CN108573938A - Power device radiator and power device radiating module - Google Patents
Power device radiator and power device radiating module Download PDFInfo
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- CN108573938A CN108573938A CN201710131631.0A CN201710131631A CN108573938A CN 108573938 A CN108573938 A CN 108573938A CN 201710131631 A CN201710131631 A CN 201710131631A CN 108573938 A CN108573938 A CN 108573938A
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- 239000007788 liquid Substances 0.000 claims abstract description 52
- 238000001816 cooling Methods 0.000 claims abstract description 51
- 238000005192 partition Methods 0.000 claims abstract description 50
- 239000002826 coolant Substances 0.000 claims abstract description 39
- 239000011148 porous material Substances 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 9
- 230000009466 transformation Effects 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 19
- 238000003466 welding Methods 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000002955 isolation Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 210000002421 cell wall Anatomy 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000002528 anti-freeze Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of power device radiator and power device radiating module, which includes heat sink body, the first working medium partition board, the second working medium partition board, the first cover board, the second cover board, inlet tube and outlet tube.Power device radiator and power device radiating module according to the present invention, effectively power device is exaggerated with the contact area of heat pipe and the heat exchange area of working medium runner and cooling passage, thermal resistance between working medium runner and slot is minimum, the radiating efficiency of power device is high, is suitable for high power device and radiates.In addition, the welding of multiple heat sinks and water inlet supervisor, water outlet main pipe in the prior art is replaced with the arranged stacked of slot, working medium runner and cooling passage, it can avoid excessive pad, manufacturing process is simple, cost is relatively low, thermal resistance can be effectively reduced, the risk that coolant liquid leakage occurs is reduced, improves radiating efficiency.
Description
Technical field
The invention belongs to Heat Dissipation Technology for Power Device fields, more particularly to a kind of power device radiator and power device
Part radiating module.
Background technology
Power device (such as IGBT) has certain loss, most loss to become heat at work.In reality
In application process, IGBT is widely used in the fields such as frequency converter, inverter, electric vehicle, IGBT as a power device
It will produce prodigious loss when work, these losses are usually expressed as heat.To enable IGBT to work normally, it is necessary to add heat dissipation
Device, most common is exactly that IGBT is mounted among radiator, heat is scattered to surrounding space using radiator, when necessary again
In addition radiator fan or water cooling, to increase radiating efficiency.In addition, for the temperature for reducing when IGBT work, the side of generally use
Formula is：It reduces IGBT operating currents or selects the IGBT of bigger, increases radiator or be changed to the stronger copper radiator of the capacity of heat transmission
Or heat-pipe radiator.
As shown in Figure 1, being a kind of existing IGBT radiators, which includes water inlet supervisor 1a, water outlet main pipe
There is the heat sink 3a of working medium runner, the both ends of heat sink 3a to be welded on into water supervisor 1a, water outlet main pipe 2a for 2a and multiple inside
Periphery on, the both ends of heat sink 3a are not connected to water inlet supervisor 1a, water outlet main pipe 2a in inside points so that, coolant liquid from
The entrance of water inlet supervisor 1a enters, and flows through the working medium runner in each heat sink 3a, and after absorbing the heat that IGBT4a is distributed,
Water outlet main pipe 2a is imported, is flowed out by the outlet of water outlet main pipe 2a.The heat dissipation of IGBT4a is realized with this.
But IGBT radiators shown in FIG. 1, multiple heat sink 3a will be welded with water inlet supervisor 1a, water outlet main pipe 2a,
Welding position is more, and manufacturing process is complicated, and cost is higher.
Invention content
The technical problem to be solved by the present invention is to more, the manufacturing process that is directed to existing IGBT radiators welding position
Complexity, and the higher defect of cost provide a kind of power device radiator and power device radiating module.
Technical solution is used by the present invention solves above-mentioned technical problem：
A kind of power device radiator, including heat sink body, the first working medium partition board, the second working medium partition board, first are provided
Cover board, the second cover board, the inlet tube for coolant liquid inflow and the outlet tube for coolant liquid outflow；
At least one for being provided with an at least slot for pluggable power device on the heat sink body, completely cutting off with the slot
Working medium runner and the multiple cooling passages completely cut off with the slot and working medium runner, the slot, working medium runner and cooling
Liquid channel arranged stacked；
The first working medium bulkhead seal is connected on the heat sink body and one end in the working medium runner, described
First chamber is formed between first working medium partition board and one end of the working medium runner, the second working medium bulkhead seal is connected to institute
State on heat sink body and be in the other end of the working medium runner, the other end of the second working medium partition board and the working medium runner
Between form second chamber, the working medium runner is communicated between the first chamber and the second chamber to form working medium closed circulation
Space, be packaged in working medium closed circulation space can phase transformation working medium；
First cover plate for sealing is connected on the heat sink body and one end in the cooling passage, and described the
Third chamber is formed between one cover board and one end of the cooling passage, second cover plate for sealing is connected to the heat dissipation master
On body and in the cooling passage the other end, formed between second cover board and the other end of the cooling passage
4th chamber, the inlet tube and the third chamber, the outlet tube and the 4th chamber, the coolant liquid
Channel is communicated between the third chamber and the 4th chamber to form coolant liquid closed circulation space, via the inlet tube stream
The coolant liquid entered after coolant liquid closed circulation space from the outlet tube by flowing out.
Optionally, the heat sink body is integrally formed by extruding metal.
Optionally, the heat sink body is hexahedron structure, and the heat sink body has first end face, second end face, the
One side, second side, third side and the 4th side, the first side, second side, third side and the 4th side are suitable
Secondary connection, and be connected between the first end face and second end face；
The both ends of the working medium runner extend through the first side and third side；
The both ends of the slot extend through the first side and third side；
The cooling passage both ends extend through the second side and the 4th side, and first cover board is located at described
On the outside of second side, second cover board is located on the outside of the 4th side.
Optionally, it is provided on the heat sink body, first partition or second partition and working medium closed circulation space
The working medium of connection fills hole, and the working medium, which fills to be connected on hole, fills column, can be closed to the working medium by the column that fills
Working medium is filled in the cyclic space.
Optionally, the inlet with the third chamber is provided on first cover board, on second cover board
It is provided with the liquid outlet with the 4th chamber；
The inlet tube is connected on the inlet, and the outlet tube is connected on the liquid outlet.
Optionally, each working medium runner includes being arranged in the multiple micro- logical of an at least row along power device plugging direction
Road hole, the multiple microchannel pore are isolated from each other, and one end of the multiple microchannel pore is connected to the first chamber, described more
The other end of a microchannel pore is connected to the second chamber.
Optionally, the multiple microchannel pore parallel interval setting, and the extending direction of the multiple microchannel pore and institute
The extending direction for stating slot is identical.
Optionally, the first side is formed with the first slot of indent, and first step is provided in first slot, described
First working medium bulkhead seal is embedded in first slot and is abutted with the first step, the outside table of the first working medium partition board
Face is concordant with the first side, and the first chamber is formed in the inner surface of the first working medium partition board and first slot
Bottom surface between；
The third side is formed with the second slot of indent, and second step, second work are provided in second slot
Matter bulkhead seal is embedded in second slot and is abutted with the second step, the outer surface of the second working medium partition board and institute
State that third side is concordant, the second chamber is formed in the bottom surface of the inner surface and second slot of the second working medium partition board
Between.
Optionally, the both ends of the slot are respectively formed the first jag and the second jag, and described first protrudes distal process
Bottom surface for first slot is simultaneously concordant with the first side, and second jag protrudes from the bottom surface of second slot
And it is concordant with the third side；
The first avoid holes are provided on the first working medium cover board, the first jag sealing is plugged in described first and keeps away
It allows in hole, the second avoid holes is provided on the second working medium cover board, the second jag sealing is plugged in described second and keeps away
It allows in hole.
Optionally, be provided on the heat sink body pluggable multiple power devices multiple slots and with it is the multiple
Multiple working medium runners of slot isolation, the multiple working medium runner and the alternately laminated arrangement of the multiple cooling passage, it is described
Multiple slots and the alternately laminated arrangement of the multiple cooling passage.
In addition, the present invention also provides a kind of power device radiating modules comprising at least one power device and above-mentioned
Power device radiator, the power device is plugged in the slot of the heat sink body.
Optionally, it is provided with heat-conducting glue between the power device and the madial wall of the slot.
Power device radiator and power device radiating module according to the present invention, working medium runner are communicated in the first working medium
Between partition board and the second working medium partition board to form working medium closed circulation space, being packaged in working medium closed circulation space can phase transformation
Working medium, cooling passage are communicated in form coolant liquid closed circulation space between third chamber and the 4th chamber, in this way, first
Working medium partition board, working medium runner and the second working medium partition board constitute heat pipe, since cloth is laminated in slot, working medium runner and cooling passage
It sets, power device (such as IGBT) is plugged in slot, since the heat absorption speed of working medium is much larger than the heat absorption speed of coolant liquid, liquid
Heat and vaporization of the state working medium by the side wall absorbed power device of working medium runner, the heat that power device distributes quickly is exported
To working medium closed circulation space, this is level-one heat exchange；Then, the following in coolant liquid closed circulation space by coolant liquid
Circulation is dynamic, and gaseous working medium to the cold walked by the cooled liquid band of side wall of cooling passage, working medium closing is followed by liquidation exothermic reaction, heat
For the heat derives of annular space to coolant liquid closed circulation space, this is secondary heat exchange.With this, the heat of power device passes through
Coolant liquid is taken away, and realizes the heat dissipation of power device.Also, due to sharing cell wall, and working medium runner between working medium runner and slot
Thus it is effectively exaggerated contact area and working medium runner of the power device with heat pipe with cooling passage and shared cell wall
With the heat exchange area of cooling passage, the thermal resistance between working medium runner and slot is minimum, and the radiating efficiency of power device is high, is applicable in
It radiates in high power device.In addition, being replaced with the arranged stacked of slot, working medium runner and cooling passage multiple in the prior art
The welding of heat sink and water inlet supervisor, water outlet main pipe, can avoid excessive pad, manufacturing process is simple, and cost is relatively low, can
To effectively reduce thermal resistance, the risk that coolant liquid leakage occurs is reduced, improves radiating efficiency.
Description of the drawings
Fig. 1 is the stereoscopic schematic diagram of existing IGBT radiators；
Fig. 2 is the stereogram of present invention power device radiating module provided in this embodiment；
Fig. 3 is the exploded view of present invention power device radiating module provided in this embodiment；
Fig. 4 is the side view of present invention power device radiating module provided in this embodiment；
Fig. 5 is the vertical view of present invention power device radiating module provided in this embodiment；
Fig. 6 is the view (transformation visual angle) along 4 after the cutting of the directions A-A；
Fig. 7 is the view (transformation visual angle) along 5 after the cutting of the directions B-B；
Fig. 8 is the stereogram of its heat sink body of power device radiating module provided in this embodiment of the invention；
Fig. 9 is another visual angle figure of Fig. 8.
Reference numeral in specification is as follows：
1, power device；
2, power device radiator；21, heat sink body；211, slot；2111, the first jag；2112, it second protrudes
End；212, working medium runner；2121, microchannel pore；213, working medium fills hole；215, the first slot；2151, first step；216,
Two slots；2161, second step；217, cooling passage；22, the first working medium partition board；221, the first avoid holes；23, the second working medium
Partition board；231, the second avoid holes；24, inlet tube；25, outlet tube；26, first chamber；27, second chamber；28, the first cover board；
281, third chamber；282, inlet；29, the second cover board；291, the 4th chamber；292, liquid outlet；
3, column is filled.
Specific implementation mode
In order to make the technical problems, technical solutions and beneficial effects solved by the present invention be more clearly understood, below in conjunction with
Accompanying drawings and embodiments, the present invention is further described in detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
As illustrated in figs. 2 through 8, present invention power device radiating module provided in this embodiment, including multiple power devices 1 and
Power device radiator 2.
In the present embodiment, power device 1 is IGBT.However, in other embodiments, being generated when can also be other work
The power device of heat.
As illustrated in figs. 2 through 8, power device radiator 2 include heat sink body 21, the first working medium partition board 22, the second working medium every
Plate 23, the first cover board 28, the second cover board 29, the inlet tube 24 for coolant liquid inflow and the outlet tube for coolant liquid outflow
25, it is provided with multiple slots 211 of pluggable multiple power devices 1 on the heat sink body 21, completely cuts off with the slot 211
Multiple working medium runners 212 and the cooling passage 217 completely cut off with the slot 211 and working medium runner 212, the power device 1
It is plugged in the slot 211 of the heat sink body.Slot 211 is consistent with 1 quantity of power device.That is, in the present embodiment, power
Device radiator 2 can simultaneously radiate to multiple power devices 1.
In the present embodiment, heat-conducting glue is provided between the power device 1 and the madial wall of the slot 211.Heat-conducting glue
On the one hand the connection of power device 1 and heat sink body 21 is realized.On the other hand, the slot of power device 1 and slot 211 can be filled
Gap between wall so that power device 1 is in close contact with heat sink body 21, reduces thermal resistance between the two.
As shown in figs 6-8, the multiple working medium runner 212 and the 211 alternately laminated arrangement of the multiple slot.It is more highly preferred to
Ground, each slot 211 are both provided with a working medium runner 212 in the both sides of stacking direction, i.e. two working medium runners 212 clip one
A slot 211.In this way, the two opposite surfaces of power device 1 in the stacking direction can rapidly with the working medium of both sides
Refrigerant heat exchanger in runner 212, the heat of power device 1 can rapid cooling, improve radiating efficiency.
As shown in figs 6-8, the first working medium partition board 22 is sealedly connected on the heat dissipation by way of welding or gluing
In main body 21 and one end in the working medium runner 212, one end of the first working medium partition board 22 and the working medium runner 212
Between form first chamber 26, the second working medium partition board 23 is sealedly connected on the heat dissipation by way of welding or gluing and led
On body 21 and the other end in the working medium runner 212, the second working medium partition board 23 are another with the working medium runner 212
Second chamber 27 is formed between end.The working medium runner is communicated between the first chamber and the second chamber to form working medium closing
The cyclic space, be packaged in working medium closed circulation space can phase transformation working medium.First cover board 28 passes through welding or glue
Viscous mode is sealedly connected on the heat sink body 21 and one end in the cooling passage 217, first cover board
Form third chamber 281 between 28 and one end of the cooling passage 217, second cover board 29 passes through welding or gluing
Mode is sealedly connected on the heat sink body 21 and the other end in the cooling passage 217, second cover board 29
The 4th chamber 291, the inlet tube 24 and the third chamber 281 are formed between the other end of the cooling passage 217
Connection, the outlet tube 25 are connected to the 4th chamber 291, and the cooling passage 217 is communicated in the third chamber 281
To form coolant liquid closed circulation space between the 4th chamber 291, the coolant liquid flowed into via the inlet tube 24 passes through institute
Coolant liquid closed circulation space is stated to flow out from the outlet tube 25 later.
In the present embodiment, be packaged in working medium closed circulation space can phase transformation working medium.Working medium has low boiling point, height
The characteristic of the coefficient of heat transfer with by the heat of vaporization absorption power device 1, and by liquidation exothermic reaction, transfers heat to cooling
The coolant liquid flowed in liquid channel, the heat of power component is quickly exported.The working medium be selected from ethylene glycol, acetone, methanol,
The mixture of refrigerant (R134a, R410A etc.), one or more of which in ammonia.
In general, coolant liquid is made of water, antifreezing agent and additive three parts, alcohol can be divided by antifreeze component difference
The coolant liquid of the types such as type, glycerol type and ethylene glycol type.But in the present embodiment, it is cold that coolant liquid can be extended to low boiling point
Matchmaker, such as liquid nitrogen, freon.
As shown in Fig. 3 and Fig. 8, it is provided with working medium on the heat sink body 21 and fills hole 213, the working medium fills hole 213
On be connected with inner hollow fill column 3.It is tightly connected with heat sink body 21 in the first working medium partition board 22, the second working medium partition board 23
It, can be by the column 3 that fills to the working medium closed circulation after completion (before the first cover board 28 and the installation of the second cover board 29)
Working medium is filled in space.In Fig. 3, it is original length to fill column 3, in fact, after working medium fills completion, it can be to filling column
3 are sheared, and the length to be filled with the first working medium partition board 22 of protrusion of column 3 controls within 14mm, to avoid the first lid is influenced
The assembly of plate 28.After filling completion, the opening for filling column is closed by modes such as welding, sprue or fluid sealants, so that work
Matter closed circulation space and external isolation completely.
However, in other embodiments, the outer end for filling column 3 can also be to be pierced by the first cover board 28, in this way, in power device
First cover board of part radiating module and the assembly of the second cover board carry out working medium after completing and fill again.
In the present embodiment, as shown in FIG. 6 and 7, each working medium runner 212 includes along 1 plugging direction of power device
Multiple microchannel pores 2121 of an at least row are arranged in, the multiple microchannel pore 2121 is isolated from each other, the multiple microchannel
The one end in hole 2121 is connected to the first chamber 26, the other end of the multiple microchannel pore 2121 and the second chamber 27
Connection.Preferably, 2121 parallel interval of the multiple microchannel pore is arranged, and the extending direction of the multiple microchannel pore 2121
It is identical as the extending direction of the slot 211.
In the present embodiment, as shown in Fig. 6 and Fig. 8, multiple microchannel pores 2121 of each working medium runner 212 are lined up more
The circle of slot 211 1 is arranged and surround, i.e., slot 211 is located in multiple microchannel pores 2121.Working medium runner 212 described in each group with it is right
The slot 211 answered is integrally located between two adjacent cooling passages 217.Cooling passage 217 and multiple microchannel pores
2121 extending direction is orthogonal.In this way, the multiple working medium runner 212 and 217 alternately laminated row of the multiple cooling passage
Cloth, the multiple slot 211 are also alternately laminated arrangement with the multiple cooling passage 217.That is, each working medium runner 212
The single heat pipe structure entirety constituted with corresponding slot 211 and the 217 alternately laminated arrangement of the multiple cooling passage.
However, in other embodiments, multiple microchannel pores of the working medium runner can also be only in the lamination side of slot
To side be arranged in a row, either, multiple microchannel pores of the working medium runner can also be the stack direction in slot
Both sides are respectively arranged in a row.
In the present embodiment, as shown in FIG. 6 and 7, each cooling passage 217 is made of multiple through-holes.Through-hole is communicated in
Between third chamber 281 and the 4th chamber 291.
However, in other embodiments, each cooling passage 217 can also be integral through-hole (such as U-shaped hole), or
Person, each cooling passage 217 is interior to have multiple fins to form serpentine channel.
In addition, in other embodiments, it is logical that other coolant liquid can also be arranged on the first cover board 28, the second cover board 29
Road, such as serpentine channel.
In the present embodiment, it is preferable that the heat sink body 21 is integrally formed by extruding metal, such as aluminium extrusion one at
Type, copper, which squeeze, to be integrally formed.In this way, avoiding pad excessive in the prior art.The integrally formed heat dissipation master of extruding metal
Body 21 can be without any processing, is directly used in power device radiator 2.It can also be by after formation, making some machines
Processing (such as fluting, hole) is used further to power device radiator 2.Certainly, as an alternative, heat sink body 21 can also be straight
Metal derby (aluminium block, copper billet etc.) machining was connected to obtain.
As shown in figs 6-8, the heat sink body 21 be hexahedron structure, the heat sink body 21 have first end face DM1,
Second end face DM2, first side CM1, second side CM2, third side CM3 and the 4th side CM4, the first side CM1,
Second side CM2, third side CM3 and the 4th side CM4 are sequentially connected with, and are connected to the first end face DM1 and second end
Between the DM2 of face.
As shown in fig. 6, the both ends of the working medium runner 212 extend through the first side CM1 and third side CM3；
The both ends of the slot 211 extend through the first side CM1 and third side CM3.217 both ends of the cooling passage point
Not Guan Chuan the second side CM2 and the 4th side CM4, first cover board 28 is located on the outside of the second side CM2, described
Second cover board 29 is located on the outside of the 4th side CM4.
Herein, slot 211 is the slot of both ends open, and such setting is for the power corresponding to the both ends outlet such as IGBT
Device.Thus, in other embodiments, if the outlet of power device one end, it is closed that slot can also be one end open, one end
Slot.
As shown in FIG. 6 and 7, it is provided with the inlet being connected to the third chamber 281 on first cover board 28
282, the liquid outlet 292 being connected to the 4th chamber 291 is provided on second cover board 29.The inlet tube 24 is connected to
On the inlet 282, the outlet tube 25 is connected on the liquid outlet 292.
As can be seen from figures 8 and 9, the first side CM1 is formed with the first slot 215 of indent, is set in first slot 215
It is equipped with first step 2151, the first working medium partition board 22 is embedded in first slot 215 and is supported with the first step 2151
It connects, and is sealed by way of welding or gluing.The outer surface of the first working medium partition board 22 is flat with the first side CM1
Together, the first chamber 25 is formed between the inner surface and the bottom surface of first slot 215 of the first working medium partition board 22.
The third side CM3 is formed with the second slot 216 of indent, is provided with second step 2161 in second slot 216, and described
Two working medium partition boards 23 are embedded in second slot 216 and are abutted with the second step 2161, the second working medium partition board 23
Outer surface is concordant with the third side CM3, and the second chamber 27 is formed in the inside table of the second working medium partition board 23
Between face and the bottom surface of second slot 216.
In addition, the first working medium partition board 22 does not cover the one end open of slot 211, the second working medium partition board 23 does not cover slotting
Another end opening of slot 211.
As can be seen from figures 8 and 9, the both ends of each slot 211 are respectively formed the first jag 2111 and the second jag
2112, first jag 2111 protrudes from the bottom surface of first slot 215 and concordant with the first side CM1, described
Second jag 2112 protrudes from the bottom surface of second slot 216 and concordant with the third side CM3.The first working medium lid
Multiple first avoid holes 221 are provided on plate 22, each first jag 2111 is sealed by way of welding or gluing
It is plugged in corresponding one the first avoid holes 221, the second avoid holes 231 is provided on the second working medium cover board 23, it is each
Second jag 2112 is sealed by way of welding or gluing and is plugged in corresponding second avoid holes 231.
Power device radiator and power device radiating module according to the above embodiment of the present invention, the connection of working medium runner
To form working medium closed circulation space between the first working medium partition board and the second working medium partition board, encapsulated in working medium closed circulation space
Have can phase transformation working medium, cooling passage is communicated between third chamber and the 4th chamber empty to form coolant liquid closed circulation
Between, in this way, the first working medium partition board, working medium runner and the second working medium partition board constitute heat pipe, due to slot, working medium runner and coolant liquid
Channel arranged stacked, power device (such as IGBT) are plugged in slot, since the heat absorption speed of working medium is much larger than coolant liquid
Heat absorption speed, heat and vaporization of the liquid refrigerant by the side wall absorbed power device of working medium runner distribute power device
Heat is quickly exported to working medium closed circulation space, this is level-one heat exchange；Then, it is followed in coolant liquid closing by coolant liquid
Circulating in annular space, gaseous working medium to the cold by the cooled liquid band of side wall of cooling passage walked by liquidation exothermic reaction, heat,
By the heat derives in working medium closed circulation space to coolant liquid closed circulation space, this is secondary heat exchange.With this, power device
The heat of part is taken away by coolant liquid, realizes the heat dissipation of power device.Also, due to common groove between working medium runner and slot
Wall, and working medium runner is also to share cell wall with cooling passage, thus, effectively it is exaggerated contact area of the power device with heat pipe
And the heat exchange area of working medium runner and cooling passage, the thermal resistance between working medium runner and slot is minimum, and power device dissipates
The thermal efficiency is high, is suitable for high power device and radiates.In addition, being replaced with the arranged stacked of slot, working medium runner and cooling passage
The welding of multiple heat sinks and water inlet supervisor, water outlet main pipe in the prior art can avoid excessive pad, manufacturing process letter
Single, cost is relatively low, can effectively reduce thermal resistance, reduces the risk that coolant liquid leakage occurs, and improves radiating efficiency.
In above-described embodiment, slot is identical as the extending direction of working medium runner, and orthogonal with cooling passage.However, this
The technical staff in field is conceivable that set working medium runner and cooling passage to extending direction identical, and with insert
Slot is orthogonal.In this type of embodiment, first chamber and third chamber are in the same side of heat sink body, second chamber and the 4th chamber
Room is in the same side (opposite side of first chamber) of heat sink body, thus, it is necessary first to ensure first chamber and third chamber
Isolation and second chamber and the 4th chamber isolation, next needs to ensure that the first working medium partition board, the second working medium partition board only hide
Lid working medium runner is without covering cooling liquid flowing channel.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (12)
1. a kind of power device radiator, which is characterized in that including heat sink body, the first working medium partition board, the second working medium partition board,
First cover board, the second cover board, the inlet tube for coolant liquid inflow and the outlet tube for coolant liquid outflow；
At least slot that pluggable power device is provided on the heat sink body, at least working medium completely cut off with the slot
Runner and the multiple cooling passages completely cut off with the slot and working medium runner, the slot, working medium runner and coolant liquid are logical
Road arranged stacked；
The first working medium bulkhead seal is connected on the heat sink body and one end in the working medium runner, and described first
First chamber is formed between working medium partition board and one end of the working medium runner, the second working medium bulkhead seal is connected to described dissipate
In hot main body and in the working medium runner the other end, between the second working medium partition board and the other end of the working medium runner
Second chamber is formed, the working medium runner is communicated between the first chamber and the second chamber empty to form working medium closed circulation
Between, be packaged in working medium closed circulation space can phase transformation working medium；
First cover plate for sealing is connected on the heat sink body and one end in the cooling passage, first lid
Third chamber is formed between plate and one end of the cooling passage, second cover plate for sealing is connected on the heat sink body
And the other end in the cooling passage, the 4th is formed between second cover board and the other end of the cooling passage
Chamber, the inlet tube and the third chamber, the outlet tube and the 4th chamber, the cooling passage
It is communicated between the third chamber and the 4th chamber to form coolant liquid closed circulation space, is flowed into via the inlet tube
Coolant liquid after coolant liquid closed circulation space from the outlet tube by flowing out.
2. power device radiator according to claim 1, which is characterized in that the heat sink body passes through extruding metal
It is integrally formed.
3. power device radiator according to claim 1, which is characterized in that the heat sink body is hexahedron knot
Structure, the heat sink body have first end face, second end face, first side, second side, third side and the 4th side, institute
It states first side, second side, third side and the 4th side to be sequentially connected with, and is connected to the first end face and second end face
Between；
The both ends of the working medium runner extend through the first side and third side；
The both ends of the slot extend through the first side and third side；
The cooling passage both ends extend through the second side and the 4th side, and first cover board is located at described second
On the outside of side, second cover board is located on the outside of the 4th side.
4. power device radiator according to claim 1, which is characterized in that the heat sink body, first partition or
It is provided with the working medium being connected to working medium closed circulation space on second partition and fills hole, the working medium is filled and is connected on hole
Column is filled, working medium can be filled with into working medium closed circulation space by the column that fills.
5. power device radiator according to claim 1, which is characterized in that be provided on first cover board and institute
The inlet of third chamber is stated, the liquid outlet with the 4th chamber is provided on second cover board；
The inlet tube is connected on the inlet, and the outlet tube is connected on the liquid outlet.
6. power device radiator according to claim 4, which is characterized in that each working medium runner includes along work(
Rate device plugging direction is arranged in multiple microchannel pores of an at least row, and the multiple microchannel pore is isolated from each other, the multiple
One end of microchannel pore is connected to the first chamber, and the other end of the multiple microchannel pore is connected to the second chamber.
7. power device radiator according to claim 6, which is characterized in that the multiple microchannel pore parallel interval
Setting, and the extending direction of the multiple microchannel pore is identical as the extending direction of the slot.
8. power device radiator according to claim 3, which is characterized in that the first side is formed with indent
First slot, is provided with first step in first slot, the first working medium bulkhead seal be embedded in first slot and with institute
First step abutting is stated, the outer surface of the first working medium partition board is concordant with the first side, and the first chamber is formed
Between the inner surface and the bottom surface of first slot of the first working medium partition board；
The third side is formed with the second slot of indent, is provided with second step in second slot, second working medium every
Is abutted in embedded second slot of plate sealing and with the second step, the outer surface of the second working medium partition board and described the
Three sides are concordant, the second chamber be formed in the inner surface of the second working medium partition board and second slot bottom surface it
Between.
9. power device radiator according to claim 8, which is characterized in that the both ends of the slot are respectively formed
One jag and the second jag, first jag protrude from the bottom surface of first slot and are put down with the first side
Together, second jag protrudes from the bottom surface of second slot and concordant with the third side；
The first avoid holes are provided on the first working medium cover board, the first jag sealing is plugged in first avoid holes
In, the second avoid holes are provided on the second working medium cover board, the second jag sealing is plugged in second avoid holes
In.
10. according to power device radiator described in any one of claim 1-9, which is characterized in that the heat sink body
On multiple working medium runners for being provided with multiple slots of pluggable multiple power devices and completely cutting off with the multiple slot, it is described
Multiple working medium runners and the alternately laminated arrangement of the multiple cooling passage, the multiple slot and the multiple cooling passage
Alternately laminated arrangement.
11. a kind of power device radiating module, which is characterized in that arbitrary including at least one power device and claim 1-10
Power device radiator described in one, the power device are plugged in the slot of the heat sink body.
12. power device radiating module according to claim 11, which is characterized in that the power device and the slot
Madial wall between be provided with heat-conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710131631.0A CN108573938A (en) | 2017-03-07 | 2017-03-07 | Power device radiator and power device radiating module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710131631.0A CN108573938A (en) | 2017-03-07 | 2017-03-07 | Power device radiator and power device radiating module |
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| CN108573938A true CN108573938A (en) | 2018-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710131631.0A Pending CN108573938A (en) | 2017-03-07 | 2017-03-07 | Power device radiator and power device radiating module |
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| CN110060967A (en) * | 2019-05-24 | 2019-07-26 | 东莞市迈泰热传科技有限公司 | A kind of two-sided cooling radiator |
| CN110958814A (en) * | 2019-12-09 | 2020-04-03 | 华南理工大学 | Flexible phase-change heat transfer cooler for server |
| WO2023115526A1 (en) * | 2021-12-24 | 2023-06-29 | 无锡星驱科技有限公司 | Electric motor controller and heat dissipation system thereof |
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