WO2023115526A1 - Electric motor controller and heat dissipation system thereof - Google Patents

Electric motor controller and heat dissipation system thereof Download PDF

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Publication number
WO2023115526A1
WO2023115526A1 PCT/CN2021/141142 CN2021141142W WO2023115526A1 WO 2023115526 A1 WO2023115526 A1 WO 2023115526A1 CN 2021141142 W CN2021141142 W CN 2021141142W WO 2023115526 A1 WO2023115526 A1 WO 2023115526A1
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WIPO (PCT)
Prior art keywords
heat dissipation
cavity
channel
sealed cavity
flow channel
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PCT/CN2021/141142
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French (fr)
Chinese (zh)
Inventor
徐章禄
刘彬
马永泉
韩韬
于海生
谭艳军
林霄喆
王瑞平
肖逸阁
Original Assignee
无锡星驱科技有限公司
浙江吉利控股集团有限公司
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Application filed by 无锡星驱科技有限公司, 浙江吉利控股集团有限公司 filed Critical 无锡星驱科技有限公司
Priority to PCT/CN2021/141142 priority Critical patent/WO2023115526A1/en
Priority to CN202180100558.5A priority patent/CN117813923A/en
Publication of WO2023115526A1 publication Critical patent/WO2023115526A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to the technical field of new energy vehicles, in particular to a motor controller and a cooling system thereof.
  • the electric drive system is one of the core components of the power output of new energy vehicles, and its requirements for light weight, miniaturization, high torque density and high power density are also of growth.
  • the motor controller is an important part of the electric drive system. In an electric vehicle, the function of the motor controller is to control the starting operation, forward and backward speed, climbing force and other driving states of the electric vehicle according to the gear position, accelerator, brake and other instructions. , or it will help electric vehicles brake and store part of the braking energy in the power battery.
  • the motor controller directly affects the quality of electric vehicles. Most of the heating of the control system is caused by the heat loss of the power device, and the power device is sensitive to temperature. If the temperature is too high, it will affect the performance of the controller, and even cause irreversible damage to the power device, affecting the performance of the controller. Normal use. Since the heat generation of power components such as IGBT (insulated gate bipolar transistor chip) is relatively concentrated, how to effectively reduce its operating temperature and prolong its service life has become a research hotspot in the electric vehicle industry around the world.
  • IGBT insulated gate bipolar transistor chip
  • Natural cooling is to install heat dissipation fins on the surface or stick a heat dissipation module label on the controller shell to dissipate heat, and the heat dissipation efficiency is low.
  • Air cooling uses a cooling fan for cooling, which leads to the motor controller's uncompact structure, high noise, and insufficient heat dissipation when running at high power.
  • the water cooling is tightly connected and packaged with the water cooling plate and the power device. Once water seeps into the controller, it will cause a great safety accident, resulting in personal safety and property loss.
  • the existing motor controller does not have a cooling system or the structure of the cooling system may lead to insufficient heat dissipation area of the IGBT components, busbar components and capacitor components, poor heat exchange efficiency, and poor overall heat dissipation effect, resulting in the motor controller housing Internal components have a low service life. Therefore, it is necessary to develop a new cooling system to solve the above problems.
  • the present invention provides a motor controller and its cooling system to improve the cooling problem of the motor controller.
  • the present invention provides a heat dissipation system for a motor controller, which includes a housing, a first main channel, a second main channel and a heat dissipation substrate, and the housing is provided with a liquid inlet and an outlet.
  • the body is divided into multiple cooling channels arranged in parallel.
  • the sealed cavity includes a distribution cavity and a collection cavity, the distribution cavity communicates with the first main flow channel, the collection cavity communicates with the second main flow channel, and the cooling flow channel One end communicates with the distribution cavity, and the other end communicates with the collection cavity.
  • the heat dissipation fins include first heat dissipation fins and second heat dissipation fins, the first heat dissipation fins protrude from the lower surface of the heat dissipation substrate, and the first heat dissipation ribs
  • the sheet extends from one end of the first main flow channel to the direction of the second main flow channel, the second heat dissipation fin protrudes from the side wall of the first heat dissipation fin, and the adjacent first heat dissipation fin
  • the second heat dissipation fins on the fins are arranged alternately.
  • a cavity sealing ring is provided in the sealed cavity, one side of the cavity sealing ring is in contact with the heat dissipation substrate, and the other side is in contact with the bottom plate of the housing;
  • the shape of the cavity sealing ring matches the shape of the sealing cavity, the cavity sealing ring is arranged around the outer periphery of the heat dissipation fins, and the cavity sealing ring is made of elastic material.
  • the cavity sealing ring is a composite material of elastic material.
  • a flow channel gasket is provided at the bottom of the sealed cavity, and the internal structure of the flow channel gasket is consistent with the arrangement structure of the plurality of heat dissipation fins. Between the heat dissipation fins and the bottom plate of the housing.
  • a spoiler structure is provided in the cooling channel, and the spoiler structure is arranged on the heat dissipation substrate and/or the housing.
  • the spoiler structure includes a cylindrical spoiler column, and the spoiler column is arranged at a corner of the cooling channel.
  • the first main channel and the second main channel are integrated with the housing, at least part of the first main channel is located below the sealed cavity, and at least part of the The second main channel is located below the sealed cavity, the liquid inlet and the liquid outlet are located on different side walls of the housing, at least part of the first main channel and at least part of the second main channel Parallel setting.
  • a plurality of heat dissipation substrates are arranged in parallel in the housing, and a sealed cavity is formed between each of the heat dissipation substrates and the housing, and each of the sealed cavities Both communicate with the first main channel and the second main channel.
  • the heat dissipation system includes a housing, a first main flow channel, a second main flow channel and a cooling
  • the substrate the housing is provided with a liquid inlet and a liquid outlet, the first main flow channel is connected to the liquid inlet; the second main flow channel is connected to the liquid outlet; the heat dissipation substrate is set Inside the housing, a number of heat dissipation fins are provided at the bottom; a sealed cavity is formed between the heat dissipation substrate and the housing, and the sealed cavity communicates with the first main channel and the second As for the main channel, the plurality of cooling fins divide the sealed cavity into a plurality of cooling channels arranged in parallel.
  • the electronic components include a first power module, a second power module and a third power module arranged on the heat dissipation substrate.
  • the heat dissipation substrate includes a first heat dissipation substrate, a second heat dissipation substrate, and a third heat dissipation substrate respectively corresponding to the first power module, the second power module, and the third power module.
  • the cavity includes a first sealed cavity, a second sealed cavity and a third sealed cavity respectively corresponding to the first power module, the second power module and the third power module, the first sealed cavity, the second sealed cavity Both the second sealed cavity and the third sealed cavity communicate with the first main channel and the second main channel.
  • a first main flow channel connected to the liquid inlet and a second main flow channel connected to the liquid outlet are arranged in the controller housing, and the heat dissipation substrate and the heat dissipation substrate are connected by the heat dissipation fins provided on the heat dissipation substrate.
  • the sealed cavity surrounded by the shell is divided into multiple cooling channels, and one end of the cooling channel communicates with the first main channel, and the other end communicates with the second main channel, and the cooling medium enters each cooling channel through the first main channel , and then discharged through the second main channel.
  • the invention adopts direct water cooling to cool the power module, improves the heat exchange efficiency, and avoids heat dissipation dead zone.
  • a cavity sealing ring is set in the sealing cavity, and it is installed between the heat dissipation substrate and the shell bottom plate by squeezing the cavity sealing ring, which is used to seal the heat dissipation cavity;
  • a flow channel gasket is set in the sealing cavity, which can Adjacent cooling channels are isolated to prevent the fluids in adjacent cooling channels from moving each other and affect the heat dissipation effect of the heat dissipation system;
  • a turbulence structure is set in the cooling channel, and the turbulence structure can strengthen the flow of local liquid and increase the solid-liquid interaction.
  • the heat dissipation area for heat transfer increases the cross-sectional area of solid heat conduction and heat transfer, and improves heat exchange efficiency;
  • the heat dissipation system can be provided with multiple heat dissipation substrates arranged side by side, and each heat dissipation substrate and the shell form a cooling plate.
  • the cavity is sealed, so that multiple power modules in the motor controller are cooled separately, and the cooling effect is better.
  • the present invention also provides a motor controller including the above-mentioned heat dissipation system.
  • the motor controller adopts a parallel arrangement of multiple power modules, and each power module corresponds to a sealed cavity for cooling, so as to avoid serial cooling of the stator and rotor.
  • the heat dissipation path is long, and the heat dissipation effect at the end of the heat dissipation path is poor, which cannot meet the heat dissipation requirements.
  • FIG. 1 is a schematic structural view of a heat dissipation system of a motor controller of the present invention in an embodiment
  • Fig. 2 is a schematic cross-sectional structure diagram of an embodiment of the heat dissipation system of the motor controller of the present invention
  • Fig. 3 is a partial cross-sectional view of the heat dissipation system of the motor controller of the present invention in an embodiment
  • Fig. 4 is a schematic cross-sectional structure diagram of the cooling channel in an embodiment of the heat dissipation system of the motor controller of the present invention
  • Fig. 5 is a structural schematic diagram of a cavity sealing ring in an embodiment of the heat dissipation system of the motor controller of the present invention
  • FIG. 6 is a schematic structural view of the flow channel gasket in an embodiment of the heat dissipation system of the motor controller of the present invention.
  • FIG. 7 is a schematic diagram of a heat dissipation fin and a flow turbulence structure in an embodiment of the heat dissipation system of the motor controller of the present invention.
  • Fig. 8 is a structural schematic diagram of an embodiment of the motor controller of the present invention.
  • FIG. 9 is a schematic cross-sectional structure diagram of an embodiment of the motor controller of the present invention.
  • Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
  • the present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.
  • the terminology used in the embodiments of the present invention is for describing specific implementations, not for limiting the protection scope of the present invention.
  • the test methods for which specific conditions are not indicated in the following examples are usually in accordance with conventional conditions, or in accordance with the conditions suggested by each manufacturer.
  • the purpose of the present invention is to provide a motor controller and its heat dissipation system to improve the heat dissipation of the motor controller.
  • the present invention provides a heat dissipation system for a motor controller including a housing 100 , a first main flow channel 103 , a second main flow channel 104 and a heat dissipation substrate 200 , and the housing 100 is provided with a liquid inlet 101 and the liquid outlet 102 , the first main channel 103 is arranged inside the casing 100 and communicates with the liquid inlet 101 ; the second main channel 104 is arranged inside the casing 100 and communicates with the liquid outlet 102 .
  • the heat dissipation substrate 200 is arranged in the casing, and a plurality of heat dissipation fins are provided at the bottom thereof, and a sealed cavity 300 is formed between the heat dissipation substrate 200 and the casing 100, and the sealed cavity 300 communicates with the first main flow channel 103 and the second main flow channel 104 , a plurality of cooling fins divide the sealed cavity 300 into a plurality of cooling channels 203 arranged in parallel.
  • the sealed chamber 300 further includes a distribution chamber 310 and a collection chamber 320 , the distribution chamber 310 communicates with the first main channel 103 , and the collection chamber 320 communicates with the second main channel 104 ,
  • the cooling channel 203 is located between the distribution cavity 310 and the collection cavity 320 , one end of which communicates with the distribution cavity 310 , and the other end communicates with the collection cavity 320 .
  • Cooling medium such as cooling water
  • the pooling cavity 320 collects, and then enters the second main channel 104 from the pooling cavity 320, and discharges the motor controller through the liquid outlet 102, and enters the motor controller again after being cooled by the intercooler outside the motor controller for cooling cycle.
  • the heat generated by the electronic components in the motor controller that is in contact with the heat dissipation system, especially the heat dissipation substrate, can be taken away, so that it can always be kept within the normal temperature range, ensuring that the motor controller normal work.
  • the casing 100 is a shell-like structure with a high periphery and a concave downward in the middle, inside which are provided support ribs for installing electronic components, a liquid inlet 101 and a liquid outlet 102
  • the liquid inlet 101 is connected with a liquid inlet pipe 105
  • the liquid outlet 102 is connected with a liquid outlet pipe 106 .
  • first main flow channel 103 communicates with the liquid inlet 101, and the other end extends toward the direction of the liquid outlet 102, and the end of the first main flow channel 103 extending toward the liquid outlet 102 direction is closed;
  • second main flow channel 104 One end communicates with the liquid outlet 102 , the other end extends toward the liquid inlet 101 , and one end of the second main channel 104 extending toward the liquid inlet 101 is closed.
  • the first main channel 103 is at least partly located below the sealed cavity 300
  • the second main channel 104 is at least partly located below the sealed cavity 300
  • the part of the first main channel 103 located below the sealed cavity 300 is connected to the second main channel.
  • the parts of 104 located below the sealed cavity 300 are parallel to each other.
  • the part of the first main channel 103 located below the sealed cavity 300 is provided with a first connecting passage extending upward and communicating with the distribution chamber 310 , the first connecting channel is along the flow direction of the first main channel 103 The length corresponds to the size of the distribution cavity 310 in this direction, and the part of the second main channel 103 located below the sealed cavity 300 is provided with a second connecting channel extending upward and communicating with the collecting cavity 320, and the second connecting channel is along the second main channel.
  • the length of the channel 104 in the channel direction corresponds to the size of the collecting chamber 320 in this direction.
  • the cooling liquid that enters the first main flow channel 103 from the liquid inlet 101 enters the distribution chamber 310 through the first connecting channel, and then divides into each cooling flow channel 203 through the distribution cavity 310, and the cooling liquid flows through each cooling flow channel 203 in the collection chamber 320 Collected, enter the second main channel 104 through the second connecting channel, and be discharged from the liquid outlet 102.
  • the first main channel 103 and the second main channel 104 are integrated with the housing 100 , for example, the first main channel 103 and the second main channel 104 are cast integrally with the housing 100 .
  • the supporting rib of the housing 100 is provided with a downwardly recessed installation cavity, the two ends of the bottom of the installation cavity communicate with the first main flow channel 103 and the second main flow channel 104 respectively, and the heat dissipation substrate 200 presses Installed on the installation cavity and form a sealed cavity 300 therewith.
  • the heat dissipation substrate 200 is screwed to the housing 100, that is, the heat dissipation substrate 200 and the housing 100 are provided with threaded holes correspondingly, and the screws are used to pass through the threaded holes on the heat dissipation substrate 200 and the housing 100 in turn to fix the heat dissipation substrate 200 in the installation cavity.
  • the housing 100 that is, the heat dissipation substrate 200 and the housing 100 are provided with threaded holes correspondingly, and the screws are used to pass through the threaded holes on the heat dissipation substrate 200 and the housing 100 in turn to fix the heat dissipation substrate 200 in the installation cavity.
  • cooling fins are arranged on the lower surface of the heat dissipation substrate 200, the cooling fins include a plurality of first cooling fins 201 and second cooling fins 202, the first cooling ribs
  • the fins 201 protrude from the lower surface of the heat dissipation substrate 200, and the first heat dissipation fins 201 extend from the first main flow channel 103 to the second main flow channel 104, and between every two adjacent first heat dissipation fins 201 A cooling channel 203 is formed.
  • the second heat dissipation fins 202 protrude from the side wall of the first heat dissipation fins 201.
  • the second heat dissipation fins 202 is connected to the first heat dissipation fins 201, and the other end extends toward the cooling channel 203.
  • the second heat dissipation fins 202 are arranged vertically to the first heat dissipation fins 201 , and the second heat dissipation fins 202 on adjacent first heat dissipation fins 201 are arranged alternately.
  • Such setting makes the cooling channel 203 have an S-shaped structure, which can increase the heat dissipation area and improve the heat dissipation efficiency.
  • a cavity sealing ring 301 is provided in the sealing cavity 300 , and the shape of the cavity sealing ring 301 matches the shape of the sealing cavity 300 .
  • the cavity sealing ring 301 is installed close to the side wall of the sealing cavity 300, its upper surface is connected with the heat dissipation substrate 200, and its lower surface is connected with the bottom wall of the housing 100, relying on the upper surface of the cavity sealing ring 301 and the lower surface The compression of the surface seals the sealed cavity 300 .
  • the cavity sealing ring 301 is made of flexible composite material, such as nitrile rubber, fluororubber and the like.
  • a flow channel gasket 302 may also be provided in the sealed cavity 300 , and the internal structure of the flow channel gasket 302 corresponds to the distribution of heat dissipation fins on the heat dissipation substrate 200 .
  • the flow channel sealing gasket 302 is placed in the installation cavity of the housing 100 first, and the heat dissipation substrate 200 is closed and pressed tightly.
  • the flow channel sealing gasket 302 isolates the adjacent cooling flow channels 203 to prevent the cooling media in the adjacent cooling flow channels 203 from moving with each other and affect the overall heat dissipation effect.
  • a spoiler structure 204 is also provided in the cooling channel 203, which can be arranged on the heat dissipation substrate 200 or on the housing.
  • the material of the spoiler structure 204 is the same as that of the heat dissipation substrate. 200 of the same material.
  • the turbulence structure 204 is arranged in each cooling channel 203, which can increase the turbulence of the cooling liquid, destroy the boundary layer of the cooling liquid, form a secondary flow, aggravate the degree of turbulent flow, generate more turbulent flow, and increase the heat dissipation area;
  • the flow form is influenced while the flow velocity of the cooling liquid is kept constant, so that the cooling liquid is fully in contact with the cooling flow channel 203 , so that convective heat exchange occurs between the fluid and the cooling flow channel 203 , thereby enhancing the heat exchange capacity.
  • the spoiler structure 204 includes cylindrical spoiler posts arranged at intervals, and the size of the spoiler posts can be set according to the size of the cooling channel 203 .
  • the spoiler column is arranged at the corner of the cooling channel 203 , since there is a dead zone at the corner, setting the spoiler column here can strengthen the flow of the liquid here, and prevent poor heat dissipation effect at the corner.
  • the spoiler column may also be in a drop shape or other suitable structures.
  • a plurality of installation cavities are arranged side by side in the housing 100, and a heat dissipation substrate 200 is placed in each installation cavity, and each heat dissipation substrate 200 forms a sealed cavity with the corresponding installation cavity.
  • Body 300 , the heat dissipation fins at the bottom of heat dissipation substrate 200 are distributed in the structure described above, and each sealed cavity 300 is divided into a plurality of cooling channels distributed in parallel.
  • the number of cooling passages 203 in each sealed cavity 300 can be set according to the heat dissipation in this area.
  • the cavity sealing cavity 301, the flow channel sealing gasket 302 and the spoiler structure 204 are selected and installed according to the specific conditions of the power module in the motor controller.
  • the present invention also provides a motor controller, which includes a heat dissipation system, a plurality of electronic components and single-chip microcomputers installed on the heat dissipation system.
  • the cooling system adopts the cooling system of the present invention.
  • the electronic components include a plurality of power modules 400, such as IGBT power modules.
  • the power modules 400 are installed on the heat dissipation substrate 200, and the power modules 400 are generated by using the cooling medium flowing in the cooling channel 203 between the heat dissipation substrate 200 and the housing 100. heat away.
  • the power module 400 is installed in parallel with multiple modules, and each module corresponds to a sealed cavity 300 enclosed by the heat dissipation substrate 200 and the housing 100 as a heat dissipation area.
  • the power module 400 includes a first power module 401, a second power module 402, and a third power module 403 arranged in sequence
  • the heat dissipation system includes The first heat dissipation substrate 210, the second heat dissipation substrate 220, and the third heat dissipation substrate 230 of the module 403, the first heat dissipation substrate 210 and the housing 100 form a first sealed cavity, and the second heat dissipation substrate 220 and the housing 100 form a first sealed cavity.
  • Two sealed cavities, the third heat dissipation substrate 230 and the housing 100 form a third sealed cavity, the setting of the cooling channel 203 in the first sealed cavity, the second sealed cavity and the third sealed cavity and the sealing of the cavities
  • the installation of the ring 301 and the flow channel gasket 302 can be selected according to the heat output of the respective corresponding power modules.
  • the second power module 402 is located between the first power module 401 and the third power module 403, affected by the power modules on both sides, the heat production of the second power module 402 is higher than that of the power modules on both sides, so , the second sealed cavity can be double-sealed by the cavity sealing ring 301 and the flow channel gasket 302 to improve the heat dissipation effect in this area, or increase the cooling medium by increasing the cooling flow channel 203 in the second sealed cavity The flow rate increases its cooling effect.
  • the first sealed cavity and the third sealed cavity can be set according to specific conditions.
  • the invention provides a heat dissipation system for a motor controller.
  • the sealed cavity between the heat dissipation substrate and the housing is divided into a plurality of parallel cooling channels, and the cooling channels
  • the two ends are respectively connected with the first main channel and the second main channel, and the cooling medium entering through the liquid inlet enters each cooling channel through the first main channel, collects into the second main channel through the cooling channel, and then is discharged from the body.
  • the cooling medium can take away the heat generated by the electronic components in the motor controller, keeping it within a normal temperature range.
  • the power modules are cooled in parallel, the cooling medium from the main channel is divided into the area where each power module is located, and each power module is cooled separately to avoid heat dissipation caused by serial cooling of the stator and rotor
  • the present invention effectively overcomes some practical problems in the prior art and thus has high utilization value and use significance.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Provided in the present invention are an electric motor controller and a heat dissipation system thereof, particularly relating to the technical field of new energy automobiles. The heat dissipation system of the electric motor controller of the present invention comprises a housing, a first main flow channel, a second main flow channel and a heat dissipation substrate, wherein the housing is provided with a liquid inlet and a liquid outlet, the first main flow channel is in communication with the liquid inlet, and the second main flow channel is in communication with the liquid outlet; the heat dissipation substrate is arranged in the housing, and a plurality of heat dissipation fins are arranged at the bottom of the heat dissipation substrate; and a sealing cavity is defined between the heat dissipation substrate and the housing, the sealing cavity is in communication with the first main flow channel and the second main flow channel, and the plurality of heat dissipation fins divide the sealing cavity into a plurality of cooling flow channels provided in parallel. By using the electric motor controller of the heat dissipation system in the present invention, a plurality of power modules can be respectively cooled, so that the cooling effect of the electric motor controller is improved.

Description

一种电机控制器及其散热系统A motor controller and its cooling system 技术领域technical field
本发明涉及新能源汽车技术领域,具体涉及一种电机控制器及其散热系统。The invention relates to the technical field of new energy vehicles, in particular to a motor controller and a cooling system thereof.
背景技术Background technique
随着新能源行业的发展以及新能源汽车技术的进步,电驱动系统作为新能源汽车动力输出的核心零部件之一,其对轻量化、小型化、高扭矩密度及高功率密度的要求亦随之增长。电机控制器是电驱动系统的重要组成部分,在电动车辆中,电机控制器的功能是根据档位、油门、刹车等指令,来控制电动车辆的启动运行、进退速度、爬坡力度等行驶状态,或者将帮助电动车辆刹车,并将部分刹车能量存储到动力电池中。With the development of the new energy industry and the advancement of new energy vehicle technology, the electric drive system is one of the core components of the power output of new energy vehicles, and its requirements for light weight, miniaturization, high torque density and high power density are also of growth. The motor controller is an important part of the electric drive system. In an electric vehicle, the function of the motor controller is to control the starting operation, forward and backward speed, climbing force and other driving states of the electric vehicle according to the gear position, accelerator, brake and other instructions. , or it will help electric vehicles brake and store part of the braking energy in the power battery.
电机控制器作为电动汽车的核心部件,直接影响到电动汽车的质量。控制系统的发热绝大部分是由功率器件的热损耗引起的,而功率器件对温度又比较敏感,温度过高会影响控制器的性能,甚至造成功率器件的不可逆转的损坏,影响控制器的正常使用。由于IGBT(绝缘栅双极型晶体管芯片)等功率元件的发热比较集中,如何有效的降低其工作温度,延长其使用寿命,已经成为世界各国电动汽车行业的研究热点。As the core component of electric vehicles, the motor controller directly affects the quality of electric vehicles. Most of the heating of the control system is caused by the heat loss of the power device, and the power device is sensitive to temperature. If the temperature is too high, it will affect the performance of the controller, and even cause irreversible damage to the power device, affecting the performance of the controller. Normal use. Since the heat generation of power components such as IGBT (insulated gate bipolar transistor chip) is relatively concentrated, how to effectively reduce its operating temperature and prolong its service life has become a research hotspot in the electric vehicle industry around the world.
目前,电机控制器主要有自然冷却、风冷和水冷三种冷却散热方式,自然冷却是在表面安装散热翅片或者散热模块标贴在控制器外壳进行散热,散热效率较低。风冷是采用散热风扇进行冷却,这就导致电机控制器结构不紧凑,噪音较大,而且在大功率运行的时候容易出现散热不足的问题。水冷是采用水冷板与功率器件紧密连接封装,一旦有水渗入控制器内部,将导致极大的安全事故,造成人身安全和财产损失。因此,现有的电机控制器没有冷却系统或冷却系统结构可能会导致IGBT组件、母排组件和电容组件的散热面积不足,热交换效率差,整体散热效果不好,最后造成电机控制器壳体内部的部件使用寿命 较低。因此,需要开发一种新的散热系统解决上述问题。At present, there are three cooling and heat dissipation methods for motor controllers: natural cooling, air cooling, and water cooling. Natural cooling is to install heat dissipation fins on the surface or stick a heat dissipation module label on the controller shell to dissipate heat, and the heat dissipation efficiency is low. Air cooling uses a cooling fan for cooling, which leads to the motor controller's uncompact structure, high noise, and insufficient heat dissipation when running at high power. The water cooling is tightly connected and packaged with the water cooling plate and the power device. Once water seeps into the controller, it will cause a great safety accident, resulting in personal safety and property loss. Therefore, the existing motor controller does not have a cooling system or the structure of the cooling system may lead to insufficient heat dissipation area of the IGBT components, busbar components and capacitor components, poor heat exchange efficiency, and poor overall heat dissipation effect, resulting in the motor controller housing Internal components have a low service life. Therefore, it is necessary to develop a new cooling system to solve the above problems.
发明内容Contents of the invention
鉴于以上现有技术的缺点,本发明提供一种电机控制器及其散热系统,以改善电机控制器的散热问题。In view of the above shortcomings of the prior art, the present invention provides a motor controller and its cooling system to improve the cooling problem of the motor controller.
为实现上述目的及其它相关目的,本发明提供一种电机控制器的散热系统,包括壳体、第一主流道、第二主流道及散热基板,所述壳体上设有进液口和出液口,所述第一主流道与所述进液口连通;所述第二主流道与所述出液口连通;所述散热基板设置在所述壳体内,且其底部设有若干散热肋片;所述散热基板与所述壳体之间围成密封腔体,所述密封腔体连通所述第一主流道和所述第二主流道,所述若干散热肋片将所述密封腔体分隔成多条并列排布的冷却流道。In order to achieve the above purpose and other related purposes, the present invention provides a heat dissipation system for a motor controller, which includes a housing, a first main channel, a second main channel and a heat dissipation substrate, and the housing is provided with a liquid inlet and an outlet. The liquid port, the first main channel communicates with the liquid inlet; the second main channel communicates with the liquid outlet; the heat dissipation substrate is arranged in the housing, and its bottom is provided with a number of heat dissipation ribs sheet; a sealed cavity is formed between the heat dissipation substrate and the housing, the sealed cavity communicates with the first main flow channel and the second main flow channel, and the plurality of heat dissipation fins connect the sealed cavity The body is divided into multiple cooling channels arranged in parallel.
在本发明一示例中,所述密封腔体包括分配腔和汇集腔,所述分配腔与所述第一主流道连通,所述汇集腔与所述第二主流道连通,所述冷却流道的一端与所述分配腔连通,另一端与所述汇集腔连通。In an example of the present invention, the sealed cavity includes a distribution cavity and a collection cavity, the distribution cavity communicates with the first main flow channel, the collection cavity communicates with the second main flow channel, and the cooling flow channel One end communicates with the distribution cavity, and the other end communicates with the collection cavity.
在本发明一示例中,所述散热肋片包括第一散热肋片和第二散热肋片,所述第一散热肋片凸出于所述散热基板的下表面,并且所述第一散热肋片自所述第一主流道的一端向所述第二主流道方向延伸,所述第二散热肋片凸出于所述第一散热肋片的侧壁设置,相邻的所述第一散热肋片上的第二散热肋片交错设置。In an example of the present invention, the heat dissipation fins include first heat dissipation fins and second heat dissipation fins, the first heat dissipation fins protrude from the lower surface of the heat dissipation substrate, and the first heat dissipation ribs The sheet extends from one end of the first main flow channel to the direction of the second main flow channel, the second heat dissipation fin protrudes from the side wall of the first heat dissipation fin, and the adjacent first heat dissipation fin The second heat dissipation fins on the fins are arranged alternately.
在本发明一示例中,所述密封腔体内设有腔体密封圈,所述腔体密封圈的一侧与所述散热基板相接,另一侧与所述壳体的底板相接;所述腔体密封圈的形状与所述密封腔体的形状相配,所述腔体密封圈围绕所述散热肋片的外周设置,所述腔体密封圈为弹性材质。In an example of the present invention, a cavity sealing ring is provided in the sealed cavity, one side of the cavity sealing ring is in contact with the heat dissipation substrate, and the other side is in contact with the bottom plate of the housing; The shape of the cavity sealing ring matches the shape of the sealing cavity, the cavity sealing ring is arranged around the outer periphery of the heat dissipation fins, and the cavity sealing ring is made of elastic material.
在本发明一示例中,所述腔体密封圈为弹性材质的复合材料。In an example of the present invention, the cavity sealing ring is a composite material of elastic material.
在本发明一示例中,所述密封腔体的底部设有流道密封垫,所述流道密封垫的内部结构与所述若干散热肋片的排布结构一致,所述流道密封垫位于所述散热肋片和所述壳体的底板之间。In an example of the present invention, a flow channel gasket is provided at the bottom of the sealed cavity, and the internal structure of the flow channel gasket is consistent with the arrangement structure of the plurality of heat dissipation fins. Between the heat dissipation fins and the bottom plate of the housing.
在本发明一示例中,所述冷却流道内设有扰流结构,所述扰流结构设置在所述散热基板和/或壳体上。In an example of the present invention, a spoiler structure is provided in the cooling channel, and the spoiler structure is arranged on the heat dissipation substrate and/or the housing.
在本发明一示例中,所述扰流结构包括圆柱形的扰流柱,所述扰流柱设置在所述冷却流道的拐角处。In an example of the present invention, the spoiler structure includes a cylindrical spoiler column, and the spoiler column is arranged at a corner of the cooling channel.
在本发明一示例中,所述第一主流道和所述第二主流道与所述壳体为一体式结构,至少部分所述第一主流道位于所述密封腔体的下方,至少部分所述第二主流道位于所述密封腔体下方,所述进液口和所述出液口位于所述壳体的不同侧壁,至少部分所述第一主流道和至少部分所述第二主流道平行设置。In an example of the present invention, the first main channel and the second main channel are integrated with the housing, at least part of the first main channel is located below the sealed cavity, and at least part of the The second main channel is located below the sealed cavity, the liquid inlet and the liquid outlet are located on different side walls of the housing, at least part of the first main channel and at least part of the second main channel Parallel setting.
在本发明一示例中,所述壳体内设有多个并列排布散热基板,每个所述的散热基板与所述壳体之间形成一个所述密封腔体,每个所述密封腔体均与所述第一主流道和所述第二主流道连通。In an example of the present invention, a plurality of heat dissipation substrates are arranged in parallel in the housing, and a sealed cavity is formed between each of the heat dissipation substrates and the housing, and each of the sealed cavities Both communicate with the first main channel and the second main channel.
本发明另一方面还提供一种电机控制器,包括散热系统和安装在所述散热系统内的电子元器件及单片机,所述散热系统包括壳体、第一主流道、第二主流道及散热基板,所述壳体上设有进液口和出液口,所述第一主流道与所述进液口连通;所述第二主流道与所述出液口连通;所述散热基板设置在所述壳体内,且其底部设有若干散热肋片;所述散热基板与所述壳体之间围成密封腔体,所述密封腔体连通所述第一主流道和所述第二主流道,所述若干散热肋片将所述密封腔体分隔成多条并列排布的冷却流道。Another aspect of the present invention also provides a motor controller, including a heat dissipation system and electronic components and single-chip microcomputers installed in the heat dissipation system. The heat dissipation system includes a housing, a first main flow channel, a second main flow channel and a cooling The substrate, the housing is provided with a liquid inlet and a liquid outlet, the first main flow channel is connected to the liquid inlet; the second main flow channel is connected to the liquid outlet; the heat dissipation substrate is set Inside the housing, a number of heat dissipation fins are provided at the bottom; a sealed cavity is formed between the heat dissipation substrate and the housing, and the sealed cavity communicates with the first main channel and the second As for the main channel, the plurality of cooling fins divide the sealed cavity into a plurality of cooling channels arranged in parallel.
在本发明一示例中,所述电子元器件包括设置在所述散热基板上的第一功率模块、第二功率模块和第三功率模块。In an example of the present invention, the electronic components include a first power module, a second power module and a third power module arranged on the heat dissipation substrate.
在本发明一示例中,所述散热基板包括分别对应于所述第一功率模块、第二功率模块、第三功率模块的第一散热基板、第二散热基板,第三散热基板,所述密封腔体包括分别对应于所述第一功率模块、第二功率模块、第三功率模块的第一密封腔体、第二密封腔体和第三密封腔体,所述第一密封腔体、第二密封腔体和第三密封腔体均与所述第一主流道和所述第二主流道连通。In an example of the present invention, the heat dissipation substrate includes a first heat dissipation substrate, a second heat dissipation substrate, and a third heat dissipation substrate respectively corresponding to the first power module, the second power module, and the third power module. The cavity includes a first sealed cavity, a second sealed cavity and a third sealed cavity respectively corresponding to the first power module, the second power module and the third power module, the first sealed cavity, the second sealed cavity Both the second sealed cavity and the third sealed cavity communicate with the first main channel and the second main channel.
本发明电机控制器的散热系统,在控制器壳体内设置与进液口连通的第一 主流道和与出液口连通的第二主流道,利用散热基板上设置的散热肋片将散热基板与壳体围成的密封腔体分隔成多个冷却流道,且冷却流道的一端与第一主流道连通,另一端与第二主流道连通,冷却介质经第一主流道进入各冷却流道,再经第二主流道排出。在冷却介质流经的过程中可将功率模块产生的热量带走,使其维持在正常的温度范围内,保持正常的工作状态。本发明采用直接水冷的方式对功率模块进行冷却,提高换热效率,避免散热死区。在密封腔体内设置腔体密封圈,通过挤压腔体密封圈使其安装于散热基板和壳体底板之间,用于密封散热腔体;在密封腔体内设置流道密封垫,可将相邻冷却流道隔离开,防止相邻冷却流道内的流体相互窜动,影响散热系统的散热效果;在冷却流道内设置扰流结构,通过扰流结构可强化局部液体的流动,增加固液对流传热的散热面积,增大了固体导热传热的横截面积,提高换热效率;该散热系统可设置多个并列排布的散热基板,每一散热基板与壳体形成一用于冷却的密封腔体,使得电机控制器内的多个功率模块分别冷却,冷却效果更好。本发明还提供一种包含上述散热系统的电机控制器,该电机控制器采用多个功率模块并列的排布方式,每一功率模块下对应一用于冷却的密封腔体,避免定转子串联冷却引起散热路径长,散热路径末端散热效果差,无法满足散热要求的问题。In the heat dissipation system of the motor controller of the present invention, a first main flow channel connected to the liquid inlet and a second main flow channel connected to the liquid outlet are arranged in the controller housing, and the heat dissipation substrate and the heat dissipation substrate are connected by the heat dissipation fins provided on the heat dissipation substrate. The sealed cavity surrounded by the shell is divided into multiple cooling channels, and one end of the cooling channel communicates with the first main channel, and the other end communicates with the second main channel, and the cooling medium enters each cooling channel through the first main channel , and then discharged through the second main channel. When the cooling medium flows through, the heat generated by the power module can be taken away to keep it within a normal temperature range and maintain a normal working state. The invention adopts direct water cooling to cool the power module, improves the heat exchange efficiency, and avoids heat dissipation dead zone. A cavity sealing ring is set in the sealing cavity, and it is installed between the heat dissipation substrate and the shell bottom plate by squeezing the cavity sealing ring, which is used to seal the heat dissipation cavity; a flow channel gasket is set in the sealing cavity, which can Adjacent cooling channels are isolated to prevent the fluids in adjacent cooling channels from moving each other and affect the heat dissipation effect of the heat dissipation system; a turbulence structure is set in the cooling channel, and the turbulence structure can strengthen the flow of local liquid and increase the solid-liquid interaction. The heat dissipation area for heat transfer increases the cross-sectional area of solid heat conduction and heat transfer, and improves heat exchange efficiency; the heat dissipation system can be provided with multiple heat dissipation substrates arranged side by side, and each heat dissipation substrate and the shell form a cooling plate. The cavity is sealed, so that multiple power modules in the motor controller are cooled separately, and the cooling effect is better. The present invention also provides a motor controller including the above-mentioned heat dissipation system. The motor controller adopts a parallel arrangement of multiple power modules, and each power module corresponds to a sealed cavity for cooling, so as to avoid serial cooling of the stator and rotor. The heat dissipation path is long, and the heat dissipation effect at the end of the heat dissipation path is poor, which cannot meet the heat dissipation requirements.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1为本发明电机控制器的散热系统于一实施例中的结构示意图;FIG. 1 is a schematic structural view of a heat dissipation system of a motor controller of the present invention in an embodiment;
图2为本发明电机控制器的散热系统于一实施例中剖视结构示意图;Fig. 2 is a schematic cross-sectional structure diagram of an embodiment of the heat dissipation system of the motor controller of the present invention;
图3为本发明电机控制器的散热系统于一实施例中的局部剖面图;Fig. 3 is a partial cross-sectional view of the heat dissipation system of the motor controller of the present invention in an embodiment;
图4为本发明电机控制器的散热系统于一实施例中冷却流道的截面结构示 意图;Fig. 4 is a schematic cross-sectional structure diagram of the cooling channel in an embodiment of the heat dissipation system of the motor controller of the present invention;
图5为本发明电机控制器的散热系统于一实施例中腔体密封圈的结构示意图;Fig. 5 is a structural schematic diagram of a cavity sealing ring in an embodiment of the heat dissipation system of the motor controller of the present invention;
图6为本发明电机控制器的散热系统于一实施例中流道密封垫的结构示意图;FIG. 6 is a schematic structural view of the flow channel gasket in an embodiment of the heat dissipation system of the motor controller of the present invention;
图7为本发明电机控制器的散热系统于一实施例中散热肋片与扰流结构的示意图。FIG. 7 is a schematic diagram of a heat dissipation fin and a flow turbulence structure in an embodiment of the heat dissipation system of the motor controller of the present invention.
图8为本发明电机控制器于一实施例中的结构示意图;Fig. 8 is a structural schematic diagram of an embodiment of the motor controller of the present invention;
图9为本发明电机控制器于一实施例中的剖视结构示意图。FIG. 9 is a schematic cross-sectional structure diagram of an embodiment of the motor controller of the present invention.
元件标号说明Component designation description
100、壳体;101、进液口;102、出液口;103、第一主流道;104、第二主流道;105、进液管;106、出液管;200、散热基板;201、第一散热肋片;202、第二散热肋片;203、冷却流道;204、扰流结构;210、第一散热基板;220、第二散热基板;230、第三散热基板;300、密封腔体;301、腔体密封圈;302、流道密封垫;310、分配腔;320、汇集腔;400、功率模块;401、第一功率模块;402、第二功率模块;403、第三功率模块。100. Shell; 101. Liquid inlet; 102. Liquid outlet; 103. First main flow channel; 104. Second main flow channel; 105. Liquid inlet pipe; 106. Liquid outlet pipe; 200. Heat dissipation substrate; 201. 202, the second heat dissipation fin; 203, the cooling channel; 204, the spoiler structure; 210, the first heat dissipation substrate; 220, the second heat dissipation substrate; 230, the third heat dissipation substrate; 300, sealing Cavity; 301, cavity sealing ring; 302, flow channel gasket; 310, distribution cavity; 320, collection cavity; 400, power module; 401, first power module; 402, second power module; 403, third power module.
具体实施方式Detailed ways
以下通过特定的具体实例说明本发明的实施方式,本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其它优点与功效。本发明还可以通过另外不同的具体实施方式加以实施或应用,本说明书中的各项细节也可以基于不同观点与应用,在没有背离本发明的精神下进行各种修饰或改变。需说明的是,在不冲突的情况下,以下实施例及实施例中的特征可以相互组合。还应当理解,本发明实施例中使用的术语是为了描述特定的具体实施方案,而不是为了限制本发明的保护范围。下列实施例中未注明具体条件的试验方法,通常按照常规条件,或者按照各制造商所建议的条件。Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other. It should also be understood that the terminology used in the embodiments of the present invention is for describing specific implementations, not for limiting the protection scope of the present invention. The test methods for which specific conditions are not indicated in the following examples are usually in accordance with conventional conditions, or in accordance with the conditions suggested by each manufacturer.
须知,本说明书中所引用的如“上”、“下”、“左”、“右”、“中间”及“一”等的 用语,亦仅为便于叙述的明了,而非用以限定本发明可实施的范围,其相对关系的改变或调整,在无实质变更技术内容下,当亦视为本发明可实施的范畴。It should be noted that terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description and are not used to limit this specification. The practicable scope of the invention and the change or adjustment of its relative relationship shall also be regarded as the practicable scope of the present invention without any substantial change in the technical content.
请参阅图1至图9,本发明的目的在于提供一种电机控制器及其散热系统,以改善电机控制器的散热问题。Please refer to FIG. 1 to FIG. 9 , the purpose of the present invention is to provide a motor controller and its heat dissipation system to improve the heat dissipation of the motor controller.
请参阅图1至图3,本发明提供一种电机控制器的散热系统包括壳体100、第一主流道103、第二主流道104及散热基板200,壳体100上设有进液口101和出液口102,第一主流道103设置于壳体100内部并与进液口101连通;第二主流道104设置于壳体100内部并与出液口102连通。散热基板200设置在壳体内,且其底部设有若干散热肋片,散热基板200与壳体100之间围成密封腔体300,密封腔体300连通第一主流道103和第二主流道104,若干散热肋片将密封腔体300分隔成多条并列排布的冷却流道203。Please refer to FIG. 1 to FIG. 3 , the present invention provides a heat dissipation system for a motor controller including a housing 100 , a first main flow channel 103 , a second main flow channel 104 and a heat dissipation substrate 200 , and the housing 100 is provided with a liquid inlet 101 and the liquid outlet 102 , the first main channel 103 is arranged inside the casing 100 and communicates with the liquid inlet 101 ; the second main channel 104 is arranged inside the casing 100 and communicates with the liquid outlet 102 . The heat dissipation substrate 200 is arranged in the casing, and a plurality of heat dissipation fins are provided at the bottom thereof, and a sealed cavity 300 is formed between the heat dissipation substrate 200 and the casing 100, and the sealed cavity 300 communicates with the first main flow channel 103 and the second main flow channel 104 , a plurality of cooling fins divide the sealed cavity 300 into a plurality of cooling channels 203 arranged in parallel.
请参阅图3和图4,在一实施例中,密封腔体300还包括分配腔310和汇集腔320,分配腔310与第一主流道103连通,汇集腔320与第二主流道104连通,冷却流道203处于分配腔310和汇集腔320之间,其一端与分配腔310连通,另一端与汇集腔320连通。冷却介质,例如冷却水从进液口101进入第一主流道103,经第一主流道103进入分配腔310,再由分配腔310分流进入各冷却流道203,于冷却流道203的末端进入汇集腔320汇集,再由汇集腔320进入第二主流道104,经出液口102排出电机控制器,经电机控制器外部的中冷器冷却后再次进入电机控制器进行冷却循环。在冷却介质循环的过程中,可将电机控制器内与散热系统接触的,尤其是与散热基板接触的电子元器件产生的热量带走,使其始终保持在正常温度范围内,确保电机控制器的正常工作。Please refer to FIG. 3 and FIG. 4 , in one embodiment, the sealed chamber 300 further includes a distribution chamber 310 and a collection chamber 320 , the distribution chamber 310 communicates with the first main channel 103 , and the collection chamber 320 communicates with the second main channel 104 , The cooling channel 203 is located between the distribution cavity 310 and the collection cavity 320 , one end of which communicates with the distribution cavity 310 , and the other end communicates with the collection cavity 320 . Cooling medium, such as cooling water, enters the first main flow channel 103 from the liquid inlet 101, enters the distribution cavity 310 through the first main flow channel 103, and then divides into each cooling flow channel 203 by the distribution cavity 310, and enters at the end of the cooling flow channel 203 The pooling cavity 320 collects, and then enters the second main channel 104 from the pooling cavity 320, and discharges the motor controller through the liquid outlet 102, and enters the motor controller again after being cooled by the intercooler outside the motor controller for cooling cycle. During the circulation of the cooling medium, the heat generated by the electronic components in the motor controller that is in contact with the heat dissipation system, especially the heat dissipation substrate, can be taken away, so that it can always be kept within the normal temperature range, ensuring that the motor controller normal work.
请参阅图1和图2,在一实施例中,壳体100为周边高中间向下凹的壳状结构,其内部设有安装电子元器件的支撑筋,进液口101和出液口102分设在壳体100的两侧,进液口101上连接有进液管105,出液口102上连接有出液管106。第一主流道103的一端与进液口101连通,另一端向出液口102的方向延伸,且第一主流道103向出液口102方向延伸的一端是封闭的;第二主流 道104的一端与出液口102连通,另一端向进液口101方向延伸,且第二主流道104向进液口101方向延伸的一端为封闭的。第一主流道103至少部分位于所述密封腔体300的下方,第二主流道104至少部分位于密封腔体300的下方,第一主流道103位于密封腔体300下方的部分与第二主流道104位于密封腔体300下方的部分相互平行。Please refer to Fig. 1 and Fig. 2, in one embodiment, the casing 100 is a shell-like structure with a high periphery and a concave downward in the middle, inside which are provided support ribs for installing electronic components, a liquid inlet 101 and a liquid outlet 102 The liquid inlet 101 is connected with a liquid inlet pipe 105 , and the liquid outlet 102 is connected with a liquid outlet pipe 106 . One end of the first main flow channel 103 communicates with the liquid inlet 101, and the other end extends toward the direction of the liquid outlet 102, and the end of the first main flow channel 103 extending toward the liquid outlet 102 direction is closed; the second main flow channel 104 One end communicates with the liquid outlet 102 , the other end extends toward the liquid inlet 101 , and one end of the second main channel 104 extending toward the liquid inlet 101 is closed. The first main channel 103 is at least partly located below the sealed cavity 300, the second main channel 104 is at least partly located below the sealed cavity 300, and the part of the first main channel 103 located below the sealed cavity 300 is connected to the second main channel. The parts of 104 located below the sealed cavity 300 are parallel to each other.
在本实施例中,第一主流道103位于密封腔体300下方的部分设有一向上延伸并与分配腔310连通的第一连接通道,第一连接通道沿第一主流道103的流道方向的长度对应于分配腔310在该方向上的尺寸,第二主流道103位于密封腔体300下方的部分设有一向上延伸并与汇集腔320连通的第二连接通道,第二连接通道沿第二主流道104的流道方向的长度对应于汇集腔320在该方向的尺寸。由进液口101进入第一主流道103的冷却液经第一连接通道进入分配腔310,再经分配腔310分流至各冷却流道203,冷却液流经各冷却流道203在汇集腔320汇集,经第二连接通道进入第二主流道104,由出液口102排出。较佳的,第一主流道103和第二主流道104与壳体100为一体式结构,例如,第一主流道103和第二主流道104与壳体100一体铸造成型。In this embodiment, the part of the first main channel 103 located below the sealed cavity 300 is provided with a first connecting passage extending upward and communicating with the distribution chamber 310 , the first connecting channel is along the flow direction of the first main channel 103 The length corresponds to the size of the distribution cavity 310 in this direction, and the part of the second main channel 103 located below the sealed cavity 300 is provided with a second connecting channel extending upward and communicating with the collecting cavity 320, and the second connecting channel is along the second main channel. The length of the channel 104 in the channel direction corresponds to the size of the collecting chamber 320 in this direction. The cooling liquid that enters the first main flow channel 103 from the liquid inlet 101 enters the distribution chamber 310 through the first connecting channel, and then divides into each cooling flow channel 203 through the distribution cavity 310, and the cooling liquid flows through each cooling flow channel 203 in the collection chamber 320 Collected, enter the second main channel 104 through the second connecting channel, and be discharged from the liquid outlet 102. Preferably, the first main channel 103 and the second main channel 104 are integrated with the housing 100 , for example, the first main channel 103 and the second main channel 104 are cast integrally with the housing 100 .
请参阅图2至图4,壳体100的支撑筋上设有向下凹陷的安装腔,该安装腔的底部两端分别与第一主流道103和第二主流道104连通,散热基板200压装在安装腔上并与其形成密封腔体300。例如散热基板200与壳体100螺纹连接,即在散热基板200和壳体100对应设置螺纹孔,利用螺钉依次穿过散热基板200和壳体100上的螺纹孔,将散热基板200固定在安装腔上方。Please refer to Fig. 2 to Fig. 4, the supporting rib of the housing 100 is provided with a downwardly recessed installation cavity, the two ends of the bottom of the installation cavity communicate with the first main flow channel 103 and the second main flow channel 104 respectively, and the heat dissipation substrate 200 presses Installed on the installation cavity and form a sealed cavity 300 therewith. For example, the heat dissipation substrate 200 is screwed to the housing 100, that is, the heat dissipation substrate 200 and the housing 100 are provided with threaded holes correspondingly, and the screws are used to pass through the threaded holes on the heat dissipation substrate 200 and the housing 100 in turn to fix the heat dissipation substrate 200 in the installation cavity. above.
请参阅图3和图7,在一实施例中,若干散热肋片设置在散热基板200的下表面,散热肋片包括多个第一散热肋片201和第二散热肋片202,第一散热肋片201凸出于散热基板200的下表面,且第一散热肋片201自第一主流道103向第二主流道104的方向延伸,每相邻的两条第一散热肋片201之间形成一个冷却流道203。第二散热肋片202凸出于第一散热肋片201的侧壁设置,第二散热肋片202的一端与第一散热肋片201相连,另一端向冷却流道203延伸, 较佳的,第二散热肋片202垂直于第一散热肋片201设置,且相邻的第一散热肋片201上的第二散热肋片202交错设置。这样设置使得冷却流道203呈S型结构,可增加散热面积,提高散热效率。Please refer to Fig. 3 and Fig. 7, in one embodiment, several cooling fins are arranged on the lower surface of the heat dissipation substrate 200, the cooling fins include a plurality of first cooling fins 201 and second cooling fins 202, the first cooling ribs The fins 201 protrude from the lower surface of the heat dissipation substrate 200, and the first heat dissipation fins 201 extend from the first main flow channel 103 to the second main flow channel 104, and between every two adjacent first heat dissipation fins 201 A cooling channel 203 is formed. The second heat dissipation fins 202 protrude from the side wall of the first heat dissipation fins 201. One end of the second heat dissipation fins 202 is connected to the first heat dissipation fins 201, and the other end extends toward the cooling channel 203. Preferably, The second heat dissipation fins 202 are arranged vertically to the first heat dissipation fins 201 , and the second heat dissipation fins 202 on adjacent first heat dissipation fins 201 are arranged alternately. Such setting makes the cooling channel 203 have an S-shaped structure, which can increase the heat dissipation area and improve the heat dissipation efficiency.
请参阅图4和图5,在一实施例中,密封腔体300内设有腔体密封圈301,腔体密封圈301的形状与密封腔体300的形状相匹配。安装时,腔体密封圈301紧贴密封腔体300的侧壁安装,其上表面与散热基板200相接,下表面与壳体100底壁相接,依靠腔体密封圈301上表面与下表面的挤压对密封腔体300进行密封。较佳的,腔体密封圈301采用柔性材质的复合材料,例如丁晴橡胶、氟橡胶等。Please refer to FIG. 4 and FIG. 5 , in one embodiment, a cavity sealing ring 301 is provided in the sealing cavity 300 , and the shape of the cavity sealing ring 301 matches the shape of the sealing cavity 300 . During installation, the cavity sealing ring 301 is installed close to the side wall of the sealing cavity 300, its upper surface is connected with the heat dissipation substrate 200, and its lower surface is connected with the bottom wall of the housing 100, relying on the upper surface of the cavity sealing ring 301 and the lower surface The compression of the surface seals the sealed cavity 300 . Preferably, the cavity sealing ring 301 is made of flexible composite material, such as nitrile rubber, fluororubber and the like.
请参阅图3、图4和图6,在一实施例中,密封腔体300内还可设置流道密封垫302,流道密封垫302内部结构对应于散热基板200上散热肋片的分布。安装时,先将流道密封垫302置于壳体100的安装腔内,将散热基板200合上并压紧。流道密封垫302将相邻冷却流道203隔离开,防止相邻冷却流道203内的冷却介质相互窜动,影响整体的散热效果。Please refer to FIG. 3 , FIG. 4 and FIG. 6 , in an embodiment, a flow channel gasket 302 may also be provided in the sealed cavity 300 , and the internal structure of the flow channel gasket 302 corresponds to the distribution of heat dissipation fins on the heat dissipation substrate 200 . During installation, the flow channel sealing gasket 302 is placed in the installation cavity of the housing 100 first, and the heat dissipation substrate 200 is closed and pressed tightly. The flow channel sealing gasket 302 isolates the adjacent cooling flow channels 203 to prevent the cooling media in the adjacent cooling flow channels 203 from moving with each other and affect the overall heat dissipation effect.
请参阅图7,在一实施例中,冷却流道203内还设有扰流结构204,其可以设置在散热基板200上,也可以设置在壳体上,扰流结构204的材质与散热基板200的材质相同。在各冷却流道203内设置扰流结构204,可提高冷却液的扰动,使冷却液边界层破坏,形成二次流动,使紊流程度加剧,而产生更多的湍流,增大散热面积;在保持冷却液流速不变的情况下影响流动形态,使冷却液与冷却流道203充分接触,使流体与冷却流道203之间发生对流换热,增强了换热能力。较佳的,扰流结构204包括间隔设置的圆柱形的扰流柱,扰流柱的尺寸可根据冷却流道203的尺寸设定。优选的,扰流柱设置于冷却流道203的拐角处,由于拐角处存在死区,在此处设置扰流柱可强化此处液体的流动,防止拐角处散热效果不佳。当然,在其他实施例中,扰流柱也可选取水滴形或其他适配的结构。Please refer to FIG. 7. In one embodiment, a spoiler structure 204 is also provided in the cooling channel 203, which can be arranged on the heat dissipation substrate 200 or on the housing. The material of the spoiler structure 204 is the same as that of the heat dissipation substrate. 200 of the same material. The turbulence structure 204 is arranged in each cooling channel 203, which can increase the turbulence of the cooling liquid, destroy the boundary layer of the cooling liquid, form a secondary flow, aggravate the degree of turbulent flow, generate more turbulent flow, and increase the heat dissipation area; The flow form is influenced while the flow velocity of the cooling liquid is kept constant, so that the cooling liquid is fully in contact with the cooling flow channel 203 , so that convective heat exchange occurs between the fluid and the cooling flow channel 203 , thereby enhancing the heat exchange capacity. Preferably, the spoiler structure 204 includes cylindrical spoiler posts arranged at intervals, and the size of the spoiler posts can be set according to the size of the cooling channel 203 . Preferably, the spoiler column is arranged at the corner of the cooling channel 203 , since there is a dead zone at the corner, setting the spoiler column here can strengthen the flow of the liquid here, and prevent poor heat dissipation effect at the corner. Certainly, in other embodiments, the spoiler column may also be in a drop shape or other suitable structures.
请参阅图2至图4,在一实施例中,壳体100内并列设置多个安装腔,每 个安装腔内容置一散热基板200,每个散热基板200与对应的安装腔形成一密封腔体300,散热基板200底部的散热肋片采用上文中所述的结构分布,进而将每个密封腔体300分隔成多个并列分布的冷却流道。每个密封腔体300内的冷却流道203的个数可根据该区域的排热量进行设置。腔体密封腔301、流道密封垫302及扰流结构204根据电机控制器内功率模块的具体情况进行选择安装。Please refer to FIG. 2 to FIG. 4. In one embodiment, a plurality of installation cavities are arranged side by side in the housing 100, and a heat dissipation substrate 200 is placed in each installation cavity, and each heat dissipation substrate 200 forms a sealed cavity with the corresponding installation cavity. Body 300 , the heat dissipation fins at the bottom of heat dissipation substrate 200 are distributed in the structure described above, and each sealed cavity 300 is divided into a plurality of cooling channels distributed in parallel. The number of cooling passages 203 in each sealed cavity 300 can be set according to the heat dissipation in this area. The cavity sealing cavity 301, the flow channel sealing gasket 302 and the spoiler structure 204 are selected and installed according to the specific conditions of the power module in the motor controller.
请参阅图1、图3和图8,本发明还提供一种电机控制器,该电机控制器包括散热系统和安装在散热系统上的多个电子元器件及单片机。其中散热系统采用本发明的散热系统。电子元器件包括多个功率模块400,例如IGBT功率模块,功率模块400安装在散热基板200上,利用散热基板200与壳体100之间的冷却流道203内流动的冷却介质将功率模块400产生的热量带走。Referring to Fig. 1, Fig. 3 and Fig. 8, the present invention also provides a motor controller, which includes a heat dissipation system, a plurality of electronic components and single-chip microcomputers installed on the heat dissipation system. Wherein the cooling system adopts the cooling system of the present invention. The electronic components include a plurality of power modules 400, such as IGBT power modules. The power modules 400 are installed on the heat dissipation substrate 200, and the power modules 400 are generated by using the cooling medium flowing in the cooling channel 203 between the heat dissipation substrate 200 and the housing 100. heat away.
请参阅1和图9,在一实施例中,功率模块400采用多模块并联的安装方式,每个模块下方对应一个散热基板200与壳体100围成的密封腔体300作为散热区域。例如,功率模块400包括依次设置的第一功率模块401、第二功率模块402及第三功率模块403,则散热系统包括分别用于安装第一功率模块401、第二功率模块402和第三功率模块403的第一散热基板210、第二散热基板220和第三散热基板230,第一散热基板210与壳体100围成第一密封腔体,第二散热基板220与壳体100围成第二密封腔体,第三散热基板230与壳体100围成第三密封腔体,第一密封腔体、第二密封腔体和第三密封腔体内的冷却流道203的设置及腔体密封圈301、流道密封垫302的安装可根据各自对应的功率模块的产热量选择。例如,第二功率模块402处于第一功率模块401和第三功率模块403之间,受两侧功率模块的影响,第二功率模块402的产热量较两侧的功率模块的产热量高,因此,第二密封腔体内可通过腔室密封圈301和流道密封垫302对其进行双重密封,以提高该区域的散热效果,或通过增加第二密封腔室内的冷却流道203以增加冷却介质的流量,提高其冷却效果。当然,第一密封腔体和第三密封腔体可根据具体情况进行设置。Please refer to FIG. 1 and FIG. 9 , in an embodiment, the power module 400 is installed in parallel with multiple modules, and each module corresponds to a sealed cavity 300 enclosed by the heat dissipation substrate 200 and the housing 100 as a heat dissipation area. For example, the power module 400 includes a first power module 401, a second power module 402, and a third power module 403 arranged in sequence, and the heat dissipation system includes The first heat dissipation substrate 210, the second heat dissipation substrate 220, and the third heat dissipation substrate 230 of the module 403, the first heat dissipation substrate 210 and the housing 100 form a first sealed cavity, and the second heat dissipation substrate 220 and the housing 100 form a first sealed cavity. Two sealed cavities, the third heat dissipation substrate 230 and the housing 100 form a third sealed cavity, the setting of the cooling channel 203 in the first sealed cavity, the second sealed cavity and the third sealed cavity and the sealing of the cavities The installation of the ring 301 and the flow channel gasket 302 can be selected according to the heat output of the respective corresponding power modules. For example, the second power module 402 is located between the first power module 401 and the third power module 403, affected by the power modules on both sides, the heat production of the second power module 402 is higher than that of the power modules on both sides, so , the second sealed cavity can be double-sealed by the cavity sealing ring 301 and the flow channel gasket 302 to improve the heat dissipation effect in this area, or increase the cooling medium by increasing the cooling flow channel 203 in the second sealed cavity The flow rate increases its cooling effect. Of course, the first sealed cavity and the third sealed cavity can be set according to specific conditions.
本发明中对于电机控制器的其他未详述的结构皆可通过本领域现有结构实现,在此不再详述。Other unspecified structures of the motor controller in the present invention can be realized by existing structures in the art, and will not be described in detail here.
本发明提供一种电机控制器的散热系统,通过在散热基板上设置散热肋片,将散热基板与壳体之间的密封腔体分隔成多条并列的冷却流道,且该冷却流道的两端分别与第一主流道和第二主流道连通,经进液口进入的冷却介质通过第一主流道进入各冷却流道,经冷却流道汇集到第二主流道,进而排出体外,在此过程中,冷却介质可将电机控制器内各电子元器件产生的热量带走,使其保持在正常的温度范围内。采用本发明的散热系统的电机控制器,将功率模块以并联的方式进行冷却,来自主流道的冷却介质分流至各功率模块所在的区域,对个功率模块分别冷却,避免定转子串联冷却引起散热路径长、散热路径末端散热效果差的问题。所以,本发明有效克服了现有技术中的一些实际问题从而有很高的利用价值和使用意义。The invention provides a heat dissipation system for a motor controller. By setting heat dissipation ribs on the heat dissipation substrate, the sealed cavity between the heat dissipation substrate and the housing is divided into a plurality of parallel cooling channels, and the cooling channels The two ends are respectively connected with the first main channel and the second main channel, and the cooling medium entering through the liquid inlet enters each cooling channel through the first main channel, collects into the second main channel through the cooling channel, and then is discharged from the body. During this process, the cooling medium can take away the heat generated by the electronic components in the motor controller, keeping it within a normal temperature range. Using the motor controller of the heat dissipation system of the present invention, the power modules are cooled in parallel, the cooling medium from the main channel is divided into the area where each power module is located, and each power module is cooled separately to avoid heat dissipation caused by serial cooling of the stator and rotor The problem of long path and poor heat dissipation effect at the end of the heat dissipation path. Therefore, the present invention effectively overcomes some practical problems in the prior art and thus has high utilization value and use significance.
上述实施例仅例示性说明本发明的原理及其功效,而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本发明的权利要求所涵盖。The above-mentioned embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical ideas disclosed in the present invention should still be covered by the claims of the present invention.

Claims (12)

  1. 一种电机控制器的散热系统,其特征在于,包括:A cooling system for a motor controller, characterized in that it comprises:
    壳体,其上设有进液口和出液口;The housing is provided with a liquid inlet and a liquid outlet;
    第一主流道,与所述进液口连通;The first main channel communicates with the liquid inlet;
    第二主流道,与所述出液口连通;The second main channel communicates with the liquid outlet;
    散热基板,设置在所述壳体内,且其底部设有若干散热肋片;A heat dissipation substrate is arranged in the housing, and a plurality of heat dissipation fins are provided at the bottom thereof;
    其中,所述散热基板与所述壳体之间围成密封腔体,所述密封腔体连通所述第一主流道和所述第二主流道,所述若干散热肋片将所述密封腔体分隔成多条并列排布的冷却流道。Wherein, a sealed cavity is formed between the heat dissipation substrate and the housing, the sealed cavity communicates with the first main flow channel and the second main flow channel, and the plurality of heat dissipation fins connect the sealed cavity The body is divided into multiple cooling channels arranged in parallel.
  2. 根据权利要求1所述的散热系统,其特征在于,所述密封腔体包括分配腔和汇集腔,所述分配腔与所述第一主流道连通,所述汇集腔与所述第二主流道连通,所述冷却流道的一端与所述分配腔连通,另一端与所述汇集腔连通。The heat dissipation system according to claim 1, wherein the sealed cavity comprises a distribution cavity and a collection cavity, the distribution cavity communicates with the first main flow channel, and the collection cavity communicates with the second main flow channel One end of the cooling channel communicates with the distribution cavity, and the other end communicates with the collection cavity.
  3. 根据权利要求1所述的散热系统,其特征在于,所述散热肋片包括第一散热肋片和第二散热肋片,所述第一散热肋片凸出于所述散热基板的下表面,并且所述第一散热肋片自所述第一主流道向所述第二主流道方向延伸,所述第二散热肋片凸出于所述第一散热肋片的侧壁设置,相邻的所述第一散热肋片上的第二散热肋片交错设置。The heat dissipation system according to claim 1, wherein the heat dissipation fins comprise first heat dissipation fins and second heat dissipation fins, the first heat dissipation fins protrude from the lower surface of the heat dissipation substrate, And the first heat dissipation fins extend from the first main flow channel to the second main flow channel, the second heat dissipation fins protrude from the side wall of the first heat dissipation fins, and the adjacent The second heat dissipation fins on the first heat dissipation fins are arranged alternately.
  4. 根据权利要求1所述的散热系统,其特征在于,所述密封腔体内设有腔体密封圈,所述腔体密封圈的一侧与所述散热基板相接,另一侧与所述壳体的底板相接;所述腔体密封圈的形状与所述密封腔体的形状相配,所述腔体密封圈围绕所述散热肋片的外周设置,所述腔体密封圈为弹性材质。The heat dissipation system according to claim 1, wherein a cavity sealing ring is provided in the sealed cavity, one side of the cavity sealing ring is in contact with the heat dissipation substrate, and the other side is in contact with the housing. The bottom plate of the body is connected; the shape of the cavity sealing ring matches the shape of the sealing cavity, the cavity sealing ring is arranged around the outer periphery of the heat dissipation fins, and the cavity sealing ring is made of elastic material.
  5. 根据权利要求1所述的散热系统,其特征在于,所述密封腔体的底部设有流道密封垫,所述流道密封垫的内部结构与所述若干散热肋片的排布结构一 致,所述流道密封垫位于所述散热肋片和所述壳体的底板之间。The heat dissipation system according to claim 1, wherein the bottom of the sealed cavity is provided with a flow channel gasket, the internal structure of the flow channel gasket is consistent with the arrangement structure of the plurality of heat dissipation fins, The flow channel sealing gasket is located between the heat dissipation fins and the bottom plate of the housing.
  6. 根据权利要求1所述的散热系统,其特征在于,所述冷却流道内设有扰流结构,所述扰流结构设置在所述散热基板和/或壳体上。The heat dissipation system according to claim 1, wherein a spoiler structure is arranged in the cooling channel, and the spoiler structure is arranged on the heat dissipation substrate and/or the casing.
  7. 根据权利要求6所述的散热系统,其特征在于,所述扰流结构包括圆柱形的扰流柱,所述扰流柱设置在所述冷却流道的拐角处。The heat dissipation system according to claim 6, wherein the spoiler structure comprises a cylindrical spoiler column, and the spoiler column is arranged at a corner of the cooling channel.
  8. 根据权利要求1所述的散热系统,其特征在于,所述第一主流道和所述第二主流道与所述壳体为一体式结构,至少部分所述第一主流道位于所述密封腔体的下方,至少部分所述第二主流道位于所述密封腔体下方,所述进液口和所述出液口位于所述壳体的不同侧壁,至少部分所述第一主流道和至少部分所述第二主流道平行设置。The heat dissipation system according to claim 1, wherein the first main channel and the second main channel are integrated with the housing, and at least part of the first main channel is located in the sealed cavity body, at least part of the second main channel is located under the sealed cavity, the liquid inlet and the liquid outlet are located on different side walls of the housing, at least part of the first main channel and At least part of the second main channels are arranged in parallel.
  9. 根据权利要求1所述的散热系统,其特征在于,所述壳体内设有多个并列排布散热基板,每个所述的散热基板与所述壳体之间形成一个所述密封腔体,每个所述密封腔体均与所述第一主流道和所述第二主流道连通。The heat dissipation system according to claim 1, wherein the casing is provided with a plurality of heat dissipation substrates arranged side by side, and a sealed cavity is formed between each of the heat dissipation substrates and the casing, Each of the sealed cavities communicates with the first main channel and the second main channel.
  10. 一种电机控制器,其特征在于,包括:散热系统和安装在所述散热系统上的电子元器件及单片机,所述散热系统包括,A motor controller, characterized in that it includes: a heat dissipation system and electronic components and single-chip microcomputers installed on the heat dissipation system, and the heat dissipation system includes,
    壳体,其上设有进液口和出液口;The housing is provided with a liquid inlet and a liquid outlet;
    第一主流道,与所述进液口连通;The first main channel communicates with the liquid inlet;
    第二主流道,与所述出液口连通;The second main channel communicates with the liquid outlet;
    散热基板,设置在所述壳体内,且其底部设有若干散热肋片;A heat dissipation substrate is arranged in the housing, and a plurality of heat dissipation fins are provided at the bottom thereof;
    其中,所述散热基板与所述壳体之间围成密封腔体,所述密封腔体连通所述第一主流道和所述第二主流道,所述若干散热肋片将所述密封腔体分隔成多条并列排布的冷却流道。Wherein, a sealed cavity is formed between the heat dissipation substrate and the housing, the sealed cavity communicates with the first main flow channel and the second main flow channel, and the plurality of heat dissipation fins connect the sealed cavity The body is divided into multiple cooling channels arranged in parallel.
  11. 根据权利要求10所述的电机控制器,其特征在于,所述电子元器件包括安装在所述散热基板上的第一功率模块、第二功率模块和第三功率模块。The motor controller according to claim 10, wherein the electronic components include a first power module, a second power module and a third power module mounted on the heat dissipation substrate.
  12. 根据权利要求11所述的电机控制器,其特征在于,所述散热基板包括分别对应于所述第一功率模块、第二功率模块、第三功率模块的第一散热基板、第二散热基板和第三散热基板,所述密封腔体包括分别对应于所述第一功率模块、第二功率模块、第三功率模块的第一密封腔体、第二密封腔体和第三密封腔体,所述第一密封腔体、第二密封腔体和第三密封腔体均与所述第一主流道和所述第二主流道连通。The motor controller according to claim 11, wherein the heat dissipation substrate comprises a first heat dissipation substrate, a second heat dissipation substrate and a heat dissipation substrate respectively corresponding to the first power module, the second power module and the third power module. The third heat dissipation substrate, the sealed cavity includes a first sealed cavity, a second sealed cavity and a third sealed cavity respectively corresponding to the first power module, the second power module, and the third power module, so The first sealed cavity, the second sealed cavity and the third sealed cavity are all in communication with the first main channel and the second main channel.
PCT/CN2021/141142 2021-12-24 2021-12-24 Electric motor controller and heat dissipation system thereof WO2023115526A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102762075A (en) * 2011-04-25 2012-10-31 北汽福田汽车股份有限公司 Balanced heat dissipation liquid cooling device
CN108573938A (en) * 2017-03-07 2018-09-25 深圳市迈安热控科技有限公司 Power device radiator and power device radiating module
US20210195807A1 (en) * 2019-12-23 2021-06-24 Aptiv Technologies Limited Cooling System for Cooling an Electronic Component, Method for Assembling a Cooling System, Electronic Control Unit and Vehicle
CN113710062A (en) * 2021-08-24 2021-11-26 电子科技大学 Multi-structure combined type special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102762075A (en) * 2011-04-25 2012-10-31 北汽福田汽车股份有限公司 Balanced heat dissipation liquid cooling device
CN108573938A (en) * 2017-03-07 2018-09-25 深圳市迈安热控科技有限公司 Power device radiator and power device radiating module
US20210195807A1 (en) * 2019-12-23 2021-06-24 Aptiv Technologies Limited Cooling System for Cooling an Electronic Component, Method for Assembling a Cooling System, Electronic Control Unit and Vehicle
CN113710062A (en) * 2021-08-24 2021-11-26 电子科技大学 Multi-structure combined type special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device

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