CN113075984B - Immersed liquid cooling system - Google Patents
Immersed liquid cooling system Download PDFInfo
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- CN113075984B CN113075984B CN202110357405.0A CN202110357405A CN113075984B CN 113075984 B CN113075984 B CN 113075984B CN 202110357405 A CN202110357405 A CN 202110357405A CN 113075984 B CN113075984 B CN 113075984B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses an immersed liquid cooling system, which comprises: the system comprises a liquid cooling server cabinet, a liquid cooling server, an auxiliary cooling system and a water cooling system; the liquid cooling server comprises a hard disk module and a main board module; the auxiliary cooling system is used for executing air cooling operation on the hard disk module; the water cooling system is used for executing radiation heat exchange operation on the main board module; the main board module comprises an immersion liquid cooling box device and a liquid cooling board cover device; the liquid cooling plate cover device is connected with the water cooling system; the immersion liquid cooling box device is used for immersing the main board; the liquid cooling plate cover device is used for executing phase change heat exchange operation on the main board, the immersion type liquid cooling arrangement mode is more flexible, the liquid cooling server cabinet is the same as the traditional cabinet arrangement mode, the maintenance and the operation are convenient, the space is saved, the helium hard disk or the solid state hard disk is not required to be replaced, and the cost of the whole machine is better.
Description
Technical Field
The invention relates to the technical field of server heat dissipation, in particular to an immersed liquid cooling system.
Background
The current direct contact liquid cooling is because the huge box is adopted to carry out the heat transfer of server, leads to the liquid velocity of flow on server surface slower, and convection heat transfer coefficient is little, and heat transfer capacity is limited, and huge box leads to the coolant liquid to volatilize easily, moreover the hard disk of the server of direct contact liquid cooling mode needs to be changed into helium hard disk or solid state hard disk for the whole cost of server rises, and the hard disk belongs to low-power consumption jumbo size part, because of soaking in the coolant liquid, when carrying out hard disk change, the coolant liquid that consumes is more, leads to economic nature and maintainability to reduce.
Disclosure of Invention
The invention mainly solves the problems that in the heat dissipation process of the server, the economic benefit and heat dissipation performance of direct contact liquid cooling are not ideal, the heating power of a main board chip is high, and the air cooling is difficult to solve.
In order to solve the technical problems, the invention adopts a technical scheme that: there is provided an immersion liquid cooling system comprising: the system comprises a liquid cooling server cabinet, a liquid cooling server, an auxiliary cooling system and a water cooling system;
the liquid cooling server comprises a hard disk module and a main board module;
the auxiliary cooling system is used for executing air cooling operation on the hard disk module;
the water cooling system is used for executing radiation heat exchange operation on the main board module;
the main board module comprises an immersion liquid cooling box device and a liquid cooling board cover device;
the liquid cooling plate cover device is connected with the water cooling system;
the immersion liquid cooling box device is used for immersing the main board;
the liquid cooling plate cover device is used for executing phase change heat exchange operation on the main board.
Further, the immersion liquid cooling box device comprises an immersion liquid cooling box, a liquid supplementing port of the liquid cooling box and a liquid cooling box constant pressure device;
the liquid supplementing port of the liquid cooling box is used for supplementing cooling liquid into the immersed liquid cooling box;
the liquid cooling box constant pressure device is used for measuring the hydraulic pressure in the immersed liquid cooling box.
Further, the auxiliary cooling system comprises a first fan and a first cooling air duct, wherein the first cooling air duct is used for acquiring cold air and guiding the cold air into the hard disk module, and the first fan is used for guiding the warmed cold air out of the liquid cooling server cabinet.
Further, the liquid cooling plate cover device comprises a plate cover runner and a liquid cooling plate;
the two ends of the plate cover runner are respectively provided with a plate cover runner inlet and a plate cover runner outlet, cooling water flows in the plate cover runner, and the plate cover runner is used for reducing the temperature of the liquid cooling heat dissipation plate;
one surface of the liquid cooling heat dissipation plate is contacted with the plate cover flow channel, and the other surface of the liquid cooling heat dissipation plate is provided with heat dissipation ribs;
the heat dissipation fins are used for cooling the gasified cooling liquid.
Further, the water cooling system comprises a second fan, a second cooling air duct, a dry cooler, a water collector and a cooling system pipeline;
the water collector is respectively connected with the plate cover runner outlet and the cooling water pump, and the cooling water pump is connected with the dry cooler;
the second cooling air duct is used for obtaining cold air and cooling the dry cooler;
the water collector is used for recycling the cooling water in the plate cover flow channel;
the cooling water pump is used for conveying the cooling water to the dry cooler;
the dry cooler is used for performing heat exchange operation on the cooling water;
the second fan is used for guiding out heat generated by the heat-exchanged dry cooler to the outside of the liquid cooling server cabinet.
Further, the water cooling system further comprises a cooling system pipeline, wherein the cooling system pipeline is used for periodically starting the cooling water pump.
Further, the heat dissipation fins include high-power dissipation fins for dissipating heat from the high-power components of the motherboard module and low-power dissipation fins for dissipating heat from the low-power components of the motherboard module.
Further, the main board is immersed in the immersion liquid cooling box device in a packaged mode.
Further, the cooling liquid is a fluoridation liquid.
Further, the liquid cooling server cabinet is used for fixing the liquid cooling server.
The beneficial effects of the invention are as follows:
1. the immersed liquid cooling system can realize more flexible arrangement mode of immersed liquid cooling, has the same arrangement mode of the liquid cooling server cabinet as the traditional cabinet, is convenient to maintain and operate, saves more space, does not need to replace a helium hard disk or a solid state hard disk, and has better cost of the whole machine.
2. The immersed liquid cooling system can solve the problems that the CPU on a main board is high in heating power consumption and difficult to solve by air cooling, compared with a traditional liquid cooling box, the immersed liquid cooling system is small in size, and continuously cools a chip in a cooling liquid evaporation and liquefaction mode, so that the problems that the traditional liquid cooling box is complex in operation and maintenance and low in liquid flow rate are solved.
3. The immersion liquid cooling system can completely encapsulate the main board module, separate cooling water from the ribs, avoid the possibility of liquid leakage caused by direct contact of the cooling water and the ribs, set the shape of the ribs according to the positions of heating elements on the main board, and improve the cost, the operation and maintenance flexibility, the equipment safety and the like compared with the traditional immersion liquid cooling products, and effectively promote the development of liquid cooling of a data center.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a front view of a liquid cooling server cabinet of an immersion liquid cooling system according to embodiment 1 of the present invention;
FIG. 2 is a perspective view of a liquid cooling server of an immersion liquid cooling system according to embodiment 1 of the present invention;
fig. 3 is a cross-sectional view of a cooling plate cover of an immersion liquid cooling system according to embodiment 1 of the present invention.
In the description of the invention, wherein: 1. a first fan; 2. a first cooling air duct; 3. a second fan; 4. a second cooling air duct; 5. a dry cooler; 6. a water collector; 7. a cooling water pump; 8. a cooling system conduit; 9. a hard disk; 10. a main board; 11. the server supplies power; 12. a plate cover runner inlet; 13. a plate cover runner outlet; 14. a liquid supplementing port of the liquid cooling box; 15. a liquid cooling box constant pressure device; 16. a plate cover flow passage; 17. liquid cooling heat dissipation plate; 18. high-power consumption heat dissipation fins; 19. low power consumption heat dissipation fins.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the description of the present invention, it is to be noted that,
CPU (Central Processing Unit) is a central processing unit,
GPU (Graphics Processing Unit) is a graphics processor,
BMC (Baseboard Management Controller) is a baseboard management controller.
Example 1
The invention provides an immersion liquid cooling system, please refer to fig. 1 to 3, comprising:
liquid cooling server rack, liquid cooling server, auxiliary cooling system and water cooling system.
The liquid cooling server cabinet is internally provided with a liquid cooling server, an auxiliary cooling system and a water cooling system.
The front end of the liquid cooling server cabinet is provided with a first fan 1 and a first cooling air duct 2, and the rear end of the liquid cooling server cabinet is provided with a second fan 3, a second cooling air duct 4, a dry cooler 5, a water collector 6, a cooling water pump 7, a cooling system pipeline 8, a hard disk 9, a main board 10, a server power supply 11, a plate cover runner inlet 12, a plate cover runner outlet 13, a liquid cooling box liquid supplementing port 14, a liquid cooling box constant pressure device 15, a plate cover runner 16, a liquid cooling heat dissipation plate 17, a high-power dissipation heat dissipation fin 18 and a low-power dissipation heat dissipation fin 19.
The inside liquid cooling server rack that is equipped with a plurality of liquid cooling servers, liquid cooling server is from the bottom of liquid cooling server rack to top tiling, and first cooling wind channel 2 and second cooling wind channel 4 set up in liquid cooling server rack is inside, and the air intake is connected to the bottom of first cooling wind channel 2 and second cooling wind channel 4, and this air intake can blow into cold wind to first cooling wind channel 2 and second cooling wind channel 4, does not have the compressor to carry out the forced air cooling heat dissipation through this kind of mode data center, but the air current production of this air intake is because of not falling within the scope that the invention needs to protect, so will not be repeated.
The liquid cooling server radiating part is divided into a hard disk radiating part and a main board radiating part, the hard disk radiating part of the liquid cooling server penetrates through the liquid cooling server for a first cooling air duct 2 inside the liquid cooling server, the specific design idea of the hard disk radiating part is that all hard disks in the server are arranged in front, the fan part of the traditional server is removed, an air duct is added between the hard disk and the main board, all air ducts of a liquid cooling server cabinet are combined into the first cooling air duct 2, a first fan 1 is arranged at the front door of the liquid cooling server cabinet or at the front door of the cabinet, and the first fan can be integrally arranged with the front door of the cabinet of the liquid cooling server cabinet or can be arranged at the front door of the cabinet as an independent radiating component.
The cold air of the first cooling air channel 2 dissipates heat of the hard disk 9 part of the liquid cooling server, after the cold air enters the first cooling air channel 2, the cold air entering the bottom of the liquid cooling server cabinet through the hard disk 9 part enters the liquid cooling server cabinet at first, the hard disk 9 flows to the outer side of the liquid cooling server cabinet near the central part of the liquid cooling server cabinet, the heat dissipation operation is carried out, after the first fan 1 dissipates heat, the cold air with the temperature rising is sent out to the outer side of the liquid cooling server cabinet, and the hard disk 9 is mainly used for storing data in the server, so that the volume is large, but the power consumption is not very large, and the hard disk 9 of the server and the main board 10 of the server are isolated for heat dissipation, so that the whole heat dissipation strategy of the server cabinet is optimized, and the power consumption is balanced.
The rear end of the liquid cooling server cabinet is provided with a second fan 3 and a second cooling air duct 4, the second fan 3 and the second cooling air duct 4 form an air cooling system, the air cooling system mainly cools a liquid cooling plate cover device of the liquid cooling server, and the cooling system is generally integrally designed with the liquid cooling server cabinet or is prolonged to the outside of a machine room where the liquid cooling server cabinet is located according to requirements, so that the aim of not influencing the internal temperature of the machine room is fulfilled.
The main board heat dissipation part of the liquid cooling server comprises an immersion liquid cooling box device, a liquid cooling plate cover device and a server power supply 11, wherein the cooling liquid adopted in the immersion liquid cooling box device is fluorinated liquid, the boiling point of the cooling liquid is lower than the normal working temperature of a chip of the main board 10, in practical application, the temperature of the chip is about 50-55 ℃, the temperature of the fluorinated liquid rises and boils when flowing through the chip of the main board 10, evaporated gas contacts the liquid cooling plate cover device, and the evaporated gas is condensed into small water drops to continuously cool the chip after the temperature of the liquid cooling plate cover device is extremely low, so the immersion liquid cooling box device is provided with a liquid cooling box fluid supplementing port 14 and a liquid cooling box constant pressure device 15, because the cooling liquid in the immersion liquid cooling box possibly is lost when maintenance personnel maintains the main board 10, therefore, the cooling liquid of the immersion liquid cooling box device needs to be supplemented by the liquid cooling box fluid supplementing port 14 during daily maintenance of the server maintenance personnel, or the cooling liquid needs to be replaced by the cooling liquid with excessive use times inside the immersion liquid cooling box device, so the server maintenance personnel can drain the cooling liquid from the liquid cooling box fluid supplementing port 14 and then inject the cooling liquid into the liquid cooling box device through the liquid cooling box fluid supplementing port 14, in industrial production, the immersion liquid cooling box is generally supplemented by a special device, the hydraulic pressure of the immersion liquid cooling box needs to be known from the outside, the maintenance personnel can set the hydraulic pressure of the immersion liquid cooling box through the liquid cooling box constant pressure device 15, the main board module of a single server can be packaged and fixed in the immersion liquid cooling box through the main board radiating part, the whole main board module is sealed, and the main board is immersed in the cooling liquid, the liquid cooling of the main board module is realized through the immersed liquid cooling box.
It should be noted that, the boiling point of the cooling liquid in the immersed liquid cooling tank is low because of evaporation and vaporization, but in order to ensure the flow of the cooling water in the plate cover flow channel, the boiling point of the cooling water is high, and distilled water is generally adopted as the cooling water.
The liquid cooling plate cover device is divided into a plate cover runner inlet 12, a plate cover runner outlet 13, a plate cover runner 16 and a liquid cooling heat radiation plate 17, one surface of the liquid cooling heat radiation plate 17 is contacted with the plate cover runner 16, the other side of the liquid cooling heat radiation plate 17 is provided with a high-power consumption heat radiation rib 18 and a low-power consumption heat radiation rib 19, the liquid cooling heat radiation plate 17 is made of metal with good heat conductivity and corrosion resistance, the high-power consumption heat radiation rib 18 and the low-power consumption heat radiation rib 19 are made of metal ribs with different densities, namely, the number of the metal ribs with different densities is unit area, for example, the number of the high-power consumption heat radiation rib 18 is 100 metal ribs with 10 square centimeters, the low-power consumption heat radiation rib 19 is 10 metal ribs with the specific proportion being set by actual needs, and a person skilled in the art should understand that through the design rules of the high-power consumption heat radiation rib 18 and the low-power consumption heat radiation rib 19, the heat dissipation fins with medium power consumption and the like can be designed, but specific design rules are not repeated, one sides of the heat dissipation fins 18 with high power consumption and the heat dissipation fins 19 with low power consumption are directly contacted with cooling liquid, and the gasified cooling liquid is cooled, and the other sides of the heat dissipation fins 18 with high power consumption and the heat dissipation fins 19 are isolated by the liquid cooling heat dissipation plate 17, heat exchange is realized through heat conduction, no contact is realized, the whole heat dissipation system has no water immersion danger, the layout mode of the power dissipation components of the main board 10 is designed according to multiple layers, in actual production, the heat dissipation device is actively matched with the layout of the main board, the layout of the heat dissipation fins 18 with high power consumption and the heat dissipation fins 19 is designed according to the layout of the main board, and the basic idea is that the upper sides of the heat dissipation fins 18 with high power consumption are vertically covered by the high power components such as a CPU, a GPU, a memory and the like, while low power components such as network cards, BMC, etc. are vertically covered with low power dissipation fins 19.
The cooling water flows into the plate cover flow channel 16, and the plate cover flow channel 16 can adopt a serpentine layout, but it is noted that various layout modes can be designed according to the serpentine layout, so long as the layout modes can increase the heat exchange area, the cooling water is used as the high-power-consumption heat dissipation fins 18 and the low-power-consumption heat dissipation fins 19 on the back of the cooling liquid cooling heat dissipation plate 17, but the cooling water in the server needs to flow, the phase-change heat exchange process can be realized, so the plate cover flow channel outlet 13 flows out hot cooling water, the hot cooling water is uniformly recovered into the water collector 6, the water collector 6 is connected with the cooling water pump 7, the cooling water pump 7 conveys the hot cooling water to the dry cooler 5, the temperature of the dry cooler 5 is extremely low, the second cooling air duct 4 continuously conveys cold air, the dry cooler 5 and the second cooling air duct 4 carry out heat exchange, the heat emitted by the second fan 3 finally brings the outside of the cooling liquid cooling server, the hot cooling water is cooled by the dry cooler 5 and is output into the plate cover flow channel inlet 12 through the cooling water pump 7, and the cooling water in the plate cover flow channel 16 is cooled.
In order to reduce the power consumption of the product, the cooling system pipeline 8 is used for providing a periodic power supply for the cooling water pump 7, so that the cooling water pump 7 periodically cools down the cooling water, and the cooling water pump 7 is controlled according to the instruction of a server maintainer.
The server power supply 11 of the heat dissipation part of the motherboard is used for providing standby power when the server cabinet is powered off, so as to prevent irreversible loss of the motherboard assembly.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (7)
1. An immersion liquid cooling system, comprising: the system comprises a liquid cooling server cabinet, a liquid cooling server, an auxiliary cooling system and a water cooling system;
the liquid cooling server comprises a hard disk module and a main board module;
the auxiliary cooling system is used for executing air cooling operation on the hard disk module;
the water cooling system is used for executing phase change heat exchange operation on the main board module;
the main board module comprises an immersion liquid cooling box device and a liquid cooling board cover device;
the liquid cooling plate cover device is connected with the water cooling system;
the immersion liquid cooling box device is used for immersing the main board;
the liquid cooling plate cover device is used for performing phase change heat exchange operation on the main board;
the auxiliary cooling system comprises a first fan (1) and a first cooling air duct (2), wherein the first cooling air duct (2) is used for acquiring cold air and guiding the cold air into the hard disk module, and the first fan (1) is used for guiding the warmed cold air out of the liquid cooling server cabinet; the first cooling air duct (2) penetrates through the liquid cooling server, and the first cooling air duct (2) is positioned between the hard disk module and the main board module;
the liquid cooling plate cover device comprises a plate cover runner (16) and a liquid cooling plate (17);
the two ends of the plate cover runner (16) are respectively provided with a plate cover runner inlet (12) and a plate cover runner outlet (13), cooling water flows in the plate cover runner (16), and the plate cover runner (16) is used for reducing the temperature of the liquid cooling heat dissipation plate (17);
one surface of the liquid cooling heat dissipation plate (17) is contacted with the plate cover flow channel (16), and the other surface is provided with heat dissipation ribs;
the heat dissipation fins are used for cooling the vaporized cooling liquid;
the heat dissipation fins comprise high-power dissipation fins (18) and low-power dissipation fins (19), the high-power dissipation fins (18) are used for dissipating heat of the high-power components of the main board module, and the low-power dissipation fins (19) are used for dissipating heat of the low-power components of the main board module.
2. The immersion liquid cooling system according to claim 1, wherein: the immersion liquid cooling box device comprises an immersion liquid cooling box, a liquid supplementing port (14) of the liquid cooling box and a liquid cooling box constant pressure device (15);
the liquid supplementing port (14) of the liquid cooling box is used for supplementing cooling liquid into the immersion liquid cooling box;
the liquid cooling box constant pressure device (15) is used for measuring the hydraulic pressure in the immersion liquid cooling box.
3. The immersion liquid cooling system according to claim 1, wherein: the water cooling system comprises a second fan (3), a second cooling air duct (4), a dry cooler (5), a water collector (6) and a cooling system pipeline (8);
the water collector (6) is respectively connected with the plate cover runner outlet (13) and the cooling water pump (7), and the cooling water pump (7) is connected with the dry cooler (5);
the second cooling air duct (4) is used for obtaining cold air and cooling the dry cooler (5);
the water collector (6) is used for recycling the cooling water in the plate cover flow channel (16);
the cooling water pump (7) is used for conveying the cooling water to the dry cooler (5);
the dry cooler (5) is used for performing phase change heat exchange operation on the cooling water;
the second fan (3) is used for guiding out heat generated by the heat exchange completed dry cooler (5) to the outside of the liquid cooling server cabinet.
4. An immersion liquid cooling system according to claim 3, wherein: the water cooling system further comprises a cooling system pipe (8), wherein the cooling system pipe (8) is used for periodically starting the cooling water pump (7).
5. The immersion liquid cooling system according to claim 1, wherein: the main board is immersed in the immersion liquid cooling box device in an encapsulated mode.
6. The immersion liquid cooling system according to claim 1, wherein: the cooling liquid is fluoridized liquid.
7. The immersion liquid cooling system according to claim 1, wherein: the liquid cooling server cabinet is used for fixing the liquid cooling server.
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| CN113703550A (en) * | 2021-07-23 | 2021-11-26 | 苏州浪潮智能科技有限公司 | Hybrid liquid cooling device |
| CN113849054B (en) * | 2021-08-31 | 2024-03-26 | 兰洋(宁波)科技有限公司 | Submerged liquid cooling heat dissipation system applied to data center |
| CN114217678B (en) * | 2021-11-01 | 2024-03-12 | 浙江大华技术股份有限公司 | Server |
| CN115016623B (en) * | 2022-08-10 | 2022-11-25 | 兰洋(宁波)科技有限公司 | Liquid cooling box |
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| CN111506169A (en) * | 2020-04-15 | 2020-08-07 | 捷通智慧科技股份有限公司 | Solid immersion type liquid cooling server and solid immersion type liquid cooling service system |
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| US9335802B2 (en) * | 2013-02-01 | 2016-05-10 | Dell Products, L.P. | System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid |
| CN106445037B (en) * | 2016-11-29 | 2023-10-24 | 广东西江数据科技有限公司 | Partial immersion type liquid cooling server cooling system |
| WO2018195885A1 (en) * | 2017-04-28 | 2018-11-01 | 曙光信息产业(北京)有限公司 | Air-vapour separation method and device for immersed-type liquid cooling system |
| CN107960049A (en) * | 2017-12-29 | 2018-04-24 | 华南理工大学 | The Intelligent server cabinet and its control method that a kind of liquid is cold, wind-cooling heat dissipating combines |
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| CN208999943U (en) * | 2018-12-13 | 2019-06-18 | 泰兴航空光电技术有限公司 | A kind of immersion liquid cooling apparatus adapting to 5D server |
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| CN212647364U (en) * | 2020-07-20 | 2021-03-02 | 苏州神尔能源科技有限公司 | Full immersion type liquid cooling host |
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| CN111506169A (en) * | 2020-04-15 | 2020-08-07 | 捷通智慧科技股份有限公司 | Solid immersion type liquid cooling server and solid immersion type liquid cooling service system |
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