CN113075984B - Immersed liquid cooling system - Google Patents

Abstract

The invention discloses an immersion liquid cooling system, comprising: a liquid cooling server cabinet, a liquid cooling server, an auxiliary cooling system and a water cooling system; the liquid cooling server includes a hard disk module and a main board module; Cold operation; the water cooling system is used to perform radiation heat exchange operation on the motherboard module; the motherboard module includes a submerged liquid cooling box device and a liquid cooling plate cover device; the liquid cooling plate cover device is connected to the water cooling system; the submerged liquid cooling box device is used for Submerge the main board; the liquid-cooled plate cover device is used to perform phase-change thermal operations on the main board. Through the above method, the present invention can realize a more flexible submerged liquid-cooled arrangement, and the arrangement of the liquid-cooled server cabinet is the same as that of the traditional cabinet, which is convenient for maintenance And operation, more space saving, no need to replace helium hard disk or solid state hard disk, the cost of the whole machine is better.

Description

An immersion liquid cooling system

technical field

The invention relates to the technical field of server heat dissipation, in particular to an immersion liquid cooling system.

Background technique

The current direct contact liquid cooling uses a huge box for server heat exchange, resulting in slow liquid flow on the server surface, small convective heat transfer coefficient, and limited heat transfer capacity, and the huge box makes the cooling liquid volatile, and adopts The hard disk of the server directly in contact with the liquid cooling method needs to be replaced with a helium hard disk or a solid-state hard disk, which increases the overall cost of the server, and the hard disk is a large-scale component with low power consumption. Because it is immersed in the cooling liquid, it consumes a lot of energy when replacing the hard disk. More coolant, resulting in less economy and less maintenance.

Contents of the invention

The invention mainly solves the problem that the direct contact liquid cooling has unsatisfactory economic benefits and heat dissipation performance during the heat dissipation process of the server, and the main board chip has high heating power, which is difficult to be solved by air cooling.

In order to solve the above technical problems, a technical solution adopted by the present invention is to provide an immersion liquid cooling system, including: a liquid cooling server cabinet, a liquid cooling server, an auxiliary cooling system and a water cooling system;

The liquid-cooled server includes a hard disk module and a motherboard module;

The auxiliary cooling system is used to perform an air cooling operation on the hard disk module;

The water cooling system is used to perform radiation heat exchange operation on the motherboard module;

The main board module includes an immersion liquid cooling box device and a liquid cooling plate cover device;

The liquid-cooled plate cover device is connected to the water-cooling system;

The immersion liquid cold box device is used to immerse the main board;

The liquid-cooled plate cover device is used to perform a phase-change heat operation on the main board.

Further, the immersion liquid cooling box device includes an immersion liquid cooling box, a liquid cooling box replenishment port, and a liquid cooling box pressure regulator;

The replenishment port of the liquid cooling box is used to replenish cooling liquid into the immersion liquid cooling box;

The liquid cold box pressure regulator is used to measure the hydraulic pressure in the submerged liquid cold box.

Further, the auxiliary cooling system includes a first fan and a first cooling air duct, the first cooling air duct is used to obtain cold air, and guide the cold air to the hard disk module, and the first fan uses The heated cold air is exported to the outside of the liquid-cooled server cabinet.

Further, the liquid-cooled plate cover device includes a plate cover flow channel and a liquid-cooled heat sink;

The two ends of the plate cover flow channel are respectively provided with a plate cover flow channel inlet and a plate cover flow channel outlet, and cooling water flows inside the plate cover flow channel, and the plate cover flow channel is used to reduce the temperature of the liquid cooling heat sink. temperature;

One side of the liquid-cooled heat dissipation plate is in contact with the flow channel of the plate cover, and the other side is provided with heat dissipation fins;

The cooling fins are used to cool the vaporized coolant.

Further, the water cooling system includes a second fan, a second cooling air duct, a dry cooler, a water collector and cooling system pipes;

The water collector is respectively connected to the outlet of the plate cover flow channel and the cooling water pump, and the cooling water pump is connected to the dry cooler;

The second cooling air channel obtains cold air for cooling the dry cooler;

The water collector is used to recover the cooling water in the flow channel of the plate cover;

The cooling water pump is used to transport the cooling water to the dry cooler;

The dry cooler is used to perform a heat exchange operation on the cooling water;

The second fan is used to export the heat generated by the dry cooler after heat exchange to the outside of the liquid-cooled server cabinet.

Further, the water-cooling system further includes a cooling system pipeline, and the cooling system pipeline is used to periodically start the cooling water pump.

Further, the heat dissipation fins include high-power dissipation fins and low-power dissipation fins, the high-power dissipation fins are used to dissipate heat from the high-power components of the motherboard module, and the low-power dissipation fins The fins are used to dissipate heat from the low power components of the motherboard module.

Further, the main board is encapsulated and submerged in the immersion liquid cold box device.

Further, the cooling liquid is a fluorinated liquid.

Further, the liquid-cooled server cabinet is used to fix the liquid-cooled server.

The beneficial effects of the present invention are:

1. The submerged liquid cooling system described in the present invention can realize a more flexible submerged liquid cooling arrangement, and the arrangement of the liquid cooling server cabinet is the same as that of the traditional cabinet, which is convenient for maintenance and operation, saves more space, and does not need to replace the helium hard disk Or a solid state drive, the cost of the whole machine is better.

2. The immersion liquid cooling system described in the present invention can solve the problem that the CPU on the main board has high heating and power consumption and is difficult to solve by air cooling. The liquid-cooled box is small in size, and continuously cools the chip by evaporating and liquefying the cooling liquid, which solves the problems of complicated operation and maintenance and slow liquid flow rate of the traditional liquid-cooled box.

3. The submerged liquid cooling system of the present invention can completely encapsulate the main board module, separate the cooling water from the fins, eliminate the possibility of liquid leakage caused by direct contact between the cooling water and the fins, and can follow the heating element on the main board Compared with traditional immersion liquid cooling products, it improves the cost, operation and maintenance flexibility, equipment safety, etc., and can effectively promote the development of data center liquid cooling.

Description of drawings

In order to more clearly illustrate the specific implementation of the present invention or the technical solutions in the prior art, the following will briefly introduce the accompanying drawings that need to be used in the specific implementation or description of the prior art. Obviously, the accompanying drawings in the following description The drawings show some implementations of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

1 is a front view of a liquid-cooled server cabinet of the submerged liquid-cooled system according to Embodiment 1 of the present invention;

2 is a three-view diagram of the liquid-cooled server of the submerged liquid-cooled system according to Embodiment 1 of the present invention;

3 is a cross-sectional view of the cooling plate cover of the submerged liquid cooling system according to Embodiment 1 of the present invention.

In the description of the present invention, wherein: 1. The first fan; 2. The first cooling air passage; 3. The second fan; 4. The second cooling air passage; 5. Dry cooler; 6. Water collector; 7. Cooling water pump; 8. Cooling system pipe; 9. Hard disk; 10. Main board; 11. Server power supply; 12. Plate cover runner inlet; 13. Plate cover runner outlet; Cold box constant pressure device; 16. Plate cover flow channel; 17. Liquid cooling heat dissipation plate; 18. High power consumption heat dissipation fins; 19. Low power consumption heat dissipation fins.

Detailed ways

The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral Ground connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, or it can be an internal connection between two components, which can be a wireless connection or a wired connection. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

It should be noted that, in the description of the present invention,

CPU (Central Processing Unit) is the central processing unit,

GPU (Graphics Processing Unit) is a graphics processor,

BMC (Baseboard Management Controller) is a baseboard management controller.

Example 1

The present invention provides an immersion liquid cooling system, please refer to Figure 1 to Figure 3, including:

Liquid-cooled server cabinets, liquid-cooled servers, auxiliary cooling systems and water-cooling systems.

The liquid-cooled server cabinet is equipped with a liquid-cooled server, an auxiliary cooling system and a water-cooling system.

The front end of the liquid-cooled server cabinet is provided with a first fan 1 and a first cooling air duct 2, and the rear end of the liquid-cooled server cabinet is provided with a second fan 3, a second cooling air duct 4, a dry cooler 5, a water collector 6, Cooling water pump 7, cooling system pipeline 8, hard disk 9, main board 10, server power supply 11, plate cover flow channel inlet 12, plate cover flow channel outlet 13, liquid cooling box replenishment port 14, liquid cooling box pressure regulator 15, board Cover flow channel 16, liquid cooling heat dissipation plate 17, high power consumption heat dissipation fins 18, and low power consumption heat dissipation fins 19.

A number of liquid-cooled servers are arranged inside the liquid-cooled server cabinet, and the liquid-cooled servers are tiled from the bottom to the top of the liquid-cooled server cabinet. The first cooling air duct 2 and the second cooling air duct 4 are arranged inside the liquid-cooled server cabinet, and the second The bottoms of the first cooling air channel 2 and the second cooling air channel 4 are connected to the air inlet, and the air inlet can blow cold air into the first cooling air channel 2 and the second cooling air channel 4. In this way, the data center does not have a compressor. Air cooling and heat dissipation, but the airflow generated by the air inlet does not belong to the scope of protection of the present invention, so it will not be described again.

The heat dissipation part of the liquid-cooled server is divided into the hard disk heat dissipation part and the main board heat dissipation part. The hard disk heat dissipation part of the liquid-cooled server is the first cooling air duct 2 inside the liquid-cooled server that runs through the liquid-cooled server. The specific design idea of the hard disk heat dissipation part is as follows: All the hard disks in the front are removed, and the fan part of the traditional server is removed, and an air duct is added between the hard disk and the motherboard. All the air ducts of the liquid-cooled server cabinet are combined into the first cooling air duct 2. A first fan 1 is installed on the front door, and the first fan can be installed integrally with the front door of the liquid-cooled server cabinet, or can be installed on the front door of the cabinet as an independent heat dissipation component.

The cold air in the first cooling air passage 2 dissipates heat to the hard disk 9 of the liquid-cooled server. After the cold air enters the first cooling air passage 2, the cold air passing through the hard disk 9 first enters the bottom of the liquid-cooled server cabinet and enters the liquid-cooled server. In the cabinet, the hard disk 9 flows from the central part of the liquid-cooled server cabinet to the outside of the liquid-cooled server cabinet to perform heat dissipation operation. After the heat dissipation process, the first fan 1 sends the cold air with increased temperature to the outside of the liquid-cooled server cabinet. Because inside the server, the hard disk 9 is mainly used to store data, and its volume is large, but the power consumption is not very large, so the hard disk 9 of the server and the motherboard 10 of the server are isolated for heat dissipation, so as to optimize the overall heat dissipation of the server cabinet strategy to balance power consumption.

The rear end of the liquid-cooled server cabinet is the second fan 3 and the second cooling air duct 4. The second fan 3 and the second cooling air duct 4 form an air-cooling system. The air-cooling system is mainly used for liquid cooling of the liquid-cooled server. The plate cover device is used for cooling. The cooling system is generally integrated with the liquid-cooled server cabinet, or the cooling system is extended to the outside of the computer room where the liquid-cooled server cabinet is located, so as not to affect the internal temperature of the computer room.

The heat dissipation part of the motherboard of the liquid-cooled server includes an immersion liquid cooling box device, a liquid cooling plate cover device, and a server power supply 11, wherein the cooling liquid used in the immersion liquid cooling box device is a fluorinated liquid, and its boiling point is lower than that of the chips on the motherboard 10. Normal working temperature, in actual application, the temperature of the chip is about 50-55°C, the temperature of the fluorinated liquid rises and boils when it flows through the chip of the main board 10, and the evaporated gas contacts the liquid-cooled plate cover device, due to the liquid cooling The temperature of the plate cover device is extremely low, so after the temperature of the evaporated gas drops rapidly, it condenses into small water droplets to continue cooling the chip, so the submerged liquid cooling box device is equipped with a liquid cooling box replenishment port 14 and a liquid cooling box constant pressure device 15 , because the coolant in the submerged liquid cooling box may be lost when the maintenance personnel are maintaining the main board 10, it is necessary to pass the cooling fluid in the submerged liquid cooling box device through the liquid cooling box replenishment port 14 during the daily maintenance of the server maintenance personnel. Liquid replenishment, or because the cooling liquid is used too many times inside the submerged liquid cooling box device, the cooling liquid needs to be replaced, so the server maintenance personnel drain the cooling liquid from the liquid cooling box replenishment port 14, Then the coolant is injected into the inside of the liquid cooling box device through the liquid cooling box replenishment port 14. In industrial production, the submerged liquid cooling box is generally replenished by a special device, so it is necessary to know the location of the submerged liquid cooling box externally. Hydraulic pressure, maintenance personnel can set its hydraulic pressure through the liquid cooling box constant pressure device 15, so through the main board heat dissipation part, the main board module of a single server can be packaged and fixed in the submerged liquid cooling box, and the entire main board module is sealed , the motherboard is immersed in the cooling liquid, and the liquid cooling of the motherboard module is realized through the submerged liquid cooling box.

It should be noted that the cooling liquid in the submerged liquid cooling box needs to evaporate and vaporize, so the boiling point is low, but the cooling water in the plate cover flow channel has a high boiling point in order to ensure its flow, and distilled water is generally used as cooling water .

The liquid-cooled plate cover device is divided into the plate cover flow channel inlet 12, the plate cover flow channel outlet 13, the plate cover flow channel 16 and the liquid cooling heat dissipation plate 17, one side of the liquid cooling heat dissipation plate 17 is in contact with the plate cover flow channel 16, and the liquid cooling The other side of the heat dissipation plate 17 is provided with high power consumption heat dissipation ribs 18 and low power consumption heat dissipation fins 19. The liquid cooling heat dissipation plate 17 is a metal with good thermal conductivity and is difficult to be corroded. The power dissipation fins 19 are arranged by metal fins with different densities, that is, how many metal fins are there per unit area with different densities, for example, there are 100 high power dissipation fins 18 under 10 square centimeters Metal fins, and the low-power heat dissipation fins 19 are 10 metal fins under 10 square centimeters, the specific ratio is set by actual needs, and those skilled in the art should understand that through high power consumption The design rules of heat dissipation ribs 18 and low power consumption heat dissipation fins 19 can also be designed, such as medium power consumption heat dissipation fins, etc., but the specific design rules will not be repeated. High power consumption heat dissipation fins 18 and low power consumption heat dissipation One side of the fins 19 directly contacts the coolant, and cools the vaporized coolant, while the other sides of the high-power dissipation fins 18 and the low-power dissipation fins 19 are separated by the liquid-cooled heat dissipation plate 17. The heat is realized through heat conduction without any contact with each other, and the entire heat dissipation system has no risk of flooding. Because the layout of the power consumption components of the motherboard 10 is designed according to multiple layers, in actual production, the heat dissipation device must actively fit the layout of the motherboard. Therefore, the layout of the high-power cooling ribs 18 and the low-power cooling ribs 19 is designed according to the layout of the motherboard. The basic idea is that high-power components, such as CPU, GPU, and memory, are vertically covered with high-power cooling ribs. 18, while low-power components, such as network cards, BMCs, etc., are vertically covered with low-power heat dissipation ribs 19.

Cooling water flows inside the plate cover flow channel 16, and the plate cover flow channel 16 can adopt a serpentine layout, but it should be noted that various layout methods can be designed according to the serpentine layout, as long as the heat exchange area can be increased Either way, the cooling water can be used as the high-power cooling fins 18 and low-power cooling fins 19 on the back of the cooling liquid cooling plate 17, but the cooling water needs to flow inside the server to achieve phase-change heat process, so the outlet 13 of the plate cover flow channel flows out the hot cooling water, and the hot cooling water is uniformly recovered into the water collector 6, and the water collector 6 is connected with the cooling water pump 7, and the cooling water pump 7 delivers the hot cooling water to The dry cooler 5, the temperature of the dry cooler 5 is extremely low, because the second cooling air channel 4 continuously transports cold air, the dry cooler 5 exchanges heat with the second cooling air channel 4, and the heat emitted is finally taken out by the second fan 3 On the outside of the liquid-cooled server cabinet, the hot cooling water is cooled by the dry cooler 5 , and then output to the plate cover flow channel inlet 12 by the cooling water pump 7 to cool down the cooling water in the plate cover flow channel 16 .

In order to reduce the power consumption of the product, the cooling system pipeline 8 is used to provide periodic power to the cooling water pump 7, so that the cooling water pump 7 periodically cools down the cooling water, and controls the cooling water pump 7 according to the instructions of the server maintenance personnel.

The server power supply 11 of the heat dissipation part of the motherboard is used to provide a backup power supply when the server cabinet is powered off, so as to prevent irreversible loss of the motherboard components.

The above is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related technologies fields, are all included in the scope of patent protection of the present invention in the same way.

Claims (7)

1. An immersion liquid cooling system, comprising: the system comprises a liquid cooling server cabinet, a liquid cooling server, an auxiliary cooling system and a water cooling system;

the liquid cooling server comprises a hard disk module and a main board module;

the auxiliary cooling system is used for executing air cooling operation on the hard disk module;

the water cooling system is used for executing phase change heat exchange operation on the main board module;

the main board module comprises an immersion liquid cooling box device and a liquid cooling board cover device;

the liquid cooling plate cover device is connected with the water cooling system;

the immersion liquid cooling box device is used for immersing the main board;

the liquid cooling plate cover device is used for performing phase change heat exchange operation on the main board;

the auxiliary cooling system comprises a first fan (1) and a first cooling air duct (2), wherein the first cooling air duct (2) is used for acquiring cold air and guiding the cold air into the hard disk module, and the first fan (1) is used for guiding the warmed cold air out of the liquid cooling server cabinet; the first cooling air duct (2) penetrates through the liquid cooling server, and the first cooling air duct (2) is positioned between the hard disk module and the main board module;

the liquid cooling plate cover device comprises a plate cover runner (16) and a liquid cooling plate (17);

the two ends of the plate cover runner (16) are respectively provided with a plate cover runner inlet (12) and a plate cover runner outlet (13), cooling water flows in the plate cover runner (16), and the plate cover runner (16) is used for reducing the temperature of the liquid cooling heat dissipation plate (17);

one surface of the liquid cooling heat dissipation plate (17) is contacted with the plate cover flow channel (16), and the other surface is provided with heat dissipation ribs;

the heat dissipation fins are used for cooling the vaporized cooling liquid;

the heat dissipation fins comprise high-power dissipation fins (18) and low-power dissipation fins (19), the high-power dissipation fins (18) are used for dissipating heat of the high-power components of the main board module, and the low-power dissipation fins (19) are used for dissipating heat of the low-power components of the main board module.

2. The immersion liquid cooling system according to claim 1, wherein: the immersion liquid cooling box device comprises an immersion liquid cooling box, a liquid supplementing port (14) of the liquid cooling box and a liquid cooling box constant pressure device (15);

the liquid supplementing port (14) of the liquid cooling box is used for supplementing cooling liquid into the immersion liquid cooling box;

the liquid cooling box constant pressure device (15) is used for measuring the hydraulic pressure in the immersion liquid cooling box.

3. The immersion liquid cooling system according to claim 1, wherein: the water cooling system comprises a second fan (3), a second cooling air duct (4), a dry cooler (5), a water collector (6) and a cooling system pipeline (8);

the water collector (6) is respectively connected with the plate cover runner outlet (13) and the cooling water pump (7), and the cooling water pump (7) is connected with the dry cooler (5);

the second cooling air duct (4) is used for obtaining cold air and cooling the dry cooler (5);

the water collector (6) is used for recycling the cooling water in the plate cover flow channel (16);

the cooling water pump (7) is used for conveying the cooling water to the dry cooler (5);

the dry cooler (5) is used for performing phase change heat exchange operation on the cooling water;

the second fan (3) is used for guiding out heat generated by the heat exchange completed dry cooler (5) to the outside of the liquid cooling server cabinet.

4. An immersion liquid cooling system according to claim 3, wherein: the water cooling system further comprises a cooling system pipe (8), wherein the cooling system pipe (8) is used for periodically starting the cooling water pump (7).

5. The immersion liquid cooling system according to claim 1, wherein: the main board is immersed in the immersion liquid cooling box device in an encapsulated mode.

6. The immersion liquid cooling system according to claim 1, wherein: the cooling liquid is fluoridized liquid.

7. The immersion liquid cooling system according to claim 1, wherein: the liquid cooling server cabinet is used for fixing the liquid cooling server.

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