CN113436538B - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN113436538B CN113436538B CN202110733244.0A CN202110733244A CN113436538B CN 113436538 B CN113436538 B CN 113436538B CN 202110733244 A CN202110733244 A CN 202110733244A CN 113436538 B CN113436538 B CN 113436538B
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 127
- 239000000758 substrate Substances 0.000 claims abstract description 104
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display module and a display device, which relate to the technical field of display and comprise: the display panel and the heat dissipation assembly are positioned on one side of the display panel, which is away from the light-emitting surface of the display panel; the heat dissipation assembly comprises a heat conduction substrate and a plurality of heat conduction metal structures, and the heat conduction metal structures are fixed on the surface of the heat conduction substrate far away from the display panel; the heat conducting metal structure comprises a heat conducting metal sheet, wherein the heat conducting metal sheet comprises an expansion state and a non-expansion state, and the heat conducting metal sheet is parallel to the heat conducting substrate in the non-expansion state; in the expanded state, the thermally conductive sheet metal is convex in a direction away from the thermally conductive substrate. When the display panel is locally heated, heat is conducted to the heat conduction metal sheets corresponding to the heated areas, the heat conduction metal sheets are heated and expanded, the heat dissipation area is increased, and the heat can be timely conducted away, so that the local heat dissipation function of the display panel is realized, and the phenomenon that the product performance and the service life are reduced due to the fact that the display panel is heated is avoided.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module and a display device.
Background
From CRT (Cathode Ray Tube) age to liquid crystal age to the now coming OLED (Organic Light-Emitting Diode) age, the display industry has undergone decades of development to become more and more varied. The display industry is closely related to our lives, and the display technology is not available from the traditional mobile phones, flat-panel televisions, PCs, the current intelligent wearable devices, VR (virtual reality) and other electronic devices.
However, due to the high integration of the present display products, the heat generated by the heating element in the display panel is not easy to volatilize, for example, a phenomenon of local overhigh temperature occurs in the display panel, and the performance and the service life of the product are affected by the continuously accumulated heat. Therefore, how to improve the heat dissipation performance of the display product is one of the technical problems to be solved in the present stage.
Disclosure of Invention
In view of this, the present invention provides a display module and a display device, which realize a local heat dissipation function for a display panel through a heat conductive metal structure in a heat dissipation assembly, so as to avoid the phenomenon that the product performance and the service life are reduced due to local heating of the display panel.
In a first aspect, the present invention provides a display module, including: the display panel and the heat dissipation assembly are positioned on one side of the display panel, which is away from the light-emitting surface of the display panel;
the heat dissipation assembly comprises a heat conduction substrate and a plurality of heat conduction metal structures, and the heat conduction metal structures are positioned on one side of the display panel far away from the light emitting surface;
the heat conducting metal structure comprises a heat conducting metal sheet, wherein the heat conducting metal sheet comprises an expansion state and a non-expansion state, and in the non-expansion state, the heat conducting metal sheet is parallel to the heat conducting substrate; in the expanded state, the thermally conductive metal sheet is convex toward a direction away from the thermally conductive substrate.
In a second aspect, the present invention provides a display device, including a display module, where the display module is a display module provided in the present application.
Compared with the prior art, the display module and the display device provided by the invention have the advantages that at least the following effects are realized:
the invention provides a display module and a display device, comprising a display panel and a heat dissipation assembly arranged on one side of the display panel, which is far away from a light emitting surface of the display panel, wherein the heat dissipation assembly comprises a heat conduction substrate and a plurality of heat conduction metal structures arranged on the surface of the heat conduction substrate, which is far away from the display panel, and the heat conduction metal structures comprise heat conduction metal sheets. When the display panel is locally heated, heat is conducted to the heat conduction metal sheet corresponding to the heated area, the heat conduction metal sheet is heated to expand, the heat dissipation area is increased, and the heat of the locally heated area in the display panel can be timely conducted out, so that the local heat dissipation function of the display panel is realized, the phenomenon that the product performance and the service life are reduced due to the fact that the display panel is heated is avoided, and therefore the display performance and the service life of the display module and the display device are improved.
Of course, it is not necessary for any one product embodying the invention to achieve all of the technical effects described above at the same time.
Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is an exploded view of a display module according to an embodiment of the invention;
fig. 2 is a schematic diagram illustrating a partial enlarged view of a heat dissipation assembly in a display module according to an embodiment of the invention;
FIG. 3 is a diagram showing a relative positional relationship between a display panel and a heat dissipation assembly in a display module according to an embodiment of the present invention;
FIG. 4 is a schematic view showing a structure of the heat conductive metal sheet in a non-expanded state;
FIG. 5 is a schematic view showing a structure of the heat conductive metal sheet in an expanded state;
FIG. 6 is a schematic view of another structure of the heat conductive sheet metal in a non-expanded state;
FIG. 7 is a schematic view showing another structure of the heat conductive metal sheet in an expanded state;
fig. 8 is a schematic diagram of another structure of a display module according to an embodiment of the invention;
fig. 9 is a diagram showing a relative positional relationship among a heat conductive housing, a heat dissipation assembly and a display panel in a display module according to an embodiment of the present invention;
FIG. 10 is a schematic view showing a structure of the heat dissipation holes formed on the side wall of the heat conductive housing;
fig. 11 is a schematic structural diagram of a display module according to an embodiment of the invention;
FIG. 12 is a diagram showing a relative positional relationship among a display panel, a heat dissipation assembly and a heat dissipation channel in a display module according to an embodiment of the present invention;
FIG. 13 is a diagram showing a relative positional relationship between a heat-conducting metal structure and a heat dissipation channel after expansion deformation;
fig. 14 is a schematic structural view of a heat conductive metal structure according to an embodiment of the present invention;
FIG. 15 is a diagram showing a relative positional relationship between a heat dissipation channel and a heat conductive metal structure according to an embodiment of the present invention;
fig. 16 is a schematic plan view of a display device according to an embodiment of the invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
Fig. 1 is an exploded schematic view of a display module according to an embodiment of the present invention, fig. 2 is a partially enlarged schematic view of a heat dissipation assembly in the display module according to an embodiment of the present invention, fig. 3 is a relative positional relationship diagram of a display panel and the heat dissipation assembly in the display module according to an embodiment of the present invention, please refer to fig. 1 to 3, and a display module 100 according to an embodiment of the present invention includes: the display panel 00 and the heat dissipation assembly 01 are positioned on one side of the display panel 00 away from the light emergent surface;
the heat dissipation assembly 01 comprises a heat conduction substrate 10 and a plurality of heat conduction metal structures 20, wherein the heat conduction metal structures 20 are fixed on the surface of the heat conduction substrate 10 away from the display panel 00;
the heat conductive metal structure 20 includes a heat conductive metal sheet 30, and the heat conductive metal sheet 30 includes an expanded state and a non-expanded state, please refer to fig. 3, in the non-expanded state, the heat conductive metal sheet 30 is parallel to the heat conductive substrate 10; in the expanded state, the heat conductive metal sheet 30 protrudes in a direction away from the light exit surface of the heat conductive substrate 10. It will be appreciated that fig. 2 shows only one schematic view of the thermally conductive sheet metal 30 in the expanded state, and fig. 3 shows a schematic view of a portion of the thermally conductive sheet metal 30 in the expanded state and a portion of the thermally conductive sheet metal 30 in the unexpanded state.
It should be noted that, fig. 1 only illustrates the relative positional relationship between the heat dissipating component 01 and the display panel 00, and only illustrates the heat dissipating component 01 having a rectangular structure and the display panel 00 having a rectangular structure, and the actual shapes of the heat conducting component and the display panel 00 are not limited, and in some other embodiments of the present invention, the shapes of the display panel 00 and the heat dissipating component 01 may be configured as rounded rectangles, circles, ovals, or special-shaped structures including arc edges, which are not particularly limited in the present invention. The thermally conductive metal structure 20 of fig. 1 and 2 is also merely illustrative and does not represent actual numbers, sizes and shapes.
In the display module 100 provided by the invention, the heat dissipation assembly 01 is introduced at one side of the display panel 00 away from the light emitting surface, and heat generated in the working process of the display panel 00 is conducted by utilizing the heat dissipation assembly 01. Specifically, the heat dissipation assembly 01 is disposed on the back surface of the display panel 00, i.e., the non-light-emitting surface of the display panel 00. The heat dissipation assembly 01 includes a heat conductive substrate 10 disposed on the back surface of the display panel 00 and a heat conductive metal structure 20 disposed on a side of the heat conductive substrate 10 away from the display panel 00, wherein the heat conductive metal structures 20 are distributed on the heat conductive substrate 10 and respectively correspond to different areas on the display panel 00, so that the heat conductive properties corresponding to the different areas of the display panel 00 are consistent. Alternatively, the heat conducting substrate 10 and the display panel 00 may be fixed by a heat conducting glue, so as to ensure that heat generated by the display panel 00 can be conducted to the heat conducting substrate 10 in the heat dissipating component 01 through the heat conducting glue.
Fig. 4 is a schematic structural view of the heat-conducting metal sheet 30 in a non-expanded state, fig. 5 is a schematic structural view of the heat-conducting metal sheet 30 in an expanded state, please refer to fig. 1, 3 and 5, when the display panel 00 is locally heated (for example, the local temperature is raised due to the heating of the components in a part of the display panel 00), at least part of the heat will be conducted to the heat-conducting metal sheet 30 corresponding to the heated region through the heat-conducting substrate 10, the heat-conducting metal sheet 30 is expanded when heated, and optionally, the heat-conducting metal sheet 30 protrudes towards a direction away from the display panel 00, so that the heat-dissipating area of the heat-conducting metal sheet 30 is increased, and the heat of the local heated region in the display panel 00 can be timely conducted away, thereby realizing the local heat-dissipating function of the display panel 00, avoiding the phenomenon that the product performance and the service life of the display module 100 are reduced due to the heating of the display panel 00, and thus being beneficial to improving the display performance and the service life of the display module 100.
In an alternative embodiment of the present invention, with continued reference to fig. 4 and 5, the thermally conductive metal structure 20 includes a thermally conductive metal sheet 30.
Specifically, fig. 4 and 5 show that the heat conducting metal structure 20 includes a heat conducting metal sheet 30, and when the heat generated by the display panel 00 is conducted to the heat conducting metal structure 20, the heat conducting metal sheet 30 is arranged in a manner that the heat conducting metal sheet 30 is easier to deform, the deformed shape is more controllable, and the heat dissipation area is more beneficial to increase, so as to improve the heat conducting performance of the display module.
In an alternative embodiment of the present invention, fig. 6 is a schematic structural view of another heat-conducting metal sheet 30 in a non-expanded state, fig. 7 is a schematic structural view of another heat-conducting metal sheet 30 in an expanded state, and referring to fig. 3, 6 and 7, the heat-conducting metal structure 20 includes at least two heat-conducting metal sheets 30 stacked along a first direction D1, and the first direction D1 is perpendicular to the heat-conducting substrate 10; the heat conductive metal structure 20 includes a first heat conductive metal sheet 31 and a second heat conductive metal sheet 32, the first heat conductive metal sheet 31 is located on a side of the second heat conductive metal sheet 32 close to the heat conductive substrate 10, and a thermal expansion coefficient of the first heat conductive metal sheet 31 is greater than a thermal expansion coefficient of the second heat conductive metal sheet 32.
Specifically, fig. 6 and 7 show a scheme in which the single heat conductive metal structure 20 includes two heat conductive metal sheets 30, in which the first heat conductive metal sheet 31 and the second heat conductive metal sheet 32 are stacked in the first direction D1, the first heat conductive metal sheet 31 is closer to the display panel 00 than the second heat conductive metal sheet 32, and the thermal expansion coefficient of the first heat conductive metal sheet 31 is larger than that of the second heat conductive metal sheet 32, and the greater the thermal expansion coefficient is, the greater the degree of thermal expansion deformation will be. The thermal expansion coefficient of the first heat conduction metal sheet 31 is set to be greater than that of the second heat conduction metal sheet 32, the first heat conduction metal sheet 31 can be regarded as an active layer, the second heat conduction metal sheet 32 can be regarded as a passive layer, when the heat generated by the display panel is conducted to the heat conduction metal structure 20, the deformation amount of the first heat conduction metal sheet 31 is greater than that of the second heat conduction metal sheet 32 due to the difference of the thermal expansion coefficients, the two metal sheets are in the state shown in fig. 7, namely, bending is generated to a certain extent, and the first heat conduction metal sheet 31 and the second heat conduction metal sheet 32 jointly deform to conduct heat outside the display panel. The heat dissipation area of the heat conducting metal structure 20 is effectively increased by the common deformation mode of the first heat conducting metal sheet 31 and the second heat conducting metal sheet 32, so that heat can be quickly conducted out of the display panel, and the heat dissipation performance of the display module is also improved.
In other alternative embodiments of the present invention, the number of the heat conductive metal sheets 30 included in the heat conductive metal structure 20 may be three or more, and optionally, the thermal expansion coefficients of the plurality of heat conductive metal sheets 30 sequentially decrease from the display panel 00 toward the heat conductive substrate 10.
In an alternative embodiment of the present invention, with continued reference to fig. 2 and 4, the heat conductive substrate 10 is provided with a plurality of positioning posts 41, and both ends of the heat conductive metal sheet 30 are respectively provided with positioning holes 42, and the positioning posts 41 are penetratingly disposed in the positioning holes 42.
Specifically, two ends of the heat conducting metal sheet 30 are fixed on the heat conducting substrate 10 through the positioning columns 41, when the heat conducting metal sheet 30 is heated to expand and deform, the two ends of the heat conducting metal sheet 30 are fixed on the heat conducting substrate 10 through the positioning columns 41, the area of the heat conducting metal sheet 30 between the two positioning columns 41 is convexly deformed, and heat is emitted through the deformed area. The mode of fixing the two ends of the heat conducting metal sheet 30 to deform the middle area is beneficial to increasing the deformation area of the heat conducting metal sheet 30, and further beneficial to increasing the heat dissipation area of the heat conducting metal structure 20 when being heated and deformed, so as to improve the heat dissipation performance of the display module.
In an alternative embodiment of the present invention, please continue to refer to fig. 3, the heat conductive metal structure 20 includes a first surface M1 and a second surface M2 parallel to the heat conductive substrate 10, the first surface M1 is located on a side of the heat conductive metal structure 20 near the heat conductive substrate 10, and in the non-expanded state, the first surface M1 of the heat conductive metal structure 20 is in direct contact with the heat conductive substrate 10.
Specifically, in the non-expansion state, the first surface M1 of the heat conductive metal structure 20 is closely attached to the heat conductive substrate 10, that is, the first surface M1 of the heat conductive metal structure 20 is in direct contact with the heat conductive substrate 10, referring to fig. 1 and 3, when the heat generated by the operation of the display panel 00 is transferred to the heat conductive substrate 10, the first surface M1 of the heat conductive metal structure 20 can sense the heat of the heat conductive substrate 10 at the first time, thereby being beneficial to improving the deformation sensitivity of the heat conductive metal structure 20, and further being beneficial to improving the heat conduction sensitivity of the heat conductive metal structure 20, so as to further improve the heat dissipation performance of the display module 100.
In an alternative embodiment of the present invention, fig. 8 is a schematic diagram of another structure of the display module 100 provided in the embodiment of the present invention, fig. 9 is a relative positional relationship diagram of the heat conductive housing 02, the heat dissipation assembly 01 and the display panel 00 in the display module provided in the embodiment of the present invention, and in order to clearly show the relationship of the three, fig. 9 is a different filling of the heat conductive metal structure 20, the heat conductive substrate 10 and the housing bottom 021 of the heat conductive housing 02. Referring to fig. 8 and 9, the display module 100 provided by the embodiment of the invention further includes a heat conductive housing 02, wherein the heat conductive housing 02 includes a housing bottom 021 and a side wall 022 surrounding the housing bottom 021; the heat conducting substrate 10 and the heat conducting housing 02 form a heat dissipation channel 50, and the heat conducting metal structure 20 is located in the heat dissipation channel 50. It should be noted that fig. 9 only shows a case where the heat conductive metal structure 20 is deformed when heated, it is understood that when the heat conductive metal structure 20 is not deformed, the surface of the heat conductive metal structure 20 facing the heat conductive substrate 10 and the surface of the heat conductive substrate 10 are parallel to the heat conductive substrate 10.
Specifically, referring to fig. 8 and 9, the display module 100 provided in the embodiment of the invention further includes a heat conductive housing 02, optionally, a housing bottom 021 and a side wall 022 of the heat conductive housing 02 form a concave accommodating space, the heat dissipation assembly 01 and the display panel 00 are disposed in the accommodating space, the light emitting surface of the display panel 00 is located at the mouth of the concave accommodating space, and the heat dissipation assembly 01 is located between the display panel 00 and the housing bottom 021. In the heat dissipation assembly 01, one side of the heat conduction substrate 10 provided with the heat conduction metal structure 20 faces the shell bottom 021, and a heat dissipation channel 50 is formed between the heat conduction substrate 10 and the shell bottom 021 of the heat conduction shell 02. In the non-expansion state, a certain distance is provided between the side of the heat conducting metal structure 20 on the heat conducting substrate 10 facing the shell bottom 021 and the shell bottom 021, and the space formed between the side of the heat conducting substrate 10 facing the shell bottom 021 and the shell bottom 021 can be regarded as the heat dissipation channel 50, and the heat conducting metal structure 20 is located in the heat dissipation channel 50. When the heat conducting metal sheet 30 in the heat conducting metal structure 20 is heated and expands, the contact area between the heat conducting metal sheet 30 and the heat dissipation channel 50 is increased, so that the heat generated by the display panel 00 is more favorably dissipated through the heat dissipation channel 50, and the heat dissipation performance of the display module 100 is more favorably improved.
In an alternative embodiment of the present invention, referring to fig. 9, in the expanded state, the heat conductive metal structure 20 protrudes toward the bottom 021, and at least a portion of the surface of the heat conductive metal structure 20 facing the bottom 021 contacts the bottom 021.
Referring to fig. 9, when the display panel 00 is heated seriously, more heat is transferred to the heat conductive substrate 10, and the deformation of the heat conductive metal structure 20 caused by heating is greater, so that the heat conductive metal structure 20 contacts the bottom 021. In this case, the heat on the heat conducting metal structure 20 can be conducted to the bottom 021 besides being dissipated through the heat dissipating channel 50, and then dissipated to the outside of the heat conducting shell 02 through the heat conducting shell 02, which is equivalent to increasing the number of heat dissipating paths of the heat conducting metal structure 20, so that the heat generated by the display panel can be more conveniently and rapidly dissipated to the outside of the display panel, and the phenomenon of overhigh local heat of the display panel can be avoided.
In an alternative embodiment of the present invention, please continue to refer to fig. 9, in the display module 100 provided in the embodiment of the present invention, the heat conductive metal structure 20 includes a first metal structure 21, and the first metal structure 21 contacts with the side wall 022 of the heat conductive housing 02; the side wall 022 includes a heat radiation hole K penetrating the side wall 022 in a direction of a thickness of the side wall 022; the heat dissipation holes K include first heat dissipation holes K1, and in the non-expanded state, orthographic projection of the first metal structure 21 on the side wall 022 of the heat conduction shell 02 covers the first heat dissipation holes K1; in the expanded state, the first metal structure 21 protrudes toward the heat conductive substrate 10, and the orthographic projection of the first metal structure 21 on the side wall 022 of the heat conductive housing 02 does not overlap with the first heat radiation hole K1 at least partially.
Specifically, in the display module 100 provided by the embodiment of the invention, the heat dissipation hole K is arranged on the side wall 022 of the heat conducting housing 02, fig. 10 is a schematic structural diagram of the heat dissipation hole K arranged on the side wall 022 of the heat conducting housing 02, when the heat generated by the display panel 00 is conducted to the heat conducting substrate 10, a part of the heat is conducted to the heat dissipation channel 50 through the heat conducting substrate 10, and another part of the heat is conducted to the heat dissipation channel 50 through the heat conducting metal structure 20.
Referring to fig. 9, the heat dissipation holes K on the side wall 022 of the heat conductive housing 02 include a first heat dissipation hole K1, and the heat conductive metal structure 20 on the heat conductive substrate 10 includes a first metal structure 21 corresponding to the first heat dissipation hole K1, and the first metal structure 21 may be regarded as the heat conductive metal structure 20 adjacent to the first heat dissipation hole K1, alternatively, the first metal structure 21 and the first heat dissipation hole K1 are disposed in a one-to-one correspondence. In the non-expansion state, the orthographic projection of the first metal structure 21 on the side wall 022 of the heat conducting housing 02 covers the first heat dissipation hole K1 corresponding to the first metal structure 21, and the side wall 022 of the first metal structure 21 facing the first heat dissipation hole K1 corresponding to the first metal structure contacts with at least part of the side wall 022 of the heat conducting housing 02, so that the first metal structure 21 is equivalent to a passage blocking the heat dissipation passage 50 from communicating with the outside through the first heat dissipation hole K1, and impurities such as dust outside the heat conducting housing 02 cannot enter the display module through the first heat dissipation hole K1, so that the dustproof performance of the display module is effectively improved. In the expansion state, the first metal structure 21 protrudes toward the heat conducting substrate 10, the orthographic projection of the first metal structure 21 on the side wall 022 of the heat conducting shell 02 is at least partially not overlapped with the first heat dissipation hole K1, so that the heat dissipation channel 50 is opened through the passage communicated with the outside through the first heat dissipation hole K1, heat in the heat dissipation channel 50 can be conducted to the outside of the display module 100 through the first heat dissipation hole K1, so that the heat dissipation channel 50 is opened through the passage connected with the outside through the first heat dissipation hole K1 when heat dissipation is needed, and external dust can be prevented from entering the display module when heat dissipation is not needed, so that the dustproof performance of the display module is effectively improved.
In an alternative embodiment of the present invention, referring to fig. 9 and 10, the heat dissipation holes K are trapezoidal in shape, and an upper bottom and a lower bottom of the trapezoid are respectively parallel to the heat conductive substrate 10, and the length of the upper bottom is smaller than that of the lower bottom, and the upper bottom is located between the case bottom 021 and the lower bottom along a direction perpendicular to the heat conductive substrate 10.
Specifically, when the heat conductive metal structure 20 is deformed by thermal expansion, the heat conductive metal structure 20 protrudes in a direction away from the heat conductive substrate 10, and the protruding shape is similar to the trapezoid shape. When the shape of the radiating hole K is set to be trapezoid, the trapezoid shape is similar to the deformation shape of the heat conducting metal structure 20, so that when the heat conducting metal structure 20 deforms, the larger the area of the radiating hole K can be exposed, the larger the area of the radiating channel 50 communicated with the outside through the radiating hole K can be increased, the radiating efficiency of the display module is improved, and the radiating performance of the display module is improved.
In an alternative embodiment of the present invention, referring to fig. 8 and 9, the display module 100 provided in the embodiment of the present invention further includes a plurality of heat conductive portions 03, a side of the heat conductive substrate 10 facing the display panel 00 includes a plurality of first grooves C1, the heat conductive portions 03 are fixed in the first grooves C1, and a heat conductivity coefficient of the heat conductive portions 03 is greater than that of the heat conductive substrate 10.
Specifically, in the display module 100 provided by the embodiment of the invention, the plurality of first grooves C1 are introduced into the side of the heat conducting substrate 10 facing the display panel 00, and the heat conducting portion 03 with a larger heat conductivity coefficient is arranged in the first grooves C1, so that when the display panel 00 generates heat, the heat is preferentially conducted to the heat conducting portion 03, and is conducted by the heat conducting portion 03 towards the direction of the heat conducting metal structure 20, thereby being beneficial to rapidly conducting the heat generated by the display panel 00 to the outside of the display panel 00, and further being beneficial to improving the heat dissipation efficiency of the display module 100.
In an alternative embodiment of the present invention, the heat conducting portion 03 includes a heat conducting pipe and a heat conducting liquid filled in the heat conducting pipe. Optionally, the heat conduction coefficient of the heat conduction pipe is larger than that of the heat conduction substrate, so that rapid conduction of heat of the display panel is facilitated. In addition, fill heat conduction liquid in the heat pipe, the heat conduction efficiency of liquid is higher, more is favorable to thermal conduction, consequently, the heat dissipation performance of display module assembly is favorable to promoting more to the mode that heat pipe and heat conduction liquid combine, promotes display module assembly's display performance and life.
In an alternative embodiment of the present invention, referring to fig. 8 and 9, the heat conductive metal structures 20 are arranged in an array on the heat conductive substrate 10 along a second direction D2 and a third direction D3, and the second direction D2 and the third direction D3 intersect;
referring to the drawings, the heat conducting portions 03 extend along the second direction D2 and are arranged along the third direction D3, and the front projection of the heat conducting portions 03 on the heat conducting substrate 10 overlaps with the front projection of the heat conducting metal structures 20 located in the same column along the second direction D2 on the heat conducting substrate 10.
Specifically, the heat conductive metal structure 20 is arranged in an array on the heat conductive substrate 10, which is beneficial to simplifying the manufacturing efficiency of the heat conductive metal structure 20. Further, the heat conducting portion 03 is provided in a long strip shape, and the heat conducting portion 03 is provided corresponding to the same column of the heat conducting metal structures 20, alternatively, a distance between two edges of the heat conducting portion 03 in the third direction D3 is smaller than or equal to a distance between two edges of the heat conducting metal structures 20 corresponding thereto in the third direction D3, which is advantageous in increasing an overlapping area of the heat conducting portion 03 and the heat conducting metal structures 20 in a direction perpendicular to the heat conducting substrate 10. When the heat of the display panel 00 is transferred to the heat conducting part 03, the heat of the heat conducting part 03 can be quickly transferred to the corresponding heat conducting metal structure 20, so that the heat is emitted at the first time, and the heat conducting efficiency of the display module is improved by the corresponding arrangement mode of the heat conducting part 03 and the heat conducting metal structure 20.
In an alternative embodiment of the present invention, please refer to fig. 8, the shape of the first groove C1 is the same as the shape of the heat conducting portion 03, and the inner wall of the first groove C1 is in direct contact with at least part of the outer wall of the heat conducting portion 03 or is fixed by a heat conducting medium.
Specifically, in the display module 100 provided in the embodiment of the present invention, when the heat conducting portion 03 is disposed in the first groove C1, at least a portion of the outer wall of the heat conducting portion 03 may be directly contacted with the outer wall of the heat conducting portion 03 or may be fixed by a heat conducting medium such as a heat conducting adhesive, soldering, or the like. The invention sets the shapes of the first groove C1 and the heat conducting part 03 as cuboid structures, so that the inner wall of the first groove C1 is matched with the outer wall of the heat conducting part 03, thereby being beneficial to increasing the heat conducting area between the heat conducting part 03 and the first groove C1 and improving the heat conducting efficiency of the display module.
In an alternative embodiment of the present invention, please refer to fig. 9, the surface of the heat conducting portion 03 facing the display panel 00 is coplanar with the surface of the heat conducting substrate 10 facing the display panel 00 and parallel to the display panel 00.
Specifically, since the display panel 00 is fixed to the surface of the heat dissipating component 01 facing the display panel 00 so as to conduct heat, when the heat conducting portion 03 is disposed in the first groove C1, the surface of the heat conducting portion 03 facing the display panel 00 and the surface of the heat conducting substrate 10 facing the display panel 00 are located on the same plane, so that the surface of the heat dissipating component 01 facing the display panel 00 is a planar structure, and the planar structure is more beneficial to fixing between the display panel 00 and the heat dissipating component 01. When the display panel 00 and the heat dissipation assembly 01 are fixed by the heat conducting medium such as the heat conducting glue, the arrangement mode that the surface of the heat conducting part 03 facing the display panel 00 and the surface of the heat conducting substrate 10 facing the display panel 00 are located on the same plane is also beneficial to increasing the heat conduction area between the display panel 00 and the heat dissipation assembly 01, and further is beneficial to improving the heat dissipation performance of the display module 100.
In an alternative embodiment of the present invention, fig. 11 is a schematic diagram showing another structure of a display module 100 provided in the embodiment of the present invention, and fig. 12 is a relative positional relationship diagram of a display panel 00, a heat dissipation assembly 01 and a heat dissipation channel 50 in the display module 100 provided in the embodiment of the present invention, where the display module 100 further includes a spacer layer 60 and the heat dissipation channel 50, along a first direction D1, the spacer layer 60 is located on a side of the heat conductive substrate 10 away from the light emitting surface thereof, and the heat dissipation channel 50 is located on a side of the spacer layer 60 away from the heat conductive substrate 10 (or the display panel 00); the heat conducting metal structure 20 further comprises a heat dissipating protrusion 33, wherein the heat dissipating protrusion 33 is located at one side of the heat conducting metal sheet 30 away from the heat conducting substrate 10;
with continued reference to fig. 11 and 12, a plurality of second grooves C2 are disposed on a side of the spacer layer 60 facing the display panel 00, the second grooves C2 are disposed in one-to-one correspondence with the heat conductive metal structures 20, and the metal sheets in the heat conductive metal structures 20 are located in the second grooves C2; the spacer layer 60 further includes a plurality of through holes T, along the first direction D1, the through holes T penetrate through the spacer layer 60, and the orthographic projection of the through holes T to the display panel 00 is located within the orthographic projection range of the second groove C2 to the heat conducting substrate 10, and the heat dissipating protrusion 33 is at least partially located in the through holes T; referring to fig. 13, in the expanded state, at least a portion of the heat dissipating protrusion 33 is located in the heat dissipating channel 50, wherein fig. 13 is a diagram showing a relative positional relationship between the heat dissipating channel 50 and the heat conducting metal structure 20 after expansion and deformation.
Specifically, fig. 11 and 12 show another possible structure of the display module 100 provided by the embodiment of the invention, where the display module 100 includes, in addition to the heat conductive substrate 10 and the heat conductive metal structure 20 disposed on a side of the heat conductive substrate 10 away from the display panel 00, a spacer layer 60 and a heat dissipation channel 50, and the spacer layer 60 is located on a side of the display panel 00 away from the light emitting surface, that is, on the back surface of the display panel 00; the heat dissipation channel 50 is located at a side of the spacer layer 60 remote from the display panel 00. The heat conductive metal structure 20 includes a heat dissipation protrusion 33 in addition to the heat conductive metal sheet 30, the heat dissipation protrusion 33 being located at a side of the heat conductive metal sheet 30 away from the display panel 00. The spacer layer 60 is provided with a plurality of second grooves C2 on a side facing the display panel 00, the heat conductive metal sheet 30 in the heat conductive metal structure 20 is located in the second grooves C2, the spacer layer 60 further includes a plurality of through holes T penetrating therethrough along the first direction D1, the through holes T are respectively communicated with the second grooves C2 and the heat dissipation channels 50, and at least part of the heat dissipation protrusions 33 in the heat conductive metal structure 20 are located in the through holes T. Fig. 12 is a schematic structural view of the heat conductive metal sheet 30 in the heat conductive metal structure 20 without deformation, and fig. 13 is a schematic structural view of the heat conductive metal sheet in the heat conductive metal structure 20 without deformation, and it should be noted that fig. 13 only illustrates the deformation of the heat conductive metal sheet 30, and does not represent an actual structure, and the connection relationship between the heat conductive metal sheet 30 and the heat conductive substrate 10 will not be described herein. With continued reference to fig. 12 to 13, when the display panel 00 is locally heated, at least a portion of heat is conducted to the heat conductive metal sheet 30 through the heat conductive substrate 10, and the heat conductive metal sheet 30 is deformed by thermal expansion and protrudes toward the heat dissipation channel 50. When the heat conducting metal sheet 30 is protruded, the heat radiating protrusion 33 connected with the heat conducting metal sheet is driven to displace towards the direction of the heat radiating channel 50, part of the heat radiating protrusion 33 is propped into the heat radiating channel 50, and the heat radiating protrusion 33 can conduct heat to the heat radiating channel 50, so that the heat generated by the display panel 00 is sequentially emitted into the heat radiating channel 50 through the heat conducting substrate 10, the heat conducting metal sheet 30 and the heat radiating protrusion 33, and the heat of a local heated area in the display panel 00 can be timely conducted out, thereby realizing the local heat radiating function of the display panel 00, avoiding the phenomenon that the product performance and the service life are reduced due to the heating of the display panel 00, and being beneficial to improving the display performance and the service life of the display module 100.
Optionally, the heat dissipating protrusion 33 provided in the embodiment of the present invention is a hollow cylindrical metal structure, for example, a cylindrical hollow structure surrounded by aluminum metal sheets, so as to reduce the weight of the heat dissipating protrusion 33, and ensure that the heat conducting metal sheet 30 can drive the cylindrical protrusion to displace in the process of expansion and deformation, so as to realize the heat dissipating function.
It should be understood that in the display module 100 provided in the embodiment shown in fig. 11, the heat conductive metal sheet 30 included in the heat conductive metal structure 20 may be implemented as a single sheet structure as shown in fig. 4 or 5, or may be implemented as a double sheet structure as shown in fig. 6 or 7, and in other embodiments of the present invention, the number of heat conductive metal sheets included in the heat conductive metal structure 20 may be three or more, which is not limited in particular. When the heat conducting metal structure comprises two or more heat conducting metal sheets, the thermal expansion coefficients of the different heat conducting metal sheets are in a decreasing trend along the direction of the display panel pointing to the heat conducting substrate.
In an alternative embodiment of the present invention, referring to fig. 11, the heat dissipation channel 50 includes an air outlet K0, and the display module 100 further includes an air extraction device 70 disposed at the air outlet K0. Specifically, in the embodiment of the present invention, the air extraction device 70 is disposed at the air outlet K0 of the heat dissipation channel 50, and the air extraction device 70 is used to extract air from the heat dissipation channel 50, so that heat in the heat dissipation channel 50 can be timely discharged out of the display module 100, thereby being beneficial to improving the heat dissipation performance of the display module 100. Alternatively, suction device 70 may embody a suction fan.
In an alternative embodiment of the present invention, please refer to fig. 14, fig. 14 is a schematic structural diagram of a heat conductive metal structure 20 provided in the embodiment of the present invention, and the heat conductive metal structure 20 further includes a plurality of heat dissipation fins 34, and referring to fig. 12, the heat dissipation fins 34 are located at an end of the heat dissipation protrusion 33 away from the heat conductive metal sheet 30 along a direction parallel to the heat conductive substrate 10.
Specifically, in the display module 100 provided by the embodiment of the invention, the heat dissipation fins 34 are disposed on the heat dissipation protrusions 33 of the heat conduction metal structure 20, and when the heat dissipation protrusions 33 are driven by the heat conduction metal sheet 30 to move into the heat dissipation channel 50, the heat dissipation fins 34 are disposed to facilitate increasing the contact area between the heat conduction metal structure 20 and the heat dissipation channel 50, thereby improving the heat dissipation rate of the heat conduction metal structure 20. In addition, when the air exhausting device 70 exhausts the air from the heat dissipating channel 50, since the heat dissipating fins 34 are in an uneven structure, when the air flow reaches the position of the heat dissipating fins 34, the heat dissipating fins 34 can disturb the air flow, and the contact time between the air and the heat dissipating fins 34 is increased, so that the heat conduction on the heat conducting metal structure 20 is facilitated.
In an alternative embodiment of the present invention, fig. 15 is a diagram showing a relative positional relationship between the heat dissipation channel 50 and the heat conductive metal structure 20 according to an embodiment of the present invention, and optionally, the orthographic projection of the heat conductive metal structure 20 on the heat conductive substrate is located in the heat dissipation channel 50. Referring to fig. 15, the heat dissipation channel 50 is a spiral channel. The heat dissipation channel 50 is arranged to be of a spiral structure, when the air draft device is used for exhausting air outwards, air can be discharged outwards in a spiral mode from the central position of the heat dissipation channel 50, so that air flow can flow through all areas, the problem that the local heat dissipation performance of the display module is poor is avoided, and the heat dissipation performance of the display module is improved.
Based on the same inventive concept, fig. 16 is a schematic plan view of a display device according to an embodiment of the present invention, and a display device 200 is also provided, including a display module 100 according to an embodiment of the present invention. The embodiment shown in fig. 16 only uses a mobile phone as an example to describe the display device, and it is to be understood that the display device 200 provided in the embodiment of the present invention may be a computer, a television, a vehicle-mounted display device, a wearable display device, or other display devices with display functions, which is not particularly limited in the present invention. The display device 200 provided in the embodiment of the present invention has the beneficial effects of the display module provided in the embodiment of the present invention, and the specific description of the display module in each of the above embodiments may be referred to specifically, and this embodiment is not repeated here.
In summary, the display module and the display device provided by the invention at least realize the following beneficial effects:
the invention provides a display module and a display device, comprising a display panel and a heat dissipation assembly arranged on one side of the display panel, which is far away from a light emitting surface of the display panel, wherein the heat dissipation assembly comprises a heat conduction substrate and a plurality of heat conduction metal structures arranged on the surface of the heat conduction substrate, which is far away from the display panel, and the heat conduction metal structures comprise heat conduction metal sheets. When the display panel is locally heated, heat is conducted from the heat conducting substrate to the heat conducting metal sheet corresponding to the heated area, the heat conducting metal sheet is heated to expand, the heat radiating area is increased, and the heat of the locally heated area in the display panel can be timely conducted out, so that the local heat radiating function of the display panel is realized, the phenomenon that the product performance and the service life are reduced due to the fact that the display panel is heated is avoided, and therefore the display performance and the service life of the display module and the display device are improved.
While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (16)
1. A display module, comprising: the display panel and the heat dissipation assembly are positioned on one side of the display panel, which is away from the light-emitting surface of the display panel;
the heat dissipation assembly comprises a heat conduction substrate and a plurality of heat conduction metal structures, wherein the heat conduction metal structures are fixed on the surface, far away from the display panel, of the heat conduction substrate;
the heat conducting metal structure comprises a heat conducting metal sheet, wherein the heat conducting metal sheet comprises an expansion state and a non-expansion state, and in the non-expansion state, the heat conducting metal sheet is parallel to the heat conducting substrate; in the expanded state, the thermally conductive metal sheet protrudes in a direction away from the thermally conductive substrate;
the heat-conducting shell comprises a shell bottom and a side wall surrounding the shell bottom; the heat conducting substrate and the heat conducting shell form a heat radiating channel, and the heat conducting metal structure is positioned in the heat radiating channel; in the expanded state, the heat conducting metal structure protrudes towards the shell bottom, and at least part of the surface of the heat conducting metal structure towards the shell bottom is in contact with the shell bottom;
the heat conducting metal structure comprises a first metal structure, and the first metal structure is in contact with the side wall of the heat conducting shell; the side wall comprises a heat dissipation hole, and the heat dissipation hole penetrates through the side wall along the thickness direction of the side wall; the heat dissipation holes comprise first heat dissipation holes, and in the non-expansion state, orthographic projection of the first metal structure on the side wall of the heat conduction shell covers the first heat dissipation holes; in the expanded state, the first metal structure protrudes towards the heat conducting substrate, and the orthographic projection of the first metal structure on the side wall of the heat conducting shell is at least partially not overlapped with the first radiating hole.
2. The display module of claim 1, wherein the thermally conductive metal structure comprises a thermally conductive metal sheet.
3. The display module of claim 1, wherein the thermally conductive metal structure comprises at least two thermally conductive metal sheets stacked along a first direction, the first direction being perpendicular to the thermally conductive substrate; the heat conduction metal structure comprises a first heat conduction metal sheet and a second heat conduction metal sheet, wherein the first heat conduction metal sheet is positioned on one side, close to the heat conduction substrate, of the second heat conduction metal sheet, and the thermal expansion coefficient of the first heat conduction metal sheet is larger than that of the second heat conduction metal sheet.
4. A display module according to claim 2 or 3, wherein a plurality of positioning posts are provided on the heat conducting substrate, positioning holes are provided at two ends of the heat conducting metal sheet, respectively, and the positioning posts penetrate through the positioning holes.
5. The display module of claim 1, wherein the thermally conductive metal structure comprises a first surface and a second surface parallel to the thermally conductive substrate, the first surface being on a side of the thermally conductive metal structure adjacent to the thermally conductive substrate, the first surface of the thermally conductive metal structure in direct contact with the thermally conductive substrate in the unexpanded state.
6. The display module of claim 1, wherein the heat dissipation holes are trapezoidal in shape, an upper bottom and a lower bottom of the trapezoid are respectively parallel to the heat conduction substrate, a length of the upper bottom is smaller than a length of the lower bottom, and the upper bottom is located between the case bottom and the lower bottom along a direction perpendicular to the heat conduction substrate.
7. The display module of claim 4, further comprising a plurality of thermally conductive portions, wherein a side of the thermally conductive substrate facing the display panel includes a plurality of first grooves, wherein the thermally conductive portions are fixed in the first grooves, and wherein a thermal conductivity of the thermally conductive portions is greater than a thermal conductivity of the thermally conductive substrate.
8. The display module of claim 7, wherein the heat conducting portion comprises a heat conducting pipe and a heat conducting liquid filled in the heat conducting pipe.
9. The display module of claim 7, wherein the thermally conductive metal structures are arranged in an array on the thermally conductive substrate along a second direction and a third direction, the second direction and the third direction intersecting;
the heat conducting parts extend along the second direction and are distributed along the third direction, and the orthographic projection of the heat conducting parts on the heat conducting substrate overlaps with the orthographic projection of the heat conducting metal structures which are positioned in the same column along the second direction on the heat conducting substrate.
10. The display module of claim 7, wherein the first groove has a shape identical to the shape of the heat conductive portion, and an inner wall of the first groove is in direct contact with at least a portion of an outer wall of the heat conductive portion or is fixed by a heat conductive medium.
11. The display module of claim 7, wherein a surface of the thermally conductive portion facing the display panel is coplanar with a surface of the thermally conductive base facing the display panel and parallel to the display panel.
12. The display module of claim 1, further comprising a spacer layer and a heat dissipation channel, the spacer layer being located on a side of the thermally conductive substrate away from the display panel along a first direction, the heat dissipation channel being located on a side of the spacer layer away from the thermally conductive substrate, the first direction being perpendicular to the thermally conductive substrate;
the heat-conducting metal structure further comprises a heat-radiating protrusion, and the heat-radiating protrusion is positioned on one side of the heat-conducting metal sheet far away from the heat-conducting substrate;
a plurality of second grooves are formed in one side, facing the heat conducting substrate, of the spacer layer, the second grooves are arranged in one-to-one correspondence with the heat conducting metal structures, and the heat conducting metal sheets in the heat conducting metal structures are located in the second grooves;
the spacer layer further comprises a plurality of through holes, the through holes penetrate through the spacer layer along the first direction, the orthographic projection of the through holes to the heat conducting substrate is located in the orthographic projection range of the second groove to the heat conducting substrate, and the heat dissipation protrusions are located in the through holes at least partially;
in the expanded state, at least a portion of the heat dissipating protrusion is located in the heat dissipating channel.
13. The display module of claim 12, wherein the thermally conductive metal structure further comprises a plurality of heat dissipating fins, the heat dissipating fins being located at an end of the heat dissipating protrusion away from the thermally conductive metal sheet in a direction parallel to the thermally conductive substrate.
14. The display module of claim 12, wherein the heat dissipation channel is a spiral channel.
15. The display module of claim 14, wherein the heat dissipation channel comprises an air outlet, and the display module further comprises an air draft device disposed at the air outlet.
16. A display device comprising the display module of any one of claims 1 to 15.
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| CN114420863B (en) * | 2022-01-10 | 2023-06-30 | 深圳市华星光电半导体显示技术有限公司 | Display device and method for manufacturing the same |
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