CN108572713B - Metal CPU radiator - Google Patents
Metal CPU radiator Download PDFInfo
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- CN108572713B CN108572713B CN201810312630.0A CN201810312630A CN108572713B CN 108572713 B CN108572713 B CN 108572713B CN 201810312630 A CN201810312630 A CN 201810312630A CN 108572713 B CN108572713 B CN 108572713B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Theoretical Computer Science (AREA)
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- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of CPU heat dissipation, and particularly discloses a metal CPU heat radiator. The CPU radiator comprises a metal substrate, a metal heat conduction block is arranged on one side of the metal substrate, a heat conduction pipe is connected to the metal heat conduction block, and the heat conduction pipe is tightly attached to one side of the metal substrate provided with the metal heat conduction block. The structure conducts away the heat of the CPU through the metal heat conducting block and further radiates out through the heat conducting pipe; in addition, the heat conduction pipe is filled with heat dissipation liquid with a brand-new composition, and the heat dissipation liquid has a high heat conduction coefficient, so that the heat dissipation effect of the CPU radiator is further improved; in conclusion, the CPU radiator has obvious heat dissipation effect, so that the popularization and application of the CPU radiator can obviously improve the stability of commercial-grade CPUs, industrial-grade CPUs, military-grade CPUs and aerospace-grade CPUs.
Description
Technical Field
The invention relates to the technical field of CPU heat dissipation, in particular to a metal CPU heat radiator.
Background
The CPU is a short for central processing unit, is an ultra-large scale integrated circuit, and is an operation core and a control core of a computer. The CPUs may be classified into commercial-grade CPUs, industrial-grade CPUs, military-grade CPUs, and aerospace-grade CPUs, depending on the application field.
CPU can produce a large amount of heats when work, if do not distribute away these heats in time, light then leads to the crash, heavy then probably burns CPU out, the CPU radiator is used for the CPU heat dissipation, the radiator plays decisive effect to CPU's steady operation. Therefore, the development of a radiator with good radiating effect plays an important role in improving the stability of commercial-grade CPUs, industrial-grade CPUs, military-grade CPUs and aerospace-grade CPUs.
Technical Field
The invention aims to solve the technical problem of providing a metal CPU radiator. The metal CPU radiator has excellent heat radiation performance.
The technical problem to be solved by the invention is realized by the following technical scheme:
a metal CPU radiator comprises a metal substrate, wherein a metal heat conduction block is arranged on one side of the metal substrate, a heat conduction pipe is connected onto the metal heat conduction block, and the heat conduction pipe is tightly attached to one side of the metal substrate provided with the metal heat conduction block.
Preferably, one side of the metal substrate provided with the metal heat conducting block is provided with a groove matched with the heat conducting pipe, and the heat conducting pipe is tightly attached to the groove.
Preferably, one end of the groove close to the metal heat conducting block penetrates through the metal substrate to form a hollow-out end of the groove.
Preferably, the metal heat conduction block is arranged by more than 1 block.
Preferably, the metal heat conduction block is connected with more than 1 heat conduction pipe.
Preferably, the heat conduction pipe is filled with heat conduction liquid.
Preferably, the heat dissipation liquid comprises the following components:
100-150 parts of water; 10-20 parts of glucomannan; 10-20 parts of glucosamine; 5-10 parts of glacial acetic acid.
Further preferably, the heat dissipation liquid contains the following components:
120-150 parts of water; 15-20 parts of glucomannan; 15-20 parts of glucosamine; 8-10 parts of glacial acetic acid.
Most preferably, the heat-dissipating fluid comprises the following components:
120 parts of water; 15 parts of glucomannan; 15 parts of glucosamine; and 8 parts of glacial acetic acid.
Preferably, the water is distilled water.
Has the advantages that: (1) the invention provides a CPU radiator with a brand new structure, which conducts away the heat of a CPU through a metal heat conduction block and further radiates out through a heat conduction pipe; (2) in addition, the heat conduction pipe is filled with heat dissipation liquid with brand-new composition, and the heat dissipation liquid has high heat conductivity coefficient, so that the heat dissipation effect of the CPU radiator is further improved; (3) in conclusion, the CPU radiator of the present invention has a significant heat dissipation effect, so that the popularization and application thereof can significantly improve the stability of commercial-grade CPUs, industrial-grade CPUs, military-grade CPUs, and aerospace-grade CPUs.
Drawings
FIG. 1 is a schematic view of a CPU heat sink side according to the present invention.
FIG. 2 is a schematic view of the other side of the CPU heat sink of the present invention.
Detailed Description
The present invention is further explained below with reference to specific examples, which are not intended to limit the present invention in any way.
Example 1
The present embodiment provides a metal CPU heat sink, as shown in fig. 1 and fig. 2, which includes a metal substrate 1, a metal heat conduction block 2 is disposed on one side of the metal substrate 1, a heat conduction pipe 3 is connected to the metal heat conduction block 2, a groove 4 matched with the heat conduction pipe 3 is disposed on one side of the metal substrate 1 on which the metal heat conduction block 2 is disposed, and the heat conduction pipe 3 is tightly attached to the groove 4; one end of the groove 4 close to the metal heat conducting block 2 penetrates through the metal substrate 1 to form a groove hollow end 5; the metal heat conducting block 2 in the embodiment is provided with 2 blocks; wherein, one metal heat conduction block 2 is connected with 2 heat conduction pipes 3; the other metal heat conducting block 2 is connected with 1 heat conducting pipe 3.
The principle is as follows: in the use process, the metal heat conducting block is tightly attached to the surface of the CPU, and then heat is dissipated through the heat conducting pipe in the groove. In addition, the one end that the recess is close to the metal heat conduction piece runs through metal substrate and forms recess fretwork end, is favorable to the heat to give off.
Example 2
The present embodiment provides a metal CPU heat sink, as shown in fig. 1 and fig. 2, which includes a metal substrate 1, a metal heat conduction block 2 is disposed on one side of the metal substrate 1, a heat conduction pipe 3 is connected to the metal heat conduction block 2, a groove 4 matched with the heat conduction pipe 3 is disposed on one side of the metal substrate 1 on which the metal heat conduction block 2 is disposed, and the heat conduction pipe 3 is tightly attached to the groove 4; one end of the groove 4 close to the metal heat conducting block 2 penetrates through the metal substrate 1 to form a groove hollow end 5; the metal heat conducting block 2 in the embodiment is provided with 2 blocks; wherein, one metal heat conduction block 2 is connected with 2 heat conduction pipes 3; the other metal heat conducting block 2 is connected with 1 heat conducting pipe 3; the heat conduction pipe 3 is filled with heat conduction liquid.
The heat dissipation liquid comprises the following components in parts by weight: 120 parts of distilled water; 15 parts of glucomannan; 15 parts of glucosamine; and 8 parts of glacial acetic acid.
The principle is as follows: in the use process, the metal heat conducting block is tightly attached to the surface of the CPU, and then heat is dissipated through the heat conducting pipe in the groove. In addition, the one end that the recess is close to the metal heat conduction piece runs through metal substrate and forms recess fretwork end, is favorable to the heat to give off. Furthermore, the heat dissipation liquid is a heat dissipation liquid with a brand new composition, so that the heat dissipation effect is further improved. The heat conductivity coefficient of the heat dissipation liquid is 2.15W/(m K) and is far higher than the heat conductivity coefficient of pure water, namely 0.62W/(m K), and the heat conductivity coefficient of acetic acid, namely 0.35W/(m K) through the test of a liquid heat conductivity coefficient tester.
Example 3
The present embodiment provides a metal CPU heat sink, as shown in fig. 1 and fig. 2, which includes a metal substrate 1, a metal heat conduction block 2 is disposed on one side of the metal substrate 1, a heat conduction pipe 3 is connected to the metal heat conduction block 2, a groove 4 matched with the heat conduction pipe 3 is disposed on one side of the metal substrate 1 on which the metal heat conduction block 2 is disposed, and the heat conduction pipe 3 is tightly attached to the groove 4; one end of the groove 4 close to the metal heat conducting block 2 penetrates through the metal substrate 1 to form a groove hollow end 5; the metal heat conducting block 2 in the embodiment is provided with 2 blocks; wherein, one metal heat conduction block 2 is connected with 2 heat conduction pipes 3; the other metal heat conducting block 2 is connected with 1 heat conducting pipe 3; the heat conduction pipe 3 is filled with heat conduction liquid.
The heat dissipation liquid comprises the following components in parts by weight: 150 parts of distilled water; 20 parts of glucomannan; 20 parts of glucosamine; and 8 parts of glacial acetic acid.
The principle is as follows: in the use process, the metal heat conducting block is tightly attached to the surface of the CPU, and then heat is dissipated through the heat conducting pipe in the groove. In addition, the one end that the recess is close to the metal heat conduction piece runs through metal substrate and forms recess fretwork end, is favorable to the heat to give off. Furthermore, the heat dissipation liquid is a heat dissipation liquid with a brand new composition, so that the heat dissipation effect is further improved. The heat conductivity coefficient of the heat dissipation liquid is 1.91W/(m K) and is far higher than the heat conductivity coefficient of pure water, namely 0.62W/(m K), and the heat conductivity coefficient of acetic acid, namely 0.35W/(m K) through the test of a liquid heat conductivity coefficient tester.
Example 4
The present embodiment provides a metal CPU heat sink, as shown in fig. 1 and fig. 2, which includes a metal substrate 1, a metal heat conduction block 2 is disposed on one side of the metal substrate 1, a heat conduction pipe 3 is connected to the metal heat conduction block 2, a groove 4 matched with the heat conduction pipe 3 is disposed on one side of the metal substrate 1 on which the metal heat conduction block 2 is disposed, and the heat conduction pipe 3 is tightly attached to the groove 4; one end of the groove 4 close to the metal heat conducting block 2 penetrates through the metal substrate 1 to form a groove hollow end 5; the metal heat conducting block 2 in the embodiment is provided with 2 blocks; wherein, one metal heat conduction block 2 is connected with 2 heat conduction pipes 3; the other metal heat conducting block 2 is connected with 1 heat conducting pipe 3; the heat conduction pipe 3 is filled with heat conduction liquid.
The heat dissipation liquid comprises the following components in parts by weight: 100 parts of distilled water; 10 parts of glucomannan; 10 parts of glucosamine; and 10 parts of glacial acetic acid.
The principle is as follows: in the use process, the metal heat conducting block is tightly attached to the surface of the CPU, and then heat is dissipated through the heat conducting pipe in the groove. In addition, the one end that the recess is close to the metal heat conduction piece runs through metal substrate and forms recess fretwork end, is favorable to the heat to give off. Furthermore, the heat dissipation liquid is a heat dissipation liquid with a brand new composition, so that the heat dissipation effect is further improved. The heat conductivity coefficient of the heat dissipation liquid is 1.74W/(m K) and is far higher than the heat conductivity coefficient of pure water, namely 0.62W/(m K), and the heat conductivity coefficient of acetic acid, namely 0.35W/(m K) through the test of a liquid heat conductivity coefficient tester.
Claims (8)
1. A metal CPU radiator is characterized by comprising a metal substrate, wherein one side of the metal substrate is provided with a metal heat conduction block, the metal heat conduction block is connected with a heat conduction pipe, and the heat conduction pipe is tightly attached to one side of the metal substrate provided with the metal heat conduction block;
the heat conduction pipe is filled with cooling liquid;
the heat dissipation liquid comprises the following components: 100-150 parts of water; 10-20 parts of glucomannan; 10-20 parts of glucosamine; 5-10 parts of glacial acetic acid.
2. The CPU heat sink according to claim 1, wherein a groove matching the heat pipe is formed on a side of the metal substrate on which the metal heat-conducting block is formed, and the heat pipe is tightly fitted in the groove.
3. The CPU heat sink of claim 2, wherein an end of the recess near the metal heat conducting block penetrates the metal substrate to form a hollow-out end of the recess.
4. The CPU heat sink of claim 1, wherein said metal heat conducting block is disposed at least 1 block.
5. The CPU heat sink of claim 1, wherein more than 1 heat pipe is connected to said metal heat conducting block.
6. The CPU heat sink of claim 1, wherein the heat sink fluid comprises the following components:
120-150 parts of water; 15-20 parts of glucomannan; 15-20 parts of glucosamine; 8-10 parts of glacial acetic acid.
7. The CPU heat sink of claim 1, wherein the heat sink fluid comprises the following components:
120 parts of water; 15 parts of glucomannan; 15 parts of glucosamine; and 8 parts of glacial acetic acid.
8. The CPU heat sink of claim 1, wherein said water is distilled water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810312630.0A CN108572713B (en) | 2018-04-09 | 2018-04-09 | Metal CPU radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810312630.0A CN108572713B (en) | 2018-04-09 | 2018-04-09 | Metal CPU radiator |
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| Publication Number | Publication Date |
|---|---|
| CN108572713A CN108572713A (en) | 2018-09-25 |
| CN108572713B true CN108572713B (en) | 2021-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810312630.0A Active CN108572713B (en) | 2018-04-09 | 2018-04-09 | Metal CPU radiator |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113436538B (en) * | 2021-06-30 | 2023-04-21 | 上海天马微电子有限公司 | Display module and display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203136413U (en) * | 2013-01-18 | 2013-08-14 | 凌华科技股份有限公司 | Embedded system low thermal resistance heat conduction structure |
| CN104672495A (en) * | 2015-01-28 | 2015-06-03 | 深圳航天科技创新研究院 | Organic-inorganic composite heat conductive filler as well as preparation method and application thereof |
| CN105924864A (en) * | 2016-05-08 | 2016-09-07 | 河南科技学院新科学院 | Food plastic wrap and preparing method thereof |
| CN206331356U (en) * | 2016-12-02 | 2017-07-14 | 苏州永腾电子制品有限公司 | The radiating subassembly of notebook computer |
| CN206788767U (en) * | 2017-03-09 | 2017-12-22 | 昆山品岱电子有限公司 | High-efficiency radiator for all-in-one core component |
-
2018
- 2018-04-09 CN CN201810312630.0A patent/CN108572713B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203136413U (en) * | 2013-01-18 | 2013-08-14 | 凌华科技股份有限公司 | Embedded system low thermal resistance heat conduction structure |
| CN104672495A (en) * | 2015-01-28 | 2015-06-03 | 深圳航天科技创新研究院 | Organic-inorganic composite heat conductive filler as well as preparation method and application thereof |
| CN105924864A (en) * | 2016-05-08 | 2016-09-07 | 河南科技学院新科学院 | Food plastic wrap and preparing method thereof |
| CN206331356U (en) * | 2016-12-02 | 2017-07-14 | 苏州永腾电子制品有限公司 | The radiating subassembly of notebook computer |
| CN206788767U (en) * | 2017-03-09 | 2017-12-22 | 昆山品岱电子有限公司 | High-efficiency radiator for all-in-one core component |
Non-Patent Citations (1)
| Title |
|---|
| 液体的粘度与导热系数间的关系;刘洪勤;《石油化工》;19931231;第22卷(第2期);101-106 * |
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| CN108572713A (en) | 2018-09-25 |
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