CN221151828U - Heat radiation structure of power device in controller - Google Patents
Heat radiation structure of power device in controller Download PDFInfo
- Publication number
- CN221151828U CN221151828U CN202322633378.2U CN202322633378U CN221151828U CN 221151828 U CN221151828 U CN 221151828U CN 202322633378 U CN202322633378 U CN 202322633378U CN 221151828 U CN221151828 U CN 221151828U
- Authority
- CN
- China
- Prior art keywords
- heat
- power device
- controller
- shell
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 52
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 47
- 239000004020 conductor Substances 0.000 claims abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 10
- 230000000191 radiation effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000010276 construction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat radiation structure of a power device in a controller with double-sided heat radiation, thereby greatly improving the heat radiation effect, comprising: the power device comprises a shell, wherein a metal heat conduction boss higher than the plastic package body is arranged in the plastic package body of the power device, so that metal heat dissipation surfaces are arranged on the front surface and the back surface of the power device; the specific structure of the shell comprises: the upper shell and the lower shell are arranged together, and heat dissipation parts are arranged in the upper shell and the lower shell and opposite to the power device; the two metal radiating surfaces of the power device are respectively arranged on the radiating parts at the corresponding sides through the heat conductors. The heat radiation structure of the power device in the controller can be widely applied to various power controllers such as electric vehicle controllers and the like.
Description
Technical Field
The utility model relates to a power controller, in particular to a heat dissipation structure of a power device in the controller.
Background
As is well known, in various power controllers such as electric vehicle controllers, a power device is generally provided on a control board thereof, and for this purpose, the controller is provided with a heat dissipation structure that cooperates with the power device. At present, the conventional heat dissipation structure generally dissipates heat on one side, namely: the radiating surface of the power device is attached to the shell through the insulating heat conducting pad (film), so that the radiating effect is poor.
Disclosure of utility model
The technical problems to be solved by the utility model are as follows: the heat dissipation structure of the power device in the controller is provided, wherein the heat dissipation structure is capable of dissipating heat from two sides, and therefore the heat dissipation effect is greatly improved.
In order to solve the technical problems, the utility model adopts the following technical scheme: a heat dissipation structure for a power device in a controller, comprising: the plastic package body of the power device is provided with a metal heat conduction boss higher than the plastic package body, so that the front surface and the back surface of the power device are provided with metal heat radiation surfaces; the shell includes: the upper shell and the lower shell are arranged together, and heat dissipation parts are arranged in the upper shell and the lower shell and opposite to the power device; the two metal radiating surfaces of the power device are respectively arranged on the radiating parts at the corresponding sides through the heat conductors.
In the heat dissipation structure of the power device in the controller, as a preferable scheme, one side of the heat conductor is an aluminum substrate, the other side of the heat conductor is a ceramic plate, and a limiting protruding part matched with the ceramic plate is arranged on an upper shell or a lower shell corresponding to the ceramic plate.
In a preferred scheme, in the heat dissipation structure of the power device in the controller, the heat conductors at two sides are all aluminum substrates.
In a preferred embodiment, in the heat dissipation structure of a power device in the controller, the heat dissipation portion is provided with a heat dissipation fin.
As a preferred solution, in the heat dissipation structure of the power device in the controller, the upper shell is provided with a heat dissipation body with a split structure as a heat dissipation part thereof, and the specific arrangement mode is as follows: and a fin mounting hole matched with the radiating fin is formed in the upper shell, and a heat conduction sealing body is arranged between the radiating fin and the fin mounting hole.
In a preferred scheme, in the heat dissipation structure of the power device in the controller, the upper shell is provided with an annular sealing groove surrounding the fin mounting hole, and the heat conduction sealing body is arranged in the annular sealing groove.
As a preferred scheme, in the heat dissipation structure of the power device in the controller, the upper shell and the heat dissipation part therein are of an integrated structure.
As a preferable scheme, in the heat dissipation structure of the power device in the controller, a hollow heat conduction pipe is arranged between the upper shell and the corresponding heat conductor.
In a preferred scheme, in the heat dissipation structure of the power device in the controller, a heat dissipation installation groove matched with a heat conduction pipe is formed in the back surface of the upper shell, and the heat conduction pipe is arranged in the heat dissipation installation groove of the upper shell.
In a preferred embodiment, in the heat dissipation structure of the power device in the controller, the lower case and the heat dissipation part therein are integrally formed.
As a preferable scheme, in the heat dissipation structure of the power device in the controller, a hollow heat conduction pipe is arranged between the lower shell and the corresponding heat conductor.
The beneficial effects of the utility model are as follows:
1. According to the utility model, the metal heat conduction boss higher than the plastic package body is arranged in the plastic package body of the power device, so that the front and back surfaces of the power device are provided with the metal heat dissipation surfaces, and the two metal heat dissipation surfaces of the power device can be correspondingly attached to the heat dissipation parts in the upper and lower shells one by one through the heat transfer body, thus the heat dissipation effect is greatly improved.
2. Through setting up split structure with the radiating portion wherein upper shell to can need not to change the design of whole upper shell when changing radiating fin, shorten design cycle greatly, also avoided simultaneously leading to whole upper shell to scrap because of changing radiating fin's structure, thereby saved the cost.
3. The metal radiating surfaces on the front side and the back side of the power device are arranged on the aluminum substrate, so that the heat conductor is not required to be positioned, and meanwhile, the metal radiating surfaces are more compact in structure with the aluminum substrate, and the radiating effect is improved.
4. By arranging the hollow heat conducting pipe between the upper shell and the corresponding heat conductor, a heat conducting medium can be added into the heat conducting pipe, so that the heat dissipation effect is further improved.
Drawings
Fig. 1 is a schematic front view of a first embodiment of the present utility model.
Fig. 2 is a schematic diagram of an exploded structure of a first embodiment of the present utility model.
The reference numerals in fig. 1 and 2 are: 1. the device comprises an upper shell, 111, an upper radiating fin, 12, a limiting protruding part, 2, a lower shell, 211, a lower radiating fin, 3, an in-line MOS tube, 31, a metal heat conduction boss, 4, a printed circuit board, 5, an aluminum substrate, 6 and a ceramic wafer.
Fig. 3 is a schematic front view of a second embodiment of the present utility model.
Fig. 4 is a schematic diagram of an exploded construction of a second embodiment of the present utility model.
The reference numerals in fig. 3 and 4 are: 1. the heat conducting device comprises an upper shell, 111, an upper radiating fin, 12, a limiting protruding portion, 2, a lower shell, 211, a lower radiating fin, 3, an in-line MOS tube, 31, a metal heat conducting boss, 4, a printed circuit board, 5, an aluminum substrate, 6, a ceramic wafer, 9 and a heat conducting tube.
Fig. 5 is a schematic diagram of a front view of a third embodiment of the present utility model.
Fig. 6 is a schematic diagram of an exploded construction of a third embodiment of the present utility model.
The reference numerals in fig. 5 and 6 are: 1. the heat conducting plate comprises an upper shell, 111, an upper radiating fin, 13, a radiating installation groove, 2, a lower shell, 211, a lower radiating fin, 3, a patch type MOS tube, 31, a metal heat conducting boss, 4, a printed circuit board, 5, a lower aluminum substrate, 8, an upper aluminum substrate and 9 heat conducting pipes.
Fig. 7 is a schematic diagram of a front view of a fourth embodiment of the present utility model.
Fig. 8 is a schematic diagram of an exploded construction of a fourth embodiment of the present utility model.
The reference numerals in fig. 7 and 8 are: 1. the heat-conducting structure comprises an upper shell, 110, an upper heat-radiating body, 111, an upper heat-radiating fin, 14, a fin mounting hole, 18, a heat-conducting sealing body, 2, a lower shell, 211, a lower heat-radiating fin, 3, a patch type MOS tube, 31, a metal heat-conducting boss, 4, a printed circuit board, 5, a lower aluminum substrate, 8 and an upper aluminum substrate.
Fig. 9 is a schematic front view of a fifth embodiment of the present utility model.
Fig. 10 is a schematic view of an exploded construction of a fifth embodiment of the present utility model.
The reference numerals in fig. 9 to 10 are: 1. the heat conducting plate comprises an upper shell, 110, an upper heat radiating body, 111, an upper heat radiating fin, 14, a fin mounting hole, 141, an annular sealing groove, 18, a heat conducting sealing body, 2, a lower shell, 211, a lower heat radiating fin, 3, a patch type MOS tube, 31, a metal heat conducting boss, 4, a printed circuit board, 5, a lower aluminum substrate, 8 and an upper aluminum substrate.
Detailed Description
Specific embodiments of a heat dissipation structure of a power device in a controller according to the present utility model are described in detail below with reference to the accompanying drawings.
Example 1:
As shown in fig. 1 and 2, a heat dissipation structure of a power device in a first controller according to the present utility model includes: the power device is a row of direct-insert type MOS tubes 3, which are arranged on a printed circuit board 4, the back surface of the direct-insert type MOS tube 3 is a first metal radiating surface, and a metal heat conduction boss 31 higher than the plastic package body is arranged in the plastic package body of the direct-insert type MOS tube 3, so that a second metal radiating surface is formed on the surface of the metal heat conduction boss 31; the upper shell 1 and the heat dissipation part of the upper shell are of an integrated structure, and the upper shell 1 is provided with an upper heat dissipation fin 111 opposite to the first metal heat dissipation surface of the row of in-line MOS tubes 3; the lower shell 2 and the heat dissipation part of the lower shell are of an integrated structure, and the lower shell 2 is provided with a lower heat dissipation fin 211 opposite to the second metal heat dissipation surface of the row of in-line MOS tubes 3; a ceramic plate 6 serving as a heat conductor is arranged between the upper shell 1 and the first metal radiating surface of the direct-insert type MOS tube 3, and a limiting protruding part 12 for limiting the ceramic plate 6 is also arranged on the upper shell 1; an aluminum substrate 5 serving as a heat conductor is arranged between the lower shell 2 and the second metal heat radiating surface of the direct-insert type MOS tube 3, and the second metal heat radiating surface of the direct-insert type MOS tube 3 is directly welded on the aluminum substrate 5.
Example 2:
As shown in fig. 3 and 4, the heat dissipation structure of the power device in the second controller according to the present utility model is identical to the structure of embodiment 1 except that a hollow heat conduction pipe 9 is disposed between the aluminum substrate 5 and the lower case 2, and will not be described again.
Example 3:
As shown in fig. 5 and 6, a heat dissipation structure of a power device in a third controller according to the present utility model includes: the power device is a row of patch type MOS tubes 3, the back surface of each patch type MOS tube 3 is a first metal radiating surface, a metal heat conduction boss 31 higher than the plastic package body is arranged in the plastic package body of each patch type MOS tube 3, and a second metal radiating surface is formed on the surface of each metal heat conduction boss 31; the upper shell 1 and the radiating part of the upper shell are of an integrated structure, an upper radiating fin 111 is arranged on the upper shell 1 opposite to the second metal radiating surface of the row of patch type MOS tubes 3, a radiating installation groove 13 is formed on the back surface of the upper shell 1 opposite to the second radiating surface of the row of patch type MOS tubes 3, a hollow heat conducting tube 9 is arranged in the radiating installation groove 13, an upper aluminum substrate 8 serving as a heat conductor is arranged between the heat conducting tube 9 and the second metal radiating surface of the patch type MOS tube 3, and the second metal radiating surface of the patch type MOS tube 3 is directly welded on the upper aluminum substrate 8; the lower shell 2 and the radiating part of the lower shell are of an integrated structure, the lower shell 2 is provided with a lower radiating fin 211 opposite to the second metal radiating surface of the patch type MOS tube 3, a lower aluminum substrate 5 serving as a heat conductor is arranged between the lower shell 2 and the first metal radiating surface of the patch type MOS tube 3, and the leading-out pin of the patch type MOS tube 3 and the first metal radiating surface are directly welded on the lower aluminum substrate 5 (the leading-out pin of the patch type MOS tube 3 is not welded on the printed circuit board 4).
Example 4:
As shown in fig. 7 and 8, a heat dissipation structure of a power device in a fourth controller according to the present utility model includes: the power device is a row of patch type MOS tubes 3, the back surface of each patch type MOS tube 3 is a first metal radiating surface, a metal heat conduction boss 31 higher than the plastic package body is arranged in the plastic package body of each patch type MOS tube 3, and a second metal radiating surface is formed on the surface of each metal heat conduction boss 31; the upper shell 1 is provided with a split upper radiator 110 as a radiating part thereof, the upper radiator 110 is provided with an upper radiating fin 111, the upper shell 1 is provided with a fin mounting hole 14 matched with the radiating fin 111, a heat conduction sealing body 18 formed by heat conduction silica gel is arranged between the radiating fin 111 and the side wall of the fin mounting hole 14, an upper aluminum substrate 8 serving as a heat conductor is arranged between the upper radiator 110 and a second metal radiating surface of the patch type MOS tube 3, and the second metal radiating surface of the patch type MOS tube 3 is directly welded on the upper aluminum substrate 8; the lower shell 2 and the radiating part of the lower shell are of an integrated structure, the lower shell 2 is provided with a lower radiating fin 211 opposite to the second metal radiating surface of the patch type MOS tube 3, a lower aluminum substrate 5 serving as a heat conductor is arranged between the lower shell 2 and the first metal radiating surface of the patch type MOS tube 3, and the leading-out pin of the patch type MOS tube 3 and the first metal radiating surface are directly welded on the lower aluminum substrate 5 (the leading-out pin of the patch type MOS tube 3 is not welded on the printed circuit board 4).
Example 5:
As shown in fig. 9 and 10, the heat dissipation structure of the power device in the fifth controller according to the present utility model is identical to the structure of embodiment 1 except that the upper case is provided with the annular sealing groove 141 surrounding the fin mounting hole 14, so that the side walls of the upper heat dissipation fin 111 and the annular sealing groove 141 form the heat conduction sealing body 18 formed by the heat conduction silica gel, and the details thereof are not repeated.
The foregoing description is only illustrative of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, but rather the equivalent variations and modifications in shape, construction, characteristics and spirit according to the scope of the claims should be construed to be included in the scope of the claims.
Claims (11)
1. A heat dissipation structure for a power device in a controller, comprising: the power device comprises a shell and is characterized in that a metal heat conduction boss higher than the plastic package body is arranged in the plastic package body of the power device, so that metal heat dissipation surfaces are arranged on the front surface and the back surface of the power device; the shell includes: the upper shell and the lower shell are arranged together, and heat dissipation parts are arranged in the upper shell and the lower shell and opposite to the power device; the two metal radiating surfaces of the power device are respectively arranged on the radiating parts at the corresponding sides through the heat conductors.
2. The heat radiation structure of power device in controller according to claim 1, wherein the heat conductor on one side is an aluminum substrate, the heat conductor on the other side is a ceramic plate, and the upper shell or the lower shell corresponding to the ceramic plate is provided with a limit protruding part matched with the ceramic plate.
3. The heat dissipating structure of a power device in a controller of claim 1, wherein the heat conductors on both sides are aluminum substrates.
4. The heat dissipating structure of the power device in the controller of claim 1, wherein the heat dissipating portion is provided with heat dissipating fins.
5. The heat dissipation structure of a power device in a controller according to any one of claims 1 to 4, wherein the upper case is provided with a heat dissipation body having a split structure as a heat dissipation portion thereof, and specifically provided in the following manner: and a fin mounting hole matched with the radiating fin is formed in the upper shell, and a heat conduction sealing body is arranged between the radiating fin and the fin mounting hole.
6. The heat dissipating structure of a power device in a controller as set forth in claim 5, wherein said upper housing is provided with an annular sealing groove surrounding the fin mounting hole, and said heat conductive sealing body is disposed in said annular sealing groove.
7. The heat dissipating structure of a power device in a controller according to any one of claims 1 to 4, wherein the upper case and the heat dissipating part are of an integral structure.
8. The heat dissipating structure of the power device in the controller of claim 7, wherein a hollow heat pipe is disposed between the upper case and the corresponding heat conductor.
9. The heat dissipating structure of the power device in the controller of claim 8, wherein the back surface of the upper case is provided with a heat dissipating mounting groove that mates with the heat conducting pipe, and the heat conducting pipe is disposed in the heat dissipating mounting groove of the upper case.
10. The heat dissipating structure of a power device in a controller according to any one of claims 1 to 4, wherein the lower case and the heat dissipating part are of an integral structure.
11. The heat dissipating structure of a power device in a controller of claim 10, wherein a hollow heat pipe is disposed between the lower housing and the corresponding heat conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322633378.2U CN221151828U (en) | 2023-09-27 | 2023-09-27 | Heat radiation structure of power device in controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322633378.2U CN221151828U (en) | 2023-09-27 | 2023-09-27 | Heat radiation structure of power device in controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221151828U true CN221151828U (en) | 2024-06-14 |
Family
ID=91385343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322633378.2U Active CN221151828U (en) | 2023-09-27 | 2023-09-27 | Heat radiation structure of power device in controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221151828U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117098373A (en) * | 2023-09-27 | 2023-11-21 | 杨志荣 | A heat dissipation structure for power devices in a controller |
-
2023
- 2023-09-27 CN CN202322633378.2U patent/CN221151828U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117098373A (en) * | 2023-09-27 | 2023-11-21 | 杨志荣 | A heat dissipation structure for power devices in a controller |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112888274B (en) | Heat dissipation structure and on-board charger | |
| CN217283820U (en) | Power supply with air cooling and liquid cooling device | |
| CN112397465A (en) | Chip heat radiation structure | |
| CN221151828U (en) | Heat radiation structure of power device in controller | |
| JPH11329616A (en) | Connector and connection structure using connector | |
| CN215647962U (en) | Mobile phone heat dissipation mainboard based on copper material | |
| CN215301255U (en) | Heat radiation structure and vehicle-mounted charger | |
| CN215991724U (en) | Circuit board with heat dissipation function | |
| CN215871957U (en) | Fine circuit flexible circuit board combining thick gold, immersion gold and OSP | |
| CN117098373A (en) | A heat dissipation structure for power devices in a controller | |
| CN117219587A (en) | Heat radiation structure and diode module | |
| CN211321839U (en) | Radiator with built-in power resistor | |
| CN223844089U (en) | Radiator, power module heat dissipation module and vehicle-mounted charger | |
| CN222638557U (en) | Mobile terminal heat dissipation support | |
| CN223080287U (en) | Controller device and electric vehicle | |
| CN223157294U (en) | A circuit board heat dissipation structure | |
| CN223844277U (en) | Power module heat dissipation module, on-board charger and electronic control equipment | |
| CN208638869U (en) | A kind of radiator structure | |
| CN219421152U (en) | Novel combined universal integrated circuit board | |
| CN216671607U (en) | Power field effect transistor (Mosfet) double-sided cooling application structure | |
| CN223693048U (en) | Automobile solid-state relay | |
| CN223816264U (en) | Heat dissipation module of inverter and photovoltaic inverter | |
| CN216744266U (en) | Heat radiation structure and circuit board used by LED lamp | |
| CN223067378U (en) | Heat abstractor, power and server power | |
| CN222260006U (en) | A radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |