CN110225690B - Compact motor controller with good heat dissipation - Google Patents
Compact motor controller with good heat dissipation Download PDFInfo
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- CN110225690B CN110225690B CN201910347860.5A CN201910347860A CN110225690B CN 110225690 B CN110225690 B CN 110225690B CN 201910347860 A CN201910347860 A CN 201910347860A CN 110225690 B CN110225690 B CN 110225690B
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- motor controller
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Abstract
The invention discloses a compact motor controller with good heat dissipation, and relates to the technical field of motor controllers. The invention comprises an upper shell, a lower shell, a control mainboard and a heat dissipation assembly, wherein the inner walls of the upper shell and the lower shell are respectively provided with a vacuum cavity, a micro exhaust fan is fixed on the inner wall of the upper shell, the heat dissipation assembly comprises a heat dissipation shell and a cover body, and one surface of the cover body is fixedly connected with one surface of the heat dissipation shell. According to the invention, water can be refrigerated through the semiconductor refrigeration sheet, water circulation can be carried out through the micro water pump, the flow guide cavity and the snake-shaped channel, water cooling treatment can be carried out through the silica gel layer, the cover body, the first heat conduction plate and the second heat conduction plate, water circulation can be formed through the micro water pump, the water inlet pipe, the heat dissipation pipe and the water outlet pipe, air circulation can be formed through the micro exhaust fan, the heat dissipation pipe, the air outlet cavity and the air return cavity, air cooling treatment can be carried out, and the problem of poor heat dissipation effect of the existing motor controller is solved.
Description
Technical Field
The invention belongs to the technical field of motor controllers, and particularly relates to a compact motor controller with good heat dissipation.
Background
The motor controller is an integrated circuit which controls the motor to work according to the set direction, speed, angle and response time through active work, is optimally composed of a high-power intelligent module, an excellent cooling and heat dissipation system, a reliable power supply control system and a closed-loop sampling feedback control system, and has the characteristics of high response speed, stable control and operation and no maintenance.
Traditional machine controller all uses complete casing to seal in order to guarantee waterproof performance, and the not good condition of radiating effect can appear, can't use external forced air cooling to dispel the heat simultaneously, and uses the liquid cooling subassembly then can cause the too big condition of occupation space, the installation of compact machine controller of not being convenient for.
Disclosure of Invention
The invention aims to provide a compact motor controller with good heat dissipation, which can refrigerate water through a semiconductor refrigerating sheet, can circulate water through a micro water pump, a flow guide cavity and a serpentine channel, can perform water cooling through a silica gel layer, a cover body, a first heat conducting plate and a second heat conducting plate, can form water circulation through the micro water pump, a water inlet pipe, a heat radiating pipe and a water outlet pipe, can form air circulation through a micro exhaust fan, the heat radiating pipe, an air outlet cavity and an air return cavity, can perform air cooling treatment, and solves the problem of poor heat dissipation effect of the existing motor controller.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a compact motor controller with good heat dissipation, which comprises an upper shell, a lower shell, a control mainboard and a heat dissipation assembly;
the inner walls of the upper shell and the lower shell are both provided with vacuum cavities, and a micro exhaust fan is fixed on one inner wall of the upper shell;
the heat dissipation assembly comprises a heat dissipation shell and a cover body, one surface of the cover body is fixedly connected with one surface of the heat dissipation shell, an opening is formed in one side surface of the heat dissipation shell, a blocking edge is fixed on the opposite inner wall of the opening, a first heat conduction plate is fixed on one surface of the blocking edge, a plurality of second heat conduction plates are fixed on one surface of the first heat conduction plate and one inner wall of the heat dissipation shell, the second heat conduction plates are distributed at intervals, the second heat conduction plates form a serpentine channel, the blocking edge and the first inner wall of the heat dissipation shell form a group of flow guide cavity, and a plurality of semiconductor refrigeration sheets are fixed on the first inner wall of the flow guide cavity;
a miniature water pump is fixed on the inner wall of the first heat dissipation shell and positioned between the group of blocking edges, and a water inlet and a water outlet of the miniature water pump are respectively communicated with the two diversion cavities through pipelines;
a plurality of telescopic sleeves are fixed on the bottom surface of the heat dissipation shell, a base plate is fixed at one end of each telescopic sleeve, a plurality of springs are fixed between one surface of each base plate and the bottom surface of the heat dissipation shell, and the springs are arranged on the outer surfaces of the telescopic sleeves in a surrounding manner;
a silica gel layer is fixed on one surface of the cover body, a water inlet pipe is fixedly communicated with a pipeline on the water outlet of the micro water pump, a water outlet pipe penetrates through and is fixed on one surface of the cover body, a radiating pipe is fixed between the water inlet pipe and the water outlet pipe, and the radiating pipe is opposite to the micro exhaust fan in position.
Further, go up a casing inner wall and be fixed with solid fixed ring, a plurality of screw holes have been seted up on a control mainboard surface and solid fixed ring surface, the control mainboard passes through screw hole and screw and a solid fixed ring fixed surface connection.
Furthermore, a gap is formed between the fixing ring and the upper shell, and the radiating pipe and the miniature exhaust fan are in clearance fit with the gap.
Furthermore, a set of sliding grooves are formed in the inner wall, opposite to the inner wall, of the lower shell, a set of sliding blocks are fixed on the outer wall, opposite to the outer wall, of the heat dissipation shell, and the heat dissipation shell is in sliding fit with the lower shell through the sliding blocks and the sliding grooves.
Furthermore, flange lugs are fixed on the peripheral side face of the upper shell and the peripheral side face of the lower shell, and the upper shell is fixedly connected with the lower shell through the flange lugs and screws.
Furthermore, a group of air deflectors are fixed on the inner wall of the upper shell, the upper shell is divided into an air outlet cavity and an air return cavity by the two air deflectors, and the miniature exhaust fan is located in the air outlet cavity.
Furthermore, a sealing groove is formed in the surface of the upper shell, a sealing ring is formed in the surface of the lower shell, and the sealing groove is in clearance fit with the sealing ring and is opposite to the sealing ring in position.
Further, lid, first heat-conducting plate, second heat-conducting plate, inlet tube, outlet pipe and cooling tube are made by the copper material, first heat-conducting plate and second heat-conducting plate top surface all contact with the lid bottom surface.
Furthermore, a groove channel is formed in one surface of the silica gel layer, and the groove channel is in clearance fit with the water inlet pipe.
The invention has the following beneficial effects:
1. according to the invention, the water in the diversion cavity can be refrigerated through the semiconductor refrigeration sheet, water circulation can be carried out through the micro water pump, the diversion cavity and the serpentine channel, heat on the control main board can be discharged into cold water in the heat dissipation shell through the silica gel layer, the cover body, the first heat conduction plate and the second heat conduction plate, water cooling treatment can be carried out, water circulation can be formed through the micro water pump, the water inlet pipe, the heat dissipation pipe and the water outlet pipe, air circulation can be formed through the micro exhaust fan, the heat dissipation pipe, the air outlet cavity and the air return cavity, air cooling treatment can be carried out, efficient heat dissipation treatment can be carried out in the cavity of the controller, the service life of the compact controller is prolonged, meanwhile, the occupied space is small, and the installation and.
2. According to the invention, the sealing performance between the upper shell and the lower shell is improved by the matching use of the sealing ring and the sealing groove, the sealing performance of the controller shell is improved by arranging the vacuum cavities in the inner walls of the upper shell and the lower shell, and meanwhile, the vacuum cavities can isolate external hot air, so that the condition of high temperature inside the shell caused by shell heat conduction is avoided.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a compact motor controller with good heat dissipation according to the present invention;
FIG. 2 is a schematic top view of the structure of FIG. 1;
FIG. 3 is a cross-sectional view of the structure at A-A in FIG. 2;
FIG. 4 is a schematic structural view of the upper housing;
FIG. 5 is a schematic structural view of the lower housing;
FIG. 6 is a schematic structural view of a heat dissipation assembly;
FIG. 7 is a schematic structural diagram of a heat dissipation housing;
in the drawings, the components represented by the respective reference numerals are listed below:
1-upper shell, 2-lower shell, 3-control mainboard, 4-radiating component, 101-vacuum cavity, 102-miniature exhaust fan, 103-fixing ring, 104-threaded hole, 105-gap, 106-flange lug, 107-air deflector, 108-air outlet cavity, 109-air return cavity, 110-sealing groove, 201-sliding groove, 202-sealing ring, 401-radiating shell, 402-cover body, 403-opening, 404-retaining edge, 405-first heat-conducting plate, 406-second heat-conducting plate, 407-serpentine channel, 408-guiding cavity, 409-miniature water pump, 410-telescopic sleeve, 411-backing plate, 412-spring, 413-silica gel layer, 414-water inlet pipe, 415-water outlet pipe, 416-radiating pipe, 417-slide block, 418-channel and 419-semiconductor refrigerating plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, the present invention is a compact motor controller with good heat dissipation, including an upper housing 1, a lower housing 2, a control motherboard 3 and a heat dissipation assembly 4;
the inner walls of the upper shell 1 and the lower shell 2 are both provided with a vacuum cavity 101, and a micro exhaust fan 102 is fixed on one inner wall of the upper shell 1;
the heat dissipation assembly 4 comprises a heat dissipation shell 401 and a cover body 402, one surface of the cover body 402 is fixedly connected with one surface of the heat dissipation shell 401, one side surface of the heat dissipation shell 401 is provided with an opening 403, a blocking edge 404 is fixed on one opposite inner wall of the opening 403, a first heat conduction plate 405 is fixed on one surface of the blocking edge 404, a plurality of second heat conduction plates 406 are fixed on one surface of the first heat conduction plate 405 and one inner wall of the heat dissipation shell 401, the plurality of second heat conduction plates 406 are distributed at intervals, a serpentine channel 407 is formed by the plurality of second heat conduction plates 406, a group of flow guide cavities 408 are formed by the blocking edge 404 and one inner wall of the heat dissipation shell 401, and a plurality of semiconductor;
a micro water pump 409 is fixed on the inner wall of the heat dissipation shell 401 and positioned between the group of blocking edges 404, and a water inlet and a water outlet of the micro water pump 409 are respectively communicated with the two diversion cavities 408 through pipelines;
a plurality of telescopic sleeves 410 are fixed on the bottom surface of the heat dissipation shell 401, a base plate 411 is fixed at one end of each telescopic sleeve 410, a plurality of springs 412 are fixed between one surface of each base plate 411 and the bottom surface of the heat dissipation shell 401, the springs 412 are arranged on the outer surface of the telescopic sleeves 410 in a surrounding mode, upward elastic force is always provided for the heat dissipation shell 401 after the heat dissipation shell 401 is installed through the telescopic sleeves 410, the springs 412 and the base plates 411, and a silica gel layer 413 can be always attached to one surface of the control main board 3;
a silica gel layer 413 is fixed on one surface of the cover body 402, a water inlet pipe 414 is fixedly communicated with a pipeline on the water outlet of the micro water pump 409, a water outlet pipe 415 is fixedly penetrated on one surface of the cover body 402, a radiating pipe 416 is fixed between the water inlet pipe 414 and the water outlet pipe 415, and the radiating pipe 416 is opposite to the micro exhaust fan 102.
As shown in fig. 3-4, a fixing ring 103 is fixed on an inner wall of the upper housing 1, a plurality of threaded holes 104 are formed on a surface of the control main board 3 and a surface of the fixing ring 103, and the control main board 3 is fixedly connected with a surface of the fixing ring 103 through the threaded holes 104 and screws.
As shown in fig. 3-4, a gap 105 is formed between the fixing ring 103 and the upper housing 1, and the heat pipe 416 and the micro-suction fan 102 are in clearance fit with the gap 105.
As shown in fig. 3 and fig. 5 to 6, a set of sliding grooves 201 are formed in the opposite inner walls of the lower housing 2, a set of sliding blocks 417 are fixed to the opposite outer walls of the heat dissipation housing 401, and the heat dissipation housing 401 is in sliding fit with the lower housing 2 through the sliding blocks 417 and the sliding grooves 201.
As shown in fig. 1 to 5, flange lugs 106 are fixed to the peripheral side of the upper housing 1 and the peripheral side of the lower housing 2, and the upper housing 1 is fixedly connected to the lower housing 2 through the flange lugs 106 and screws.
As shown in fig. 4, a set of air deflectors 107 is fixed on an inner wall of the upper casing 1, the upper casing 1 is divided into an air outlet chamber 108 and an air return chamber 109 by the two air deflectors 107, and the micro-exhaust fan 102 is located inside the air outlet chamber 108.
As shown in fig. 3-5, a sealing groove 110 is formed on a surface of the upper housing 1, a sealing ring 202 is formed on a surface of the lower housing 2, and the sealing groove 110 and the sealing ring 202 are in clearance fit and are opposite to each other.
The cover 402, the first heat conducting plate 405, the second heat conducting plate 406, the water inlet pipe 414, the water outlet pipe 415 and the heat dissipating pipe 416 are all made of copper material, and the top surfaces of the first heat conducting plate 405 and the second heat conducting plate 406 are both in contact with the bottom surface of the cover 402.
As shown in fig. 6, a groove 418 is formed on one surface of the silicone layer 413, and the groove 418 is in clearance fit with the water inlet pipe 414.
One specific application of this embodiment is: when in use, the semiconductor refrigeration sheet 419 can cool the water in the diversion cavity 408, can drive the inside rivers of water conservancy diversion chamber 408 through micro water pump 409 and flow, cold water can circulate through serpentine channel 407 and water conservancy diversion chamber 408, the heat that control mainboard 3 produced can transmit to first heat-conducting plate 405 and second heat-conducting plate 406 in through silica gel layer 413 and lid 402, cold water in the serpentine channel 407 can absorb the heat on first heat-conducting plate 405 and the second heat-conducting plate 406, can carry out water-cooling treatment, micro water pump 409 can pass through inlet tube 414 with cold water simultaneously, cooling tube 416 and outlet pipe 415 form the hydrologic cycle, cooling tube 416 outside is cold, micro exhaust fan 102 can take out the cold air around cooling tube 416 and form the air cycle through air-out chamber 108 and return air chamber 109, can carry out the forced air cooling and handle, can carry out the thermal diffusivity in the controller cavity.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (9)
1. Compact machine controller that heat dissipation is good, including last casing (1), casing (2) and control mainboard (3) down, its characterized in that: the heat dissipation device also comprises a heat dissipation component (4);
the inner walls of the upper shell (1) and the lower shell (2) are both provided with a vacuum cavity (101), and a micro exhaust fan (102) is fixed on one inner wall of the upper shell (1);
the heat dissipation assembly (4) comprises a heat dissipation shell (401) and a cover body (402), one surface of the cover body (402) is fixedly connected with one surface of the heat dissipation shell (401), one side surface of the heat dissipation shell (401) is provided with an opening (403), a blocking edge (404) is fixed on one opposite inner wall of the opening (403), a first heat conduction plate (405) is fixed on one surface of the blocking edge (404), a plurality of second heat conduction plates (406) are fixed on one surface of the first heat conduction plate (405) and one inner wall of the heat dissipation shell (401), the plurality of second heat conduction plates (406) are distributed at intervals, the plurality of second heat conduction plates (406) form a serpentine channel (407), the blocking edge (404) and one inner wall of the heat dissipation shell (401) form a group of flow guide cavities (408), and a plurality of semiconductor refrigeration sheets (419) are fixed on one inner wall of the flow guide cavities (408);
a micro water pump (409) is fixed on the inner wall of the heat dissipation shell (401) and positioned between the group of blocking edges (404), and a water inlet and a water outlet of the micro water pump (409) are respectively communicated with the two flow guide cavities (408) through pipelines;
a plurality of telescopic sleeves (410) are fixed on the bottom surface of the heat dissipation shell (401), a base plate (411) is fixed at one end of each telescopic sleeve (410), a plurality of springs (412) are fixed between one surface of each base plate (411) and the bottom surface of the heat dissipation shell (401), and the springs (412) are arranged on the outer surface of each telescopic sleeve (410) in a surrounding mode;
a silica gel layer (413) is fixed on one surface of the cover body (402), a water inlet pipe (414) is fixedly communicated with a pipeline on a water outlet of the micro water pump (409), a water outlet pipe (415) penetrates through and is fixed on one surface of the cover body (402), a radiating pipe (416) is fixed between the water inlet pipe (414) and the water outlet pipe (415), and the radiating pipe (416) is opposite to the micro exhaust fan (102).
2. The compact motor controller with good heat dissipation performance as recited in claim 1, wherein a fixing ring (103) is fixed to an inner wall of the upper housing (1), a plurality of threaded holes (104) are formed in a surface of the control main board (3) and a surface of the fixing ring (103), and the control main board (3) is fixedly connected with a surface of the fixing ring (103) through the threaded holes (104) and screws.
3. The radiating compact motor controller according to claim 2, wherein a gap (105) is formed between the fixing ring (103) and the upper housing (1), and the radiating pipe (416) and the miniature suction fan (102) are in clearance fit with the gap (105).
4. The compact motor controller with good heat dissipation performance according to claim 1, wherein a set of sliding grooves (201) are formed in one opposite inner wall of the lower shell (2), a set of sliding blocks (417) are fixed on one opposite outer wall of the heat dissipation shell (401), and the heat dissipation shell (401) is in sliding fit with the lower shell (2) through the sliding blocks (417) and the sliding grooves (201).
5. The compact motor controller with good heat dissipation performance as recited in claim 1, wherein a flange support lug (106) is fixed on each of the peripheral side surface of the upper housing (1) and the peripheral side surface of the lower housing (2), and the upper housing (1) is fixedly connected with the lower housing (2) through the flange support lug (106) and a screw.
6. The compact motor controller with good heat dissipation performance as recited in claim 1, wherein a set of air deflectors (107) are fixed on an inner wall of the upper shell (1), the two air deflectors (107) divide the upper shell (1) into an air outlet cavity (108) and an air return cavity (109), and the micro exhaust fan (102) is located inside the air outlet cavity (108).
7. The compact motor controller with good heat dissipation of claim 1, wherein a sealing groove (110) is formed on one surface of the upper housing (1), a sealing ring (202) is formed on one surface of the lower housing (2), and the sealing groove (110) is in clearance fit with the sealing ring (202) and is opposite to the sealing groove.
8. The radiating compact motor controller of claim 1, wherein the cover body (402), the first heat conducting plate (405), the second heat conducting plate (406), the water inlet pipe (414), the water outlet pipe (415) and the radiating pipe (416) are made of copper material, and the top surfaces of the first heat conducting plate (405) and the second heat conducting plate (406) are in contact with the bottom surface of the cover body (402).
9. The compact motor controller with good heat dissipation performance as recited in claim 1, wherein a surface of the silicone rubber layer (413) is provided with a groove (418), and the groove (418) is in clearance fit with the water inlet pipe (414).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910347860.5A CN110225690B (en) | 2019-04-28 | 2019-04-28 | Compact motor controller with good heat dissipation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910347860.5A CN110225690B (en) | 2019-04-28 | 2019-04-28 | Compact motor controller with good heat dissipation |
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| CN110225690A CN110225690A (en) | 2019-09-10 |
| CN110225690B true CN110225690B (en) | 2020-09-25 |
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| CN201910347860.5A Active CN110225690B (en) | 2019-04-28 | 2019-04-28 | Compact motor controller with good heat dissipation |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111029950B (en) * | 2020-01-10 | 2021-08-24 | 安徽明远电力设备制造有限公司 | Sealed circulative cooling switch board |
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| CN2435777Y (en) * | 2000-07-19 | 2001-06-20 | 柯浩志 | Active heat sink |
| CN1351417A (en) * | 2000-10-31 | 2002-05-29 | 富士电机株式会社 | Electric inverter |
| CN106711110A (en) * | 2017-03-19 | 2017-05-24 | 北京工业大学 | Air-cooling and water-cooling hybrid radiating module for large-power series connected IGBT (Insulated Gate Bipolar Translator) |
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| CN208241583U (en) * | 2018-04-02 | 2018-12-14 | 湖北理工学院 | It is a kind of for studying the inverter of combined type Repetitive Control |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201251749Y (en) * | 2008-06-20 | 2009-06-03 | 刘雪 | Novel refrigerating and heat-dissipating device of CPU semiconductor |
| CN208367613U (en) * | 2018-06-07 | 2019-01-11 | 旭品科技股份有限公司 | Liquid cooling heat-exchanger rig and the equipment with liquid cooling heat-exchanger rig |
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2019
- 2019-04-28 CN CN201910347860.5A patent/CN110225690B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2435777Y (en) * | 2000-07-19 | 2001-06-20 | 柯浩志 | Active heat sink |
| CN1351417A (en) * | 2000-10-31 | 2002-05-29 | 富士电机株式会社 | Electric inverter |
| CN106711110A (en) * | 2017-03-19 | 2017-05-24 | 北京工业大学 | Air-cooling and water-cooling hybrid radiating module for large-power series connected IGBT (Insulated Gate Bipolar Translator) |
| CN207927125U (en) * | 2018-02-09 | 2018-09-28 | 南京越博电驱动系统有限公司 | A kind of radiator of electric vehicle motor controller |
| CN208241583U (en) * | 2018-04-02 | 2018-12-14 | 湖北理工学院 | It is a kind of for studying the inverter of combined type Repetitive Control |
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| CN110225690A (en) | 2019-09-10 |
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Address after: 221000 Xuzhou Industrial Park, Xuzhou City, Jiangsu Province, east of Tunshidagou and west of Tunqing Road Applicant after: Jiangsu Jinpeng Group Co.,Ltd. Address before: 221000 Xuzhou Industrial Park, Xuzhou City, Jiangsu Province, east of Tunshidagou and west of Tunqing Road Applicant before: JIANGSU JINPENG VEHICLE Co.,Ltd. |
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Denomination of invention: Compact motor controller with good heat dissipation Effective date of registration: 20221018 Granted publication date: 20200925 Pledgee: Xuzhou Jiawang Sub branch of Bank of Jiangsu Co.,Ltd. Pledgor: Jiangsu Jinpeng Group Co.,Ltd. Registration number: Y2022980018797 |