CN218471256U

CN218471256U - Cooling device

Info

Publication number: CN218471256U
Application number: CN202123052944.8U
Authority: CN
Inventors: 丁少枫; 刘振锋
Original assignee: Lthpc Beijing Technology Co ltd
Current assignee: Lthpc Beijing Technology Co ltd
Priority date: 2021-12-07
Filing date: 2021-12-07
Publication date: 2023-02-10
Anticipated expiration: 2031-12-07

Abstract

The utility model belongs to the technical field of the treater, a cooling device is disclosed, be equipped with first recess on this cooling device apron, be equipped with first through-hole and second through-hole on the splint, the apron, splint and first cooling plate lock in proper order connect, and first recess, first through-hole and first cooling plate form first circulation chamber, the apron, splint and second cooling plate lock in proper order connect, and first recess, second through-hole and second cooling plate form second circulation chamber, first circulation chamber and second circulation chamber are through first recess intercommunication, realize the effect of one set of cooling system of first cooling plate and second cooling plate sharing from this, be used for the cooling of treater with one of them of first cooling plate and second cooling plate, another is used for power supply unit's cooling, can realize the effect of one set of cooling system of treater and power supply unit sharing.

Description

Cooling device

Technical Field

The utility model relates to a treater technical field especially relates to a cooling device.

Background

At present, researchers have greatly improved the integration degree of circuit boards and the operation speed of processors, processors running at high speed can emit a large amount of heat, and in order to ensure the normal running of processors, cooling plates are usually added to the processors to accelerate the heat dissipation of the processors. In addition, the power supply unit for providing electric energy for the processor can also emit a large amount of heat, and in actual use, a cooling plate is additionally arranged on the power supply unit so as to accelerate the heat dissipation of the power supply unit.

In the prior art, the processor cooling plate and the power supply unit cooling plate are respectively connected with two sets of separated cooling systems, and each set of cooling system is respectively provided with a refrigerant circulating flow channel and a refrigerant connecting pipeline, so that the overall occupied space of the cooling system is increased, the overall structure of the cooling system is complex, and the maintenance and the repair of the cooling system are not facilitated.

Therefore, a cooling device is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a cooling device can bring two cooling plates one set of cooling system's of sharing technical effect.

To achieve the purpose, the utility model adopts the following technical proposal:

a cooling device, comprising:

the cover plate is provided with a first groove;

the clamping plate is provided with a first through hole and a second through hole;

the first cooling plate, the cover plate, the clamping plate and the first cooling plate are sequentially buckled and connected, and the first groove, the first through hole and the first cooling plate form a first circulation cavity;

the second cooling plate, apron, splint and second cooling plate lock in proper order and connect, and first recess, second through-hole and second cooling plate form the second circulation chamber, and first circulation chamber communicates through first recess with the second circulation chamber.

Optionally, the first cooling plate is provided with a second groove, the second groove is arranged towards the first circulation cavity, cooling fins are arranged in the second groove, the number of the cooling fins is multiple, and the cooling fins are arranged at intervals.

Optionally, the fixing plate is further included, the bottom of the second groove is arranged in the plurality of radiating fins, a third groove is formed in the tops of the plurality of radiating fins, the fixing plate is arranged in the third groove, the side wall of the fixing plate is attached to the inner wall of the third groove, an annular bulge is arranged in the first groove and connected with the fixing plate through a sealing element, and the annular bulge is connected with the edge of the third groove through the sealing element.

Optionally, the fixing plate is provided with a third through hole, and the third through hole is parallel to the axis of the first through hole.

Optionally, a first refrigerant circulation hole and a second refrigerant circulation hole are formed in the cover plate, and the first refrigerant circulation hole and the second refrigerant circulation hole are communicated with the first groove and used for allowing refrigerant to flow into and out of the first groove.

Optionally, the first refrigerant circulation hole is disposed at the first circulation cavity, and the second refrigerant circulation hole is disposed at the second circulation cavity.

Optionally, the cover plate is sealingly connected with the clamping plate.

Optionally, the first cooling plate is sealingly connected to the clamping plate.

Optionally, the second cooling plate is sealingly connected to the clamping plate.

Optionally, the refrigerant flowing in the first circulation cavity and the second circulation cavity is a liquid refrigerant.

Has the advantages that:

the utility model provides a cooling device, be equipped with first recess on the apron, be equipped with first through-hole and second through-hole on the splint, the apron, splint and first cooling plate lock in proper order connect, and first recess, first through-hole and first cooling plate form first circulation chamber, the apron, splint and second cooling plate lock in proper order connect, and first recess, second through-hole and second cooling plate form second circulation chamber, first circulation chamber communicates through first recess with second circulation chamber, realize one set of cooling system's of first cooling plate and second cooling plate sharing effect from this, and then effectively reduce the holistic occupation space of cooling system, and can effectively simplify cooling system overall structure. One of the first cooling plate and the second cooling plate is arranged on the processor and used for cooling the processor, and the other one of the first cooling plate and the second cooling plate is arranged on the power supply unit and used for cooling the power supply unit, so that the effect that the processor and the power supply unit share one set of cooling system can be realized.

Drawings

Fig. 1 is an exploded view of a cooling device according to the present embodiment;

fig. 2 is a schematic view of a cover plate structure provided in this embodiment;

fig. 3 is a schematic structural diagram of a cooling device provided in the present embodiment;

FIG. 4 isbase:Sub>A sectional view taken along line A-A of FIG. 3;

fig. 5 is a schematic structural diagram of the first cooling plate provided in this embodiment.

In the figure:

100. a cover plate; 110. a first groove; 120. an annular projection; 121. a fourth seal groove; 130. a first refrigerant circulation hole; 140. a second refrigerant circulation hole; 150. first of all a sealing groove; 200. a splint; 210. a first through hole; 220. a second through hole; 300. a first cooling plate; 310. a second groove; 320. a heat sink; 321. a third groove; 330. a third seal groove; 400. a second cooling plate; 410. a second seal groove; 500. a first flow-through chamber; 600. a second flow-through chamber; 700. a fixing plate; 710. a third via.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The embodiment provides a cooling device which can bring the technical effect that two cooling plates share one set of cooling system.

Specifically, as shown in fig. 1 to 5, the cooling device includes a cover plate 100, a clamping plate 200, a first cooling plate 300, and a second cooling plate 400, the cover plate 100 is provided with a first groove 110, the clamping plate 200 is provided with a first through hole 210 and a second through hole 220, the cover plate 100, the clamping plate 200, and the first cooling plate 300 are sequentially connected in a snap-fit manner, the first groove 110, the first through hole 210, and the first cooling plate 300 form a first circulation chamber 500, the cover plate 100, the clamping plate 200, and the second cooling plate 400 are sequentially connected in a snap-fit manner, the first groove 110, the second through hole 220, and the second cooling plate 400 form a second circulation chamber 600, and the first circulation chamber 500 and the second circulation chamber 600 are communicated through the first groove 110. Through set up first recess 110 on apron 100, set up the splint 200 that has first through-hole 210 and second through-hole 220 simultaneously, realized the intercommunication in first circulation chamber 500 and second circulation chamber 600, and then realized first cooling plate 300 and the effect of one set of cooling system of second cooling plate 400 sharing, and then effectively reduced the holistic occupation space of cooling system, and can effectively simplify cooling system overall structure, be favorable to cooling system's maintenance and maintenance more. One of the first cooling plate 300 and the second cooling plate 400 is installed on the processor for cooling the processor, and the other is installed on the power supply unit for cooling the power supply unit, so that the effect that the processor and the power supply unit share one set of cooling system can be achieved.

Alternatively, the connection of the cover plate 100, the clamping plate 200 and the first cooling plate 300 may be achieved by fasteners such as spring bolts, screws, and the like. Similarly, the connection of the cover plate 100, the clamping plate 200 and the second cooling plate 400 may be realized by fasteners such as spring bolts, screws and the like.

Optionally, as shown in fig. 1 to 5, the cover plate 100 is provided with a first refrigerant circulation hole 130 and a second refrigerant circulation hole 140, and the first refrigerant circulation hole 130 and the second refrigerant circulation hole 140 are both communicated with the first groove 110 and used for refrigerant flowing into and flowing out of the first groove 110, so that the refrigerant flowing into the first groove 110 enters the first circulation cavity 500 and the second circulation cavity 600, and then the refrigerant is discharged from the first groove 110. In the present embodiment, the first refrigerant circulation hole 130 is a refrigerant inflow hole, and the second refrigerant circulation hole 140 is a refrigerant outflow hole. In other embodiments, the first refrigerant circulation hole 130 may be a refrigerant outflow hole, and the second refrigerant circulation hole 140 may be a refrigerant inflow hole.

Alternatively, as shown in fig. 1 to 5, the first refrigerant circulation hole 130 is disposed at the first circulation chamber 500, and the second refrigerant circulation hole 140 is disposed at the second circulation chamber 600, so as to increase the refrigerant circulation between the first circulation chamber 500 and the second circulation chamber 600, thereby increasing the heat dissipation efficiency of the first cooling plate 300 and the second cooling plate 400.

Preferably, the refrigerant flowing through the first and

second circulation cavities

500 and 600 is a liquid refrigerant, for example, cooling water, a liquid refrigerant, or the like, and the heat exchange efficiency of the liquid refrigerant is high, so that the heat radiation efficiency of the first and

second cooling plates

300 and 400 can be effectively improved. In the technical scheme provided by this embodiment, the refrigerant is cooling water, which is low in cost and has high heat exchange efficiency.

Optionally, the cover plate 100 is hermetically connected to the clamp plate 200 to improve the sealing property between the cover plate 100 and the clamp plate 200 and prevent the refrigerant from leaking. Specifically, as shown in fig. 1 to 5, a first sealing groove 150 is disposed on the cover plate 100, the first sealing groove 150 is in an annular structure and is disposed at an edge of the first groove 110, and a sealing ring is disposed in the first sealing groove 150 to seal the cover plate 100 and the clamping plate 200. Of course, in other embodiments, a sealant may be applied to the cover plate 100 and/or the clamping plate 200 to seal the cover plate 100 and the clamping plate 200.

Optionally, the second cooling plate 400 is hermetically connected to the clamping plate 200 to improve the sealing property between the second cooling plate 400 and the clamping plate 200, so as to prevent the refrigerant from leaking. Specifically, as shown in fig. 1 to 5, a second sealing groove 410 is formed on the second cooling plate 400, the second sealing groove 410 is in an annular structure, and a sealing ring is installed in the second sealing groove 410 to seal the second cooling plate 400 and the clamping plate 200. Of course, in other embodiments, a sealant may be applied to the second cooling plate 400 and/or the clamping plate 200 to seal the second cooling plate 400 and the clamping plate 200.

Optionally, with continued reference to fig. 1 to 5, the first cooling plate 300 is provided with a second groove 310, the second groove 310 is disposed toward the first circulation cavity 500, the second groove 310 is provided with a plurality of fins 320, the number of the fins 320 is multiple, and the plurality of fins 320 are arranged at intervals. The arrangement of the second groove 310 increases the carrying capacity of the cooling medium in the first circulation cavity 500, and effectively improves the heat dissipation capacity of the first cooling plate 300; the arrangement of the heat dissipation fins 320 increases the contact area between the first cooling plate 300 and the refrigerant, and further improves the heat dissipation capability of the first cooling plate 300.

Optionally, the first cooling plate 300 is hermetically connected to the clamping plate 200, so as to improve the sealing property between the first cooling plate 300 and the clamping plate 200 and prevent the refrigerant from leaking. Specifically, with reference to fig. 1 to 5, a third sealing groove 330 is formed on the first cooling plate 300, the third sealing groove 330 is in an annular structure and is disposed at the edge of the second groove 310, and a sealing ring is installed in the third sealing groove 330 to seal the first cooling plate 300 and the clamping plate 200. Of course, in other embodiments, a sealant may be applied to the first cooling plate 300 and/or the clamping plate 200 to seal the first cooling plate 300 and the clamping plate 200.

Optionally, with continued reference to fig. 1 to 5, the cooling device provided in this embodiment further includes a fixing plate 700, the plurality of cooling fins 320 are disposed at the bottom of the second groove 310, a third groove 321 is formed at the top of the plurality of cooling fins 320, the fixing plate 700 is disposed in the third groove 321, a side wall of the fixing plate 700 is attached to an inner wall of the third groove 321, an annular protrusion 120 is disposed in the first groove 110, the annular protrusion 120 is connected to the fixing plate 700 through a sealing member, and the annular protrusion 120 is further connected to an edge of the third groove 321 through the sealing member. Therefore, the cover plate 100 is in direct contact with the first cooling plate 300, the sealing element is arranged to effectively increase the contact friction force between the cover plate 100 and the first cooling plate 300, the problem of refrigerant leakage caused by dislocation between the cover plate 100 and the first cooling plate 300 is prevented, the consistency of the whole structure of the cooling device is improved, and the whole sealing performance of the cooling device is improved.

Specifically, with reference to fig. 1 to 5, a fourth seal groove 121 is formed at an end of the annular protrusion 120, the fourth seal groove 121 is in an annular structure, the sealing element is a sealing ring, and the sealing ring is disposed in the fourth seal groove 121, so as to increase a contact friction force between the cover plate 100 and the first cooling plate 300. It is understood that, in other embodiments, the sealing element may be a sealing strip or other structure, and the fourth sealing groove 121 may also be an arc-shaped structure, a strip-shaped structure, or the like.

Further, with reference to fig. 1 to 5, a gap is left between the plurality of fins 320 and the second groove 310 to realize the circulation of the refrigerant between the first circulation cavity 500 and the second circulation cavity 600.

Preferably, with continued reference to fig. 1 to 5, the fixing plate 700 is provided with a third through hole 710, and the third through hole 710 is parallel to the axis of the first through hole 210, so as to increase the flow rate of the cooling medium in the first flow-through cavity 500, and further increase the heat dissipation capability of the first cooling plate 300.

The cooling device provided by the embodiment, through setting up first recess 110 on apron 100, set up the splint 200 that has first through-hole 210 and second through-hole 220 simultaneously, realized the intercommunication in first circulation chamber 500 and second circulation chamber 600, and then realized first cooling plate 300 and second cooling plate 400 sharing one set of cooling system's effect, and then effectively reduce the holistic occupation space of cooling system, and can effectively simplify cooling system overall structure, be favorable to cooling system's maintenance and maintenance more. One of the first cooling plate 300 and the second cooling plate 400 is installed on the processor for cooling the processor, and the other is installed on the power supply unit for cooling the power supply unit, so that the effect that the processor and the power supply unit share one set of cooling system can be realized, and the processor and the power supply unit can work in high performance under the same heat dissipation environment.

On the other hand, in the prior art, the power supply unit usually uses air as a cooling medium, the heat dissipation efficiency depends on the external environment temperature and the gas convection condition, and the heat dissipation mode is relatively passive. In the technical scheme that this embodiment provided, adopt the cooling water as the refrigerant, the cooling water is compared with the air, and coefficient of thermal conductivity is higher to the heat that the power supply unit distributed out is direct to be absorbed and taken away by the cooling water that flows, and its radiating mode is comparatively initiative, consequently, this embodiment adopts the technical scheme of cooling water as the refrigerant to have the technological effect that improves power supply unit radiating efficiency, provides the powerful guarantee for power supply unit's stable work.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A cooling apparatus, comprising:

a cover plate (100), the cover plate (100) being provided with a first groove (110);

the clamping plate (200), the clamping plate (200) is provided with a first through hole (210) and a second through hole (220);

the cover plate (100), the clamping plate (200) and the first cooling plate (300) are sequentially connected in a buckling mode, and the first groove (110), the first through hole (210) and the first cooling plate (300) form a first circulation cavity (500);

the second cooling plate (400), apron (100), splint (200) and second cooling plate (400) lock in proper order and connect, just first recess (110), second through-hole (220) and second cooling plate (400) form second circulation chamber (600), first circulation chamber (500) with second circulation chamber (600) pass through first recess (110) intercommunication.

2. The cooling device according to claim 1, wherein the first cooling plate (300) is provided with a second groove (310), the second groove (310) is disposed toward the first circulation chamber (500), a plurality of cooling fins (320) are disposed in the second groove (310), and the plurality of cooling fins (320) are arranged at intervals.

3. The cooling device according to claim 2, further comprising a fixing plate (700), wherein a plurality of the heat dissipation fins (320) are disposed at the bottom of the second groove (310), and a third groove (321) is formed at the top of the plurality of the heat dissipation fins (320), the fixing plate (700) is disposed in the third groove (321), the side wall of the fixing plate (700) is attached to the inner wall of the third groove (321), an annular protrusion (120) is disposed in the first groove (110), the annular protrusion (120) is connected to the fixing plate (700) through a sealing member, and the annular protrusion (120) is connected to the edge of the third groove (321) through the sealing member.

4. A cooling device according to claim 3, characterized in that the fixing plate (700) is provided with a third through hole (710), the third through hole (710) being parallel to the axis of the first through hole (210).

5. The cooling device according to any one of claims 1 to 4, wherein a first refrigerant circulation hole (130) and a second refrigerant circulation hole (140) are formed in the cover plate (100), and the first refrigerant circulation hole (130) and the second refrigerant circulation hole (140) are both communicated with the first groove (110) for flowing a refrigerant into and out of the first groove (110).

6. The cooling device as claimed in claim 5, wherein the first refrigerant circulation hole (130) is disposed at the first circulation chamber (500), and the second refrigerant circulation hole (140) is disposed at the second circulation chamber (600).

7. A cooling arrangement according to any one of claims 1-4, characterised in that the cover plate (100) is sealingly connected to the clamping plate (200).

8. A cooling arrangement according to any one of claims 1-4, characterised in that the first cooling plate (300) is sealingly connected with the clamping plate (200).

9. A cooling arrangement according to any one of claims 1-4, characterised in that the second cooling plate (400) is sealingly connected with the clamping plate (200).

10. The cooling device according to any one of claims 1 to 4, wherein the refrigerant flowing through the first circulation chamber (500) and the second circulation chamber (600) is a liquid refrigerant.