability and the like; and the structure is simple, and the process cost is low.
In addition, the heat dissipation device provided by the embodiment of the application also has the following additional technical characteristics:
in some embodiments of the present application, the heat transfer working fluid has a critical activation nucleation site radius of less than 0.1 microns;
the bubble separation diameter of the heat transfer working medium is less than 0.5 mm;
the bubble separation frequency of the heat transfer working medium is more than 350 Hz.
In the technical scheme, the radius of the critical activation nucleation point of the heat transfer working medium is small, the bubble separation diameter of the heat transfer working medium is small, and the bubble separation frequency of the heat transfer working medium is high, so that the heat transfer working medium has higher phase change rate in the bubble nucleation and bubble separation process of the phase change full period, and further the phase change heat exchange rate of the heat dissipation device is enhanced.
In some embodiments of the present application, the heat sink has a first inlet and a first outlet;
the heat sink has a second inlet and a second outlet;
the radiator also comprises a steam inlet pipe and a liquid inlet pipe;
the first outlet is communicated with the second inlet through the steam inlet pipe;
the second outlet is communicated with the first inlet through the liquid inlet pipe.
In the technical scheme, the first outlet of the heat sink is communicated with the second inlet of the radiator through the steam inlet pipe, the second outlet of the radiator is communicated with the first outlet of the heat sink through the steam inlet pipe, the steam inlet pipe is responsible for heat transmission, and the steam inlet pipe is responsible for heat transfer working medium backflow. The heat transfer working medium which is heated in the heat sink and is converted into a vapor state flows into the radiator through the steam inlet pipe and is condensed into a liquid state; the liquid heat transfer working medium in the radiator flows back to the heat sink through the liquid inlet pipe.
In some embodiments of the present application, a capillary structure is provided in the heat sink for allowing the liquid heat transfer medium in the liquid inlet pipe to enter the heat sink.
In the technical scheme, the liquid heat transfer working medium entering the heat sink from the liquid inlet pipe firstly passes through the capillary structure, the capillary structure can play a certain role in preventing the liquid heat transfer working medium flowing into the heat sink, vapor-liquid separation can be realized, meanwhile, the boiling interface pressure is effectively reduced, and an overheat boiling state is established, so that the heat exchange strength between the vapor heat transfer working medium and the liquid heat transfer working medium is increased in the processes of bubble growth and bubble polymerization rise in the phase change full period, and the phase change heat exchange rate of the heat dissipation device is further enhanced.
In some embodiments of the present application, a portion of the liquid inlet pipe adjacent to the first inlet is formed in a U-shaped structure.
In the technical scheme, the U-shaped structure is formed at the part, close to the first inlet, of the liquid inlet pipe, the U-shaped structure can play a certain role in preventing the liquid heat transfer working medium flowing into the heat sink, vapor-liquid separation can be realized, meanwhile, the boiling interface pressure is effectively reduced, and an overheat boiling state is established, so that the heat exchange strength between the vapor heat transfer working medium and the liquid heat transfer working medium is increased in the process of bubble growth and bubble polymerization rise in the phase change full period, and the phase change heat exchange rate of the heat dissipation device is further enhanced.
In some embodiments of the present application, the first inlet is located at a lower position than the first outlet.
In the technical scheme, the position of the first inlet is lower than that of the first outlet, so that vapor-liquid separation can be realized, the boiling interface pressure is effectively reduced, an overheat boiling state is established, the heat exchange strength of the vapor-state heat transfer working medium and the liquid-state heat transfer working medium is increased in the processes of bubble growth and bubble polymerization and rising of the phase change full period, and the phase change heat exchange rate of the heat dissipation device is further enhanced.
In some embodiments of the present application, a first chamber, a second chamber and a plurality of communication channels are arranged at intervals inside the heat sink;
the first inlet is in communication with the first chamber and the first outlet is in communication with the second chamber;
one end of the communication channel is communicated with the first chamber, and the other end of the communication channel is communicated with the second chamber.
In the technical scheme, after the liquid heat transfer working medium enters the first cavity from the first inlet, the liquid heat transfer working medium enters the communicating channels, after the heat sink is heated, heat is dispersedly transferred to the liquid heat transfer working medium in each communicating channel, after the liquid heat transfer working medium is heated, vapor-liquid separation is realized in the communicating channels, and the vapor heat transfer working medium enters the second cavity and flows out of the heat sink through the first outlet. The heat sink with the structure can quickly transfer absorbed heat to the heat transfer working medium, so that the heat transfer working medium can well realize vapor-liquid separation in the heat sink.
In some embodiments of the present application, the heat sink includes a plate body, a first cover body, and a second cover body;
a first accommodating groove and a second accommodating groove are respectively formed in the two opposite ends of the plate body;
the first cover body is connected to the first accommodating groove in a sealing mode, and the first cover body and the groove peripheral wall of the first accommodating groove jointly define the first cavity;
the second cover body is connected to the second accommodating groove in a sealing mode, and the second cover body and the groove peripheral wall of the second accommodating groove jointly define the second cavity;
one end of the communication channel penetrates through the bottom wall of the first accommodating groove, and the other end of the communication channel penetrates through the bottom wall of the second accommodating groove.
In the technical scheme, the heat sink has the advantage of convenience in processing and manufacturing.
In some embodiments of the present application, a plurality of first heat dissipation fins arranged at intervals are disposed on the heat sink.
Among the above-mentioned technical scheme, the setting of first radiating fin has increased heat transfer area, and then makes the heat sink have supplementary heat-sinking capability.
In some embodiments of the present application, the heat sink has a connection surface and a contact surface opposite to the connection surface for contacting a heat generating source;
the first radiating fins are connected to the connecting surface, and the communicating channel is paved between the connecting surface and the contact surface.
Among the above-mentioned technical scheme, first radiating fin connects in connecting the face, and the intercommunication passageway is tiled between connecting face and contact surface, and after the source that generates heat contacted with the contact surface, the heat that generates heat the source will be given for heat sink to the working medium and the first radiating fin who connects on the face of transmission in the intercommunication passageway make heat sink have fine supplementary heat-sinking capability.
In a second aspect, an embodiment of the present application provides an air conditioner frequency conversion module structure, which includes an air conditioner frequency conversion module and the heat dissipation apparatus provided in the embodiment of the first aspect, wherein the air conditioner frequency conversion module is connected to the heat sink.
In the technical scheme, in the air conditioner frequency conversion module structure, the heat dissipation device realizes high-efficiency heat transfer by strengthening phase change heat transfer, has the heat transfer characteristics of high heat quantity, high heat flow density, low thermal resistance, high reliability and the like, and can play a good heat dissipation effect on the air conditioner frequency conversion module.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present disclosure;
fig. 2 is a schematic connection diagram of a liquid inlet pipe and a heat sink of the heat dissipation apparatus according to some embodiments of the present disclosure;
fig. 3 is a schematic view illustrating a connection between a liquid inlet pipe and a heat sink of a heat dissipation apparatus according to still other embodiments of the present disclosure;
fig. 4 is a schematic connection diagram of a liquid inlet pipe and a vapor inlet pipe of a heat dissipation apparatus according to still other embodiments of the present disclosure;
fig. 5 is a cross-sectional view of the heatsink shown in fig. 1;
fig. 6 is a schematic structural diagram of the heat sink shown in fig. 1;
fig. 7 is a schematic structural diagram of a heat sink of a heat dissipation device according to another embodiment of the present application;
fig. 8 is a schematic structural diagram of an air conditioner inverter module structure provided in an embodiment of the present application.
Icon: 100-a heat sink; 10-heat sink; 11-a first inlet; 12-a first outlet; 13-a first chamber; 14-a second chamber; 15-a communication channel; 16-a plate body; 161-a first receiving groove; 162-a second receiving groove; 163-connection face; 164-a contact surface; 17-a first cover; 18-a second cover; 19-first cooling fins; 20-a radiator; 21-a second inlet; 22-a second outlet; 23-heat dissipation channels; 231-rectangular channels; 24-heat dissipation holes; 25-a heat sink; 26-a circuitous pipe; 27-second heat sink fins; 30-a steam inlet pipe; 40-liquid inlet pipe; a 41-U-shaped structure; 50-capillary structure; 200-air conditioner frequency conversion module structure; 210-air conditioner frequency conversion module.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present application, it should be noted that the indication of orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship which is usually placed when the product of the application is used, or the orientation or positional relationship which is usually understood by those skilled in the art, or the orientation or positional relationship which is usually placed when the product of the application is used, and is only for the convenience of describing the application and simplifying the description, but does not indicate or imply that the indicated device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the application. Furthermore, the terms "first" and "second" are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present application, it should also be noted that the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, unless explicitly stated or limited otherwise; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Examples
As shown in fig. 1, a heat dissipation apparatus 100 according to an embodiment of the first aspect of the present application includes a heat sink 10, a heat spreader 20, and a heat transfer working medium, where the heat spreader 20 is communicated with the heat sink 10 and forms a circulation loop, and the heat transfer working medium is movably disposed in the circulation loop. The heat sink 10 can change the liquid heat transfer working medium into a vapor state when heated, and the radiator 20 can change the vapor heat transfer working medium into a liquid state when radiating.
The heat sink 10 and the radiator 20 form a circulation loop, after the heat sink 10 is heated, the liquid heat transfer working medium in the heat sink 10 is converted into a vapor state, and after the vapor heat transfer working medium flows to the radiator 20, the radiator 20 radiates heat to condense the vapor heat transfer working medium into a liquid state. The liquid heat transfer working medium and the vapor heat transfer working medium exist in the whole circulation loop, and the self circulation of the heat transfer working medium in the circulation loop is realized through the temperature difference between the heat sink and the radiator without external power. The heat dissipation device realizes high-efficiency heat transfer by strengthening phase change heat transfer, and has the heat transfer characteristics of high heat, high heat flow density, low thermal resistance, high reliability and the like; and the structure is simple, and the process cost is low.
Further, the heat sink 10 has a first inlet 11 and a first outlet 12 (not shown in fig. 1), and the heat spreader 20 has a second inlet 21 and a second outlet 22. The radiator 20 further includes a steam inlet pipe 30 and a liquid inlet pipe 40, the first outlet 12 is communicated with the second inlet 21 through the steam inlet pipe 30, and the second outlet 22 is communicated with the first inlet 11 through the liquid inlet pipe 40.
The heat sink 10 and the heat spreader 20 are connected by a steam inlet pipe 30 and a liquid inlet pipe 40 to form a circulation loop. It is understood that the space inside the heat sink 10, the space inside the steam inlet pipe 30, the space inside the heat spreader 20, and the space inside the liquid inlet pipe 40 together constitute a closed circulation circuit.
The steam inlet pipe 30 is responsible for heat transfer, and the liquid inlet pipe 40 is responsible for heat transfer working medium reflux. Namely, the heat transfer working medium which is heated in the heat sink 10 and is converted into a vapor state flows into the radiator 20 through the vapor inlet pipe 30 and is condensed into a liquid state; the liquid heat transfer working medium in the radiator 20 flows back to the heat sink 10 through the liquid inlet pipe 40.
Wherein, the steam inlet pipe 30 and the liquid inlet pipe 40 can be made of pipe fittings of various materials, such as aluminum pipes, copper pipes and the like.
In other embodiments, the vapor inlet pipe 30 and the liquid inlet pipe 40 may not be disposed between the heat sink 10 and the heat spreader 20, and the first outlet 12 of the heat sink 10 may directly communicate with the second inlet 21 of the heat spreader 20, and the second outlet 22 of the heat spreader 20 may directly communicate with the first inlet 11 of the heat sink 10. Of course, only the steam inlet pipe 30 may be disposed between the heat sink 10 and the heat spreader 20, and the liquid inlet pipe 40 is not disposed, that is, the first outlet 12 of the heat sink 10 is communicated with the second inlet 21 of the heat spreader 20 through the steam inlet pipe 30, and the second outlet 22 of the heat spreader 20 is directly communicated with the first inlet 11 of the heat sink 10; it is also possible to arrange only the liquid inlet pipe 40 and not the vapor inlet pipe 30 between the heat sink 10 and the heat spreader 20, that is, the first outlet 12 of the heat sink 10 is directly communicated with the second inlet 21 of the heat spreader 20, and the second outlet 22 of the heat spreader 20 is communicated with the first inlet 11 of the heat sink 10 through the liquid inlet pipe 40.
The phase change heat exchange capacity of the heat transfer working medium depends on the product of the phase change rate and the phase change latent heat of the heat transfer working medium, and the larger the product of the phase change rate and the phase change latent heat of the heat transfer working medium is, the stronger the heat exchange capacity of the heat transfer working medium is. The following is an analysis of the factors that affect the phase change rate of the heat transfer medium.
The whole phase change period covers the whole process of bubble nucleation, bubble growth, bubble detachment and bubble polymerization.
(1) Bubble nucleation stage
Critical activation nucleation point radius rmCritical core of vaporization Rmin＝2γTs/rρvΔ T, where γ is the surface tension coefficient of the working fluid, TsIs the saturation temperature at local pressure, r is the latent heat of vaporization at saturation temperature, ρvIs the saturated steam density, Δ t ═ tw-tsThe superheat degree of the liquid working medium on the wall surface. The boiling heat exchange intensity (or phase change rate) on the wall surface depends on the total number of activated nucleation points on the heating wall surface, and the size distribution density of pits on the heating wall surface is approximate to normal distribution with the origin as the starting pointFunction NrThus total number of activated nucleation sitesI.e. the radius r of the heating wall surface is larger than the critical activation nucleation pointmThe pits of (a) are all activation nucleation sites. Thus, the ways to increase the total number of activated nucleation sites N fall into two categories: firstly, a layer of porous structure is formed on the heating wall surface, and the normal distribution function N is increasedrThe method can multiply increase the total number N of activated nucleation points to modify the phase-change working medium at a certain saturation temperature TsAnd the critical activation nucleation point radius r is reduced under the condition of the wall surface superheat degree delta tmThis method can increase the total number of activated nucleation sites N by several orders of magnitude.
(2) Bubble growth and detachment stage
(2.1) the bubble growth period is a dynamic control stage in the early stage, the bubble growth is mainly governed by internal thermal inertia force and external surface tension, and the bubble growth rate is high; the later stage is a heat transfer control stage, the duration of the stage is longer, the growth rate of the bubbles is mainly dominated by the heat transfer capacity from the heated liquid to the bubbles, when the liquid is saturated liquid, the growth rate of the bubbles is slower, and when the liquid is superheated liquid, the growth rate of the bubbles is faster.
(2.2) bubble detachment period, bubble detachment diameter D from heated walldThe smaller the detachment frequency f, the higher the phase transition rate. Wherein the bubble detachment diameter DdThe influencing factors comprise pressure, gravitational acceleration, inertia force and the like; the bubble disengagement frequency f has a relationship
For the kinetic control phase, the index n is 2, and for the heat transfer control phase, the index n is 1/2. Therefore, the bubble separation diameter D can be reduced by modifying the working mediumdMeanwhile, the bubble separation frequency f is increased, and the phase change rate is further enhanced.
(2.3) in the polymerization rising period of the vapor bubbles, the heat exchange between the vapor bubbles and liquid in the rising process can reach very high intensity, so that the effective discharge of the vapor bubbles can improve the critical heat flow density under the working condition of high heat flow density, the polymerization and rising movement of the vapor bubbles are very complex, and complex vapor-liquid two-phase turbulence is involved. The reasonable bubble discharge structure can be designed to effectively discharge bubbles, so that the phase change rate is enhanced.
Based on the phase change characteristic of the phase change full cycle, the phase change working medium is modified, and the radius r of the critical activation nucleation point is reduced from the physical property levelmTo increase the total number of activated nucleation sites N; reducing the bubble separation diameter D from the physical layerdIncreasing the bubble separation frequency f to further enhance the phase change rate.
(3) Superheated boiling
In the boiling process, in the heat transfer control stage at the later stage of bubble growth, the bubble growth rate is mainly governed by the heat transfer capacity from liquid to bubbles, and the superheat degree of the liquid determines the bubble growth rate; in the rising stage of the bubble polymerization, the superheat degree of the liquid determines the heat exchange strength between the bubble and the liquid in the rising process. Therefore, the bubble growth rate can be enhanced by designing the liquid working medium into superheated liquid.
The boiling state when the temperature of the liquid main body reaches the saturation temperature is saturated boiling, and vapor bubbles can grow slowly in the liquid after being separated from the wall surface; the boiling state that the main body temperature of the liquid is lower than the saturation temperature is supercooling boiling, and vapor bubbles can gradually disappear in the liquid after being separated from the wall surface; the boiling state in which the bulk temperature of the liquid exceeds the saturation temperature is superheated boiling, and vapor bubbles grow rapidly in the liquid after separating from the wall surface. Therefore, the liquid working medium is designed to be an overheat liquid, namely, an overheat boiling state is established.
For heterogeneous boiling on the overheating wall surface, the temperature of the liquid working medium is derived from the heating of the overheating wall surface, and the liquid body is difficult to obtain larger superheat degree in a wall surface heating mode, so that the boiling point of the working medium can be reduced in a boiling interface pressure reducing mode, and the overheating boiling is realized under the condition that the liquid working medium obtains heat only through the wall surface heating.
Based on the above analysis, in this embodiment, optionally, the critical activation nucleation site radius of the heat transfer medium is less than 0.1 micron; the bubble separation diameter of the heat transfer working medium is less than 0.5 mm; the bubble separation frequency of the heat transfer working medium is more than 350 Hz.
The radius of the critical activation nucleation point of the heat transfer working medium is small, the bubble detachment diameter of the heat transfer working medium is small, and the bubble detachment frequency of the heat transfer working medium is high, so that the heat transfer working medium has a high phase change rate in the bubble nucleation and bubble detachment processes of the phase change full cycle, and the phase change heat exchange rate of the heat dissipation device 100 is further enhanced.
From the above analysis, it can be known that the phase change rate can be enhanced by constructing the superheated boiling state of the heat transfer medium.
In some embodiments of the present application, as shown in fig. 2, a capillary structure 50 is provided in the heat sink 10 for allowing the liquid transport medium in the liquid inlet pipe 40 to enter into the heat sink 10.
The capillary structure 50 can prevent the liquid heat transfer medium flowing into the heat sink 10, so as to achieve vapor-liquid separation, and simultaneously effectively reduce the boiling interface pressure, and establish an overheat boiling state, so that the heat exchange strength between the vapor heat transfer medium and the liquid heat transfer medium is increased during the bubble growth and bubble polymerization rise process of the phase change full period, and the phase change heat exchange rate of the heat dissipation device 100 is further enhanced.
The capillary structure 50 may be a barrier made of a porous material, or a barrier made of a plurality of capillaries. In fig. 2, the capillary structure 50 is a barrier made of porous material.
In some embodiments of the present application, as shown in fig. 3, the liquid inlet pipe 40 is formed with a U-shaped structure 41 at a portion near the first inlet 11.
The U-shaped structure 41 can prevent the liquid heat transfer medium flowing into the heat sink 10 to a certain extent, so as to realize vapor-liquid separation, and simultaneously effectively reduce the boiling interface pressure, and establish an overheat boiling state, so that the heat exchange strength between the vapor heat transfer medium and the liquid heat transfer medium is increased during the bubble growth and bubble polymerization rise process of the phase change full period, and the phase change heat exchange rate of the heat dissipation device 100 is further enhanced.
In some implementations of the present application, as shown in fig. 4, the first inlet 11 is located lower than the first outlet 12. The structure can realize vapor-liquid separation, effectively reduce the pressure of a boiling interface, and establish an overheat boiling state, so that the heat exchange strength of the vapor-state heat transfer working medium and the liquid-state heat transfer working medium is increased in the processes of bubble growth and bubble polymerization and rising in the phase change full period, and the phase change heat exchange rate of the heat dissipation device 100 is further enhanced.
In practical applications, the phase change rate of the heat transfer medium can be enhanced by any one or more of the three methods, so as to improve the heat transfer capability of the heat dissipation device 100.
Further, as shown in fig. 5, in the present embodiment, the heat sink 10 is provided inside with a first chamber 13, a second chamber 14, and a plurality of communication channels 15 arranged at intervals. The first inlet 11 communicates with the first chamber 13 and the first outlet 12 communicates with the second chamber 14. One end of the communication passage 15 communicates with the first chamber 13, and the other end of the communication passage 15 communicates with the second chamber 14.
After the liquid heat transfer working medium enters the first chamber 13 from the first inlet 11, the liquid heat transfer working medium enters the communicating channels 15, after the heat sink 10 is heated, heat is dispersedly transferred to the liquid heat transfer working medium in each communicating channel 15, after the liquid heat transfer working medium is heated, vapor-liquid separation is realized in the communicating channels 15, and the vapor heat transfer working medium enters the second chamber 14 and flows out of the heat sink 10 through the first outlet 12. The heat sink 10 with the structure can quickly transfer the absorbed heat to the heat transfer working medium, so that the heat transfer working medium can well realize vapor-liquid separation in the heat sink 10.
In case the capillary structure 50 is provided within the heat sink 10, the capillary structure 50 may be provided within the first chamber 13 such that the capillary structure 50 abuts against the liquid inlet pipe 40.
In other embodiments, the heat sink 10 may have other structures, for example, a larger chamber is formed in the heat sink 10, and the first inlet 11 and the first outlet 12 are both communicated with the chamber.
Further, with continued reference to fig. 5, the heat sink 10 includes a plate body 16, a first cover 17, and a second cover 18. The plate 16 has a first receiving groove 161 and a second receiving groove 162 at opposite ends thereof. The first cover 17 is hermetically connected to the first receiving groove 161, and the first cover 17 and the groove peripheral wall of the first receiving groove 161 jointly define the first chamber 13. The second cover 18 is hermetically connected to the second receiving groove 162, and the second cover 18 and the groove peripheral wall of the second receiving groove 162 jointly define the second chamber 14. One end of the communication passage 15 penetrates the groove bottom wall of the first accommodation groove 161, and the other end of the communication passage 15 penetrates the groove bottom wall of the second accommodation groove 162.
The heat sink 10 of this structure has an advantage of being easy to manufacture. In actual processing, the first receiving groove 161 and the second receiving groove 162 may be processed at two ends of the board 16, the communication channels 15 are processed, the first cover 17 and the second cover 18 are connected to the first receiving groove 161 and the second receiving groove 162, and finally the first cover 17 and the second cover 18 are welded and sealed with the board 16.
Illustratively, the plate body 16 is a rectangular plate, the first receiving groove 161 and the second receiving groove 162 are respectively disposed at two ends of the plate body 16 in the width direction, and the first receiving groove 161 and the second receiving groove 162 are strip-shaped grooves arranged along the length direction of the plate body 16. The communication passage 15 is a hole passage arranged in the width direction of the plate body 16.
The first inlet 11 is disposed on the plate body 16, one end of the first inlet 11 penetrates through an end surface of one end of the plate body 16 in the thickness direction, and the other end of the first inlet 11 is communicated with the first chamber 13. The first outlet 12 is arranged on the second cover plate, and the arrangement direction lines of the first inlet 11 and the first outlet 12 are perpendicular to each other.
Alternatively, as shown in fig. 6, the heat sink 10 is provided with a plurality of first heat dissipation fins 19 arranged at intervals. The arrangement of the first heat dissipation fins 19 increases the heat exchange area, so that the heat sink 10 has auxiliary heat dissipation capability.
Illustratively, the first heat dissipating fins 19 are rectangular pieces. The arrangement direction of the first heat radiation fins 19 coincides with the arrangement direction of the communication passage 15.
Alternatively, the heat sink 10 has a connection face 163 and a contact face 164 opposite to the connection face 163 and for contacting the heat generation source. The first heat dissipating fins 19 are connected to the connecting surface 163, and the communication passage 15 is laid flat between the connecting surface 163 and the contact surface 164.
The first heat dissipation fins 19 are connected to the connection surface 163, the communication channel 15 is laid between the connection surface 163 and the contact surface 164, and after the heat source contacts the contact surface 164, the heat of the heat source is transferred to the heat sink 10, and is transferred to the working medium in the communication channel 15 and the first heat dissipation fins 19 on the connection surface 163, so that the heat sink 10 has auxiliary heat dissipation capability.
Here, the connection surface 163 and the contact surface 164 are two end surfaces in the thickness direction of the plate body 16, respectively. Illustratively, the first heat dissipating fins 19 are perpendicular to the connecting face 163.
In this embodiment, as shown in fig. 1, the heat sink 20 is a plate-shaped structure, a mesh-shaped heat dissipation channel 23 for flowing the heat transfer medium is formed inside the heat sink 20, and both the second inlet 21 and the second outlet 22 are communicated with the heat dissipation channel 23. The heat sink 20 of this structure has a good heat dissipating capability.
Further, the heat dissipation channel 23 includes a plurality of rectangular channels 231 distributed at intervals, the heat sink 20 is provided with a plurality of heat dissipation holes 24, and one heat dissipation hole 24 is correspondingly distributed on the inner side of each rectangular channel 231. This structure can further improve the heat dissipation capability of the heat sink 20.
Alternatively, the heat dissipation hole 24 is a rectangular hole, and one edge of the heat dissipation hole 24 is provided with a heat dissipation fin 25 perpendicular to the heat sink 20.
In other embodiments, the radiator 20 may have other structures, for example, as shown in fig. 7, the radiator 20 includes a circuitous pipe 26 and a plurality of second heat dissipation fins 27 arranged at intervals outside the circuitous pipe 26. The second inlet 21 and the second outlet 22 are respectively provided at both ends of the detour pipe 26. Of course, the heat spreader 20 may also have the same structure as the heat sink 10 provided with the first heat dissipation fins 19 in the present embodiment. The heat sink may also take other forms, such as a blown plate heat sink, a tube fin heat sink, a microchannel heat sink, a wire tube heat sink, an extruded profile heat sink, and the like.
It should be noted that the heat sink 10 and the heat spreader 20 may be made of various materials as long as they have good heat conduction capability, such as copper, iron, aluminum, etc. In the present embodiment, the heat sink 10 and the heat spreader 20 are made of aluminum, for example.
As shown in fig. 8, a second aspect of the present application provides an air conditioner inverter module structure 200, which includes an air conditioner inverter module 210 and the heat dissipation apparatus 100 provided in the first aspect of the present application, where the module air conditioner inverter is connected to a heat sink 10.
In the structure of the air conditioner frequency conversion module, the heat dissipation device 100 realizes efficient heat transfer by strengthening phase change heat transfer, has the heat transfer characteristics of large heat quantity, high heat flow density, low thermal resistance, high reliability and the like, and can play a good heat dissipation effect on the air conditioner frequency conversion module.
Wherein, the air-conditioning frequency conversion module 210 is fixed on the heat sink 10 by screws.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A heat dissipating device, comprising:
a heat sink;
the radiator is communicated with the heat sink and forms a circulation loop; and
the heat transfer working medium is arranged in the circulating loop in a flowing manner;
the heat sink is heated to convert the liquid heat transfer working medium into a vapor state;
the heat radiator can convert the vapor heat transfer working medium into liquid through heat dissipation.
2. The heat sink of claim 1, wherein the critical activation nucleation site radius of the heat transfer medium is less than 0.1 microns;
the bubble separation diameter of the heat transfer working medium is less than 0.5 mm;
the bubble separation frequency of the heat transfer working medium is more than 350 Hz.
3. The heat dissipation device of claim 1, wherein the heat sink has a first inlet and a first outlet;
the heat sink has a second inlet and a second outlet;
the radiator also comprises a steam inlet pipe and a liquid inlet pipe;
the first outlet is communicated with the second inlet through the steam inlet pipe;
the second outlet is communicated with the first inlet through the liquid inlet pipe.
4. The heat dissipating device of claim 3, wherein the heat sink has a capillary structure therein for allowing the liquid heat transfer medium in the liquid inlet pipe to enter the heat sink.
5. The heat dissipating device of claim 3, wherein the inlet pipe is formed in a U-shaped configuration adjacent to the first inlet.
6. The heat dissipating device of claim 3, wherein the first inlet is located at a lower position than the first outlet.
7. The heat dissipation device of claim 3, wherein the heat sink is internally provided with a first chamber, a second chamber and a plurality of communication channels which are arranged at intervals;
the first inlet is in communication with the first chamber and the first outlet is in communication with the second chamber;
one end of the communication channel is communicated with the first chamber, and the other end of the communication channel is communicated with the second chamber.
8. The heat dissipation device of claim 7, wherein the heat sink comprises a plate body, a first cover and a second cover;
a first accommodating groove and a second accommodating groove are respectively formed in the two opposite ends of the plate body;
the first cover body is connected to the first accommodating groove in a sealing mode, and the first cover body and the groove peripheral wall of the first accommodating groove jointly define the first cavity;
the second cover body is connected to the second accommodating groove in a sealing mode, and the second cover body and the groove peripheral wall of the second accommodating groove jointly define the second cavity;
one end of the communication channel penetrates through the bottom wall of the first accommodating groove, and the other end of the communication channel penetrates through the bottom wall of the second accommodating groove.
9. The heat dissipating device as claimed in any one of claims 7 to 8, wherein the heat sink is provided with a plurality of first heat dissipating fins arranged at intervals.
10. An air conditioner frequency conversion module structure, which is characterized by comprising an air conditioner frequency conversion module and the heat dissipation device according to any one of claims 1-9, wherein the heat sink is connected with the air conditioner frequency conversion module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910885514.2A CN110678038A (en) | 2019-09-18 | 2019-09-18 | Heat abstractor and air conditioner frequency conversion module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910885514.2A CN110678038A (en) | 2019-09-18 | 2019-09-18 | Heat abstractor and air conditioner frequency conversion module structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110678038A true CN110678038A (en) | 2020-01-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910885514.2A Withdrawn CN110678038A (en) | 2019-09-18 | 2019-09-18 | Heat abstractor and air conditioner frequency conversion module structure |
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| CN (1) | CN110678038A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111895523A (en) * | 2020-07-20 | 2020-11-06 | 青岛海尔空调电子有限公司 | Radiator and air condensing units |
-
2019
- 2019-09-18 CN CN201910885514.2A patent/CN110678038A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111895523A (en) * | 2020-07-20 | 2020-11-06 | 青岛海尔空调电子有限公司 | Radiator and air condensing units |
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Application publication date: 20200110 |