CN206788767U - High-efficiency radiator for all-in-one core component - Google Patents
High-efficiency radiator for all-in-one core component Download PDFInfo
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- CN206788767U CN206788767U CN201720227165.1U CN201720227165U CN206788767U CN 206788767 U CN206788767 U CN 206788767U CN 201720227165 U CN201720227165 U CN 201720227165U CN 206788767 U CN206788767 U CN 206788767U
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- heat
- heat conducting
- conducting pipe
- substrate
- radiating fin
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Abstract
The utility model discloses a kind of high-efficiency radiator for all-in-one core component,Including radiating fin group,Heat conducting pipe and substrate,The radiating end of the heat conducting pipe is connected with radiating fin group,The heat absorbing end and substrate connection of heat conducting pipe,The radiating fin group is fastened and connected successively by some radiating fins arranged in parallel,2 through holes passed through for heat conducting pipe are provided with radiating fin so that radiating fin group has 2 passages penetrated for heat conducting pipe,The upper surface of base plate is provided with the slot to make way for heat conducting pipe insertion,It is welded to connect in the heat absorbing end insertion slot to make way of heat conducting pipe and with substrate,The lateral surface of 2 heat conducting pipes has a gib block,The upper surface of base plate is evenly distributed with some thermal columns for auxiliary heat dissipation,The base lower surface is pasted with some for being contacted with computer heating element and carrying out the heat absorbing sheet of heat exchange.Auxiliary heat dissipation and comprehensive radiating mode of the utility model by thermal column, greatly improve the overall heat conduction efficiency of system, so as to improve the radiating efficiency of radiator.
Description
Technical field
A kind of radiator of integral desktop computer is the utility model is related to, it is more particularly to a kind of to be used for all-in-one core component
High-efficiency radiator, belong to heat radiation part field.
Background technology
With the development of electronic industry technology, the transistor density of all kinds of chips increasingly increases, although the speed of data processing
Degree is more and more faster, but the power consumed and caused heat also increasingly increase.Operated in order to which central processing unit can be stablized,
Efficient radiator turns into demand inevitable at present.In order to maintain efficient heat sinking function, the volume and weight of radiator
Also have to more big heavier therewith, but in the design of computer, limited space is always the greatest problem on designing.It is existing
In technology, most universal and most efficient method, i.e., air flow is driven using fan, the fin of itself and thermal-arrest is carried out hot friendship
Change, to take away the heat of fin to reach the purpose of cooling.The main frame of traditional split desktop computer is integrated into display and formed
Integrated desktop, optimize line connection, it is more very thin than traditional split desktop computer, yet with the integrated of its height
Property so that its radiating turns into urgent problem to be solved, therefore, how on the premise of radiator volume is not increased as far as possible, effectively
The efficiency of radiator is improved, turns into the direction that numerous engineers make great efforts.
The content of the invention
The utility model purpose is to provide a kind of high-efficiency radiator for all-in-one core component, and this is used for all-in-one core
Auxiliary heat dissipation and comprehensive radiating mode of the high-efficiency radiator of heart component by thermal column, greatly improve the overall heat transfer of system
Efficiency, so as to improve the radiating efficiency of radiator.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of height for all-in-one core component
Radiator is imitated, including radiating fin group, heat conducting pipe and substrate, the radiating end of the heat conducting pipe are connected with radiating fin group, heat conduction
The heat absorbing end and substrate connection of pipe；
The radiating fin group is fastened and connected successively by some radiating fins arranged in parallel, and 2 are provided with radiating fin
The individual through hole passed through for heat conducting pipe is so that radiating fin group has 2 passages penetrated for heat conducting pipe, the substrate upper table
Face is provided with the slot to make way for heat conducting pipe insertion, and the heat absorbing end insertion slot to make way of heat conducting pipe is interior and is welded to connect with substrate；
The lateral surface of 2 heat conducting pipes has a gib block, and the upper surface of base plate is evenly distributed with some for auxiliary
The thermal column of radiating is helped, the base lower surface is pasted with some for being contacted with computer heating element and carrying out heat exchange
Heat absorbing sheet.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the substrate is heat-dissipating aluminium plate.
2. in such scheme, the heat absorbing sheet is copper sheet.
3. in such scheme, the computer heating element for being contacted with heat absorbing sheet and carrying out heat exchange is respectively center
Processor（CPU）, video card, video memory, electric capacity, inductance etc..
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model is used for the high-efficiency radiator of all-in-one core component, and the lateral surface of its 2 heat conducting pipes has one to lead
To bar, the setting of gib block, certain guide effect can be both played to heat conducting pipe, the skew of heat conducting pipe position is prevented, again may be used
Effectively to protect the heat conducting pipe of hollow setting to be weighed wounded, ensure the stabilization of heat conducting pipe performance；Secondly, its upper surface of base plate uniformly divides
Some thermal columns for auxiliary heat dissipation are furnished with, the setting of thermal column, can aid in first shedding the heat on heat absorbing sheet one
Divide, improve the integral heat sink efficiency of radiator；Again, its base lower surface is pasted with some for being connect with computer heating element
Touch and carry out the heat absorbing sheet of heat exchange, the setting of polylith heat absorbing sheet, dissipation not only is carried out to the heat of central processing unit, also to each
The heat of individual computer heating element carries out integrating dissipation, so as to improve the overall heat conduction efficiency of system, improves radiator
Efficiency.
Brief description of the drawings
Accompanying drawing 1 is the high efficient radiator structure schematic diagram that the utility model is used for all-in-one core component；
Accompanying drawing 2 is the high-efficiency radiator partial bottom view that the utility model is used for all-in-one core component.
In the figures above：1st, radiating fin group；2nd, heat conducting pipe；201st, heat absorbing end；202nd, radiating end；3rd, substrate；4th, radiate
Fin；5th, passage；6th, slot to make way；7th, gib block；8th, thermal column；16th, heat absorbing sheet.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of high-efficiency radiator for all-in-one core component, including radiating fin group 1, the and of heat conducting pipe 2
Substrate 3, the radiating end 202 of the heat conducting pipe 2 are connected with radiating fin group 1, and the heat absorbing end 201 of heat conducting pipe 2 is connected with substrate 3；
The radiating fin group 1 is fastened and connected successively by some radiating fins 4 arranged in parallel, is opened on radiating fin 4
There are 2 through holes passed through for heat conducting pipe 2 so that radiating fin group 1 has 2 passages 5 penetrated for heat conducting pipe 2, the base
The upper surface of plate 3 is provided with the slot to make way 6 being embedded in for heat conducting pipe 2, and the heat absorbing end 201 of heat conducting pipe 2 is embedded in slot to make way 6 and and substrate
3 are welded to connect；
The lateral surface of 2 heat conducting pipes 2 has a gib block 7, and the upper surface of substrate 3 is evenly distributed with some be used for
The thermal column 8 of auxiliary heat dissipation, the lower surface of substrate 3 are pasted with some for being contacted with computer heating element and carrying out hot friendship
The heat absorbing sheet 16 changed.
Aforesaid substrate 3 is heat-dissipating aluminium plate；Above-mentioned heat absorbing sheet 16 is copper sheet.
Embodiment 2：A kind of high-efficiency radiator for all-in-one core component, including radiating fin group 1, the and of heat conducting pipe 2
Substrate 3, the radiating end 202 of the heat conducting pipe 2 are connected with radiating fin group 1, and the heat absorbing end 201 of heat conducting pipe 2 is connected with substrate 3；
The radiating fin group 1 is fastened and connected successively by some radiating fins 4 arranged in parallel, is opened on radiating fin 4
There are 2 through holes passed through for heat conducting pipe 2 so that radiating fin group 1 has 2 passages 5 penetrated for heat conducting pipe 2, the base
The upper surface of plate 3 is provided with the slot to make way 6 being embedded in for heat conducting pipe 2, and the heat absorbing end 201 of heat conducting pipe 2 is embedded in slot to make way 6 and and substrate
3 are welded to connect；
The lateral surface of 2 heat conducting pipes 2 has a gib block 7, and the upper surface of substrate 3 is evenly distributed with some be used for
The thermal column 8 of auxiliary heat dissipation, the lower surface of substrate 3 are pasted with some for being contacted with computer heating element and carrying out hot friendship
The heat absorbing sheet 16 changed.
The above-mentioned computer heating element for being contacted with heat absorbing sheet 16 and carrying out heat exchange is respectively central processing unit（CPU）、
Video card, video memory, electric capacity, inductance etc..
, both can be to leading by the setting of gib block during using above-mentioned high-efficiency radiator for all-in-one core component
Heat pipe plays certain guide effect, prevents the skew of heat conducting pipe position, can effectively protect the heat conducting pipe quilt of hollow setting again
Weigh wounded, ensure the stabilization of heat conducting pipe performance；Secondly, the setting of thermal column, can aid in the heat on heat absorbing sheet first shedding one
Part, improve the integral heat sink efficiency of radiator；Again, the setting of polylith heat absorbing sheet, not only the heat of central processing unit is entered
Row dissipation, also the heat of each computer heating element is carried out integrating dissipation, so as to improve the overall heat conduction efficiency of system,
Improve the efficiency of radiator.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (4)
- A kind of 1. high-efficiency radiator for all-in-one core component, it is characterised in that：Including radiating fin group（1）, heat conducting pipe （2）And substrate（3）, the heat conducting pipe（2）Radiating end（202）With radiating fin group（1）Connection, heat conducting pipe（2）Heat absorbing end （201）With substrate（3）Connection；The radiating fin group（1）By some radiating fins arranged in parallel（4）It is fastened and connected successively, radiating fin（4）It is upper equal It is provided with 2 and supplies heat conducting pipe（2）The through hole passed through is so that radiating fin group（1）Heat conducting pipe is supplied with 2（2）The passage penetrated （5）, the substrate（3）Upper surface is provided with for heat conducting pipe（2）Embedded slot to make way（6）, heat conducting pipe（2）Heat absorbing end（201） Embedded slot to make way（6）Interior and and substrate（3）It is welded to connect；2 heat conducting pipes（2）Lateral surface there is a gib block（7）, the substrate（3）Upper surface is evenly distributed with some use In the thermal column of auxiliary heat dissipation（8）, the substrate（3）Lower surface, which is pasted with, some to be used to contact and go forward side by side with computer heating element The heat absorbing sheet of row heat exchange（16）.
- 2. it is used for the high-efficiency radiator of all-in-one core component according to claim 1, it is characterised in that：The substrate（3） For heat-dissipating aluminium plate.
- 3. it is used for the high-efficiency radiator of all-in-one core component according to claim 1, it is characterised in that：The heat absorbing sheet （16）For copper sheet.
- 4. it is used for the high-efficiency radiator of all-in-one core component according to claim 1, it is characterised in that：Described and heat absorbing sheet （16）The computer heating element for contacting and carrying out heat exchange is respectively central processing unit（CPU）, video card, video memory, electric capacity, electricity Sense.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720227165.1U CN206788767U (en) | 2017-03-09 | 2017-03-09 | High-efficiency radiator for all-in-one core component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720227165.1U CN206788767U (en) | 2017-03-09 | 2017-03-09 | High-efficiency radiator for all-in-one core component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206788767U true CN206788767U (en) | 2017-12-22 |
Family
ID=60703865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720227165.1U Active CN206788767U (en) | 2017-03-09 | 2017-03-09 | High-efficiency radiator for all-in-one core component |
Country Status (1)
| Country | Link |
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| CN (1) | CN206788767U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108572713A (en) * | 2018-04-09 | 2018-09-25 | 中尚能源科技有限公司 | A kind of metal cpu heat |
-
2017
- 2017-03-09 CN CN201720227165.1U patent/CN206788767U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108572713A (en) * | 2018-04-09 | 2018-09-25 | 中尚能源科技有限公司 | A kind of metal cpu heat |
| CN108572713B (en) * | 2018-04-09 | 2021-05-25 | 中尚能源科技有限公司 | Metal CPU radiator |
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