CN115494923A - Single-layer server-level full liquid cooling heat dissipation device - Google Patents
Single-layer server-level full liquid cooling heat dissipation device Download PDFInfo
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- CN115494923A CN115494923A CN202211133237.8A CN202211133237A CN115494923A CN 115494923 A CN115494923 A CN 115494923A CN 202211133237 A CN202211133237 A CN 202211133237A CN 115494923 A CN115494923 A CN 115494923A
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- G06—COMPUTING; CALCULATING OR COUNTING
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- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
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Abstract
The invention relates to the technical field of server cooling, in particular to a full liquid cooling heat dissipation device of a single-layer server level, wherein a server comprises a circuit board, a memory strip and a chip are arranged on the surface of the circuit board, and the memory strip and the chip are arranged at different positions of the circuit board and correspond to four heat dissipation processing conditions; the invention provides a brand-new liquid cooling scheme of the server, which can be compatible with the transformation of the traditional air cooling server and can also be used for developing a new energy-saving liquid cooling server product, integrates the functions of fan air cooling and convection liquid cooling, can realize the simultaneous cooling of a chip and a memory in a single-layer server by only arranging a set of water cooling system, is independent of each layer of server, can realize free cooling according to the actual working load of each layer, realizes free cooling, obtains the maximum energy saving, occupies small area, has small investment, has no large fan system noise, is convenient for maintaining the single-layer server, adopts a 3D printing technology for device pipelines, and has no liquid leakage risk.
Description
Technical Field
The invention relates to the technical field of server cooling, in particular to a single-layer server-level full liquid cooling heat dissipation device.
Background
In recent years, with the development of technologies such as artificial intelligence and the like, a data center cooling system is more important, the performance of the cooling system directly affects the stability and the economy of IT equipment, the current cooling mode mainly adopts air cooling and liquid cooling, the heat transfer performance of air cannot meet the heating condition of high heat flow density of the current IT equipment, meanwhile, because liquid has higher heat transfer coefficient, the liquid cooling heat dissipation technology becomes the main research direction in the field of heat dissipation of chips of high-performance data centers in recent years, and the liquid cooling transformation of air cooling data centers which are put into production and used is also concerned by people. The liquid cooling of the server mainly comprises an immersion type liquid cooling mode, a spray type liquid cooling mode and a cold plate type liquid cooling mode, wherein the immersion type liquid cooling mode is to completely immerse the server in the cooling liquid and take away heat by means of liquid flowing circulation; spray type liquid cooling changes server machine case roof into the shower plate for spray the coolant liquid to the device that generates heat, submergence formula liquid cooling and spray type liquid cooling are typical direct contact type liquid cooling, all have very high requirement to the insulating nature of coolant liquid and the leakproofness of rack, cold plate formula liquid cooling simple structure, not with chip direct contact, belong to indirect cooling, it is higher to compare in submergence formula cooling and spray type cooling security, therefore it is comparatively extensive to use, traditional cold plate formula liquid cooling is only used for the chip cooling, all the other electronic components's the heat dissipation adopts the mode of air-cooled, and need additionally set up air conditioning system between the row to hot-blast cooling, be used for cooling the hot-blast that the rack blew out.
The three server liquid cooling disadvantages are as follows:
the traditional cold plate type system is complex, needs a cold water system and a cold air conditioning system, and still has large energy consumption; the traditional cold plate type needs a tail end air conditioner, needs a cold and hot air channel to be closed, and has high investment cost and difficult maintenance; in the traditional cold plate type two sets of cooling systems, a cold air conditioning system is in cabinet-level cooling, and occupies a large area of a machine room; the water cooling plate in the traditional cold plate type cabinet is assembled in a split welding mode, the risk of leaking points still exists, and electronic devices have potential safety hazards; a high-power cabinet-level inter-row air conditioner needs to be arranged in a traditional cold plate type machine room, and a fan in the cabinet is high in cold air conveying noise, so that the single-layer server-level full-liquid-cooling heat dissipation device is provided for solving the problems.
Disclosure of Invention
The invention aims to provide a single-layer server-level full-liquid-cooling heat dissipation device to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the full liquid cooling heat abstractor of individual layer server level, including the circuit board, circuit board surface mounting has memory strip and chip, and memory strip and chip install and correspond four kinds of heat dissipation processing conditions in the different positions of circuit board, and full liquid cooling heat abstractor is through the inside cooling water operating mode of adjustment radiator for absorb all inside heat dissipation capacities of individual layer server, no longer dispel the heat to the server outside.
Preferably, the traditional air-cooled server put into use is subjected to server-level full liquid cooling transformation, wherein one heat dissipation treatment condition is that the chip, the memory bank and the fan are not arranged on the same straight line, a single-core chip and the memory are taken as an example, the original traditional fan is omitted, a groove-type water-cooling plate radiator is covered on the chip and used for liquid cooling of the chip, and the rear side of the groove-type water-cooling plate radiator is fixedly connected with the circuit board; a channel type air-liquid metal radiator with a fan is arranged on one side of the memory bank and used for cooling the memory bank.
Preferably, the groove type water-cooling plate radiator comprises a liquid cooling water inlet, a liquid cooling water outlet and an internal micro-channel groove, the micro-channel groove is located in the center of the bottom plate of the radiator, the total area of the micro-channel groove is consistent with the area of a chip, the direction of the groove is consistent with the direction of internal water flow, and the height of the groove is up to the top wall of the channel.
Preferably, the traditional fan is replaced by the channel type air-liquid metal radiator with the built-in fan, the memory bank is cooled, the rear side of the channel type air-liquid metal radiator with the fan is fixedly connected with the circuit board, the slot direction of the memory bank is perpendicular to the long edge of the channel type air-liquid metal radiator with the fan, the height of the channel type air-liquid metal radiator with the fan is equal to the height of the memory, the width of the channel type air-liquid metal radiator with the fan is equal to the width of the memory, the air guiding cover is arranged, the memory bank and the channel type air-liquid metal radiator with the fan are covered in an air channel, the channel type air-liquid metal radiator with the fan comprises a liquid cooling water inlet, a liquid cooling water outlet, an internal water cooling channel and an internal air cooling channel, and the fan is fully arranged in the internal air cooling channel.
Preferably, the traditional air-cooled server put into use is subjected to server-level full liquid cooling transformation, wherein under the other heat dissipation treatment condition, the chip, the memory bar and the fan are linearly arranged on the surface of the circuit board, the original fan is kept still, and the upper surface of the chip is covered with the channel type air-liquid metal radiator with the groove.
Preferably, the rear side of the channel-type wind-liquid metal radiator with the groove is fixedly connected with the circuit board, and the total height of the channel-type wind-liquid metal radiator with the groove is consistent with the height of the memory bank, the width of the channel-type wind-liquid metal radiator with the groove is consistent with the width of the memory bank, and the length of the channel-type wind-liquid metal radiator with the groove is consistent with the length of the chip.
Preferably, the channel type air-liquid metal radiator with the grooves comprises a liquid cooling water inlet, a liquid cooling water outlet, an internal water cooling channel and an internal air cooling channel, the grooves are formed in the upper portion of the bottom plate of the internal water channel, the grooves are located in the center of the bottom plate of the channel type air-liquid metal radiator with the grooves, the area of the grooves is consistent with the area of a chip, the direction of the grooves is consistent with the direction of internal water flow, and the heights of the grooves reach the top wall of the channel.
Preferably, to newly-produced mononuclear liquid cooling blade server, the third kind of heat dissipation processing circumstances, memory strip and chip are the straight line and install on the circuit board surface, the chip is arranged in and is close to a distolateral of circuit board, covers ditch area fan single channel geomantic omen integrated form liquid cooling radiator on the chip, ditch area fan single channel geomantic omen integrated form liquid cooling radiator includes liquid cooling water inlet, liquid cooling delivery port, inside water-cooling passageway and inside air-cooled passageway, and ditch area fan single channel geomantic omen integrated form liquid cooling radiator covers directly over the chip, and the direction of placement is perpendicular with memory strip slot direction, and the height of ditch area fan single channel geomantic omen integrated form liquid cooling radiator is unanimous with the memory strip height, and the width is unanimous with the total width of memory strip group, and length are unanimous with chip length, and the microchannel slot is arranged to the bottom plate positive center of inside water cooling passageway, and the total area of ditch cover is unanimous with chip area, and bottom plate area geomantic omen chip position of bottom plate outside chip is unanimous, and the ditch arrangement direction is unanimous with inside rivers direction, and the groove height to the roof, and air-cooled channel geomantic integrated form water cooling radiator, and water-cooled channel geomantic-cooling radiator water inlet intercommunication respectively.
Preferably, for a newly produced multi-core liquid cooling blade server, the fourth heat dissipation processing condition is that four cores are taken as an example, four groups of memory bars and four chips are arranged in parallel and are linearly installed on the surface of a circuit board, the four chips are arranged on one end side close to the circuit board, the chips are arranged at equal intervals, a groove multi-channel wind-liquid integrated liquid cooling radiator with a fan is covered on the four chips, the groove multi-channel wind-liquid integrated liquid cooling radiator with the fan comprises a liquid cooling water inlet, a liquid cooling water outlet, an internal water cooling channel and a plurality of groups of internal air cooling channels, the arrangement direction of the groove multi-channel wind-liquid integrated liquid cooling radiator with the fan is perpendicular to the insertion direction of the memory bars, and the height of the groove multi-channel wind-liquid integrated liquid cooling radiator with the fan is consistent with the height of the memory bars, the width is unanimous with the shared total width of four internal storage strip groups, and length is unanimous with chip length, and the multiunit microchannel slot is arranged to the bottom plate positive center of inside water-cooling channel, and the group number of slot and wind channel is unanimous with the internal storage strip number, and every group slot covers total area unanimous with single chip area, and every slot position is unanimous with the corresponding single chip's in the bottom plate outside position, and the slot direction of arranging is unanimous with inside rivers direction, and the slot height is to the wall top, and every group air-cooled passageway inside is equipped with the fan of full row, the fan outside is fixed connection with slot band fan multichannel wind liquid cooling radiator, slot band fan multichannel wind liquid cooling radiator top both ends communicate respectively has liquid cooling delivery port and liquid cooling water inlet.
Preferably, liquid cooling water inlet coolant liquid parameter can be regulated and control alone, through temperature and the flow parameter of adjusting radiator import coolant liquid, realize the heat dissipation needs to chip and memory simultaneously, the cooling parameter regulation of each layer server does not influence each other, can carry out cooling free control according to actual each layer work load, liquid cooling delivery port and liquid cooling water inlet and all liquid cooling radiators inside the server, all adopt the full 3D printing of aluminium matter or copper, liquid cooling delivery port and liquid cooling water inlet to the rack outside, because the pipeline tie point is outside the server, can avoid the inside liquid of server to reveal.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a brand-new liquid cooling scheme of the server, which can be compatible with the transformation of the traditional air cooling server, can also be used for developing a new energy-saving liquid cooling server product, integrates the functions of fan air cooling and convection liquid cooling, can realize the simultaneous cooling of chips and memories in a single-layer server by only arranging a set of water cooling system, is independent of each layer of server, can realize free cooling according to the actual working load of each layer, realizes free cooling, obtains the maximum energy conservation, occupies small area, has small investment, has no large fan system noise, is convenient for maintaining the single-layer server, adopts a 3D printing technology for device pipelines, and has no liquid leakage risk.
Drawings
FIG. 1 is a schematic diagram of a memory bank, a chip, and a fan according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a liquid-cooling heat dissipation scheme according to an embodiment of the present invention;
FIG. 3 is a schematic view of a fan-equipped channel-type liquid-air metal heat sink according to an embodiment of the present invention;
FIG. 4 is a schematic view of a trench-type water-cooled plate heat sink according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a microchannel trench structure according to an embodiment of the invention;
FIG. 6 is a schematic diagram of the memory bank, the chip, and the fan according to the second embodiment of the present invention;
fig. 7 is a schematic structural diagram of a liquid-cooling heat dissipation scheme according to a second embodiment of the present invention;
FIG. 8 is a side view of a channel-type liquid metal air heat sink with grooves according to a second embodiment of the present invention;
fig. 9 is a schematic structural diagram of a liquid-cooling heat dissipation scheme according to a third embodiment of the present invention;
fig. 10 is a side view of a groove fan single-channel air-liquid integrated liquid-cooled heat sink according to a third embodiment of the present invention;
fig. 11 is a schematic structural diagram illustrating a liquid-cooling heat dissipation scheme according to a fourth embodiment of the present invention;
fig. 12 is a schematic side view of a multi-channel air-liquid integrated liquid-cooled radiator with a fan in a groove according to a fourth embodiment of the present invention.
In the figure: 1. a circuit board; 2. a memory bank; 3. a chip; 4. a groove type water-cooled plate radiator; 5. a fan; 6. a channel type air-liquid metal radiator with a fan; 7. channel type air-liquid metal radiator with grooves; 8. the groove is provided with a fan and a single-channel air-liquid integrated liquid cooling radiator; 9. a microchannel trench; 10. a grooved water channel floor; 11. air cooling channels; 12. a liquid cooling water inlet; 13. a liquid cooling water outlet; 14. an internal water-cooling channel; 15. the groove is provided with a fan and is provided with a multi-channel air-liquid integrated liquid cooling radiator; 16. the bottom plate of the groove type water-cooling plate radiator.
Detailed Description
The full liquid cooling heat abstractor of individual layer server level, including circuit board 1, above-mentioned 1 surface mounting of circuit board has memory strip 2 and chip 3, and memory strip 2 and chip 3 install four kinds of heat dissipation processing conditions that correspond in the different positions of circuit board 1, and full liquid cooling heat abstractor is through adjusting the inside cooling water operating mode of radiator for absorb all inside heat dissipation capacities of individual layer server, no longer dispels the heat to the server outside.
The first embodiment is as follows:
for the conventional air-cooled server in use, server-level full-liquid-cooling transformation is performed, wherein one of the heat dissipation situations is that the chip 3, the memory bank 2 and the fan 5 are not arranged on the same straight line, and a single-core chip and a memory are taken as an example, the invention provides a technical scheme, please refer to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5.
The original fan 5 is cancelled, the groove type water-cooling plate radiator 4 is covered on the chip 3 and used for cooling the chip, the temperature of the chip 3 is not higher than the safe working temperature, the traditional fan 5 is replaced by the channel type air-liquid metal radiator 6 with the built-in fan 5 and used for cooling the memory bank 2, the rear side of the channel type air-liquid metal radiator 6 with the fan is fixedly connected with the circuit board 1, the original air guide cover is arranged or utilized, and the memory bank 2 and the channel type air-liquid metal radiator 6 with the fan are covered in an air channel and used for cooling the memory bank.
The groove type water-cooling plate radiator 4 comprises a liquid cooling water inlet 12, a liquid cooling water outlet 13 and an internal micro-channel groove 9, wherein the micro-channel groove 9 is located in the center of the bottom plate of the radiator, the total area of the groove is consistent with the area of a chip, the direction of the groove is consistent with the direction of internal water flow, and the groove is high up to the top wall of a channel.
The height of the channel type air-liquid metal radiator 6 with the fan is the same as the height of the memory bank 2, the width of the channel type air-liquid metal radiator 6 with the fan is the same as the width of the memory bank 2, the length of the channel type air-liquid metal radiator with the fan is about 2-5cm, the slot direction of the memory bank 2 is vertical to the long edge of the channel type air-liquid metal radiator 6 with the fan, an air guide cover is arranged to cover the memory bank 2 and the channel type air-liquid metal radiator 6 with the fan in an air channel, the channel type air-liquid metal radiator 6 with the fan comprises a liquid cooling water inlet 12, a liquid cooling water outlet 13, an internal water cooling channel 14 and an internal air cooling channel 11, and the interior of the internal air cooling channel 11 is filled with the fan 5.
The working process is as follows: the fan 5 sucks external ambient air, blows through the channel-type air-liquid metal radiator 6 in the air duct firstly, when the air blows through the channel in the channel-type air-liquid metal radiator 6, the air is cooled by the water inside the channel-type air-liquid metal radiator 6, the air is cooled, then blows through the memory bank 2 to cool the memory bank 2, the air is heated, the air temperature blowing through the air duct of the channel-type air-liquid metal radiator 6 and the temperature of the memory bank 2 are controlled by adjusting the flow of low-temperature water, the temperature of the memory bank is guaranteed not to be higher than the safe working temperature of the memory bank, and meanwhile, the air temperature when the server is blown out is guaranteed not more than the ambient air temperature at an inlet, namely, the heat load is not brought to the machine room environment.
From this, chip 3 and memory all are in the inside whole cooling of server, realize server level cooling, need not to set up alone the rack air conditioner again, take fan passageway type geomantic omen radiator 6 and chip 3 water-cooling plate radiator 4 to share a water system, possess the same import temperature promptly, but the flow in two radiators can be regulated and control alone to the respective heat dissipation demand of adaptation chip 3 and memory.
Example two
For the conventional air-cooled server in use, server-level full liquid-cooled transformation is performed, wherein in another heat dissipation treatment situation, the memory bank 2 and the chip 3 are linearly installed on the surface of the circuit board 1, and a single-core chip and a memory are taken as examples, the invention provides a technical scheme, please refer to fig. 6, fig. 7 and fig. 8.
Specifically, the original fan 5 is kept still, and the channel-type air-liquid metal radiator 7 with the groove is covered on the chip 3, so that the memory 2 and the chip 3 are cooled simultaneously.
The rear side of the channel-type air-liquid metal radiator 7 with the groove is fixedly connected with the circuit board 1, and the total height of the channel-type air-liquid metal radiator 7 with the groove is consistent with the height of the memory bank 2, the width of the channel-type air-liquid metal radiator is consistent with the width of the memory bank 2, and the length of the channel-type air-liquid metal radiator is consistent with the length of the chip 3.
The channel type air-liquid metal radiator 7 with the grooves comprises a liquid cooling water inlet 12, a liquid cooling water outlet 13, an internal water cooling channel 14 and an internal air cooling channel 11, wherein the grooves are formed in the upper portion of a bottom plate of the internal water channel, the grooves are located in the center of the bottom plate of the channel type air-liquid metal radiator 7 with the grooves, the areas of the grooves are consistent with the areas of the chips 3, the directions of the grooves are consistent with the directions of internal water flows, and the heights of the grooves reach a top wall of the channel.
Because the chip 3 and the memory bank 2 are on the same straight line, the two radiators for cooling the chip 3 and the memory are combined, and a channel type air-liquid metal radiator 7 with a groove is developed, namely, a groove structure is added on an inner flat bottom plate of the original channel type air-liquid metal radiator, and the channel type air-liquid metal radiator 7 with the groove is arranged on the chip 3; the groove structure on the internal bottom plate of the channel type wind-liquid metal heat dissipation 7 with the groove is positioned outside the chip 3, the total area is consistent with the area of the chip 3, the direction of the groove is consistent with the direction of internal water flow, and the height of the groove is up to the top wall of the channel; the original wind scooper is arranged or utilized to cover the fan 5, the memory bank 2 and the channel type air-liquid metal radiator 7 with the groove in one air duct, so that the chip 3 and the memory bank 2 can be cooled simultaneously.
The working process comprises the following steps: the channel type air-liquid metal radiator 7 with the groove is arranged on the chip 3, external cooling water flows into the radiator to form forced convection heat exchange for cooling the chip 3 at the bottom, and the groove structure is positioned right above the chip to play a role in strengthening heat exchange; on the other hand, the groove channel type air-liquid metal radiator 7 is also used for cooling air flowing through the channel (namely, when the fan sucks external ambient air, the air firstly blows the memory in the air guide cover, the memory is cooled and cooled, the air is heated, then the air blows the groove channel type air-liquid metal radiator, and the air is cooled by the water in the radiator, so that the memory is cooled, the air temperature when the server is blown out is not higher than the ambient air temperature at the inlet, namely, the heat load is not brought to the machine room environment, the temperature of the chip 3 and the memory bar 2 is not higher than the safe working temperature by adjusting the flow of low-temperature water in the groove channel type air-liquid metal radiator 7, the temperature of the air blown out of the server is not higher than the ambient air temperature at the inlet, namely, the heat load is not brought to the machine room environment, the whole cooling is realized in the server, an air conditioner cabinet is not required to be arranged independently, the server-level full-liquid cooling is realized, only one radiator is arranged in the server, and only one water inlet and one water outlet are required for cooling the machine room.
EXAMPLE III
For a newly produced single-core liquid-cooled blade server, please refer to fig. 9 and 10 for a third heat dissipation handling case.
Specifically, the memory bank 2 and the chip 3 are linearly installed on the surface of the circuit board 1, the chip 3 is arranged at one end side close to the circuit board, the chip 3 is covered with a groove fan single-channel wind-liquid integrated liquid cooling radiator 8, the groove fan single-channel wind-liquid integrated liquid cooling radiator 8 comprises a built-in fan 5, a liquid cooling water inlet 12, a liquid cooling water outlet 13, an internal water cooling channel 14 and an internal air cooling channel 11, the groove fan single-channel wind-liquid integrated liquid cooling radiator 8 is covered right above the chip 3, the placement direction is perpendicular to the slot direction of the memory bank 2, the height of the single-channel air-liquid integrated liquid cooling radiator 8 with the fan in the groove is consistent with the height of the memory bank 2, the width of the single-channel air-liquid integrated liquid cooling radiator is consistent with the total width of a memory bank group, the length of the single-channel air-liquid integrated liquid cooling radiator is consistent with the length of the chip 3, the micro-channel groove 9 is arranged in the center of the bottom plate of the internal water cooling channel 14, the total area covered by the groove is consistent with the area of the chip, the position of the groove in the inner side of the bottom plate is consistent with the position of the chip on the outer side of the bottom plate, the arrangement direction of the groove is consistent with the direction of internal water flow, the height of the groove reaches the wall top, the fan 5 is arranged in the air cooling channel 11, and the two ends of the top of the single-channel air-liquid cooling radiator 8 with the fan in the groove are respectively communicated with a liquid cooling water outlet 13 and a liquid cooling water inlet 12.
The single-channel server-level full-liquid-cooling arrangement scheme is provided for cooling a single-core chip, a memory bar 2 and a single-channel air-liquid integrated liquid-cooling radiator 8 with a fan and a groove are placed in a fan cover, the single-channel air-liquid integrated liquid-cooling radiator 8 with the fan and the groove are placed on the chip 3, external cooling water flows into the radiator to form forced convection heat exchange for cooling the chip 3 at the bottom, and a groove structure on a water channel bottom plate 10 with the groove is located right above the chip 3 and plays a role in strengthening heat exchange; meanwhile, the fan 5 sucks external ambient air, the air cooling channel 11 of the groove single-channel air-liquid integrated liquid cooling radiator 8 with the fan cools the air to be lower than the ambient temperature, then the air is blown through the memory, the temperature of the memory is reduced and cooled, the air is heated to be consistent with the ambient air temperature, the air is discharged out of the server, namely, a set of water system is provided with a small internal fan, the chip 3 and the memory can be cooled simultaneously, the heat load is not brought to the machine room environment, and the server-level liquid cooling is realized.
The groove single-channel wind-liquid integrated liquid cooling radiator 8 with the fan is arranged right above the high-heat-flow chip 3, the arrangement direction is vertical to the direction of the memory chip slot, a plurality of micro-channel grooves are arranged in the center of the water channel bottom plate 10 with the grooves, the total area of the grooves is consistent with the area of the chip 3, the groove structure is located right above the chip 3, the arrangement direction of the grooves is consistent with the direction of internal water flow, and the height of the grooves reaches the wall top; the small fan blades are arranged in the air cooling channel 11 of the groove-belt fan single-channel air-liquid integrated liquid cooling radiator 8, so that the fan 5 and the liquid cooling radiator are combined into a whole, the land is saved, the fan is integrated, and the installation is easy. Through fan 5 and 8 dual control of slot band fan single channel wind liquid cooling radiator of liquid cooling, guarantee to blow out the ambient air temperature when the air temperature of server can not be higher than the import, the business turn over water parameter of each layer server can be regulated and control alone, through the temperature and the flow parameter of the liquid cooling water inlet 12 cold liquid of adjusting slot band fan single channel wind liquid cooling radiator 8, realize the heat dissipation needs to chip 3 and memory simultaneously, the cooling parameter regulation of each layer server does not influence each other, can cool free control according to actual each layer work load, obtain the biggest energy-conservation, wind liquid integrated form liquid cooling radiator, only one liquid cooling water inlet 12 and liquid cooling delivery port 13.
Example four
Based on the requirements of supercomputing and large-scale computation, the number of cores of the server is increased, the heat flow density is increased, newly developed products are increased, the embodiment is an improvement on the three embodiments, and for a newly developed multi-core server, please refer to fig. 11 and 12.
Specifically, for a newly produced multi-core liquid cooling blade server, in a fourth heat dissipation processing case, taking four cores as an example, four memory banks 2 and four chips 3 are arranged in parallel and are linearly installed on the surface of a circuit board 1, the four chips 3 are arranged on one end side close to the circuit board, the chips are arranged at equal intervals, a groove fan multi-channel wind-liquid integrated liquid cooling radiator 15 is covered on the four chips 3, the groove fan multi-channel wind-liquid integrated liquid cooling radiator 15 comprises a liquid cooling water inlet 12, a liquid cooling water outlet 13, an internal water cooling channel 14 and a plurality of groups of internal wind cooling channels 11, the arrangement direction of the groove fan multi-channel wind-liquid integrated liquid cooling radiator 15 is perpendicular to the insertion direction of the memory banks 2, and the height of the groove fan multi-channel wind-liquid integrated liquid cooling radiator is consistent with the height of the memory banks 2, the width of the chip is consistent with the total width occupied by four groups of memory bank groups, the length of the chip is consistent with the length of the chip 3, a plurality of groups of micro-channel grooves 9 are arranged in the center of the bottom plate of the internal water cooling channel 14, the number of the grooves and the number of the air channels are consistent with the number of the memory banks 2, the total area covered by each group of grooves is consistent with the area of a single chip, the position of each groove is consistent with the position of a corresponding single chip on the outer side of the bottom plate, the arrangement direction of the grooves is consistent with the direction of internal water flow, the height of the grooves reaches the wall top, the fans 5 are fully arranged in each group of air cooling channels 11, the outer sides of the fans 5 are fixedly connected with the groove multi-channel air-liquid cooling radiator 15 with the fans, and two ends of the top of the groove multi-channel air-liquid cooling radiator 15 are respectively communicated with a liquid cooling water outlet 13 and a liquid cooling water inlet 12.
The parameters of the cooling liquid at the liquid cooling water inlet 12 can be independently regulated and controlled, the cooling requirements on the chip 3 and the memory are met by regulating the temperature and the flow parameters of the cooling liquid at the inlet of the radiator, the regulation of the cooling parameters of the servers at all layers does not influence each other, and the cooling can be freely controlled according to the actual workload of all layers.
Cooling a multi-core chip (taking 4 cores as an example), placing a memory bar 2 and a second heat dissipation assembly in a fan cover, wherein the number of air cooling channels 11 in a groove multi-channel air-liquid integrated liquid cooling radiator with a fan in the second heat dissipation assembly is the same as that of chips 3, a fan 5 is arranged in each air cooling channel 11, the number of groove structures of a bottom plate at the bottom of the second heat dissipation assembly is the same as that of chips 3, taking 4 cores as an example, the groove multi-channel air-liquid integrated liquid cooling radiator with the fan is placed on four chips 3, four groups of groove structures on the bottom plate with the groove water channels respectively correspond to positions right above the four chips 4, external cooling water flows into the radiator to form forced convection heat exchange for cooling the bottom chip 3, so as to play a role in strengthening heat exchange, meanwhile, the fan 5 sucks external ambient air, cools in an air channel of the groove multi-channel air-liquid cooling radiator with the fan, the air is lower than the ambient temperature, blows the air through a memory, the memory is cooled, the air is heated to the ambient air temperature is consistent after the memory is cooled, and the air is discharged out of the server, namely, the water system is provided with an internal small fan, so that the cooling of the chip 3 and the memory 2 can simultaneously realize cooling of the server without the room, and the liquid cooling stage heat load of the server.
The radiators of the first, second, third and fourth embodiments are all printed by using aluminum or copper full 3D, and the radiators, the liquid cooling water inlets 12 and the liquid cooling water outlets 13 are all printed by using 3D until extending out of the cabinet, so that the pipeline connection points are only limited outside the cabinet, and liquid leakage cannot be caused inside the server.
The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. It should be noted that there are no specific structures but rather a few limitations to the preferred embodiments of the present invention, and that many modifications, adaptations, and variations are possible and can be made by one skilled in the art without departing from the principles of the present invention; such modifications, variations, or combinations, or other applications of the inventive concepts and solutions as may be employed without such modifications, are intended to be included within the scope of the present invention.
Claims (10)
1. Full liquid cooling heat abstractor of individual layer server level, including circuit board (1), its characterized in that: circuit board (1) surface mounting has memory stick (2) and chip (3), and memory stick (2) and chip (3) install and correspond four kinds of heat dissipation processing conditions in the position that circuit board (1) is different, and full liquid cooling heat abstractor is used for absorbing inside all heat dissipation capacity of individual layer server through the inside cooling water operating mode of adjustment radiator, no longer dispels the heat to the server outside.
2. The single server-level, full-liquid-cooled heat sink of claim 1, wherein: the traditional air-cooled server which is put into use is subjected to server-level full liquid cooling transformation, wherein one heat dissipation treatment condition is that the chip (3), the memory bar (2) and the fan (5) are not arranged on the same straight line, a single-core chip and a memory are taken as an example, the original traditional fan (5) is omitted, a groove type water-cooled plate radiator (4) is covered on the chip and used for liquid cooling of the chip, and the rear side of the groove type water-cooled plate radiator (4) is fixedly connected with the circuit board (1); a channel type air-liquid metal radiator (6) with a fan is arranged on one side of the memory bank (2) and used for cooling the memory bank (2).
3. The single server-level, full-liquid-cooled heat sink of claim 2, wherein: the groove type water cooling plate radiator (4) comprises a liquid cooling water inlet (12), a liquid cooling water outlet (13) and an internal micro-channel groove (9), wherein the micro-channel groove (9) is located in the center of a bottom plate of the radiator, the total area of the micro-channel groove is consistent with the area of a chip, the direction of the groove is consistent with the direction of internal water flow, and the height of the groove is equal to the top wall of a channel.
4. The single server-level, full-liquid-cooled heat sink of claim 2, wherein: the memory bank cooling structure is characterized in that a traditional fan (5) is replaced by a channel type air-liquid metal radiator (6) with a built-in fan (5) and used for cooling the memory bank (2), the rear side of the channel type air-liquid metal radiator (6) with the fan is fixedly connected with the circuit board (1), the inserting direction of the memory bank (2) is perpendicular to the long side of the channel type air-liquid metal radiator (6) with the fan, the height of the channel type air-liquid metal radiator (6) with the fan is the same as the height of the memory, the width of the channel type air-liquid metal radiator with the fan is the same as the width of the memory, an air guiding cover is arranged to cover the memory bank (2) and the channel type air-liquid metal radiator (6) with the fan in an air channel, the channel type air-liquid metal radiator with the fan (6) comprises a liquid cooling water inlet (12), a liquid cooling water outlet (13), an internal water cooling channel (14) and an internal air cooling channel (11), and the internal air cooling channel (11) is internally filled with the fan (5).
5. The single tier server level full liquid-cooled heat sink of claim 1, wherein: the server-level full liquid cooling transformation is carried out on a traditional air-cooled server which is put into use, wherein under the other heat dissipation treatment condition, the chip (3), the memory bar (2) and the fan (5) are linearly installed on the surface of the circuit board (1), the original fan (5) is kept still, and the upper surface of the chip (3) is covered with a channel type air-liquid metal radiator (7) with a groove.
6. The single tier server level full liquid-cooled heat sink of claim 5, wherein: the rear side of the channel-type air-liquid metal radiator (7) with the groove is fixedly connected with the circuit board (1), the total height of the channel-type air-liquid metal radiator (7) with the groove is consistent with the height of the memory bank (2), the width of the channel-type air-liquid metal radiator is consistent with the width of the memory bank (2), and the length of the channel-type air-liquid metal radiator is consistent with the length of the chip (3).
7. A grooved channel type liquid air metal heat sink (7) according to claim 6, characterized in that: the channel type air-liquid metal radiator (7) with the groove comprises a liquid cooling water inlet (12), a liquid cooling water outlet (13), an internal water cooling channel (14) and an internal air cooling channel (11), wherein the groove is formed in the upper portion of a bottom plate of the internal water channel, the groove is located in the center of the bottom plate of the channel type air-liquid metal radiator (7) with the groove, the area of the groove is consistent with that of a chip (3), the direction of the groove is consistent with that of internal water flow, and the height of the groove reaches the top wall of the channel.
8. The single server-level, full-liquid-cooled heat sink of claim 1, wherein: for newly produced single-core liquid cooling blade server, the third kind of heat dissipation processing case, memory strip (2) and chip (3) are installed on the surface of circuit board (1) in a straight line, chip (3) is arranged near one end side of circuit board, chip (3) is covered with groove fan single-channel wind-liquid integrated liquid cooling radiator (8), groove fan single-channel wind-liquid integrated liquid cooling radiator (8) comprises liquid cooling water inlet (12), liquid cooling water outlet (13), internal water cooling channel (14) and internal air cooling channel (11), groove fan single-channel wind-liquid integrated liquid cooling radiator (8) is covered over chip (3), the placing direction is vertical to memory strip (2) inserting direction, the height of groove fan single-channel wind-liquid integrated liquid cooling radiator (8) is consistent with the height of memory strip (2), the width is consistent with the total width of memory strip group, the length is consistent with chip (3) length, the bottom plate of internal water cooling channel (14) is centrally arranged with microchannel (9), the total area of groove is consistent with the chip area, the bottom plate is arranged with the bottom plate outside the groove, the fan is arranged with the inner water cooling channel (5), and the fan is connected with the top of the water cooling radiator (11), the two ends of the top of the single-channel air-liquid integrated liquid cooling radiator (8) with the fan in the groove are respectively communicated with a liquid cooling water outlet (13) and a liquid cooling water inlet (12).
9. The single server-level, full-liquid-cooled heat sink of claim 1, wherein: for a newly produced multi-core liquid cooling type blade server, a fourth heat dissipation treatment condition takes four cores as an example, four groups of memory bars (2) and four chips (3) are arranged side by side and are linearly installed on the surface of a circuit board (1), the four chips (3) are arranged on one end side close to the circuit board, the chips are arranged at equal intervals, a groove multi-channel wind-liquid integrated liquid cooling radiator (15) with a fan is covered on the four chips (3) together, the groove multi-channel wind-liquid integrated liquid cooling radiator (15) with the fan comprises a liquid cooling water inlet (12), a liquid cooling water outlet (13), an internal water cooling channel (14) and a plurality of groups of internal air cooling channels (11), the placement direction of the groove multi-channel wind-liquid integrated liquid cooling radiator (15) with the fan is vertical to the slot direction of the memory bars (2), the height of the heat radiator is consistent with the height of the memory bank (2), the width of the heat radiator is consistent with the total width occupied by four groups of memory bank groups, the length of the heat radiator is consistent with the length of the chip (3), a plurality of groups of micro-channel grooves (9) are arranged in the center of the bottom plate of the internal water cooling channel (14), the number of the grooves and the air channels is consistent with the number of the memory bank (2), the total area covered by each group of grooves is consistent with the area of a single chip, the position of each groove is consistent with the position of the corresponding single chip outside the bottom plate, the arrangement direction of the grooves is consistent with the direction of the internal water flow, the height of the grooves reaches the wall top, a full-row fan (5) is arranged inside each group of air cooling channels (11), the outer side of the fan (5) and the groove multi-channel air-liquid cooling integrated liquid cooling radiator (15) with the fan and the air-liquid cooling The multi-channel air-liquid integrated liquid cooling radiator with the fan is fixedly connected, and two ends of the top of the multi-channel air-liquid integrated liquid cooling radiator (15) with the fan in the groove are respectively communicated with a liquid cooling water outlet (13) and a liquid cooling water inlet (12).
10. The single-tier server level full liquid-cooled heat sink of any one of claims 1-9, wherein: liquid cooling water inlet (12) coolant liquid parameter can be regulated and control alone, through the temperature and the flow parameter of adjusting the import coolant liquid of radiator, realize the heat dissipation needs to chip (3) and memory simultaneously, the cooling parameter of each layer server is adjusted and is not mutually influenced, can cool off free control according to actual each layer work load, liquid cooling delivery port (13) and liquid cooling water inlet (12) and all liquid cooling radiators inside the server, whole full 3D that adopts aluminium matter or copper prints, liquid cooling delivery port (13) and liquid cooling water inlet (12) extend to the rack outside, because the pipe connection point is outside the server, the inside liquid of server has been avoided revealing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211133237.8A CN115494923A (en) | 2022-09-16 | 2022-09-16 | Single-layer server-level full liquid cooling heat dissipation device |
| PCT/CN2023/092446 WO2024055604A1 (en) | 2022-09-16 | 2023-05-06 | Full-liquid-cooling heat dissipation apparatus of single-layer server level |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211133237.8A CN115494923A (en) | 2022-09-16 | 2022-09-16 | Single-layer server-level full liquid cooling heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115494923A true CN115494923A (en) | 2022-12-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211133237.8A Pending CN115494923A (en) | 2022-09-16 | 2022-09-16 | Single-layer server-level full liquid cooling heat dissipation device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115494923A (en) |
| WO (1) | WO2024055604A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024055604A1 (en) * | 2022-09-16 | 2024-03-21 | 天津商业大学 | Full-liquid-cooling heat dissipation apparatus of single-layer server level |
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| CN114828577A (en) * | 2022-05-05 | 2022-07-29 | 天津商业大学 | Novel high-efficient data center server liquid cooling heat dissipation cabinet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115494923A (en) * | 2022-09-16 | 2022-12-20 | 天津商业大学 | Single-layer server-level full liquid cooling heat dissipation device |
-
2022
- 2022-09-16 CN CN202211133237.8A patent/CN115494923A/en active Pending
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- 2023-05-06 WO PCT/CN2023/092446 patent/WO2024055604A1/en unknown
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| JP2005038112A (en) * | 2003-07-18 | 2005-02-10 | Hitachi Ltd | Liquid cooling system and radiator |
| CN107515657A (en) * | 2017-10-24 | 2017-12-26 | 郑州云海信息技术有限公司 | A kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus |
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| CN114217678A (en) * | 2021-11-01 | 2022-03-22 | 浙江大华技术股份有限公司 | Server |
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| WO2024055604A1 (en) * | 2022-09-16 | 2024-03-21 | 天津商业大学 | Full-liquid-cooling heat dissipation apparatus of single-layer server level |
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| WO2024055604A1 (en) | 2024-03-21 |
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