CN215872513U - Radiator and electrical equipment - Google Patents

Abstract

The utility model relates to the technical field of heat dissipation of electrical equipment, and discloses a heat radiator and electrical equipment. The radiator comprises a heat absorption plate and a heat dissipation assembly, wherein the side face of the heat absorption plate is configured to be provided with a power device, a first cavity is arranged in the heat absorption plate, the heat dissipation assembly comprises a body portion, a sealing plate and heat dissipation fins, the sealing plate and the heat dissipation fins are connected to the side face of the body portion respectively, the plate extension plane of the sealing plate is intersected with the extension plane of the heat absorption plate, the body portion and the sealing plate are arranged in a surrounding mode to form a second cavity, the second cavity is communicated with the first cavity to form a flowing space, and working media are arranged in the flowing space. The radiator provided by the utility model is provided with two heat absorption planes, can absorb heat of power devices on two circuit boards at the same time, and can meet the heat dissipation requirement under the condition of high power density. The electrical equipment comprises a plurality of power devices and a radiator, wherein the power devices are distributed on two sides of the heat absorption plate. The electric equipment provided by the utility model has a compact structure and a good heat dissipation effect by arranging the radiator.

Description

Radiator and electrical equipment

Technical Field

The utility model relates to the technical field of heat dissipation of electrical equipment, in particular to a heat radiator and electrical equipment.

Background

With the development of electrical equipment, the total power of various power devices on a circuit board is increasing, and therefore the demand of the electrical equipment for heat dissipation is also increasing.

In the prior art, a plurality of power devices are integrated on a circuit board, and heat dissipation is realized by fixing the circuit board on a heat sink, and the specific structure has the following two types, wherein the first type is: as shown in fig. 1, the supporting plate 210 is provided with heat dissipating fins 202 on one side and a power device integrated circuit board 100 on the other side, and in this scheme, when the electrical apparatus has a plurality of circuit boards, a plurality of heat sinks need to be configured, resulting in an electrical apparatus with a non-compact and bulky structure. The second method is as follows: as shown in fig. 2, the heat sink includes a case 301 having both ends opened, heat radiating fins 302 are provided in the case 301, and the circuit board 100 is mounted outside the case 301. In this solution, the heat sink can dissipate heat of the two circuit boards 100, but the whole heat sink needs to be disposed inside the electrical device, and in order to ensure heat dissipation of the heat dissipation fins 302, an opening through which wind passes needs to be disposed on the housing of the electrical device, which not only affects sealing of the electrical device, but also affects arrangement of other components in the electrical device.

Therefore, a heat sink and an electrical apparatus are needed to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

One object of the present invention is to provide a heat sink having a plurality of heat exchange surfaces, which is suitable for heat dissipation requirements under high power density conditions and is easy to install in electrical equipment.

The second purpose of the present invention is to provide an electrical apparatus, which has a compact structure and a good heat dissipation effect by providing the above heat sink.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a heat sink, comprising:

the side surface of the heat absorption plate is configured to be mounted with a power device, and a first cavity is arranged in the heat absorption plate;

the heat dissipation assembly comprises a body part, a sealing plate and a heat dissipation fin, wherein the sealing plate and the heat dissipation fin are connected to the side face of the body part respectively, a plate extension plane of the sealing plate is intersected with an extension plane of the heat absorption plate, the body part and the sealing plate are surrounded to form a second cavity, the second cavity is communicated with the first cavity to form a flow space, and working media are arranged in the flow space.

Optionally, a wall surface of the first cavity and/or the second cavity is provided with a heat sink.

Optionally, a capillary structure is disposed within the first cavity and/or the second cavity.

Optionally, the heat sink plate includes a plurality of sides for mounting the power device.

Optionally, a groove is formed in one side, facing the heat absorbing plate, of the body portion, the sealing plate blocks the groove to enclose the second cavity, a via hole is formed in the sealing plate, a communication port is formed in one side, facing the sealing plate, of the first cavity, and the via hole is communicated with the communication port.

Optionally, a size of the via hole is not smaller than a size of the communication port.

Optionally, the flow space is provided with an inlet provided on the absorber plate or on the closure plate or on the body portion.

Optionally, the extending plane of the sealing plate is perpendicular to the extending plane of the heat absorbing plate.

Optionally, the heat dissipation assembly includes a plurality of heat dissipation fins, the heat dissipation fins are arranged in parallel at intervals, and the heat dissipation fins are perpendicular to the body portion.

The electric equipment comprises a plurality of power devices and the heat radiator, wherein the power devices are distributed on the side surface of the heat absorption plate.

Optionally, the electrical device further includes a housing, at least one side of the housing has an opening, the body portion blocks the opening, and the heat dissipation fin is disposed outside the housing.

The utility model has the beneficial effects that:

when the power device arranged on the side surface of the heat absorbing plate generates heat, the heat is transferred to the working medium positioned in the first cavity through the heat absorbing plate, the working medium is heated and gasified and enters the second cavity, the gasified working medium transfers the heat to the radiating fins through the body part, the radiating fins transfer the heat to the surrounding environment, the working medium is cooled into liquid after being radiated and circulates to the first cavity to absorb the heat again, and therefore the radiating effect of the power device is achieved. On one hand, the heat is taken away by means of the circulation process of the working medium in the first cavity and the second cavity, and the plurality of side surfaces of the heat absorbing plate can be used as heat absorbing surfaces, so that the heat exchange area is increased, the heat dissipation efficiency is high, and the heat absorbing plate can meet the heat dissipation requirement under the condition of high power density; on the other hand, the whole heat dissipation assembly is intersected with the heat absorption plate, and the power device is arranged on the side face of the heat absorption plate, so that when the heat radiator is installed on the electrical equipment, the heat absorption plate can be arranged inside the shell, the heat dissipation assembly is arranged outside the equipment, the arrangement of other parts in the electrical equipment is convenient, the heat generated by the power device can be effectively dissipated, a heat dissipation hole structure does not need to be formed in the shell, and the problem of sealing of the electrical equipment is solved.

The electric equipment of the embodiment has a compact structure and a good heat dissipation effect by arranging the radiator.

Drawings

FIG. 1 is a schematic view of a first prior art heat sink and circuit board mounted on the heat sink;

FIG. 2 is a schematic view of a second prior art heat sink and circuit board mounted on the heat sink;

fig. 3 is a schematic structural diagram of a heat sink mounted with a circuit board and a power device according to an embodiment of the present invention;

FIG. 4 is a cross-sectional view of FIG. 3;

fig. 5 is an exploded view of a heat sink according to an embodiment of the present invention;

fig. 6 is an exploded view of a heat sink according to a second embodiment of the present invention.

In the figure:

100-a circuit board; 201-a support plate; 202-radiating fins; 301-a cartridge; 302-heat dissipation fins; 400-power devices;

1-a heat absorbing plate; 11-a first cavity; 111-communication port;

2-a heat dissipation assembly; 21-a body portion; 211-grooves; 22-closing plate; 221-a via hole; 23-heat dissipation fins; 24-a second cavity; 25-heat sink.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

Example one

The embodiment provides a heat sink and an electrical apparatus, the electrical apparatus includes a housing, a heat sink, a plurality of power devices 400, the housing is used for accommodating the plurality of power devices 400 and supporting the heat sink, further, the electrical apparatus includes at least two circuit boards 100, the plurality of power devices 400 are respectively disposed on the two circuit boards 100, the circuit boards 100 are connected with the heat sink, that is, the plurality of power devices 400 are connected with the heat sink through one circuit board 100.

Preferably, as shown in fig. 2-5, the heat sink includes a heat absorbing plate 1 and a heat dissipating assembly 2, the heat absorbing plate 1 is rectangular, one side of the heat absorbing plate 1 is used for mounting the heat dissipating assembly 2, and the other five sides are heat absorbing surfaces, that is, all the sides can be used for mounting power devices. In this embodiment, a circuit board 100 integrated with a plurality of power devices 400 is respectively mounted on two opposite and larger side surfaces of the heat absorbing plate 1, and the power devices 400 are disposed on one side of the circuit board 100 facing the heat absorbing plate 100, so that the plurality of power devices 400 are respectively in contact with two sides of the heat absorbing plate 1, in other embodiments, the heat absorbing plate 1 may also be mounted on other side surfaces of the heat absorbing plate 1 or the power devices 400 may be directly mounted on the other side surfaces of the heat absorbing plate 1. In other embodiments, the specific shape of the heat absorbing plate 1 is not limited, and as long as one side is used for mounting the heat dissipation assembly 2, other sides can be used as the heat absorbing surface. Further, a first cavity 11 is arranged in the heat absorbing plate 1, the heat dissipation assembly 2 includes a body portion 21, a sealing plate 22 and heat dissipation fins 23, the sealing plate 22 and the heat dissipation fins 23 are respectively connected to two opposite sides of the body portion 21, in other embodiments, the sealing plate 22 and the heat dissipation fins 23 may also be respectively arranged on adjacent sides of the body portion 21, an extension plane of the sealing plate 22 intersects with an extension plane of the heat absorbing plate 1, the body portion 21 and the sealing plate 22 surround to form a second cavity 24, the second cavity 24 is communicated with the first cavity 11 to form a flow space, and a working medium is arranged in the flow space.

According to the radiator, when the power device 400 on the two circuit boards 100 generates heat, heat is transferred to the working medium in the first cavity 11 through the heat absorbing plate 1, the working medium is heated and gasified and enters the second cavity 24, the gasified working medium transfers the heat to the radiating fins 23 through the body part 21, the radiating fins 23 transfer the heat to the surrounding environment, the working medium is cooled into liquid again after being radiated and circulates to the first cavity 11 to absorb the heat again, and therefore the radiating effect of the power device 400 is achieved. On one hand, the heat is taken away by means of the circulation process of the working medium in the first cavity 11 and the second cavity 24, and both sides of the heat absorbing plate 1 can be used as heat absorbing surfaces, so that the power devices 400 respectively positioned on the two circuit boards 100 can be simultaneously absorbed, the heat dissipation efficiency is high, and the heat dissipation requirement under the condition of high power density can be met; on the other hand, the whole heat dissipation assembly 2 is intersected with the heat absorption plate 1, and the circuit board 100 is arranged on two sides of the heat absorption plate 1, so that when the heat sink is installed on the electrical equipment, the heat absorption plate 1 can be arranged inside the shell, and the heat dissipation assembly 2 is arranged outside the equipment, so that the arrangement of other parts in the electrical equipment is facilitated, the heat generated by the power device 400 can be effectively dissipated, a heat dissipation hole structure does not need to be formed in the shell, and the problem of sealing of the electrical equipment is solved. The electric equipment of the embodiment has a compact structure and a good heat dissipation effect by arranging the radiator.

Specifically, in this embodiment, at least one side of the housing of the electrical device is provided with an opening, which can be used to install other components of the electrical device into the housing, and in addition, the body portion 21 of the heat sink can seal the opening to seal the entire housing, and at this time, the heat absorbing plate 1 is located in the housing, and the heat dissipating fins 23 are located outside the housing, so that heat can be dissipated to the surrounding environment well. The working medium is a substance that is easily changed from liquid to gas after absorbing heat, and easily changed from gas to liquid after releasing heat. In this embodiment, the working medium may be water, R1233zd, R410A, R134A, CO2, or the like, and may be selectively disposed according to actual needs, which is not limited herein.

Preferably, as shown in fig. 4 and 5, the first cavity 11 is a sheet-shaped space matched with the shape of the absorber plate 1, so that heat absorbed at various positions on the absorber plate 1 can be rapidly exchanged with the working medium. Further, the body part 21 is a plate-shaped structure arranged in parallel with the sealing plate 22, the radiator comprises a plurality of radiating fins 23, the radiating fins 23 are arranged in parallel at intervals and are perpendicular to the body part 21, and the second cavity 24 is a sheet space matched with the body part 21 in shape, so that the gasified working medium can uniformly transfer heat to the radiating fins 23, and a good radiating effect is ensured.

Specifically, as shown in fig. 4, a groove 211 is provided on a side of the body portion 21 facing the absorber plate 1, the cover plate 22 closes the groove 211 to form the second cavity 24, a through hole 221 is provided on the cover plate 22, a communication port 111 is provided on a side of the first cavity 11 facing the cover plate 22, and the through hole 221 is communicated with the communication port 111. The second cavity 24 is formed by surrounding the sealing plate 22 through the groove 211 on the body part 21, so that the machining and the manufacturing are convenient, and the communication between the second cavity 24 and the first cavity 11 is convenient to realize by arranging the via hole 221 on the sealing plate 22. In this embodiment, the absorber plate 1 may be hermetically connected to the sealing plate 22 by welding. Further, the closing plate 22 may be connected to the body 21 in a sealing manner by welding, but in other embodiments, the closing plate 22 and the body 21 may also be fixedly connected by a bolt or the like, and sealing is achieved by a sealing ring, which is not limited in this respect.

Preferably, as shown in fig. 4 and 5, the extension plane of the closing plate 22 is perpendicular to the extension plane of the absorber plate 1, so that the overall shape of the radiator is regular and the structure is stable. Preferably, the through hole 221 is disposed at a center line of the sealing plate 22 and extends along the direction of the center line, and at this time, the whole heat dissipation assembly 2 and the heat absorbing plate 1 form a T-shaped structure, so that the working medium gasified in the first cavity 11 can enter the second cavity 24 more uniformly, and the heat dissipation effect is improved.

Further, as shown in fig. 4, the size of the via hole 221 is not smaller than the size of the communication port 111, so that the working medium gasified in the first cavity 11 can enter the second cavity 24 through the communication port 111 without hindrance, and the smoothness of the working medium circulation is ensured, thereby ensuring a good heat exchange effect. The size of the through hole 221 is not smaller than the size of the communication opening 111, which means that the area of the through hole 221 can completely cover the area of the communication opening 111 so as not to block the flow of the gasified working medium from the first cavity 11 to the second cavity 24. Specifically, in the present embodiment, both the via hole 221 and the communication opening 111 are rectangular holes, and both the length and the width of the via hole 221 are greater than those of the communication opening 111. In other embodiments, the shape of the via hole 221 and the shape of the communication opening 111 may be different, but the size of the via hole 221 is preferably larger than the size of the communication opening 111.

In order to deform the working medium introduced into the circulation space, the circulation space is further provided with an inlet, optionally, the inlet of the circulation space may be arranged on the body portion 21, even if the inlet is located outside the housing, so as to avoid that the liquid working medium leaks from the inlet and flows into the housing, which affects normal use of other parts of the electrical apparatus. In other embodiments, the inlet of the circulation space may be provided on the sealing plate 22 or the absorber plate 1, and may be selectively provided according to actual needs, which is not limited herein. Note that, the sealing process is required regardless of whether the inlet is provided in the main body 21, the sealing plate 22, or the absorber plate 1.

Example two

The embodiment provides a heat sink and an electrical apparatus, the electrical apparatus includes a housing, a heat sink, a plurality of power devices 400, the housing is used for accommodating the plurality of power devices 400 and supporting the heat sink, further, the electrical apparatus includes at least two circuit boards 100, the plurality of power devices 400 are respectively disposed on the two circuit boards 100, the circuit boards 100 are connected with the heat sink, that is, the plurality of power devices 400 are connected with the heat sink through one circuit board 100. The radiator of the present embodiment has the same working principle as the radiator of the first embodiment, and has a similar structure, except that:

as shown in fig. 6, in the present embodiment, the wall surfaces of the first cavity 11 and the second cavity 24 are provided with the heat dissipation fins 25, and the heat dissipation fins 25 are disposed in the first cavity 11 and the second cavity 24, so that the heat exchange effect of the heat sink can be further improved, and the heat sink can more quickly transfer the heat generated by the power device 400 to the surrounding environment. Specifically, as shown in fig. 6, a plurality of cooling fins 25 are disposed in the first cavity 11, and the plurality of cooling fins 25 are disposed in parallel and perpendicular to the sealing plate 22, so as to ensure the smoothness of the flow process of the working medium in the first cavity 11. Further, a plurality of cooling fins 25 are arranged in the second cavity 24, the plurality of cooling fins 25 are arranged in parallel and are perpendicular to the sealing plate 22, and the plurality of cooling fins 25 are uniformly distributed on two sides of the via holes 221, so that the heat exchange can be performed by contacting with the gasified working medium more uniformly. In this embodiment, the heat dissipation fins 25 in the second cavity 24 are fixed to the cover plate 22, but in other embodiments, the heat dissipation fins 25 in the second cavity 24 may be fixed to the body 21, which is not limited herein.

Preferably, capillary structures are arranged in the first cavity 11 and the second cavity 24, so that the heat exchange effect of the heat sink can be further improved. The specific form of the capillary structure may be any one of the prior art, and is not limited herein, without departing from the inventive concept of the present application.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the utility model and are not to be construed as limitations of the embodiments of the present invention, but may be modified in various embodiments and applications by those skilled in the art according to the spirit of the present invention, and the content of the present description should not be construed as a limitation of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (11)

1. A heat sink, comprising:

the heat absorption plate comprises a heat absorption plate (1) and a first cavity (11) arranged in the heat absorption plate (1), wherein the side surface of the heat absorption plate is configured to be mounted with a power device (400);

the heat dissipation assembly (2) comprises a body portion (21), and a sealing plate (22) and a heat dissipation fin (23) which are connected to the side face of the body portion (21) respectively, wherein a plate extension plane of the sealing plate (22) is intersected with an extension plane of the heat absorption plate (1), the body portion (21) and the sealing plate (22) are enclosed to form a second cavity (24), the second cavity (24) is communicated with the first cavity (11) to form a flow space, and a working medium is arranged in the flow space.

2. A heat sink according to claim 1, wherein the walls of the first cavity (11) and/or the second cavity (24) are provided with fins (25).

3. The heat sink according to claim 1, wherein a capillary structure is arranged in the first cavity (11) and/or the second cavity (24).

4. A heat sink according to claim 1, wherein the heat absorbing plate (1) comprises a plurality of sides for mounting the power device (400).

5. A heat sink according to any one of claims 1 to 4, wherein a recess (211) is provided in a side of the body portion (21) facing the heat absorbing plate (1), the sealing plate (22) blocks the recess (211) to enclose the second cavity (24), a through hole (221) is provided in the sealing plate (22), a communication opening (111) is provided in a side of the first cavity (11) facing the sealing plate (22), and the through hole (221) is communicated with the communication opening (111).

6. The heat sink according to claim 5, wherein the size of the via hole (221) is not smaller than the size of the communication port (111).

7. A heat sink according to any one of claims 1-4, characterised in that the flow space is provided with an inlet opening provided in the absorber plate (1) or in the cover plate (22) or in the body portion (21).

8. Radiator according to any one of claims 1 to 4, wherein the plane of extension of said cover plate (22) is arranged perpendicular to the plane of extension of said absorber plate (1).

9. A heat sink according to any one of claims 1 to 4, wherein the heat dissipating assembly (2) comprises a plurality of said heat dissipating fins (23), the plurality of said heat dissipating fins (23) being arranged in parallel spaced apart relationship, the heat dissipating fins (23) being perpendicular to the body portion (21).

10. An electrical apparatus, characterized in that it comprises a plurality of power devices (400) and a heat sink according to any of claims 1-9, a plurality of said power devices (400) being distributed on the sides of said heat absorbing plate (1).

11. The electrical apparatus according to claim 10, further comprising a housing having an opening on at least one side, the body portion (21) closing the opening, the heat dissipating fins (23) being provided outside the housing.

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