CN212209473U - Electronic chip radiator with air cooling and auxiliary liquid cooling heat dissipation functions - Google Patents
Electronic chip radiator with air cooling and auxiliary liquid cooling heat dissipation functions Download PDFInfo
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- CN212209473U CN212209473U CN202020571016.9U CN202020571016U CN212209473U CN 212209473 U CN212209473 U CN 212209473U CN 202020571016 U CN202020571016 U CN 202020571016U CN 212209473 U CN212209473 U CN 212209473U
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Abstract
The utility model discloses a forced air cooling holds concurrently with radiating electronic chip radiator of supplementary liquid cooling, including setting up the air-cooled heat radiation structure of quick-witted incasement and locating the radiating fin on the chip, be equipped with the liquid cooling structure that has the coolant liquid circulation to flow in being equipped with on the radiating fin, be equipped with coolant liquid import and coolant liquid export on the quick-witted case, liquid cooling structure and coolant liquid import and coolant liquid export intercommunication, in the radiating while of forced air cooling, the coolant liquid in the liquid cooling structure carries out supplementary liquid cooling heat dissipation to the chip. The chip heat dissipation of traditional server adopts to set up radiating fin in the chip upper end usually, forms great extension surface, improves air-cooled radiating efficiency, the utility model discloses set up the liquid cooling structure on radiating fin, utilize the liquid cooling structure mesocycle flowing coolant liquid to assist the heat dissipation to the chip, not only can improve the radiating effect, only improve to the chip radiator in the traditional server moreover, change the range little, with traditional server and data center's compatibility good, be suitable for extensive popularization and use.
Description
Technical Field
The utility model relates to an electronic chip radiator, in particular to radiating electronic chip radiator of forced air cooling and supplementary liquid cooling concurrently.
Background
With the rapid development of the computer communication industry and the electronic industry, the number of high-density servers in the IDC room is continuously increased, the integration level and the processing capacity of the servers are gradually improved, and meanwhile, the power consumption of the servers is increased, so that the heat dissipation problem of electronic devices in the servers becomes a technical problem to be solved urgently in the industry.
Air-cooled heat dissipation of the air conditioner used at present is an indirect contact cooling mode with low heat transfer efficiency, and liquid-cooled heat dissipation becomes the mainstream of the future heat dissipation technology in recent years. However, the liquid cooling heat dissipation adopts a mode that the cooling liquid directly or indirectly contacts the heating chip, and in order to protect the safety of the chip, the liquid cooling structure is complex, the compatibility with the existing server and equipment is poor, and the wide application of the liquid cooling technology is severely restricted.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a radiating electronic chip radiator of forced air cooling and supplementary liquid cooling of simple structure, with low costs, structural compatibility are good, improve the radiating effect.
The above object of the present invention is achieved by the following technical measures: the utility model provides a radiating electronic chip radiator of forced air cooling and supplementary liquid cooling, it is including setting up the forced air cooling heat radiation structure at quick-witted incasement and locating the radiating fin on the chip, its characterized in that be equipped with the liquid cooling structure that has the coolant liquid circulation to flow in being equipped with on the radiating fin be equipped with coolant liquid import and coolant liquid export on the quick-witted case, the liquid cooling structure communicates with coolant liquid import and coolant liquid export, and in the forced air cooling heat dissipation, the coolant liquid in the liquid cooling structure carries out supplementary liquid cooling heat dissipation to the chip.
The chip heat dissipation of traditional server adopts to set up radiating fin in the chip upper end usually to form great extension surface, improve forced air cooling radiating efficiency, the utility model discloses set up the liquid cooling structure on radiating fin, utilize the coolant liquid of circulation flow in the liquid cooling structure to assist the heat dissipation to the chip, not only can improve the radiating effect, only improve to the chip radiator in the traditional server moreover, change the range little, good with traditional server and data center's compatibility, be suitable for extensive popularization and use.
As an embodiment of the utility model, the liquid cooling structure includes lower extreme open-ended sealed cowling, feed liquor pipe and drain pipe, the sealed cowling covers including radiating fin, and the lower extreme opening border of sealed cowling is fixed on radiating fin's the bottom base plate, feed liquor pipe and coolant liquid access connection, drain pipe and coolant liquid outlet connection.
As another embodiment of the utility model be equipped with the heat pipe on the radiating fin, the liquid cooling structure includes lower extreme open-ended sealed cowling, feed liquor pipe and drain pipe, radiating fin and heat pipe are covered in the sealed cowling, sealed cowling lower extreme opening and this opening border are fixed on radiating fin's bottom base plate, feed liquor pipe and coolant liquid access connection, drain pipe and coolant liquid outlet connection.
Preferably, the one end and the coolant liquid access connection of feed liquor pipe, the other end is connected with the top of sealed cowling, the one end and the coolant liquid outlet connection of drain pipe, the other end is connected with the bottom of sealed cowling.
As another embodiment of the present invention, the heat pipe is disposed on the heat dissipation fins, the two ends of the heat pipe are respectively connected to the liquid inlet pipe and the liquid outlet pipe to form the liquid cooling structure, the liquid inlet pipe is connected to the coolant inlet, and the liquid outlet pipe is connected to the coolant outlet.
Preferably, the two ends of the heat pipe are respectively connected with the liquid inlet pipe and the liquid outlet pipe through quick plugs.
The liquid cooling structure of the utility model is arranged on the heat dissipation fins of the partial chip in the case.
The utility model discloses the chip with liquid cooling structure is CPU and GPU.
Air-cooled heat radiation structure includes the fan, locates air intake and air outlet on the machine tank wall, the fan is installed in the air outlet, the air intake is relative with the air outlet.
Compared with the prior art, the utility model discloses the effect that is showing as follows has:
the utility model discloses set up the liquid cooling structure on the heat dissipation fin, utilize the cooling liquid that the circulation flows in the liquid cooling structure to assist the heat dissipation to the chip, the forced air cooling is the main promptly, and the liquid cooling has improved the radiating effect for assisting.
A small amount of the utility model discloses only improve to the chip radiator in the traditional server, the range of change is little, and is good with traditional server and data center's compatibility.
The utility model discloses to the inside chip differentiation processing of server, can only assist the liquid cooling heat dissipation to the chip that the consumption is high (like CPU and GPU), the less chip of consumption still is the forced air cooling heat dissipation to further improve energy utilization.
Drawings
The present invention will be described in further detail with reference to the following drawings and specific embodiments.
Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of embodiment 2 of the present invention;
fig. 3 is a schematic structural diagram of embodiment 3 of the present invention.
Detailed Description
Example 1
As shown in fig. 1, be the utility model relates to a radiating electronic chip radiator of forced air cooling and supplementary liquid cooling, it is including setting up forced air cooling heat radiation structure in quick-witted case 1 and locating radiating fin 3 on chip 2, forced air cooling heat radiation structure and radiating fin are the original heat radiation structure in the server, chip 2 is located on PCB board 14, there is liquid cooling structure 4 that the coolant liquid circulation flows in being equipped with on radiating fin 3, be equipped with coolant liquid import 5 and coolant liquid export 6 on quick-witted case 1, liquid cooling structure 4 and coolant liquid import 5 and coolant liquid export 6 intercommunication, in the air-cooled radiating, the coolant liquid in the liquid cooling structure 4 carries out supplementary liquid cooling heat dissipation to chip 2.
In this embodiment, liquid cooling structure 4 includes lower extreme open-ended sealed cowling 7, feed liquor pipe 8 and drain pipe 9, and radiating fin 3 is drawn together to sealed cowling 7, and the lower extreme opening border of sealed cowling 7 is fixed on radiating fin 3's bottom base plate 10, and the one end and the coolant liquid import 5 of feed liquor pipe 8 are connected, and the other end is connected with the top of sealed cowling 7, and the one end and the coolant liquid export 6 of drain pipe 9 are connected, and the other end is connected with the bottom of sealed cowling 7.
When the chip works, the cooling liquid is introduced into the sealing cover to flow circularly, and the cooling liquid is assisted to contact and radiate the surface of the chip in the air cooling radiation process, so that the radiating effect is obviously improved.
The air-cooled heat dissipation structure comprises a fan 11, an air inlet 12 and an air outlet 13 which are arranged on the side wall of the case 1, wherein the fan 11 is arranged at the air outlet 13, the air inlet 12 is opposite to the air outlet 13 and is conveyed by the fan 11, cold air A enters the case from the air inlet, and hot air B is formed after air-cooled heat dissipation is carried out on a chip and a radiator and then is sent out from the air outlet. The cooling liquid inlet 5, the cooling liquid outlet 6 and the air outlet 13 are positioned on the same side of the case wall and are respectively positioned above and below the fan.
Example 2
As shown in fig. 2, the difference between this embodiment and embodiment 1 is that a heat pipe 15 is disposed on the heat dissipation fin 3, and the heat pipe is an original heat dissipation structure in the server. The liquid cooling structure includes lower extreme open-ended sealed cowling 7, feed liquor pipe 8 and drain pipe 9, and radiating fin 3 and heat pipe 15 are covered and are drawn together in sealed cowling 7, and 7 lower extreme openings of sealed cowling and this opening border are fixed on radiating fin 3's bottom base plate 10, and feed liquor pipe 8 is connected with coolant liquid import 5, and drain pipe 9 is connected with coolant liquid export 6.
When the chip works, the chip is subjected to auxiliary liquid cooling heat dissipation through the circulating flow of the cooling liquid, so that the heat dissipation effect is improved.
Example 3
As shown in fig. 3, the difference between this embodiment and embodiment 2 lies in that the liquid cooling structure is different, in this embodiment, the liquid cooling structure includes a heat pipe 15, a liquid inlet pipe 8 and a liquid outlet pipe 9, two ends of the heat pipe 15 are respectively connected to the liquid inlet pipe 8 and the liquid outlet pipe 9 through a quick plug, the liquid inlet pipe 8 is connected to the cooling liquid inlet 5, and the liquid outlet pipe 9 is connected to the cooling liquid outlet 6. The cooling liquid inlet 5 and the cooling liquid outlet 6 are both positioned above the air outlet 13.
This embodiment improves original radiator heat pipe, imports and exports at the heat pipe and sets up quick plug, connects coolant liquid import and coolant liquid export, through the circulation flow of coolant liquid in the heat pipe, carries out supplementary liquid cooling heat dissipation to the chip, improves the radiating effect.
The utility model discloses can also handle the inside chip differentiation of server, the liquid cooling structure can only set up on the radiating fin of quick-witted incasement portion chip promptly, only assist the liquid cooling heat dissipation to the chip that the consumption is high (like CPU and GPU), and the less chip of consumption still is the forced air cooling heat dissipation, further improves energy utilization.
The embodiments of the present invention are not limited thereto, and according to the above-mentioned contents of the present invention, according to the common technical knowledge and the conventional means in the field, the present invention can also make other modifications, replacements or changes in various forms, all falling within the scope of protection of the present invention.
Claims (9)
1. The utility model provides a radiating electronic chip radiator of forced air cooling and supplementary liquid cooling, it is including setting up the forced air cooling heat radiation structure of quick-witted incasement and locating the radiating fin on the chip, its characterized in that: the radiating fin is provided with a liquid cooling structure in which cooling liquid circularly flows, the case is provided with a cooling liquid inlet and a cooling liquid outlet, the liquid cooling structure is communicated with the cooling liquid inlet and the cooling liquid outlet, and the cooling liquid in the liquid cooling structure is used for assisting the chip in liquid cooling heat dissipation while air cooling heat dissipation is performed.
2. The air-cooled and auxiliary liquid-cooled heat dissipating electronic chip heat sink of claim 1, wherein: the liquid cooling structure comprises a sealing cover with an opening at the lower end, a liquid inlet pipe and a liquid outlet pipe, the sealing cover covers the radiating fins, the edge of the opening at the lower end of the sealing cover is fixed on the bottom substrate of the radiating fins, the liquid inlet pipe is connected with a cooling liquid inlet, and the liquid outlet pipe is connected with a cooling liquid outlet.
3. The air-cooled and auxiliary liquid-cooled heat dissipating electronic chip heat sink of claim 1, wherein: the liquid cooling structure comprises a sealing cover with an opening at the lower end, a liquid inlet pipe and a liquid outlet pipe, the sealing cover is internally covered with the heat radiating fins, the opening at the lower end of the sealing cover is fixed on a bottom substrate of the heat radiating fins at the edge of the opening, the liquid inlet pipe is connected with a cooling liquid inlet, and the liquid outlet pipe is connected with a cooling liquid outlet.
4. The air-cooled and auxiliary liquid-cooled heat dissipating electronic chip heat sink as claimed in claim 2 or 3, wherein: one end of the liquid inlet pipe is connected with the cooling liquid inlet, the other end of the liquid inlet pipe is connected with the top of the sealing cover, one end of the liquid outlet pipe is connected with the cooling liquid outlet, and the other end of the liquid outlet pipe is connected with the bottom of the sealing cover.
5. The air-cooled and auxiliary liquid-cooled heat dissipating electronic chip heat sink of claim 1, wherein: the heat dissipation structure is characterized in that heat pipes are arranged on the heat dissipation fins, two ends of each heat pipe are respectively connected with a liquid inlet pipe and a liquid outlet pipe to form the liquid cooling structure, the liquid inlet pipes are connected with a cooling liquid inlet, and the liquid outlet pipes are connected with a cooling liquid outlet.
6. The air-cooled and auxiliary liquid-cooled heat dissipating electronic chip heat sink of claim 5, wherein: and two ends of the heat pipe are respectively connected with the liquid inlet pipe and the liquid outlet pipe through the quick plugs.
7. The air-cooled and auxiliary liquid-cooled heat dissipating electronic chip heat sink as claimed in claim 2, 3 or 5, wherein: the liquid cooling structure is arranged on the radiating fins of the partial chip in the case.
8. The air-cooled and auxiliary liquid-cooled heat dissipating electronic chip heat sink of claim 7, wherein: the chips provided with the liquid cooling structures are a CPU and a GPU.
9. The air-cooled and auxiliary liquid-cooled heat dissipating electronic chip heat sink of claim 8, wherein: the air-cooled heat dissipation structure comprises a fan, an air inlet and an air outlet, wherein the air inlet and the air outlet are formed in the wall of the cabinet, the fan is installed at the air outlet, and the air inlet is opposite to the air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020571016.9U CN212209473U (en) | 2020-04-16 | 2020-04-16 | Electronic chip radiator with air cooling and auxiliary liquid cooling heat dissipation functions |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020571016.9U CN212209473U (en) | 2020-04-16 | 2020-04-16 | Electronic chip radiator with air cooling and auxiliary liquid cooling heat dissipation functions |
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| CN212209473U true CN212209473U (en) | 2020-12-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114916212A (en) * | 2022-07-18 | 2022-08-16 | 浙江大华技术股份有限公司 | Heat dissipation framework and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114916212A (en) * | 2022-07-18 | 2022-08-16 | 浙江大华技术股份有限公司 | Heat dissipation framework and electronic equipment |
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Effective date of registration: 20211123 Address after: 526000 room 142, workshop (Building B), Zhaoqing New District Investment Development Co., Ltd., north 8 District, Guicheng new town, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: Guangdong Xijiang Data Technology Co.,Ltd. Address before: Room 431, No. 333, jiufo Jianshe Road, Guangzhou Zhongxin, Guangzhou, Guangdong 510130 Patentee before: GUANGDONG HI-1 NEW MATERIALS TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. |