CN220674191U - Cooling device, electronic device and power supply device - Google Patents

Abstract

The present disclosure provides a cooling device, relates to the field of electronic devices, the cooling device includes: a housing having a receiving chamber therein for receiving a cooling liquid; the outer surface of the shell is provided with a first through hole communicated with the accommodating cavity, the outer surface of the shell with the first through hole is used for being abutted with the electronic device, the electronic device covers the first through hole, and the cooling device has higher cooling efficiency. The disclosure also provides an electronic device using the cooling device and a power supply device using the cooling device.

Description

Cooling device, electronic device and power supply device

Technical Field

The present disclosure relates to the field of electronic devices, and in particular, to a cooling device, an electronic device, and a power supply device.

Background

The electronic device or the power supply device can generate heat in the operation process, and in order to ensure that the electronic device or the power supply device is damaged due to overheating, a cooling device is required to be arranged for cooling the electronic device and the power supply device. The related cooling device can remove heat from the electronic device or the power supply device by flowing the circulating cooling liquid through the heating part of the electronic device or the power supply device, so that the temperature of the electronic device or the power supply device is reduced, and the cooling device has low heat dissipation efficiency and can cause the electronic device and the power supply device to be easily damaged due to overheating.

Disclosure of Invention

The disclosure provides a cooling device, an electronic device and a power supply device, which are used for improving the heat dissipation efficiency of the cooling device, so as to reduce the possibility of damaging the electronic device and the power supply device due to excessive heat.

Embodiments of the present disclosure provide a cooling device including: a housing having a receiving chamber therein for receiving a cooling liquid; the outer surface of the shell is provided with a first through hole communicated with the accommodating cavity, the outer surface of the shell with the first through hole is used for being abutted with the electronic device, and the electronic device covers the first through hole.

Further, the cooling device further includes: and the driving device is used for driving the cooling liquid to flow in the accommodating cavity or driving the cooling liquid to flow into the accommodating cavity and flow out of the accommodating cavity.

Further, the housing has a spoiler protruding from an inner wall surface of the accommodating chamber.

The embodiment of the disclosure also provides an electronic device, which includes: the cooling device according to the above embodiment, wherein the housing of the cooling device is connected to the circuit board, the circuit board is abutted to an outer surface of the housing having the first through hole, and the circuit board covers the first through hole.

Further, the electronic device is provided with a plurality of cooling devices, each cooling device is respectively connected with the circuit board, the circuit board is abutted with the outer surface of the shell of each cooling device, which is provided with the first through hole, and the circuit board covers each first through hole.

Further, the electronic device is provided with a plurality of circuit boards, the shell is provided with a plurality of first through holes, the shell is respectively connected with the circuit boards, each circuit board is abutted with the outer surface of the cooling device, which is provided with the first through holes, and each circuit board covers each first through hole.

Further, the circuit board has opposite first and second end faces, the first end face having a conductive portion and an insulating portion, the second end face having the insulating portion; the first end surface covers the first through hole, or the second end surface covers the first through hole,

or alternatively, the first and second heat exchangers may be,

the insulating portion of the first end face covers the first through hole, or the insulating portion of the second end face covers the first through hole.

Further, the electronic device further comprises a sealing member, and the sealing member is provided with a second through hole; in a state that the circuit board is connected with the cooling device, the sealing piece is clamped between the circuit board and the cooling device, and the inner edge of the second through hole surrounds the inner edge of the first through hole.

Further, the electronic device further includes: a memory element fixed to the circuit board and connected to the conductive portion of the circuit board; and/or, the electronic device further comprises: a processing element secured to the circuit board and connected to the conductive portion of the circuit board, and/or the electronic device further comprises: a first power supply unit connected with the conductive portion of the circuit board; and the first output unit is connected with the first power supply unit and is used for outputting the electric energy of the first power supply unit.

The embodiment of the disclosure also provides a power supply device, which comprises: a second power supply unit having a conductive portion and an insulating portion; the second output unit is connected with the second power supply unit and is used for outputting the electric energy of the second power supply unit; and the cooling device of the above embodiment is connected to the second power supply unit so that the second power supply unit covers the first through hole of the cooling device.

The embodiment of the disclosure provides a cooling device for cooling electronic devices, which comprises a shell, wherein a containing cavity for containing cooling liquid is formed in the shell, a first through hole communicated with the containing cavity is formed in the outer surface of the shell, and the outer surface of the shell with the first through hole is used for being abutted against the electronic devices, so that the cooling liquid can be in direct contact with the electronic devices in a state of connecting the cooling device with the electronic devices, the heat exchange efficiency between the cooling liquid and the electronic devices is improved, the cooling efficiency of the cooling device on the electronic devices is improved, and the possibility of damaging the electronic devices due to excessive heat is reduced; meanwhile, the electronic device covers the first through hole, so that after the electronic device is connected with the cooling device, the electronic device can plug the first through hole, and the possibility that cooling liquid in the accommodating cavity flows out of the accommodating cavity through the first through hole is reduced. The cooling device is applied to the electronic device, so that the possibility of damaging a circuit board and electronic elements of the electronic device due to excessive heat can be reduced; the cooling device is applied to the power supply device, so that the possibility of thermal runaway of a power supply unit of the power supply device can be reduced. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic view of a cooling device according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of another cooling device provided in an embodiment of the present disclosure;

FIG. 3 is a schematic view of another cooling device provided in an embodiment of the present disclosure;

FIG. 4 is a schematic view of an assembly of a casing and a spoiler in a cooling device according to an embodiment of the present disclosure;

FIG. 5 is an exploded view of an electronic device provided by an embodiment of the present disclosure;

FIG. 6 is an exploded view of another electronic device provided by an embodiment of the present disclosure;

FIG. 7 is an exploded view of another electronic device provided by an embodiment of the present disclosure;

FIG. 8 is an assembled schematic view of a cooling device and a circuit board in an electronic device provided in an embodiment of the present disclosure;

FIG. 9 is an assembled schematic view of another cooling device and circuit board in an electronic device provided by an embodiment of the present disclosure;

FIG. 10 is an exploded view of another electronic device provided by an embodiment of the present disclosure;

FIG. 11 is an exploded view of another electronic device provided by an embodiment of the present disclosure;

fig. 12 is an exploded view of another power supply device provided by an embodiment of the present disclosure.

Description of the reference numerals

1. A cooling device; 10. a housing; 11. a receiving chamber; 12. a first through hole; 13. an inflow port; 14. an outflow port; 15. a spoiler; 20. a driving device; 2. an electronic device; 30. a circuit board; 31. a first end face; 32. a second end face; 40. a seal; 41. a second through hole; 50. a first power supply unit; 60. a first output unit; 70. a second power supply unit; 80. and a second output unit.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus consistent with some aspects of the disclosure as detailed in the accompanying claims.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

In the following description, references to the term "first/second/are merely to distinguish between different objects and do not indicate that the objects have the same or a relationship therebetween. It should be understood that references to orientations of "above", "below", "outside" and "inside" are all orientations in normal use, and "left" and "right" directions refer to left and right directions illustrated in the specific corresponding schematic drawings, and may or may not be left and right directions in normal use.

It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. The term "coupled," unless specifically indicated otherwise, includes both direct and indirect coupling.

In some embodiments, the cooling device may be applied to any electronic device, and by way of example, the cooling device may be applied to electronic devices such as switches, routers, servers, etc. for cooling electronic devices in the electronic device; the cooling device can also be applied to power supply equipment, and the cooling device can be applied to power supply equipment such as a power supply of a server, a power supply of a chassis, a battery of an automobile and the like, and the cooling device can be used for cooling a power supply unit of the power supply equipment and also can be used for cooling a control element of the power supply equipment with a control system.

In some embodiments, as shown in fig. 1, the cooling device 1 is applied to cool an electronic device, which may be understood as any kind of electronic device, such as a circuit board of a server, or a battery cell of a battery. The cooling device 1 comprises a shell 10, wherein a containing cavity 11 for containing cooling liquid is arranged in the shell 10, the cooling liquid can be any substance which can be used for carrying out heat exchange and is in a liquid state in the working temperature range of the electronic device, such as water, oil, liquid metal and the like, meanwhile, the outer surface of the shell 10 is provided with a first through hole 12 communicated with the containing cavity 11, the outer surface of the shell 10 provided with the first through hole 12 is used for being abutted against the electronic device, and the electronic device covers the first through hole, and it can be understood that the electronic device is abutted against the outer surface of the shell 10 provided with the first through hole 12 in the state that the cooling device 1 is connected with the electronic device, so that the electronic device can be directly contacted with the cooling liquid in the containing cavity 11 through the first through hole 12, the heat exchange efficiency between the cooling liquid and the electronic device is improved, the cooling efficiency of the cooling device 1 on the electronic device is improved, and the possibility of damaging the electronic device due to excessive heat is reduced; meanwhile, the insulating part of the electronic device covers the first through hole 12, so that after the electronic device is connected with the cooling device, the insulating part of the electronic device can block the first through hole 12, and the possibility that the cooling liquid in the accommodating cavity 11 flows out of the accommodating cavity 11 through the first through hole 12 is reduced. The outer surface of the housing 10 provided with the first through holes 12 may be one or more, and the number of the first through holes 12 may be one or more. Alternatively, the shape of the outer edge of the first through hole may be any shape, and the shape may be one or more of a circle, a square, a diamond, a triangle, and a dumbbell. The portion of the electronic device, which is used for being abutted against the first through hole, is different based on the type of the cooling liquid contained in the containing cavity, and specifically, in the case that the cooling liquid is a non-conductive medium, the portion of the electronic device, which is used for being abutted against the first through hole, may be an insulating portion of the electronic device, or may be a conductive portion of the electronic device; in the case where the coolant is a conductive medium, the portion of the electronic device that is in contact with the first through hole is an insulating portion of the electronic device, and for convenience of explanation, the structure of the cooling device will be exemplarily described by taking the coolant as a conductive medium and the portion of the electronic device that is in contact with the first through hole as an insulating portion of the electronic device.

Alternatively, the outer surface of the housing 10 having the first through hole 12 of the cooling device may be a plane or a curved surface, and the shape of the outer surface of the housing 10 having the first through hole 12 is matched with the outer surface of the electronic device that the outer surface abuts against, so that the electronic device can be closely abutted against the outer surface of the housing 10 having the first through hole 12. Alternatively, the material of the housing 10 may be a metal or non-metal material such as aluminum, copper, iron, ceramic, etc.

The embodiment of the disclosure provides a cooling device for cooling an electronic device, the cooling device comprises a shell, wherein a containing cavity for containing cooling liquid is formed in the shell, a first through hole communicated with the containing cavity is formed in the outer surface of the shell, the outer surface of the shell with the first through hole is used for being abutted against an insulating part of the electronic device, so that the cooling liquid can be directly contacted with the insulating part of the electronic device in a state of connecting the cooling device with the electronic device, the heat exchange efficiency between the cooling liquid and the electronic device is improved, the cooling efficiency of the cooling device on the electronic device is further improved, the possibility of damage of the electronic device due to overheat is reduced, and the possibility of damage of the electronic device due to short circuit caused by contact of the cooling liquid with the insulating part of the electronic device can be reduced; meanwhile, the insulating part of the electronic device covers the first through hole, so that after the electronic device is connected with the cooling device, the insulating part of the electronic device can block the first through hole, and the possibility that cooling liquid in the accommodating cavity flows out of the accommodating cavity from the first through hole is reduced.

In some embodiments, as shown in fig. 2, the cooling device 1 further includes a driving device 20, where the driving device 20 is used to drive the cooling liquid to flow in the accommodating cavity 11, it may be understood that the driving device 20 is located in the accommodating cavity 11, the driving device 20 flows the cooling liquid in the accommodating cavity 11, and illustratively, the driving device 20 is a rotating fan blade located in the accommodating cavity 11 and is used to drive the cooling liquid to generate a horizontal swirl in the accommodating cavity 11, or the driving device 20 is used to drive the cooling liquid to flow into the accommodating cavity 11 and flow out of the accommodating cavity 11, where the driving device 20 is located outside the accommodating cavity 11, the casing 10 has an inflow port 13 and an outflow port 14, and the driving device 20 can drive the cooling liquid to flow from the inflow port 13 into the accommodating cavity 11, and flow from the outflow port 14 after the cooling liquid flows in the accommodating cavity 11 through the first through hole 12, so that the cooling liquid with higher temperature after completing heat exchange with the electronic device flows to a position away from the first through hole 12, and the cooling liquid with lower temperature that has not yet exchanged with the electronic device flows into the first through hole 12, or the cooling liquid with lower temperature flowing into the accommodating cavity 11, so that the cooling liquid with the cooling liquid flows into the accommodating cavity with the first through hole, and the cooling device is further improved, and the heat exchange efficiency is further improved, and the cooling efficiency is improved. Alternatively, the housing 10 is connected to the inflow pipe and the outflow pipe through the inflow port 13 and the outflow port 14, respectively, wherein the inflow port 13 and the outflow port 14 may be formed by drilling, or may be formed by providing a core during casting, and the inflow pipe and the outflow pipe connected to the inflow port 13 and the outflow port 14 may be a hose or a hard pipe.

In some embodiments, as shown in fig. 3, the casing 10 has a turbulence member 15, where the turbulence member 15 protrudes from an inner wall surface of the accommodating cavity 11, and laminar flow of the cooling liquid in the accommodating cavity 11 generates turbulence different from a laminar flow direction when flowing through the turbulence member 15, so that the cooling liquid in different positions in the accommodating cavity 11 can perform sufficient heat exchange through thermal convection, or the cooling liquid in the accommodating cavity 11 flows along a preset direction under the guiding action of the turbulence member 15, so that the preset position in the accommodating cavity can be cooled, or the laminar flow forms vortex in the accommodating cavity through diversion, so that the heat exchange rate of the liquid in the accommodating cavity 11 is accelerated, and the cooling effect on the electronic device is further improved. The structure and function of the spoiler 15 are exemplarily described below with reference to fig. 3 and 4. As shown in fig. 3, the cooling device 11 is illustrated as an example, the cooling device protrudes from the inner wall surface of the accommodating cavity 11 along the first direction (the first direction is shown by a solid arrow in fig. 3), and a preset included angle is formed between the first direction and the flowing direction of the cooling liquid, which can be understood that the laminar flow of the cooling liquid in the accommodating cavity 11 generates a turbulent flow different from the laminar flow direction (the laminar flow direction is shown by a solid arrow in fig. 3) when the cooling liquid flows through the turbulence member 15, so that the cooling liquid in different positions in the accommodating cavity 11 can perform sufficient heat exchange through thermal convection, and the cooling liquid away from the first through hole position can perform heat exchange with the cooling liquid close to the first through hole position at a higher speed, thereby further improving the cooling efficiency of the cooling device 1. As shown in fig. 4, the turbulence members 15 protruding from the inner wall surface of the accommodating cavity 11 extend along a curve, and a plurality of turbulence members 15 extending along the curve are arranged at intervals, so that the laminar flow in the accommodating cavity 11 can form a vortex in the accommodating cavity 11 under the guiding action of the turbulence members 15, thereby accelerating the heat exchange speed of the liquid flow in the accommodating cavity 11 and further improving the cooling efficiency of the cooling device 1.

Embodiments of the present disclosure also provide an electronic device, which may be any electronic device having an electronic component that needs to be cooled during use, and for example, the electronic device may be a server, a processor, a memory, or the like.

In some embodiments, as shown in fig. 5, the electronic device 2 includes: a circuit board 30 and a cooling device 1 as shown in any one of fig. 1 to 4 of the drawings of the specification. The circuit board 30 has an insulating portion and a conductive portion, and different types of electronic components are fixed to the circuit board 30 and connected to the conductive portion of the circuit board 30 according to types of electronic devices to form a circuit required for the electronic device 2, and during operation of the electronic device 2, the electronic components fixed to the circuit board 30 generate heat and transfer or conduct the generated heat to the circuit board 30, and it is necessary to reduce the temperature of the circuit board 30 by the cooling device 1, thereby directly or indirectly reducing the temperature of each electronic component fixed to the circuit board 30. The circuit board 30 may be one or more of an epoxy glass cloth laminate, an aluminum substrate, and a copper substrate. The case 10 is connected to the circuit board, the insulating portion of the circuit board 30 is abutted against the outer surface of the case 10 having the first through hole 12, and the insulating portion of the circuit board 30 covers the first through hole 12, it can be understood that the circuit board 30 can be directly contacted with the cooling liquid in the accommodating cavity 11 through the first through hole 12 of the case 10, thereby improving the heat exchange efficiency between the circuit board 30 and the cooling liquid, thereby improving the cooling efficiency of the cooling device 10 to the circuit board 30, thereby reducing the possibility of the circuit board 30 and the electronic component fixed to the circuit board 30 being damaged due to excessive heat, and at the same time, the insulating portion of the circuit board 30 covers the first through hole 12, thereby reducing the possibility of the cooling liquid leaking out of the accommodating cavity 11 from the first through hole 12, and the cooling liquid is contacted with the insulating portion of the circuit board 30, thereby reducing the short circuit caused by the contact of the conductive portion of the circuit board 30 or the electronic component fixed to the fixing plate 20 with the cooling liquid. The cooling device 1 may be connected to the circuit board 30 by any connection method capable of bringing the housing 10 into close contact with the circuit board 30, and the cooling device 1 may be connected to the circuit board 30 by screw connection, pin connection, clamping connection, or welding, for example.

The embodiment of the disclosure provides an electronic device, the electronic device includes a circuit board having a conductive portion and an insulating portion, and the cooling device provided in the above embodiment, an outer surface of a housing of the cooling device having a first through hole is connected to the circuit board, the insulating portion of the circuit board is abutted against an outer surface of the housing having the first through hole, and the insulating portion covers the first through hole, so that a cooling liquid in the housing can directly contact with the circuit board through the first through hole, cooling efficiency of the cooling device on the circuit board is improved, and further possibility of overheating damage of the circuit board and an electronic component connected with the conductive portion of the circuit board is reduced, and meanwhile, the insulating portion of the circuit board seals the first through hole, so that possibility of leakage of the cooling liquid in the housing from the first through hole to the housing can be reduced, and possibility of short circuit caused by contact of the cooling liquid with the conductive portion of the circuit board or the electronic component fixed to the circuit board can be reduced.

In some embodiments, as shown in fig. 6, the electronic device 2 has a plurality of cooling devices 1, each cooling device 1 is connected to the circuit board 30, and an insulating portion of the circuit board 30 abuts against an outer surface of a housing of each cooling device 1 having the first through hole 12, and the insulating portion of the circuit board 30 covers the first through hole 12 of each cooling device 1, that is, the circuit board 30 is cooled by the plurality of cooling devices 1, thereby further improving the cooling effect of the circuit board 30, and further reducing the possibility of the circuit board 30 and the electronic components fixed to the circuit board 30 being damaged due to excessive heat. Optionally, each cooling device 1 is respectively disposed at a position where the heat productivity of the circuit board 30 is large or is easy to be used for excessive thermal damage, so as to perform targeted cooling on a position where the cooling requirement of the circuit board 30 is high.

In some embodiments, as shown in fig. 7, the electronic device 2 has a plurality of circuit boards 30, and the housing 10 of the cooling device 1 has a plurality of first through holes 12, the housing 10 of the cooling device 1 is connected to each circuit board 30, the insulating portion of each circuit board 30 abuts against the outer surface of the housing of the cooling device 1 having the first through hole 12, and the insulating portion of the circuit board 30 covers each first through hole 12, where the number of the cooling devices 1 may be one or more, and in the case that the number of the cooling devices 1 is 1, the plurality of circuit boards 30 are cooled by one cooling device 1 at the same time, so that the structure of the electronic device 2 is more compact, and the manufacturing cost of the electronic device 2 is reduced; in the case that the number of the cooling devices 1 is plural, the number of the cooling devices 1 may be the same as the number of the circuit boards 2, and the cooling device 1 may cool down one circuit board 30, and the number of the cooling devices 1 may be different from the number of the circuit boards 2, so that the plurality of circuit boards 30 are cooled by one cooling device 1 and/or the plurality of cooling devices 1 cool down the circuit boards 30 together, respectively, so that the arrangement of the circuit boards 30 and the cooling devices 1 is more flexible.

In some embodiments, as shown in fig. 8 and 9, the circuit board 30 has opposing first and second end faces 31, 32, as shown in fig. 8, the first end face 31 having an insulating portion and a conductive portion, as shown in fig. 9, and the second end face having an insulating portion. As shown in fig. 8, the insulating portion of the first end surface 31 covers the first through hole 12, and/or as shown in fig. 9, the insulating portion of the second end surface 32 covers the first through hole 12, it can be understood that cooling the long and wide surfaces of the circuit board 30 by the cooling device improves the contact area of the cooling device 1 with the circuit board 30, and improves the sealing reliability of the circuit board 30 to the first through hole 12. In the case where the insulating portion of the first end face 31 covers the first through hole 12 of the cooling device 1, as shown in fig. 8, the cooling device 1 is located between the electronic components fixed to the first end face 31, so that the possibility of interference between the cooling device 1 and the electronic components is reduced, and optionally, the housing 10 of the cooling device 1 is in contact with the electronic components fixed to the first end face 31 and adjacent to the housing 10, so that the electronic components are cooled in an auxiliary manner by the contact with the electronic components, and the overall cooling effect of the cooling device 1 on the electronic device 2 is further improved.

In some embodiments, as shown in fig. 10, the electronic device 2 further includes a sealing member 40, and the sealing member 40 has a second through hole 41, in a state that the circuit board 30 is connected to the cooling device 1, the sealing member 40 is clamped between the circuit board 30 and the housing 10 of the cooling device 1, it may be understood that the sealing member 40 is located between the circuit board 30 and the outer surface of the housing 10, the sealing member 40 is simultaneously abutted against the circuit board 30 and the sealing member 40 is abutted against the outer surface of the housing 10, at the same time, the inner edge of the second through hole 41 includes the outer edge of the first through hole 12, so that the cooling liquid in the accommodating cavity 11 can contact the circuit board 30 through the first through hole 12 and the second through hole 41, and perform heat exchange with the circuit board 30, and the portion of the circuit board 30 located within the inner edge of the second through hole 41 is an insulating portion, that is, in a state that the sealing member 40 is clamped between the circuit board 30 and the housing 10, the projection of the inner edge of the second through hole 12 on the circuit board 30 forms a projection curve, and the portion of the circuit board 30 within a space enclosed by the projection curve is a portion of the projection curve, so that the portion of the cooling liquid in contact with the insulating portion of the cooling liquid is reduced, and the insulating portion of the cooling liquid is only contacts the insulating portion of the circuit board 30.

In some embodiments, the electronic device 2 further comprises a memory element, which is fixed to the circuit board 30 in fig. 5 and is connected to the conductive portion of the circuit board 30, i.e. the electronic device 2 is a memory. Optionally, the memory further comprises a processing element capable of data processing and/or the memory further comprises a power supply element capable of powering the processing element or the storage element. In other embodiments, the electronic device 2 further comprises a processing element, which is fixed to the circuit board 30 in fig. 4 and is connected to the conductive portion of the circuit board 30, i.e. the electronic device 2 is a data processing device or a control device with data processing function. Optionally, the control device further comprises a storage element capable of storing data or programs, and/or the control device further comprises a processing element capable of processing data.

In some embodiments, as shown in fig. 11, the electronic device 2 further includes: the first power supply unit 50 and the first output unit 60, the first power supply unit 50 is connected to the conductive portion of the circuit board 30, the first output unit 60 is connected to the first power supply unit 50, and is used for outputting the electric energy of the first power supply unit 50, that is, the electronic device 2 is a power source having a control function, and the structure of the electronic device 2 will be exemplarily described below taking the electronic device 2 as a power source having a control function as an example. The first power supply unit 50 is a battery cell capable of storing and outputting electric energy, the first output unit 60 is a copper bar connected with the positive electrode and the negative electrode of the battery cell, the copper bar can output the electric energy stored in the battery cell to the outside of a power supply in a high-voltage electric energy mode, meanwhile, the battery cell is connected with the circuit board 30 through a low-voltage sampling circuit, and the circuit board 30 can acquire state data of each battery cell through the low-voltage sampling circuit and control the state of each battery cell to output electric energy. Alternatively, the first output unit 60 may be a battery module or a battery pack of a battery according to different cell arrangement strategies and power integration strategies of the power supply. Optionally, the power supply device further comprises a storage element capable of storing data or programs, and/or the power supply device further comprises a control element capable of processing data or transmitting control instructions.

The present disclosure also provides a power supply device, which is any device capable of storing electric energy and outputting electric energy, and the power supply device may be a power supply device with a control element or a power supply device without a control element. In some embodiments, as shown in fig. 12, the power supply device 3 includes: a second power supply unit 70 and a second output unit 80, the second output unit 80 being connected with an electrode of the second power supply unit 70 to output electric power of the second power supply unit 70; meanwhile, the power supply device 3 further comprises the cooling device 1 shown in any one of fig. 1 to 4 in the drawings of the specification, the cooling device 1 is connected with the second power supply unit 70, so that the insulation part of the second power supply unit 70 covers the through hole 12 of the cooling device 1, namely, the second power supply unit 70 can be in direct contact with the cooling liquid in the accommodating cavity 11 through the first through hole 12, thereby improving the heat exchange efficiency between the cooling liquid and the second power supply unit 70, further improving the cooling efficiency of the cooling device 1 on the second power supply unit 70, reducing the possibility of thermal runaway of the second power supply unit 70, and meanwhile, the second power supply unit 70 covers the first through hole 12, thereby reducing the possibility of leakage of the cooling liquid from the first through hole 12, and further reducing the possibility of short circuit caused by contact of the conductive parts such as electrodes of the second power supply unit 70 with the cooling liquid.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A cooling device for cooling an electronic device, the cooling device comprising:

a housing having a receiving chamber therein for receiving a cooling liquid;

the outer surface of the shell is provided with a first through hole communicated with the accommodating cavity, the outer surface of the shell with the first through hole is used for being abutted with the electronic device, and the electronic device covers the first through hole.

2. The cooling device of claim 1, further comprising:

and the driving device is used for driving the cooling liquid to flow in the accommodating cavity or driving the cooling liquid to flow into the accommodating cavity and flow out of the accommodating cavity.

3. The cooling device according to claim 1, wherein the housing has a spoiler protruding from an inner wall surface of the accommodating chamber.

4. An electronic device, the electronic device comprising:

the electrical circuit board is provided with a plurality of circuit boards,

and the cooling device according to any one of claims 1 to 3, wherein a housing of the cooling device is connected to the circuit board, the circuit board abuts against an outer surface of the housing having the first through hole, and the circuit board covers the first through hole.

5. The electronic device according to claim 4, wherein the electronic device has a plurality of the cooling devices, each of the cooling devices is connected to the circuit board, the circuit board is abutted against an outer surface of a housing of each of the cooling devices having the first through holes, and the circuit board covers each of the first through holes.

6. The electronic device according to claim 4, wherein the electronic device has a plurality of the circuit boards, and the housing has a plurality of the first through holes, the housing is connected to each of the circuit boards, each of the circuit boards is abutted against an outer surface of the cooling device having the first through holes, and each of the circuit boards covers each of the first through holes.

7. The electronic device of claim 4, wherein the circuit board has opposing first and second end faces, the first end face having a conductive portion and an insulating portion, the second end face having the insulating portion;

the first end surface covers the first through hole, or the second end surface covers the first through hole,

or alternatively, the first and second heat exchangers may be,

the insulating portion of the first end face covers the first through hole, or the insulating portion of the second end face covers the first through hole.

8. The electronic device of any one of claims 4 to 7, further comprising a seal, and wherein the seal has a second through hole; in a state that the circuit board is connected with the cooling device, the sealing piece is clamped between the circuit board and the cooling device, and the inner edge of the second through hole surrounds the inner edge of the first through hole.

9. The electronic device of claim 4, further comprising: a memory element fixed to the circuit board and connected to the conductive portion of the circuit board;

and/or the number of the groups of groups,

the electronic device further includes: a processing element fixed on the circuit board and connected with the conductive part of the circuit board,

and/or the number of the groups of groups,

the electronic device further includes:

a first power supply unit connected with the conductive portion of the circuit board;

and the first output unit is connected with the first power supply unit and is used for outputting the electric energy of the first power supply unit.

10. A power supply device, characterized in that the power supply device comprises:

a second power supply unit having a conductive portion and an insulating portion;

the second output unit is connected with the second power supply unit and is used for outputting the electric energy of the second power supply unit;

a cooling device according to any one of claims 1 to 3, which is connected to the second power supply unit so that the second power supply unit covers the first through hole of the cooling device.