CN216982389U - Heat sink and electrical device - Google Patents
Heat sink and electrical device Download PDFInfo
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- CN216982389U CN216982389U CN202220224203.9U CN202220224203U CN216982389U CN 216982389 U CN216982389 U CN 216982389U CN 202220224203 U CN202220224203 U CN 202220224203U CN 216982389 U CN216982389 U CN 216982389U
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Abstract
The utility model provides a heat dissipation device and electrical equipment, wherein the heat dissipation device comprises a fin substrate, a top cover and a fan, the fin substrate is provided with a cooling liquid channel, a channel inlet and a channel outlet, the channel inlet and the channel outlet are both communicated with the cooling liquid channel, an opening is arranged above the cooling liquid channel, a device contact surface is arranged on the fin substrate, and the device contact surface is positioned on the bottom wall of the fin substrate. The top cover is arranged on the fin base plate and covers the opening, and a top cover fin group is arranged on one side, opposite to the fin base plate, of the top cover and corresponds to the cooling liquid channel up and down. The fan is disposed adjacent the header fin set. The heat dissipation device is high in universality, can dissipate heat for all heating elements in the electrical equipment, and is good in heat dissipation effect.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device and electrical equipment.
Background
The electric energy consumed by the electronic components is finally almost converted into heat energy. The electronic component is kept at a proper working temperature by using forced convection heat dissipation, so that the service life of the electronic component can be prolonged, the operation stability is improved, and the operation performance of the electronic component is improved. Especially, electronic components such as a CPU, a display card and an IGBT module which have large power consumption and high heat flux density must use a special heat dissipation device to ensure normal work.
The most common heat sinks for electronic components today are air-cooled heat sinks. Which places a fan over a circular heat sink for creating forced convection air. The base bottom surface of the heat sink is in contact with the heat source and conducts heat into the radial fin sets on the base. Similar designs are widely used to dissipate heat from CPU and graphics card products commonly found in the market. When the heat dissipation capacity is required to be larger and the area of the fin is larger, in order to enhance the conduction of heat in the fin, the air-cooled radiator adopts a heat pipe or a heat equalizing plate technology, the heat equalizing plate or the heat pipe is used as a base plate of the heat sink, and the heat pipe is vertically inserted in the fin.
The biggest problem of the air-cooled heat dissipation technology is the limited heat dissipation capability due to the low density and low thermal conductivity of air. When the heat dissipation capacity is larger, the common technical scheme is to reduce the air temperature, increase the number of the heat pipes and the fins, increase the size of the fins and improve the wind speed. To ensure stable operation of the electronic components, the temperature of the air supply typically needs to be kept below ambient temperature. Facilities such as a water chilling unit, a cooling tower, a circulating water pump, a machine room precise air conditioner, a ventilation pipeline and the like are utilized, so that on one hand, investment is increased, and on the other hand, energy consumption is also increased. Generally speaking, no matter how to increase the heat exchange area and increase the wind speed, the heat dissipation capability of the air-cooled heat dissipation technology is very limited. With the increasing energy density of integrated circuits, the use of air-cooled heat dissipation has gradually failed to meet the heat dissipation requirements.
Compared with air, the specific heat and the thermal conductivity of various liquid working media are higher, so that the forced convection of the liquid is used for heat dissipation, and higher heat dissipation capacity can be provided. According to the packaging form of liquid, the common liquid cooling heat dissipation technologies are divided into immersion type liquid cooling and cold plate type liquid cooling. Disadvantages of immersion liquid cooling include heavy weight, equipment corrosion, high working medium cost, inconvenient maintenance, etc. The equipment to be cooled is typically custom designed to match the immersed liquid working fluid and to accommodate this form of heat removal in mechanical design and heat transfer.
The application of liquid cooling cold plate heat dissipation technology is wider than that of immersion liquid cooling, and air cooling heat dissipation technology is gradually replaced. The problem of heat dissipation of the liquid cooling cold plate is that the cold plate can only cover main heat sources such as a CPU, a display card, an IGBT module and the like, and can not cool other heating elements on the circuit board. Therefore, in an apparatus including a plurality of electronic components, such as a server, it is necessary to simultaneously perform air cooling and heat dissipation in addition to the use of the liquid cooling plate. In practice, some of the heat sinks of the servers themselves still need to be retained, or back door heat exchangers or air walls are used to allow air to circulate within the servers. Meanwhile, the environment in the machine room still needs to be cooled by an air conditioner.
In order to allow liquid cooling to meet the heat dissipation requirements of all elements in the equipment, one solution is to use a large cold plate to cover all the heating elements. For example, an integrated cold plate disclosed in US8358505B2 is a server motherboard cold plate that covers a majority of the heat generating units on the motherboard. The problems with this design are that the cold plate is bulky, complex to machine, heavy and expensive. Moreover, the cold plate is completely customized and basically has no universality. And the existing cold plate generally only utilizes one surface of the cold plate to cool the heating unit, thereby increasing the volume of the cold plate and increasing the cost.
SUMMERY OF THE UTILITY MODEL
A first object of the present invention is to provide a heat dissipating device which has high versatility, can dissipate heat from all heat generating elements in an electrical apparatus, and has a good heat dissipating effect.
A second object of the present invention is to provide an electric apparatus having the above heat dissipating device.
In order to achieve the first purpose, the utility model provides a heat dissipation device, which comprises a fin substrate, a top cover and a fan, wherein the fin substrate is provided with a cooling liquid channel, a channel inlet and a channel outlet, the channel inlet and the channel outlet are both communicated with the cooling liquid channel, an opening is arranged above the cooling liquid channel, the fin substrate is also provided with a device contact surface, and the device contact surface is positioned on the bottom wall of the fin substrate. The top cover is arranged on the fin base plate and covers the opening, a top cover fin group is arranged on one side, opposite to the fin base plate, of the top cover, and the top cover fin group corresponds to the cooling liquid channel up and down. The fan is disposed adjacent the header fin set.
According to the scheme, the heat dissipation device is installed on the heating element through the fixing portion, the device contact surface is used for being in contact with the main heating elements such as the CPU and the display card, heat generated by the main heating elements is conducted into the fin base plate through heat conduction, and the liquid working medium flows through the cooling liquid channel to take away the heat. The top surface of the top cover is also provided with a top cover fin group for increasing the heat convection area between the top cover and the ambient air. Meanwhile, the fan is arranged and used for disturbing the air flow in the electrical equipment, so that forced convection is generated for the air in the equipment, and higher air speed is achieved among the top cover fin groups, and the heat exchange speed is increased. And the air with lower temperature passes through secondary heating elements such as a memory, a VRM and a capacitor in the convection heat exchange cooling equipment, the heat of the secondary heating elements is absorbed by the air and then is transmitted to the top cover fin group, and further transmitted to the liquid working medium in the top cover and the cooling liquid channel and then taken away by the liquid working medium, and the arrangement of the fan enhances the cooling effect of the heat dissipation device on the surrounding air. Therefore, the heat dissipation device can provide liquid cooling with strong heat dissipation capability for the primary heating element and can also provide air cooling heat dissipation for the secondary heating element. In addition, the heat dissipation device is strong in universality, mass production can be achieved, and production cost is reduced. Simultaneously, two relative upper and lower surfaces all are used for carrying out thermal conduction on the cold drawing that comprises fin base plate and top cap among this heat abstractor, consequently can make full use of the surface area of cold plate, and then can reduce the size of cold plate, reduce cost.
The top cover fin group is provided with a mounting groove, the mounting groove is sunken downwards from the upper surface of the top cover fin group, and the fan is mounted in the mounting groove.
Further, the air supply direction of the fan is perpendicular to the surface of the top cover.
It can be seen that when the fan is on top of the top cover fin set, the direction of the air flow is along the fins towards the heat source, i.e. the direction of the air flow is opposite to the direction of heat conduction in the fins. Therefore, the convective heat transfer temperature difference can be increased along the flowing direction, and the weakening of the heat transfer caused by the thickening of a convective heat boundary layer is compensated. In addition, when the fan is arranged on the top of the top cover fin group, air is forced to move towards the top cover under the driving of the fan, and an impact effect is formed on the top cover. Namely, when the air reaches the top cover of the fin root, the speed direction changes suddenly, and in the case, the convection speed boundary layer on the top cover surface of the fin root is very thin, so that the heat exchange performance is good. The pressure drop of the air flowing over the fin array is high due to the very dense fin array above the top cover. Therefore, if the fan is disposed outside the header fin group, the air flow will have a very large proportion, bypassing the fin array and spreading from the surroundings, thereby reducing the air flow velocity entering the fin array and affecting the heat dissipation effect, which can be solved by disposing the fan inside the header fin group. In addition, make integral type structure with fan and top cap, the user installation of being convenient for, if the fan is as independent subassembly, need the user to look for the position installation that can fix in server/computer machine incasement portion, increase the complexity and the degree of difficulty of installation, moreover, many quick-witted incasement portions do not have the installation condition, directly use the server from taking the fan, the air current trend and the velocity of flow can not necessarily satisfy the requirement.
In a preferred mode, the top cover fin group comprises a plurality of first fins which are arranged in parallel and at intervals, and the first fins extend along the length direction of the fin base plate; the fan is located on one side of the top cover fin group and located in the extending direction of the first fins, and the air supply direction of the fan is parallel to the extending direction of the first fins.
Therefore, the purpose of disturbing the air inside the electrical equipment can be achieved by arranging the fan at one end of the extending direction of the first fins, and reasonable space is arranged between every two adjacent first fins, so that the air flow is cooled through the top cover fin group, and the heat exchange effect is improved.
In a preferred embodiment, the cross-sectional area of the header fin group is close to the cross-sectional area of the cooling liquid channel.
Therefore, the sectional area of the top cover fin group is close to that of the cooling liquid channel, the surface area of the top cover fin group can be increased to the greatest extent, the heat exchange area is further increased, the surrounding air is cooled rapidly, and the service life of each heating element is prolonged.
In a preferred scheme, a liquid cooling fin group is arranged in the cooling liquid channel.
Therefore, the fins are arranged in the cooling liquid channel and used for increasing the heat convection area of the liquid working medium and the fin base plate, so that the heat exchange performance is improved, and a good heat exchange effect is realized.
The further proposal is that the channel inlet and the channel outlet are respectively positioned at two opposite sides of the length direction of the fin substrate; the liquid cooling fin group comprises a plurality of second fins which are parallel and arranged at intervals, the second fins extend along the length direction of the fin base plate, the first ends of the second fins extend to positions close to the inlet of the channel, the second ends of the second fins extend to positions close to the outlet of the channel, and two side walls of the liquid cooling fin group in the width direction are respectively close to the side walls corresponding to the cooling liquid channel.
Therefore, the surface area of the liquid cooling fin group is increased as much as possible through reasonable layout, and meanwhile, the liquid working medium entering from the channel inlet flows out from the channel outlet after passing through the liquid cooling fin group, so that the heat exchange area of the liquid cooling fin group is increased to the greatest extent, and the heat exchange performance is further improved.
The cooling liquid channel is provided with two inlet guide surfaces at the first end close to the second fin, and two outlet guide surfaces at the second end close to the second fin; the two inlet guide surfaces are respectively arranged on two opposite sides of the channel inlet, and the distance between the two inlet guide surfaces is gradually increased from one end close to the channel inlet to one end close to the liquid cooling fin group; the two outlet guide surfaces are respectively arranged on two opposite sides of the channel outlet, and the distance between the two inlet guide surfaces is gradually increased from one end close to the channel outlet to one end close to the liquid cooling fin group.
Therefore, the inlet guide surface and the outlet guide surface can guide the flow direction of the liquid working medium, so that the liquid working medium smoothly flows into the liquid cooling fin group from the inlet of the channel and smoothly flows to the outlet of the channel from the liquid cooling fin group.
Preferably, the heat sink is further provided with a fixing portion, and the fixing portion is located on the fin base plate or the top cover.
To achieve the second object, the present invention provides an electrical apparatus including a housing, a circuit board, and a heat sink. The circuit board is arranged in the shell, a heating element is arranged on the circuit board, the heat dissipation device is detachably arranged on the heating element, and the contact surface of the device is in contact with the heating element.
Therefore, the heat sink is used as a cooling system of the electrical equipment, and all the heat generating elements in the whole electrical equipment can be cooled simultaneously. The electronic element with large heating value is cooled by the liquid cooling cold plate and can work at an ideal working temperature; the electronic components with small heating value are cooled by air cooling, and the energy consumption is lower. The heat dissipation device has small volume, few components and simple structure. In addition, after the heat dissipation device is used, the fan of the electrical equipment such as the server and the like can be omitted or removed, so that the energy consumption is reduced, and the noise is reduced. In addition, the cold plate formed by the fin substrate and the top cover in the fan is used as a cold source for air cooling, the fan drives air in the electrical equipment to circularly flow, the air inlet and outlet and cold air supply of conventional air cooling are not needed, and meanwhile, the risk that external air pollutes electronic elements is reduced.
Drawings
Fig. 1 is a structural view of a first embodiment of an electric apparatus of the present invention.
Fig. 2 is a structural view of a heat dissipating device in a first embodiment of an electric apparatus of the present invention.
Fig. 3 is an exploded view of a heat sink in a first embodiment of the electrical apparatus of the present invention.
Fig. 4 is a sectional view of a heat sink in a first embodiment of the electric apparatus of the present invention.
Fig. 5 is a structural view of a second embodiment of the electric apparatus of the present invention.
The utility model is further explained with reference to the drawings and the embodiments.
Detailed Description
First embodiment of Electrical apparatus and Heat sink
Referring to fig. 1 to 4, the electrical apparatus includes a housing 11, a circuit board 12, and a heat sink 13. The circuit board 12 is located in the housing 11, the circuit board 12 is provided with a primary heating element 101 such as a CPU and a graphics card, and a secondary heating element 102 such as a memory, a VRM, and a capacitor, and the heat sink 13 is mounted on the heating element.
The heat sink 13 includes a fin base 2, a top cover 3, and a fan 4. The fin base plate 2 and the top cover 3 are both made of a metal material having good thermal conductivity, such as aluminum. The fin substrate 2 is provided with a cooling liquid channel 21, a channel inlet 22 and a channel outlet 23, the channel inlet 22 and the channel outlet 23 are respectively located on two opposite sides of the fin substrate 2 in the length direction, the channel inlet 22 and the channel outlet 23 are both communicated with the cooling liquid channel 21, an opening 24 is arranged above the cooling liquid channel 21, the fin substrate 2 is further provided with a fixing portion 25 and a device contact surface 26, the four fixing portions 25 are arranged on the periphery of the fin substrate 2 and located at four corners of the fin substrate 2, the heat dissipation device 13 is detachably mounted on a heating element through the fixing portion 25, and the device contact surface 26 is located on the bottom wall of the fin substrate 2 and is used for being in contact with the main heating element 101. A liquid cooling fin group 27 is provided in the cooling liquid passage 21, and the liquid cooling fin group 27 and the fin base plate 2 are integrally formed. The top cover 3 is arranged on the fin base plate 2 and covers the opening 24, a top cover fin group 31 is arranged on one side of the top cover 3 opposite to the fin base plate 2, and the top cover fin group 31 corresponds to the cooling liquid channel 21 up and down. The sectional area of the header fin group 31 is close to the sectional area of the cooling liquid channel 21, that is, the sectional area of the header fin group 31 is equal to the sectional area of the cooling liquid channel 21 or the sectional area of the header fin group 31 is slightly larger than or slightly smaller than the sectional area of the cooling liquid channel 21.
The header fin group 31 includes a plurality of first fins 32 arranged in parallel and at intervals, and the first fins 32 extend in the longitudinal direction of the fin base 2. The top cover fin group 31 is provided with a mounting groove 33, the mounting groove 33 is recessed downwards from the upper surface of the top cover fin group 31, the fan 4 is mounted in the mounting groove 33, the sectional shape of the mounting groove 33 is the same as that of the fan 4, the air supply direction of the fan 4 is perpendicular to the surface of the top cover 3, the thickness of the top cover fin group 31 is larger than that of the mounting groove 33, and the depth of the mounting groove 33 is smaller than that of the fan 4.
The liquid cooling fin group 27 includes a plurality of second fins 271 arranged in parallel and at intervals, the second fins 271 extend along the length direction of the fin substrate 2, first ends of the second fins 271 extend to positions close to the channel inlets 22, second ends of the second fins 271 extend to positions close to the channel outlets 23, and two side walls in the width direction of the liquid cooling fin group 27 are respectively close to corresponding side walls of the cooling liquid channels 21.
The cooling liquid channel 21 is provided with two inlet guide surfaces 211 at a first end close to the second fin 271, two outlet guide surfaces 212 at a second end close to the second fin 271, the two inlet guide surfaces 11 are respectively arranged at two opposite sides of the channel inlet 22 and are oppositely arranged in the width direction of the fin base plate 2, and the distance between the two inlet guide surfaces 211 gradually increases from one end close to the channel inlet 22 to one end close to the liquid cooling fin group 27. The two outlet guide surfaces 212 are respectively disposed on opposite sides of the passage outlet 23, and the distance between the two inlet guide surfaces 211 gradually increases from the end near the passage outlet 23 to the end near the liquid-cooling fin group 27.
The heat generated by the main heating element 101 is conducted into the fin base plate 2 by the heat conduction of the heat sink, and the liquid working medium flows through the cooling liquid channel 21 to take away the heat. The top surface of the top cover 3 is also provided with a top cover fin group 31 for increasing the heat convection area of the top cover 3 and the ambient air. Meanwhile, the fan 4 is arranged to disturb the air flow in the electrical equipment, so that forced convection is generated in the air in the electrical equipment, and a high air speed is provided between the top cover fin groups 31, thereby improving the heat exchange speed. And the air with lower temperature passes through the secondary heating element 102 in the convection heat exchange cooling device, the heat of the secondary heating element 102 is absorbed by the air and then is transferred to the top cover fin group 31, and further is transferred to the liquid working medium in the cooling liquid channel 21 and then is taken away by the liquid working medium, and the arrangement of the fan 4 enhances the cooling effect of the heat dissipation device 13 on the surrounding air. Therefore, the heat dissipation device 13 can provide both liquid cooling with high heat dissipation capability for the primary heating element 101 and air cooling for the secondary heating element 102.
As can be seen, by disposing the fan inside the top cover fin set and at the top, the air flow direction of the fan is along the fins toward the heat source, i.e. the air flow direction is opposite to the heat conduction direction in the fins. Therefore, the convection heat exchange temperature difference is increased along the flowing direction, and the weakening of heat exchange caused by the thickening of a convection heat boundary layer is compensated. In addition, when the fan is arranged on the top of the top cover fin group, air is forced to move towards the top cover under the driving of the fan, and an impact effect is formed on the top cover. Namely, when the air reaches the top cover of the fin root, the speed direction changes suddenly, and in the case, the convection speed boundary layer on the top cover surface of the fin root is very thin, so that the heat exchange performance is good. The pressure drop of the air flowing over the fin array is high due to the very dense fin array above the top cover. Therefore, if the fan is disposed outside the header fin group, the air flow will have a very large proportion, bypassing the fin array and spreading from the surroundings, thereby reducing the air flow velocity entering the fin array and affecting the heat dissipation effect, which can be solved by disposing the fan inside the header fin group. In addition, make integral type structure with fan and top cap, the user installation of being convenient for, if the fan is as independent subassembly, need the user to look for the position installation that can fix in server/computer machine incasement portion, increase the complexity and the degree of difficulty of installation, moreover, many quick-witted incasement portions do not have the installation condition, directly use the server from taking the fan, the air current trend and the velocity of flow can not necessarily satisfy the requirement.
Second embodiment of Electrical apparatus and Heat sink
As a description of a second embodiment of the electric apparatus and the heat dissipating device of the present invention, only differences from the first embodiment of the electric apparatus and the heat dissipating device described above will be described below.
Referring to fig. 5, the fan 204 is located on one side of the top cover fin group 231 and in the extending direction of the first fins 232, and the blowing direction of the fan 204 is parallel to the extending direction of the first fins 232.
Therefore, the heat dissipation device is high in universality, mass production can be achieved, and production cost is reduced. The sectional area of the top cover fin group is close to that of the cooling liquid channel, so that the heat exchange area can be further increased, the surrounding air can be rapidly cooled, and the service life of each heating element is prolonged.
The heat sink is used as a cooling system of the electrical equipment, and can simultaneously cool all the heating elements in the whole electrical equipment. The electronic element with large heating value is cooled by the liquid cooling cold plate and can work at a more ideal working temperature; the electronic components with small heating value are cooled by air cooling, and the energy consumption is lower. The heat sink has small volume, few components and simple structure. In addition, after the heat dissipation device is used, the fan of the electrical equipment such as the server and the like can be omitted or removed, so that the energy consumption is reduced, and the noise is reduced. In addition, the cold plate formed by the fin substrate and the top cover in the fan is used as a cold source for air cooling, the fan drives air in the electrical equipment to circularly flow, the air inlet and outlet and cold air supply of conventional air cooling are not needed, and meanwhile, the risk that external air pollutes electronic elements is reduced.
Further, the liquid-cooled fin group may be a separate member fixed to the fin base plate in the cooling liquid passage. The top of the liquid cooling fin group can be abutted to the top cover, and a gap can be formed between the top of the liquid cooling fin group and the top cover. Two side walls in the width direction of the liquid cooling fin group can be abutted to the corresponding side walls of the cooling liquid channel or form a gap for the liquid working medium to flow through. The types, the number, the sizes, the intervals between two adjacent fins and the like of the fins in the top cover fin group and the liquid cooling fin group can be changed according to requirements. The fixing portion may be provided on the outer periphery of the top cover, or the fixing portion may be not provided, and the fixing of the heat sink may be achieved by applying pressure to the top cover or the fin substrate through the housing of the electrical device. The above-described modifications also achieve the object of the present invention.
Finally, it should be emphasized that the above-described preferred embodiments of the present invention are merely examples of implementations, not limitations, and various changes and modifications may be made by those skilled in the art, without departing from the spirit and scope of the utility model, and any changes, equivalents, improvements, etc. made within the spirit and scope of the present invention are intended to be embraced therein.
Claims (10)
1. A heat sink, comprising:
the cooling fin comprises a fin base plate, a cooling liquid channel, a channel inlet and a channel outlet are formed in the fin base plate, the channel inlet and the channel outlet are communicated with the cooling liquid channel, an opening is formed above the cooling liquid channel, a device contact surface is further arranged on the fin base plate, and the device contact surface is located on the bottom wall of the fin base plate;
the top cover is arranged on the fin base plate and covers the opening, a top cover fin group is arranged on one side of the top cover opposite to the fin base plate, and the top cover fin group corresponds to the cooling liquid channel up and down;
a fan disposed proximate the header fin set.
2. The heat dissipating device of claim 1, wherein:
the top cover fin group is provided with a mounting groove, the mounting groove is sunken downwards from the upper surface of the top cover fin group, and the fan is mounted in the mounting groove.
3. The heat dissipating device of claim 2, wherein:
the air supply direction of the fan is perpendicular to the surface of the top cover.
4. The heat dissipating device of claim 1, wherein:
the top cover fin group comprises a plurality of first fins which are arranged in parallel and at intervals, and the first fins extend along the length direction of the fin base plate;
the fan is located on one side of the top cover fin group and located in the extending direction of the first fins, and the air supply direction of the fan is parallel to the extending direction of the first fins.
5. The heat dissipating device according to any one of claims 1 to 4, wherein:
the sectional area of the top cover fin group is close to that of the cooling liquid channel.
6. The heat dissipating device according to any one of claims 1 to 4, wherein:
and a liquid cooling fin group is arranged in the cooling liquid channel.
7. The heat dissipating device of claim 6, wherein:
the channel inlet and the channel outlet are respectively positioned at two opposite sides of the fin base plate in the length direction;
the liquid cooling fin group comprises a plurality of second fins which are parallel and arranged at intervals, the second fins extend along the length direction of the fin base plate, the first ends of the second fins extend to be close to the channel inlet, the second ends of the second fins extend to be close to the channel outlet, and two side walls in the width direction of the liquid cooling fin group are close to the side walls corresponding to the cooling liquid channels respectively.
8. The heat dissipating device of claim 7, wherein:
the cooling liquid channel is provided with two inlet guide surfaces at the first end close to the second fin, and two outlet guide surfaces at the second end close to the second fin;
the two inlet guide surfaces are respectively arranged on two opposite sides of the channel inlet, and the distance between the two inlet guide surfaces is gradually increased from one end close to the channel inlet to one end close to the liquid cooling fin group;
the two outlet guide surfaces are respectively arranged on two opposite sides of the channel outlet, and the distance between the two inlet guide surfaces is gradually increased from one end close to the channel outlet to one end close to the liquid cooling fin group.
9. The heat dissipating device according to any one of claims 1 to 4, wherein:
the heat dissipation device is further provided with a fixing portion, and the fixing portion is located on the fin base plate or the top cover.
10. Electrical apparatus comprising a housing, a circuit board and a heat sink according to any of claims 1 to 9;
the circuit board is located in the shell, a heating element is arranged on the circuit board, the heat dissipation device is detachably mounted on the heating element, and the contact surface of the device is in contact with the heating element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220224203.9U CN216982389U (en) | 2022-01-26 | 2022-01-26 | Heat sink and electrical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220224203.9U CN216982389U (en) | 2022-01-26 | 2022-01-26 | Heat sink and electrical device |
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| Publication Number | Publication Date |
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| CN216982389U true CN216982389U (en) | 2022-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220224203.9U Active CN216982389U (en) | 2022-01-26 | 2022-01-26 | Heat sink and electrical device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115494923A (en) * | 2022-09-16 | 2022-12-20 | 天津商业大学 | Single-layer server-level full liquid cooling heat dissipation device |
| CN115768040A (en) * | 2022-10-29 | 2023-03-07 | 深圳市瀚强科技股份有限公司 | Heat dissipation device, electronic equipment and electric equipment |
-
2022
- 2022-01-26 CN CN202220224203.9U patent/CN216982389U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115494923A (en) * | 2022-09-16 | 2022-12-20 | 天津商业大学 | Single-layer server-level full liquid cooling heat dissipation device |
| WO2024055604A1 (en) * | 2022-09-16 | 2024-03-21 | 天津商业大学 | Full-liquid-cooling heat dissipation apparatus of single-layer server level |
| CN115768040A (en) * | 2022-10-29 | 2023-03-07 | 深圳市瀚强科技股份有限公司 | Heat dissipation device, electronic equipment and electric equipment |
| CN115768040B (en) * | 2022-10-29 | 2023-12-26 | 深圳市瀚强科技股份有限公司 | Heat abstractor, electronic equipment and consumer |
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