CN206546544U - Heat radiation module built in game notebook - Google Patents
Heat radiation module built in game notebook Download PDFInfo
- Publication number
- CN206546544U CN206546544U CN201720226712.4U CN201720226712U CN206546544U CN 206546544 U CN206546544 U CN 206546544U CN 201720226712 U CN201720226712 U CN 201720226712U CN 206546544 U CN206546544 U CN 206546544U
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- China
- Prior art keywords
- heat
- conducting pipe
- absorbing sheet
- heat absorbing
- radiating fin
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Abstract
The utility model discloses heat radiation module built in a kind of game notebook, including radiating fin group, to conduct the heat conducting pipe of heat and the heat absorbing sheet of heat exchange contacted and carried out with computer chip, the heat absorbing end of the heat conducting pipe is welded in heat absorbing sheet upper surface, the radiating end of the heat conducting pipe is welded on the planar top surface of radiating fin group and close to air inlet side, one polyester film one end is attached at the air inlet side of radiating fin group flat bottom, the heat absorbing sheet upper surface and connection sheet is set respectively positioned at heat conducting pipe both sides, the connection sheet includes substrate portion and the extension foot being connected with substrate portion lateral surface, the heat absorbing sheet lower surface is pasted with a wheat along its circumference and draws film, the wheat draws the inner side edge of film and the fringe region of heat absorbing sheet to be bonded by adhesive layer.The utility model can both play certain guide effect by the setting of turn-up portion to heat conducting pipe, prevent the skew of heat conducting pipe position and weighed wounded, and the stability of whole heat absorption chip architecture can be improved again, the heat dispersion of radiator and the stability of radiating is improved.
Description
Technical field
The utility model is related to a kind of radiator of notebook computer, and more particularly to a kind of game notebook is built-in to radiate
Module, belongs to heat radiation part field.
Background technology
With the development of electronic industry technology, the transistor density of all kinds of chips increasingly increases, although the speed of data processing
Degree is more and more faster, but the power of consumption and the heat of generation also increasingly increase.Operated in order to which central processing unit can be stablized,
Efficient radiator turns into demand inevitable at present.In order to maintain efficient heat sinking function, the volume and weight of radiator
Also have to more big heavier therewith, but in the design of notebook computer, limited space is always that the maximum in design is asked
Topic.In existing technologies, most universal and most efficient method drives air flow using fan, enters the fin of itself and thermal-arrest
Row heat exchange, the purpose of cooling is reached to take away the heat of fin.The now size of air quantity of fan and fin heat-exchange surface
Product determines the efficiency of this radiator, and the heat exchange area of fin is bigger, although the effect of radiating is better, but electric with notebook
Light, thin, the small design spirit of brain is disagreed.Therefore, how on the premise of radiator volume is not increased as far as possible, effectively improve scattered
The efficiency of hot device, the direction made great efforts as numerous engineers.
The content of the invention
The utility model purpose is to provide heat radiation module built in a kind of game notebook, is dissipated built in the game notebook
On the one hand thermal module can play certain guide effect to heat conducting pipe, prevent heat conducting pipe position by the setting of turn-up portion
Offset and weighed wounded, the stability of whole heat absorption chip architecture on the other hand can be improved, so that every in radiator system
Complemented each other between individual component, it is maximized to play respective efficiency, improve the heat dispersion of radiator and the stability of radiating.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：Radiating mould built in a kind of game notebook
Group, including radiating fin group, the heat conducting pipe to conduct heat and the heat absorbing sheet for contacting and carrying out heat exchange with computer chip, institute
The heat absorbing end for stating heat conducting pipe is welded in heat absorbing sheet upper surface, and the radiating end of heat conducting pipe is fixedly connected with radiating fin group；
The radiating fin group is fastened and connected successively by some radiating fins arranged in parallel, so that it is parallel to form several
The heat dissipation wind channel of setting, and radiating fin group upper surface, lower surface are planar top surface and flat bottom, the heat dissipation wind channel side
For air inlet, opposite side is air outlet, and the radiating end of the heat conducting pipe is welded on the planar top surface of radiating fin group and close
Air inlet side；
One polyester film one end is attached at the air inlet side of radiating fin group flat bottom, extends radiating fin group
The other end surface opposite with radiating fin group is provided with a foam bar；
The heat absorbing sheet upper surface and connection sheet is set respectively positioned at heat conducting pipe both sides, the connection sheet includes substrate portion
With the extension foot being connected with substrate portion lateral surface, this extension foot end is provided with the lockhole being embedded in for bolt, the substrate portion
On be provided with 2 rivet holes, the heat absorbing sheet has riveting in rivet portion corresponding with rivet hole, this rivet portion insertion rivet hole；
The substrate portion of the connection sheet is respectively provided with a strip turn-up portion, the heat absorbing sheet following table close to the medial surface of heat conducting pipe
Face is pasted with a wheat along its circumference and draws film, and the wheat draws the inner side edge of film and the fringe region of heat absorbing sheet viscous by adhesive layer
Close.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, mutually it is fastened and connected between adjacent heat radiation fin in the radiating fin group.
2. in such scheme, the heat absorbing sheet is copper sheet.
3. in such scheme, welded between the radiating end of the heat conducting pipe and the planar top surface of radiating fin group by tin cream
Connect, welded between the heat absorbing end of the heat conducting pipe and the upper surface of heat absorbing sheet by tin cream.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
1. heat radiation module built in the utility model game notebook, polyester film one end is attached at radiating fin group
The air inlet side of flat bottom, the other end surface opposite with radiating fin group for extending radiating fin group is provided with a bubble
Sliver, the setting of polyester film and foam bar so that fan is combined closely with air inlet can be whole by the heat of internal system
By air outlet guiding system, the hot blast in fin is effectively prevented to be back to internal system again, so as to substantially increase radiating effect
Rate.
2. heat radiation module built in the utility model game notebook, its heat absorbing sheet lower surface is pasted with one along its circumference
Wheat draws film, and the wheat draws the inner side edge of film and the fringe region of heat absorbing sheet to be bonded by adhesive layer, heat absorbing sheet lower surface
Wheat draws film to set, and plays insulating effect, can be prevented effectively to produce between other electronic components inside heat absorbing sheet and computer and lead
The risk of electricity, in addition, film local back adhesive is drawn wheat, it is on the one hand cost-effective, on the other hand reprocessed etc. to radiator
During operation, it is easy under wheat tearing and not allow to tend to have remnants adhesive, so as to effectively protect component, extends it and use the longevity
Life.
3. heat radiation module built in the utility model game notebook, the substrate portion of its connection sheet is in heat conducting pipe
Side is respectively provided with a strip turn-up portion, and on the one hand the setting of turn-up portion can play certain guide effect to heat conducting pipe, prevent
The skew of heat conducting pipe position and weighed wounded, the stability of whole heat absorption chip architecture on the other hand can be improved, so that radiating
Complemented each other between each component in device system, it is maximized to play respective efficiency, improve the heat dispersion of radiator and dissipate
The stability of heat.
Brief description of the drawings
Accompanying drawing 1 is heat emission module structure schematic diagram built in the utility model game notebook；
Accompanying drawing 2 is the radiating fin group partial structural diagram of the utility model heat radiation module；
Accompanying drawing 3 is the heat absorbing sheet partial structural diagram of the utility model heat radiation module.
In the figures above：1st, radiating fin group；2nd, heat conducting pipe；201st, heat absorbing end；202nd, radiating end；3rd, heat absorbing sheet；301、
Rivet portion；4th, radiating fin；5th, planar top surface；6th, flat bottom；7th, air inlet；8th, air outlet；9th, polyester film；10th, foam
Bar；11st, connection sheet；13rd, substrate portion；131st, rivet hole；14th, foot is extended；141st, lockhole；16th, strip turn-up portion；18th, wheat is drawn thin
Film；19th, adhesive layer.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：Heat radiation module built in a kind of game notebook, including radiating fin group 1, to conduct leading for heat
Heat pipe 2 and the heat absorbing sheet 3 that heat exchange is contacted and carried out with computer chip, the heat absorbing end 201 of the heat conducting pipe 2 are welded in heat absorbing sheet
3 upper surfaces, the radiating end 202 of heat conducting pipe 2 is fixedly connected with radiating fin group 1；
The radiating fin group 1 is fastened and connected successively by some radiating fins 4 arranged in parallel, is put down so as to form several
The heat dissipation wind channel that row is set, and the upper surface of radiating fin group 1, lower surface are planar top surface 5 and flat bottom 6, the radiation air
Road side is air inlet 7, and opposite side is air outlet 8, and the radiating end 202 of the heat conducting pipe 2 is welded in the plane of radiating fin group 1
On top surface 5 and close to the side of air inlet 7；
The one end of one polyester film 9 is attached at the side of air inlet 7 of the flat bottom 6 of radiating fin group 1, extends radiating fin
The surface that the other end of group 1 is opposite with radiating fin group 1 is provided with a foam bar 10；
The upper surface of heat absorbing sheet 3 and connection sheet 11 is set respectively positioned at the both sides of heat conducting pipe 2, the connection sheet 11 includes
Substrate portion 13 and the extension foot 14 being connected with the lateral surface of substrate portion 13, this extension foot 14 end are provided with the lock being embedded in for bolt
2 rivet holes 131 are provided with hole 141, the substrate portion 13, the heat absorbing sheet 3 has rivet portion 301 corresponding with rivet hole 131, this
Riveting in the insertion of rivet portion 301 rivet hole 131；
The substrate portion 13 of the connection sheet 11 is respectively provided with a strip turn-up portion 16 close to the medial surface of heat conducting pipe 2, described to inhale
The lower surface of backing 3 is pasted with a wheat along its circumference and draws film 18, and the wheat draws the inner side edge of film 18 and the fringe region of heat absorbing sheet 3
Bonded by adhesive layer 19.
Mutually it is fastened and connected between adjacent heat radiation fin 4 in above-mentioned radiating fin group 1；Above-mentioned heat absorbing sheet 3 is copper sheet.
Embodiment 2：Heat radiation module built in a kind of game notebook, including radiating fin group 1, to conduct leading for heat
Heat pipe 2 and the heat absorbing sheet 3 that heat exchange is contacted and carried out with computer chip, the heat absorbing end 201 of the heat conducting pipe 2 are welded in heat absorbing sheet
3 upper surfaces, the radiating end 202 of heat conducting pipe 2 is fixedly connected with radiating fin group 1；
The radiating fin group 1 is fastened and connected successively by some radiating fins 4 arranged in parallel, is put down so as to form several
The heat dissipation wind channel that row is set, and the upper surface of radiating fin group 1, lower surface are planar top surface 5 and flat bottom 6, the radiation air
Road side is air inlet 7, and opposite side is air outlet 8, and the radiating end 202 of the heat conducting pipe 2 is welded in the plane of radiating fin group 1
On top surface 5 and close to the side of air inlet 7；
The one end of one polyester film 9 is attached at the side of air inlet 7 of the flat bottom 6 of radiating fin group 1, extends radiating fin
The surface that the other end of group 1 is opposite with radiating fin group 1 is provided with a foam bar 10；
The upper surface of heat absorbing sheet 3 and connection sheet 11 is set respectively positioned at the both sides of heat conducting pipe 2, the connection sheet 11 includes
Substrate portion 13 and the extension foot 14 being connected with the lateral surface of substrate portion 13, this extension foot 14 end are provided with the lock being embedded in for bolt
2 rivet holes 131 are provided with hole 141, the substrate portion 13, the heat absorbing sheet 3 has rivet portion 301 corresponding with rivet hole 131, this
Riveting in the insertion of rivet portion 301 rivet hole 131；
The substrate portion 13 of the connection sheet 11 is respectively provided with a strip turn-up portion 16 close to the medial surface of heat conducting pipe 2, described to inhale
The lower surface of backing 3 is pasted with a wheat along its circumference and draws film 18, and the wheat draws the inner side edge of film 18 and the fringe region of heat absorbing sheet 3
Bonded by adhesive layer 19.
Welded between the radiating end 202 of above-mentioned heat conducting pipe 2 and the planar top surface 5 of radiating fin group 1 by tin cream, it is above-mentioned to lead
Welded between the heat absorbing end 201 of heat pipe 2 and the upper surface of heat absorbing sheet 3 by tin cream.
Using during heat radiation module, passing through the setting of polyester film and foam bar so that wind built in above-mentioned game notebook
Fan is combined closely with air inlet, can effectively be prevented by the heat of internal system all by air outlet guiding system in fin
Hot blast be back to internal system again, so as to substantially increase radiating efficiency；Secondly, the wheat of heat absorbing sheet lower surface draws film to set
Put, play insulating effect, the risk for producing conduction inside heat absorbing sheet and computer between other electronic components can be prevented effectively from, this
Outside, to wheat draw film local back adhesive, on the one hand it is cost-effective, on the other hand to radiator carry out reprocess wait operate when, be easy to
It under wheat tearing and will not allow to tend to have remnants adhesive, so as to effectively protect component, extend its service life；Again, flange
The setting in portion, on the one hand can play certain guide effect to heat conducting pipe, prevent the skew of heat conducting pipe position and weighed wounded, separately
On the one hand the stability of whole heat absorption chip architecture can be improved, so that mutually auxiliary phase between each component in radiator system
Into, it is maximized to play respective efficiency, improve the heat dispersion of radiator and the stability of radiating.
Above-described embodiment is only to illustrate technical concepts and features of the present utility model, and its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover protection domain of the present utility model it
It is interior.
Claims (4)
1. heat radiation module built in a kind of game notebook, it is characterised in that：Including radiating fin group（1）, to conduct heat
Heat conducting pipe（2）With the heat absorbing sheet that heat exchange is contacted and carried out with computer chip（3）, the heat conducting pipe（2）Heat absorbing end（201）
It is welded in heat absorbing sheet（3）Upper surface, heat conducting pipe（2）Radiating end（202）With radiating fin group（1）It is fixedly connected；
The radiating fin group（1）By some radiating fins arranged in parallel（4）It is fastened and connected, is put down so as to form several successively
The heat dissipation wind channel that row is set, and radiating fin group（1）Upper surface, lower surface are planar top surface（5）And flat bottom（6）, it is described
Heat dissipation wind channel side is air inlet（7）, opposite side is air outlet（8）, the heat conducting pipe（2）Radiating end（202）It is welded in scattered
Hot fins group（1）Planar top surface（5）Upper and close air inlet（7）Side；
One polyester film（9）One end is attached at radiating fin group（1）Flat bottom（6）Air inlet（7）Side, extends radiating
Fins group（1）The other end and radiating fin group（1）Opposite surface is provided with a foam bar（10）；
The heat absorbing sheet（3）Upper surface and positioned at heat conducting pipe（2）Both sides set connection sheet respectively（11）, the connection sheet（11）
Including substrate portion（13）With with substrate portion（13）The extension foot of lateral surface connection（14）, this extension foot（14）End is provided with confession
The lockhole of bolt insertion（141）, the substrate portion（13）On be provided with 2 rivet holes（131）, the heat absorbing sheet（3）Have and rivet hole
（131）Corresponding rivet portion（301）, this rivet portion（301）Embedded rivet hole（131）Interior riveting；
The connection sheet（11）Substrate portion（13）Close to heat conducting pipe（2）Medial surface be respectively provided with a strip turn-up portion（16）, institute
State heat absorbing sheet（3）Lower surface is pasted with a wheat along its circumference and draws film（18）, wheat drawing film（18）Inner side edge and heat absorbing sheet
（3）Fringe region pass through adhesive layer（19）Bonding.
2. heat radiation module built in game notebook according to claim 1, it is characterised in that：The radiating fin group（1）
Middle adjacent heat radiation fin（4）Between be mutually fastened and connected.
3. heat radiation module built in game notebook according to claim 1, it is characterised in that：The heat absorbing sheet（3）For copper
Piece.
4. heat radiation module built in game notebook according to claim 1, it is characterised in that：The heat conducting pipe（2）Dissipate
Hot junction（202）With radiating fin group（1）Planar top surface（5）Between welded by tin cream, the heat conducting pipe（2）Heat absorbing end
（201）With heat absorbing sheet（3）Upper surface between welded by tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720226712.4U CN206546544U (en) | 2017-03-09 | 2017-03-09 | Heat radiation module built in game notebook |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720226712.4U CN206546544U (en) | 2017-03-09 | 2017-03-09 | Heat radiation module built in game notebook |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206546544U true CN206546544U (en) | 2017-10-10 |
Family
ID=59994480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720226712.4U Active CN206546544U (en) | 2017-03-09 | 2017-03-09 | Heat radiation module built in game notebook |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206546544U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113607049A (en) * | 2021-07-09 | 2021-11-05 | 武汉海达数云技术有限公司 | Heat dissipation type explosion-proof structure of laser scanner |
| CN113607049B (en) * | 2021-07-09 | 2024-05-14 | 武汉海达数云技术有限公司 | Heat dissipation type explosion-proof structure of laser scanner |
-
2017
- 2017-03-09 CN CN201720226712.4U patent/CN206546544U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113607049A (en) * | 2021-07-09 | 2021-11-05 | 武汉海达数云技术有限公司 | Heat dissipation type explosion-proof structure of laser scanner |
| CN113607049B (en) * | 2021-07-09 | 2024-05-14 | 武汉海达数云技术有限公司 | Heat dissipation type explosion-proof structure of laser scanner |
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| GR01 | Patent grant |