CN112888274A

CN112888274A - Heat radiation structure and vehicle-mounted charger

Info

Publication number: CN112888274A
Application number: CN202110271758.9A
Authority: CN
Inventors: 冯颖盈; 姚顺; 刘钧; 徐金柱; 詹良城; 王虎
Original assignee: Shenzhen Vmax Power Co Ltd
Current assignee: Shenzhen Vmax Power Co Ltd; Shenzhen VMAX New Energy Co Ltd
Priority date: 2021-03-12
Filing date: 2021-03-12
Publication date: 2021-06-01

Abstract

The invention provides a heat dissipation structure and a vehicle-mounted charger, which comprise a base, a heat dissipation water channel extending upwards from the base, a PCB (printed circuit board) positioned above a substrate and electrically connected with a power device, and the vehicle-mounted charger also comprises: and the base plate is arranged on the side surface of the heat dissipation water channel and is provided with at least one power device. According to the heat dissipation structure and the vehicle-mounted charger, the heat dissipation water channel adopts a three-dimensional design which is vertical to the substrate and parallel to the PCB, so that the plane and space utilization rate of the water channel is effectively improved, the heat conduction performance and compact size of the metal substrate are combined, the heat dissipation efficiency and the whole space utilization rate of a power device are improved while the signal transmission and the whole power density are ensured, and the integration, miniaturization and light weight of the vehicle-mounted charger are facilitated; the power device replaces the plug-in unit by surface mounting, so that the consistency is better; the pins are directly arranged on the top end face of the metal substrate to realize power transmission, so that the area is saved, and the effective heat dissipation area of the metal substrate is utilized to the maximum extent.

Description

Heat radiation structure and vehicle-mounted charger

Technical Field

The invention relates to the technical field of power device heat dissipation, in particular to a water-cooled heat dissipation structure and a vehicle-mounted charger.

Background

With the development of electronic technology, electronic devices are increasingly widely used, and meanwhile, the power density of the electronic devices is continuously improved, and the heating power is increased. Therefore, the heat dissipation problem has become a major bottleneck restricting the further development of electronic technology. A great deal of practice shows that: temperature is one of the main causes of electronic device failure, and as temperature increases, the probability of device failure increases exponentially. Electronic devices need to operate near full load for a long time, and solving the heat dissipation problem of such electronic devices faces a great challenge under limited conditions. In the application field such as electric vehicles, for example, the environmental temperature of a motor controller and a vehicle-mounted charger is very high, and since functional elements such as an IGBT, an MOS transistor and a capacitor are included in the parts, the parts are very sensitive to the temperature, and especially in a high-temperature environment, the performance of the parts is slightly affected, and accidents such as explosion and the like are generated.

At present, most of high-power conversion devices used in a power transmission system of a vehicle-mounted charger are of plug-in type, the power devices are directly attached to a metal substrate (an aluminum substrate or a copper substrate), and then the metal substrate is fixed on a plane (parallel to a horizontal plane) water channel. Referring to fig. 1, a conventional planar water channel is adopted to dissipate heat of a power device, and a metal substrate, the water channel and a water channel cover plate 6 are all arranged in parallel to a horizontal plane, so that the plane and space utilization rate of a water channel heat dissipation structure is low, meanwhile, a large number of power switching interfaces on the conventional metal substrate occupy a large amount of area on the metal substrate, and the effective area and utilization rate of the metal substrate for heat dissipation are low.

Therefore, the conventional heat dissipation structure of the power device with the planar water channel and the vehicle-mounted charger have low overall space utilization rate, and are not favorable for improving the power density and meeting the requirement of miniaturization of product integration, which is a technical problem to be solved in the field.

Disclosure of Invention

The invention provides a water-cooled heat dissipation structure suitable for a power device and a vehicle-mounted charger with high space utilization rate and high power density, aiming at solving the technical problems that the overall space utilization rate of the heat dissipation structure of the conventional planar water channel power device and the vehicle-mounted charger are low, and the requirements of improving the power density and miniaturizing the product integration are not facilitated.

In order to solve the problem, the invention adopts the technical scheme that: the utility model provides a heat radiation structure, including the base, locate the heat dissipation water course on the base, be located heat dissipation water course top and the PCB board of being connected with the power device electricity, still include: the base plate is positioned on the side face of the heat dissipation water channel and used for dissipating heat, and the power device is installed on the base plate.

Furthermore, the base plate is parallel to the side face of the heat dissipation water channel, and the base plate is perpendicular to the PCB.

Furthermore, the heat dissipation water channel comprises a water channel body, a water inlet and a water outlet which are arranged on the water channel body, and a water channel inner cavity which is arranged in the water channel body and used for containing cooling liquid, wherein the water channel inner cavity is connected with the water inlet and the water outlet.

Preferably, one side of the water channel body is provided with an opening communicated with the inner cavity of the water channel, and the base plate covers the opening and seals the inner cavity of the water channel through a sealing ring.

Preferably, at least one side of the water channel body is an installation surface, the heat dissipation surface of the substrate is attached to the installation surface, and a heat conduction layer is filled between the heat dissipation surface and the installation surface.

Further, the top end of the substrate is provided with at least one plug port electrically connected with the power device, the PCB is provided with a slot hole allowing the plug port to be inserted, and a conductor used for being electrically connected with the plug port is arranged in the slot hole.

Furthermore, the substrate is pressed on the side surface of the heat dissipation water channel through a pressing piece, and the pressing piece is provided with a notch corresponding to the position of the power device.

Further, the base is provided with at least one pillar, the base plate is provided with a supporting copper bar which corresponds to the pillar and extends towards the pillar, one end of the supporting copper bar is clamped and installed between the top of the pillar and the PCB, and the other end of the supporting copper bar is connected onto the base plate.

Furthermore, the substrate is a metal substrate, one surface of the substrate, which is far away from the heat dissipation water channel, is a working surface, one surface of the substrate, which is close to the heat dissipation water channel, is a heat dissipation surface, the working surface is provided with a power device and a control circuit, which is correspondingly and electrically connected with the power device, and the heat dissipation surface is installed on the side surface of the heat dissipation water channel.

The invention also provides a vehicle-mounted charger which comprises the heat dissipation structure.

Compared with the prior art, the heat dissipation structure and the vehicle-mounted charger provided by the invention have the following beneficial effects:

according to the heat dissipation structure and the vehicle-mounted charger, the heat dissipation water channel adopts a three-dimensional design which is perpendicular to the substrate and parallel to the PCB, so that the plane and space utilization rate of the water channel is effectively improved, the heat dissipation efficiency and the whole space utilization rate of a power device are improved while signal transmission and whole power density are ensured in combination with the strong heat conduction performance of the metal substrate and the compact board surface volume, and the integral integration, the miniaturization and the light weight of the vehicle-mounted charger are facilitated; the power device replaces a plug-in unit by patch mounting, so that the consistency of the power device is better; the pins are directly arranged on the top end face of the metal substrate to realize power transmission, so that the area of the working face of the metal substrate is saved, and the effective heat dissipation area of the metal substrate is utilized to the maximum extent.

Drawings

Fig. 1 is a schematic view of an overall structure of a conventional heat dissipation structure;

fig. 2 is an exploded view of an embodiment of a heat dissipation structure provided in the present invention;

fig. 3 is a schematic view illustrating a connection between a substrate and a PCB according to an embodiment of the heat dissipation structure provided in the present invention;

fig. 4 is a schematic overall structure diagram of an embodiment of a heat dissipation structure provided in the present invention;

FIG. 5 is an exploded view of an embodiment of a heat dissipation structure provided by the present invention;

FIG. 6 is a schematic diagram illustrating a connection between a substrate and a PCB according to an embodiment of the heat dissipation structure of the present invention;

fig. 7 is a schematic overall structure diagram of an embodiment of a heat dissipation structure provided in the present invention;

fig. 8 is an exploded view of another embodiment of a heat dissipation structure according to the present invention.

Wherein, in the drawings, the reference numerals are mainly as follows:

1-a PCB board; 11-a first slot; 12-a second slot; 13-drilling; 2-a substrate; 21-a power device; 22-a control circuit; 23-pin; 231-pads; 24-signal terminals; 25-supporting copper bars; 26-power copper bar; 3-a heat dissipation water channel; 31-a pillar; 32-water channel lumen; 33-sealing ring; 34-a base; 4-pressing piece; 41-notch; 5-a screw; 6-water channel cover plate.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to fig. 2 to 8 and embodiments.

The invention provides a heat dissipation structure, which comprises a base 34, wherein the base 34 is preferably a plate-shaped part and is connected with a bottom plate of a shell of a vehicle-mounted charger into a whole during assembly; locate heat dissipation water course 3 on base 34, this heat dissipation water course 3 upwards extends from base 34, and this heat dissipation water course 3 is made by the heat conduction material, includes: a waterway body provided on the base 34, preferably integrally formed with the base 34; a water inlet and a water outlet (not shown) formed on the water channel body, and a water channel inner chamber 32 formed in the water channel body and connected to the water inlet and the water outlet for receiving a coolant.

The PCB board 1 is positioned above the heat dissipation water channel 3 and electrically connected with the power device 21, the substrate 2 is positioned on the side surface of the heat dissipation water channel 3 and conducts heat dissipation by utilizing the heat dissipation water channel 3, the substrate 2 is provided with at least one power device 21, and the substrate 2 is preferably a metal substrate 2, such as an aluminum substrate 2 or a copper substrate 2; the power device 21 is preferably a power tube. As an embodiment, the water channel body of the heat dissipation water channel 3 is rectangular and perpendicular to the base 34, and the substrate 2 is perpendicular to the base 34 and parallel to the side surface of the water channel body; the PCB board 1 is parallel to the base 34, i.e. the substrate 2 is parallel to the water channel body of the heat dissipation water channel 3 and perpendicular to the PCB board 1.

At least one side surface of the water channel body of the heat dissipation water channel 3 is an installation surface, and the heat dissipation surface of the substrate 2 is attached to the installation surface. In one embodiment, a heat conducting layer is filled between the heat dissipation water channel 3 and the substrate 2. The heat conduction layer is preferably made of heat conduction silicone grease, the heat conduction silicone grease is filled in a gap between the mounting surface of the heat dissipation water channel 3 and the heat dissipation surface of the substrate 2, so that the contact area between the mounting surface and the heat dissipation surface is increased, and meanwhile, the heat conduction performance between the heat dissipation water channel 3 and the substrate 2 is enhanced through the heat conduction layer made of the heat conduction silicone grease between the heat dissipation water channel 3 and the substrate 2, so that the heat dissipation efficiency of the heat dissipation water channel 3 to the substrate 2 is improved. As a preferred embodiment, both side surfaces of the water channel body of the heat dissipation water channel 3 are installation surfaces, the base plates 2 are respectively arranged on the bases 34 at both sides of the water channel body of the heat dissipation water channel 3, the area of the base plates 2 and the number of the power devices 21 are multiplied on the premise of slightly increasing the structural volume, and the heat dissipation efficiency, the space utilization rate and the overall power density of the heat dissipation water channel 3 to the power devices 21 are improved.

As an embodiment, the base plate 2 is pressed against the heat dissipation water channel 3 by a pressing member 4, and the pressing member 4 is preferably an L-shaped plate member composed of a continuous bottom plate fixed to the base 34 by screws 5 and a side plate pressing the base plate 2 against the heat dissipation water channel 3 and clamped between the heat dissipation water channel 3 and the base plate 2. In a preferred embodiment, the power device 21 and other elements are disposed on the surface of the substrate 2 opposite to the heat dissipation surface, the side plate of the pressing member 4 is provided with a notch 41 corresponding to the power device 21 for enhancing the heat dissipation capability of the power device 21, and the notch 41 limits the displacement of the power device 21 and the substrate 2 in the direction parallel to the heat dissipation water channel 3, i.e., plays a role of positioning the substrate 2.

In one embodiment, the base 34 is provided with at least one pillar 31, the substrate 2 is provided with a supporting copper bar 25 corresponding to the pillar 31 and extending towards the pillar 31, one end of the supporting copper bar 25 is clamped between the top of the pillar 31 and the PCB1, and the other end of the supporting copper bar 25 is connected to the substrate 2. As an embodiment, the top of the one end of the supporting copper bar 25 is connected to the PCB board 1, the bottom of the one end of the supporting copper bar 25 is connected to the top of the pillar 31, the other end of the supporting copper bar 25 is connected to the base plate 2, the screw 5 penetrates through the corresponding mounting hole of the PCB board 1 and the supporting copper bar 25 and is screwed into the threaded hole in the top of the pillar 31, and the supporting copper bar 25 and the pillar 31 play a supporting role in supporting the PCB board 1.

The top end of the substrate 2 is provided with at least one plug port electrically connected with the power device 21, the PCB board 1 is provided with a slot hole allowing the plug port to be inserted, a conductor used for electrically connecting with the plug port is arranged in the slot hole, and the conductor is preferably a metal piece made of metal such as copper, aluminum and the like and is welded in the slot hole through reflow soldering.

As an embodiment, the plug port is a pin 23 provided on the top end surface of the substrate 2 and extending upward, and the pin 23 is preferably integrally formed with the substrate 2; the PCB board 1 is provided with a first slot 11 corresponding to the power connection of the pin 23. One sidewall of the lead 23 is provided with a pad 231, and one sidewall of the first slot 11 is provided with a conductor corresponding to the pad 231. The pins 23 are directly arranged on the top end face of the metal substrate 2 to realize power transmission, so that the area of the metal substrate 2 occupied by the pins 23 is saved, and the effective heat dissipation area of the metal substrate 2 is utilized to the maximum extent.

As an embodiment, the plug port is at least one power copper bar 26 disposed on the top of the substrate 2, and the power copper bar 26 is preferably reflow-soldered on the top of the side of the substrate 2 away from the heat sink water channel 3; the PCB board 1 is provided with a second slot 12 in power connection with the power copper bar 26, and four side walls of the second slot 12 are made of conductors and are in one-to-one power connection with four side walls of the port of the power copper bar 26.

As an embodiment, a power device 21 and a control circuit 22 electrically connected to the power device 21 are disposed on a surface of the substrate 2 away from the heat sink water channel 3, and the power device 21 is soldered on the substrate 2; the top of the substrate 2 is provided with at least one signal terminal 24 which is electrically connected with the control circuit 22 correspondingly and is electrically connected with the PCB board 1, and the signal terminal 24 is preferably soldered on the top of one surface of the substrate 2 far away from the heat dissipation water channel 3 by reflow soldering; the PCB board 1 is provided with a drill hole 13 correspondingly connected with the signal terminal 24, and the side wall of the drill hole 13 is provided with a conductor corresponding to the signal terminal 24.

As an embodiment, the substrate 2 is a metal substrate 2, which has good heat conduction capability and compact board surface volume, and realizes rapid heat conduction from the power device 21 to the heat dissipation water channel 3, and improves the space utilization rate and the overall power density of the heat dissipation water channel 3. The surface of the substrate 2 away from the heat dissipation water channel 3 is a working surface, the surface close to the heat dissipation water channel 3 is a heat dissipation surface, the working surface is provided with a power device 21, a power copper bar 26 and a control circuit 22 correspondingly and electrically connected with the power device 21, and the heat dissipation surface is installed on the side surface of the heat dissipation water channel 3.

In a preferred embodiment, an opening communicating with the water channel inner cavity 32 is provided at a side of the water channel body of the heat dissipation water channel 3 close to the base plate 2, and the base plate 2 is connected to the water channel body and seals the water channel inner cavity 32 by a sealing ring 33. The sealing ring 33 is preferably a sealing rubber ring, and may also be made of plastic, and is used for sealing the base plate 2 and the waterway inner cavity 32 at the joint of the opening of the waterway body close to the base plate 2.

The invention also provides a vehicle-mounted charger which comprises the power device 21 heat dissipation structure. The vehicle-mounted motor controller can also use the heat dissipation structure of the power device 21 provided by the invention.

The invention provides a power device 21 heat dissipation structure and a vehicle-mounted charger, which are assembled:

the method comprises the steps of integrally forming pins 23 on a metal substrate 2, welding a power device 21 (the power device 21 is formed by surface mounting and reflow soldering instead of a plug-in, so that the consistency of the power device 21 is better), a power copper bar 26, a control circuit 22, a signal terminal 24 and a supporting copper bar 25 on the working surface of the metal substrate 2 through reflow soldering, coating heat-conducting silicone grease on the mounting surface of a water channel body of a heat-radiating water channel 3, then enabling the metal substrate 2 to be close to the mounting surface of the heat-radiating water channel 3 and to be placed on a base 34, fixedly mounting a pressing piece 4 on the base 34 through a screw 5, and enabling the metal substrate 2 to be tightly pressed on the heat-radiating water channel. Then, the conductors of the slots or the drilled holes 13 of the PCB1 are soldered to the corresponding plug ports on the substrate 2 (wherein the pads 231 of the pins 23 are soldered to the conductors on the corresponding side walls in the first slot 11 by wave soldering), so as to transmit power and control signals. Simultaneously will support the copper bar 25 and arrange the top of pillar 31 in, support the top of copper bar 25 and support in the bottom of PCB board 1, pass PCB board 1, support the corresponding mounting hole of copper bar 25 and screw in the screw hole at pillar 31 top with screw 5, realize the support to PCB board 1.

The invention provides a power device 21 heat dissipation structure and a vehicle-mounted charger, wherein when in work:

when the power circuit on the PCB1 and the metal substrate 2 works, the cooling liquid is introduced from the water inlet of the water channel body of the heat dissipation water channel 3 and filled into the water channel inner cavity 32, so that the cooling liquid flows in the water channel inner cavity 32 and flows out of the water channel body through the water outlet on the water channel body, at this time, the heat generated by the power device 21 on the metal substrate 2 is transferred to the heat dissipation water channel 3 through the metal substrate 2 and the heat conduction layer, and finally, the heat is taken away by the cooling liquid in the water channel inner cavity 32 of the heat dissipation water channel 3, thereby realizing the heat dissipation of the power device 21 in.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a heat radiation structure, includes the base, locates heat dissipation water course on the base is located the PCB board that heat dissipation water course top and power device electricity are connected, its characterized in that still includes: and the power device is arranged on the substrate.

2. The heat dissipating structure of claim 1, wherein said base plate is parallel to a side of said heat dissipating water channel, said base plate being perpendicular to said PCB.

3. The heat dissipating structure of claim 1, wherein said heat dissipating waterway comprises a waterway body, a water inlet and a water outlet disposed on said waterway body, and a waterway cavity disposed in said waterway body and configured to receive a coolant, said waterway cavity connecting said water inlet and said water outlet.

4. The heat dissipating structure of claim 3, wherein an opening is formed at one side of the waterway body to communicate with the waterway inner cavity, and the base plate covers the opening and seals the waterway inner cavity by a sealing ring.

5. The heat dissipating structure of claim 3, wherein at least one side of said waterway body is a mounting surface, said heat dissipating surface of said substrate is attached to said mounting surface, and a heat conductive layer is filled between said heat dissipating surface and said mounting surface.

6. The heat dissipating structure of any one of claims 1 to 5, wherein the top end of the substrate is provided with at least one plug port electrically connected to the power device, and the PCB board is provided with a slot hole allowing the plug port to be inserted therein, and a conductor for electrically connecting to the plug port is disposed in the slot hole.

7. The heat dissipating structure of any one of claims 1 to 5, wherein the base plate is pressed against the side surface of the heat dissipating water passage by a pressing member provided with a notch corresponding to the position of the power device.

8. The heat dissipating structure of any one of claims 1 to 5, wherein the base has at least one pillar, the substrate has a supporting copper bar corresponding to the pillar and extending toward the pillar, one end of the supporting copper bar is clamped between the top of the pillar and the PCB, and the other end of the supporting copper bar is connected to the substrate.

9. The heat dissipation structure according to any one of claims 1 to 5, wherein the substrate is a metal substrate, a surface of the substrate away from the heat dissipation water channel is a working surface, a surface close to the heat dissipation water channel is the heat dissipation surface, the working surface is provided with the power device and a control circuit electrically connected to the power device, and the heat dissipation surface is installed on a side surface of the heat dissipation water channel.

10. A vehicle-mounted charger characterized by comprising the heat dissipation structure according to any one of claims 1 to 9.