CN212851549U - Heat dissipation member and electronic device - Google Patents

Abstract

The application relates to a heat dissipation piece and an electronic device, wherein the heat dissipation piece comprises a first metal sheet and a second metal sheet, the second metal sheet is stacked with the first metal sheet, and a gap is formed between the first metal sheet and the second metal sheet. The first metal sheet is provided with a heat collecting groove separated from the gap, and the heat collecting groove extends to the surface of the first metal sheet back to the second metal sheet. The heat sink may be disposed corresponding to a heat generating device of the electronic device, so that the heat collecting slot covers at least a portion of the heat generating device. The heat generated by the heating device in the working process can be conducted into the heat collecting groove and can be uniformly dissipated into the gap through the groove wall of the heat collecting groove. The heat of the heating device can be quickly dissipated to the outside by utilizing the convection of air in the gap and the heat conduction of the first metal sheet and the second metal sheet, so that the heat dissipation performance of the electronic equipment is improved.

Description

Heat dissipation member and electronic device

Technical Field

The present application relates to the field of electronic devices, and in particular, to a heat dissipation device and an electronic device.

Background

Electronic equipment can be equipped with a heat pipe or a VC (Vapor chamber) to improve the heat dissipation performance of the electronic equipment, but the heat pipe and the VC have complicated structures.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a heat dissipation piece and electronic equipment, so that the structure of a heat dissipation device of the electronic equipment is simplified.

A heat sink, comprising:

a first metal sheet; and

a second metal sheet stacked with the first metal sheet, a gap being formed between the first metal sheet and the second metal sheet; the first metal sheet is provided with a heat collection groove separated from the gap, and the heat collection groove extends to the surface of the first metal sheet, which is back to the second metal sheet.

The heat sink may be disposed corresponding to a heat generating device of the electronic device, so that the heat collecting slot covers at least a portion of the heat generating device. The heat generated by the heating device in the working process can be conducted into the heat collecting groove and can be uniformly dissipated into the gap through the groove wall of the heat collecting groove. The heat of the heating device can be quickly dissipated to the outside by utilizing the convection of air in the gap and the heat conduction of the first metal sheet and the second metal sheet, so that the heat dissipation performance of the electronic equipment is improved.

In one embodiment, the second metal sheet is provided with a through hole communicating with the gap.

In one embodiment, the heat collecting groove penetrates through two opposite sides of the first metal sheet, and the second metal sheet covers one end of the heat collecting groove.

In one embodiment, the heat sink includes a support member disposed between the first metal sheet and the second metal sheet, the support member separating the first metal sheet and the second metal sheet to form the gap.

In one embodiment, the heat collecting groove penetrates through two opposite sides of the supporting member.

In one embodiment, one of the first metal sheet and the second metal sheet forms a protrusion into the gap, the protrusion being connected to the other of the first metal sheet and the second metal sheet.

In one embodiment, a surface of at least one of the first metal sheet and the second metal sheet is provided with a heat-dissipating ceramic coating.

In one embodiment, the first metal sheet is provided with a heat dissipation hole communicating with the gap.

In one embodiment, any one of the following schemes is included:

the first metal sheet comprises a first part and a second part which are integrally formed, and the thickness of the first part is larger than that of the second part;

the second metal sheet comprises a third part and a fourth part which are integrally formed, and the thickness of the third part is larger than that of the fourth part.

In one embodiment, the first metal sheet is bent to form a first bent portion, the second metal sheet is bent to form a second bent portion, the first bent portion and the second bent portion are disposed opposite to each other, and the gap extends between the first bent portion and the second bent portion.

An electronic device comprises a circuit board and the heat radiating piece, wherein the circuit board is provided with a heating device, and at least part of the heating device is covered by a heat collecting groove.

In one embodiment, any one of the following schemes is included:

the first metal sheet is abutted against the heating device so that the heating device covers the opening of the heat collecting groove;

the first metal sheet abuts against the circuit board, and the heating device is accommodated in the heat collection groove.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of an electronic device according to an embodiment;

FIG. 2 is a schematic view of a heat sink according to an embodiment;

fig. 3 is an exploded view from one perspective of the heat sink shown in fig. 2;

fig. 4 is a front view of the heat sink shown in fig. 2;

fig. 5 is an exploded view of the heat sink shown in fig. 3 from another perspective;

fig. 6 is a cross-sectional view of the heat sink shown in fig. 4 taken along a-a;

fig. 7 is a cross-sectional view of a heat sink of an embodiment;

fig. 8 is a cross-sectional view of another embodiment heat sink;

FIG. 9 is a schematic view of a first metal sheet according to one embodiment;

FIG. 10 is a schematic view of a first metal sheet according to another embodiment;

fig. 11 is a schematic view of a heat sink of another embodiment;

fig. 12 is a schematic block diagram of an electronic device according to an embodiment.

Reference numerals: 10. an electronic device; 20. a heat sink; 20a, a gap; 20b, a heat collecting groove; 21. a first metal sheet; 21a, heat dissipation holes; 211. a first portion; 213. a second portion; 215. a first bent portion; 22. a protrusion; 23. a second metal sheet; 23a, a through hole; 235. a second bent portion; 25. a support member; 27. a heat dissipating ceramic coating; 30. a heat generating device.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

As used herein, "electronic device" means a device capable of receiving and/or transmitting communication signals including, but not limited to, a device connected via any one or more of the following connections:

(1) via wireline connections, such as via Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), Digital cable, direct cable connections;

(2) via a Wireless interface means such as a cellular Network, a Wireless Local Area Network (WLAN), a digital television Network such as a DVB-H Network, a satellite Network, an AM-FM broadcast transmitter.

Electronic devices arranged to communicate over a wireless interface may be referred to as "mobile terminals". Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1) satellite or cellular telephones;

(2) personal Communications Systems (PCS) terminals that may combine cellular radiotelephones with data processing, facsimile, and data Communications capabilities;

(3) radiotelephones, pagers, internet/intranet access, Web browsers, notebooks, calendars, Personal Digital Assistants (PDAs) equipped with Global Positioning System (GPS) receivers;

(4) conventional laptop and/or palmtop receivers;

(5) conventional laptop and/or palmtop radiotelephone transceivers, and the like.

Referring to fig. 1 and 2, in some embodiments, the electronic device 10 is a smartphone. The electronic device 10 includes a circuit board (not shown) and electronic components such as a processor, a power management module, etc. integrated on the circuit board. During operation of the electronic device 10, electronic components such as processors tend to generate a large amount of heat, causing the temperature of the area surrounding such heat generating components to increase. The electronic device 10 therefore generally needs to be equipped with the heat dissipation member 20 to improve the heat dissipation performance of the electronic device 10, and prevent the temperature of such heat generating devices from being too high to affect the operating efficiency and the service life of the electronic devices. In other embodiments, the electronic device 10 may be a tablet computer, a handheld game console, or the like. In other embodiments, the electronic device 10 may also be other devices that need to be equipped with the heat sink 20, such as a notebook, a display, and the like.

Referring to fig. 2 and 3, the present application provides a heat dissipation member 20, where the heat dissipation member 20 may be applied to an electronic device 10 to dissipate heat generated by a heat generating device of the electronic device 10, so as to improve the heat dissipation performance of the electronic device 10. The heat sink 20 includes at least a first metal sheet 21 and a second metal sheet 23, and the first metal sheet 21 and the second metal sheet 23 are stacked. In some embodiments, the first metal sheet 21 has a size comparable to the second metal sheet 23, and the first metal sheet 21 is stacked on the second metal sheet 23. The first metal sheet 21 and the second metal sheet 23 may or may not be in contact, for example, other structural members may be disposed between the first metal sheet 21 and the second metal sheet 23, and such an arrangement may still consider the first metal sheet 21 and the second metal sheet 23 as being a stacked arrangement. Of course, the size of the first metal sheet 21 may be larger or smaller than the size of the second metal sheet 23, and in this embodiment, the first metal sheet 21 and the second metal sheet 23 may also be regarded as a stacked structure.

Referring to fig. 4 and 5, a gap 20a is formed between the first metal sheet 21 and the second metal sheet 23, the heat sink 20 is provided with a heat collecting groove 20b blocked from the gap 20a, and the heat collecting groove 20b extends to a surface of the first metal sheet 21 facing away from the second metal sheet 23. In other words, one opening of the heat collecting groove 20b is formed at a side of the first metal sheet 21 facing away from the second metal sheet 23, and the gap 20a formed between the first metal sheet 21 and the second metal sheet 23 is disposed spaced apart from the heat collecting groove 20 b. In the present embodiment, the material of the first metal sheet 21 is the same as that of the second metal sheet 23, and is copper or a copper alloy, and the first metal sheet 21 and the second metal sheet 23 made of copper or a copper alloy have relatively high thermal conductivity. In other embodiments, the first metal sheet 21 and the second metal sheet 23 may be made of aluminum or aluminum alloy, and the first metal sheet 21 and the second metal sheet 23 made of aluminum or aluminum alloy also have relatively high thermal conductivity. In other embodiments, the first metal sheet 21 and the second metal sheet 23 may be made of other materials with relatively high thermal conductivity, such as steel. Of course, the material of the first metal sheet 21 and the second metal sheet 23 may be different. For example, the first metal sheet 21 may be a copper alloy, and the second metal sheet 23 may be an aluminum alloy.

Referring to fig. 5 and 6, in some embodiments, the heat sink 20 may include a support 25 disposed between the first and second metal sheets 21 and 23, the support 25 separating the first and second metal sheets 21 and 23 to form a gap 20 a. The material of the support 25, the first metal sheet 21 and the second metal sheet 23 may be the same, for example, in the present embodiment, the first metal sheet 21, the support 25 and the second metal sheet 23 are all copper sheets, the first metal sheet 21, the support 25 and the second metal sheet 23 are stacked in order with the same thickness, and the first metal sheet 21 and the second metal sheet 23 are disposed substantially in parallel and separated by the support 25 to form the gap 20 a. Specifically, in some embodiments, the first metal sheet 21 is a copper sheet and has a thickness of 0.1 mm to 0.15 mm; the supporting piece 25 is a copper sheet, and the thickness is 0.05 mm-0.2 mm; the second metal sheet 23 is a copper sheet, and has a thickness of 0.1 mm to 0.15 mm. After the first metal sheet 21, the supporting member 25 and the second metal sheet 23 with the above thickness ranges are stacked, the heat sink 20 has a smaller thickness and is easier to bend and deform to better adapt to the shapes of the heat generating devices with different shapes, so that the heat sink can be attached to the surfaces of the heat generating devices and is beneficial to heat conduction. In other embodiments, the material of the supporting member 25 may be an aluminum sheet or a steel sheet, and the thickness thereof may be greater than or less than the thickness of the first metal sheet 21 and the second metal sheet 23. Of course, it is understood that the supporting member 25 is not necessary, and for example, the first metal sheet 21 may be protruded toward the second metal sheet 23 to form a supporting position, so that the first metal sheet 21 and the second metal sheet 23 are spaced apart and form the gap 20a described above. Of course, in some embodiments, the support 25 and one of the first or second metal sheets 21 or 23 are integrally formed.

Further, in the present embodiment, the second metal piece 23 is provided with a through hole 23a communicating with the gap 20 a. The through-hole 23a may be provided in plural, for example, the through-hole 23a is provided in 2 or more. The plurality of through holes 23a are disposed at intervals on the second metal sheet 23 and are all communicated with the gap 20 a. In the present embodiment, the through holes 23a are regularly distributed, for example, the through holes 23a are arranged along the same straight line at intervals, and the through holes 23a in a certain area may be arranged in an array. In other embodiments, the arrangement of the through holes 23a may have greater randomness. Further, referring to fig. 5 and 6, in the present embodiment, a protrusion 22 is provided between two adjacent through holes 23a, and the protrusion 22 protrudes into the gap 20a and is connected to the first metal piece 21. The protrusion 22 is provided to form a supporting point between the first metal sheet 21 and the second metal sheet 23 to maintain the size of the gap 20 a. For example, in the present embodiment, the support 25 and the protrusion 22 are disposed such that the gap 20a between the first metal sheet 21 and the second metal sheet 23 is maintained in the range of 0.05 mm to 0.2 mm, thereby facilitating the flow of air. Of course, in other embodiments, the distribution of the protrusions 22 may be more random. Further, since the protrusion 22 may form a solid heat conducting path, that is, the first metal sheet 21 may conduct heat to the second metal sheet 23 through the protrusion 22, the protrusion 22 may serve as a welding point, so that the first metal sheet 21 and the second metal sheet 23 are reliably fixed, and heat conduction from the first metal sheet 21 to the second metal sheet 23 is facilitated.

Of course, it is understood that the protrusion 22 may be formed on the side of the first metal sheet 21 facing the second metal sheet 23, that is, the protrusion 22 may be a part of the first metal sheet 21, and the protrusion 22 may also be a welding point to enable the first metal sheet 21 and the second metal sheet 23 to be reliably fixed and facilitate heat conduction from the first metal sheet 21 to the second metal sheet 23.

Referring to fig. 5, the heat collecting groove 20b penetrates through opposite sides of the first metal sheet 21 and the supporting member 25, and the second metal sheet 23 covers one end of the heat collecting groove 20 b. The heat collecting groove 20b with such a structure may be configured to attach the first metal sheet 21 to or be close to the surface of the heat generating device when the heat dissipating member 20 covers the heat generating device of the electronic device 10, so that heat generated by the heat generating device can enter the heat collecting groove 20b, the heat exchanging area is increased by using the groove wall of the heat collecting groove 20b, and the heat can be uniformly transmitted to the gap 20a formed by the first metal sheet 21 and the second metal sheet 23 along the groove wall of the heat collecting groove 20b, thereby uniformly increasing temperature in the circumferential direction of the heat collecting groove 20b, and improving the heat dissipating efficiency of the heat dissipating member 20. Of course, in other embodiments, the heat collecting groove 20b need not extend through the supporting member 25, and in the default embodiment of the supporting member 25, the heat collecting groove 20b need not extend through two opposite sides of the first metal sheet 21, i.e. the heat collecting groove 20b on the first metal sheet 21 may be a sinking groove.

Referring to fig. 7, in some embodiments, the heat generating device 30 of the electronic device 10, such as a processor, has a relatively large size, and the first metal sheet 21 may abut against the heat generating device 30 so that the heat generating device 30 covers the opening of the heat collecting slot 20 b. During the operation of the electronic device 10, the heat generating device 30 exchanges heat with the second metal sheet 23 and the air in the heat collecting slot 20b, the heat generated by the heat generating device 30 is further uniformly dissipated into the gap 20a through the slot wall of the heat collecting slot 20b, and after the air in the gap 20a is heated, the volume of the air expands and rises, so as to generate convection with the air in the through hole 23a and the gap 20 a. In other words, the temperature of the first metal sheet 21 close to the heat source (i.e., the heat generating device 30) rises relatively fast, the temperature of the second metal sheet 23 far from the heat source rises relatively slow through the heat collecting groove 20b and the through hole 23a, and the gap 20a between the first metal sheet 21 and the second metal sheet 23, so that a temperature difference is formed between the first metal sheet 21 and the second metal sheet 23, and according to the air convection principle, a micro air flow is formed in the gap 20a between the first metal sheet 21 and the second metal sheet 23, thereby facilitating the rapid heat dissipation and improving the heat dissipation performance of the electronic device 10.

Of course, referring to fig. 8, in other embodiments, the first metal sheet 21 may also be provided with heat dissipation holes 21a, and the heat dissipation holes 21a are communicated with the gaps 20a, such a structure may further enhance the heat dissipation efficiency of the heat dissipation member 20, and further enhance the heat dissipation performance of the electronic device 10. Of course, in other embodiments, for a heat generating device 30 having a relatively small size, the heat collecting slot 20b may be used to house the heat generating device 30 to enhance the heat dissipation performance of the electronic apparatus 10. That is, the first metal sheet 21 may abut on the circuit board, and the heat generating device 30 is received in the heat collecting slot 20 b. In this embodiment, the heat collecting groove 20b may also increase the heat exchange area of the heat generating device 30 and the heat sink 20, and enable heat to be more uniformly conducted into the gap 20a formed by the first metal sheet 21 and the second metal sheet 23 along the groove wall of the heat collecting groove 20b, thereby making temperature rise in the circumferential direction of the heat collecting groove 20b uniform and enhancing the heat dissipation efficiency of the heat sink 20.

Further, referring to fig. 7 and 8, in some embodiments, a surface of at least one of the first metal sheet 21 and the second metal sheet 23 is provided with a heat-dissipating ceramic coating 27. For example, in the present embodiment, the surface of the first metal piece 21 facing the second metal piece 23 and the surface facing away from the second metal piece 23 are both coated with the heat dissipation ceramic coatings 27. The heat dissipation ceramic coating 27 can improve the efficiency of radiation heat dissipation, for example, the heat dissipation ceramic coating 27 can radiate heat to the outside with an infrared wavelength of 8 micrometers to 13.5 micrometers to reduce the temperature on the surface and inside of the first metal sheet 21, so that the heat dissipation efficiency of the heat dissipation member 20 can be remarkably improved, and the temperature rise of the heat dissipation member 20 can be reduced. The heat dissipation ceramic coating 27 also has the advantages of being not affected by surrounding media, being capable of being used in a vacuum environment, and the like, so that the applicable scene of the heat dissipation member 20 can be improved. In other embodiments, the surface of the second metal sheet 23 may also be provided with a heat dissipation ceramic coating 27 to improve the heat dissipation performance of the heat dissipation member 20, which is not described herein again.

The heat sink 20 has a better heat dissipation effect for the heat generating device 30 with higher heat generating power. For the electronic device 10 with a complicated structure, the heat dissipation member 20 can be easily deformed to meet the heat dissipation requirement of the electronic device 10, and particularly, the heat dissipation member has a significant heat dissipation advantage for the electronic device 10 with high heat generation. For example, for high power consumption AR (Augmented Reality) devices and portable projection devices, the heat dissipation member 20 may significantly improve the heat dissipation performance of the electronic device 10, so that the electronic device 10 maintains high operation performance and the service life of the electronic device 10 is prolonged. In addition, the heat sink 20 may also reduce manufacturing costs. For example, compared to a heat dissipation heat pipe, the cost of the heat dissipation member 20 may be reduced by 20% to 30%, so that the cost of the electronic device 10 may be reduced while the heat dissipation performance of the electronic device 10 is improved.

In the heat sink 20, the thickness of the first metal sheet 21 does not need to be uniform, and the thickness of the second metal sheet 23 does not need to be uniform. In other words, the local thickness of the first metal sheet 21 or the second metal sheet 23 may be set thicker or thinner than the other portions. For example, referring to fig. 9, in some embodiments, the first metal sheet 21 may include a first portion 211 and a second portion 213 integrally formed, the second portion 213 being located at an edge of the first metal sheet 21, and the first portion 211 having a thickness greater than a thickness of the second portion 213. Referring to fig. 10, in other embodiments, the second portion 213 may be located in a middle region of the first metal sheet 21, i.e., the first metal sheet 21 may have a structure with thick edges and thin middle.

The second metal sheet 23 may also be provided in a similar structure. For example, the second metal sheet 23 may include a third portion and a fourth portion integrally formed, and the thickness of the third portion is greater than that of the fourth portion. The third portion may be located at an edge of the second metal sheet 23, and the third portion may also be located in a middle area of the second metal sheet 23, which is not described herein again.

Further, since the gap 20a between the first metal sheet 21 and the second metal sheet 23 is easily implemented, the local positions of the first metal sheet 21 and the second metal sheet 23 may also be bent and deformed to adapt to the shapes of different heat generating devices 30. For example, referring to fig. 11, the first metal sheet 21 is bent to form a first bent portion 215, the second metal sheet 23 is bent to form a second bent portion 235, the first bent portion 215 is disposed opposite to the second bent portion 235, and the gap 20a extends between the first bent portion 215 and the second bent portion 235. In other words, the first metal sheet 21 and the second metal sheet 23 in the planar structure may be bent and molded, and the size of the gap 20a between the first metal sheet 21 and the second metal sheet 23 is maintained by the protrusion 22, so that the heat dissipation member 20 may be suitable for the heat generating devices 30 in different shapes or the heat dissipation member 20 may be better attached to the heat generating devices 30, so as to improve the heat dissipation performance of the electronic device 10.

In the present embodiment, the first metal sheet 21, the support 25 and the second metal sheet 23 are each a single-layer copper sheet, so that the heat sink 20 after being sequentially stacked has a relatively small thickness and the heat sink 20 has relatively good deformation performance. For example, the above-described heat sink 20 may be easily deformed and cover the heat generating devices 30 of different shapes to improve the versatility of the heat sink 20. For another example, the shapes of the first metal sheet 21, the second metal sheet 23 and the supporting member 25 may not be limited, so that the applicable scene of the heat sink 20 may be improved. In other embodiments, the first metal sheet 21 may include a plurality of metal sheets, for example, the number of the metal sheets in the first metal sheet 21 may be 2 or more, and the metal sheets in the first metal sheet 21 may be stacked and pressed, or stacked and arranged to form a gap 20a between two adjacent metal sheets. Similarly, the second metal sheet 23 may also include a plurality of metal sheets, for example, the number of the metal sheets in the second metal sheet 23 may be more than 2, and the metal sheets in the second metal sheet 23 may be laminated together, or may be laminated together and form a gap 20a between two adjacent metal sheets. The support member 25 may have a similar structure to the first metal sheet 21 or the second metal sheet 23, and will not be described herein.

Of course, in other embodiments, a plurality of layers of the first metal sheets 21 and a plurality of layers of the supporting members 25 may be alternately stacked on the side of the first metal sheet 21 away from the second metal sheet 23, and the gap 20a is formed between two adjacent layers of the first metal sheets 21 through the supporting members 25. The side of the first metal sheet 21 far from the first metal sheet 21 may also be provided with a plurality of second metal sheets 23 and a plurality of supporting members 25 in a staggered and stacked manner, and a gap 20a is formed between two adjacent second metal sheets 23 through the supporting members 25. Of course, on the side of the first metal sheet 21 far from the second metal sheet 23, or on the side of the second metal sheet 23 far from the first metal sheet 21, multiple layers of the first metal sheet 21 and the second metal sheet 23 may be provided, and the gap 20a is formed between two adjacent layers of the metal sheets through the supporting member 25.

Referring to fig. 12, fig. 12 is a schematic structural diagram of an electronic device 10 according to an embodiment. The electronic device 10 may include Radio Frequency (RF) circuitry 501, memory 502 including one or more computer-readable storage media, input unit 503, display unit 504, sensor 505, audio circuitry 506, Wireless Fidelity (WiFi) module 507, processor 508 including one or more processing cores, and power supply 509. Those skilled in the art will appreciate that the configuration of the electronic device 10 shown in FIG. 12 is not intended to be limiting of the electronic device 10 and may include more or fewer components than shown, or some components may be combined, or a different arrangement of components.

The rf circuit 501 may be used for receiving and transmitting information, or receiving and transmitting signals during a call, and in particular, receives downlink information of a base station and then sends the received downlink information to one or more processors 508 for processing; in addition, data relating to uplink is transmitted to the base station. In general, radio frequency circuit 501 includes, but is not limited to, an antenna, at least one Amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, a Low Noise Amplifier (LNA), a duplexer, and the like. In addition, the radio frequency circuit 501 may also communicate with a network and other devices through wireless communication. The wireless communication may use any communication standard or protocol, including but not limited to Global System for Mobile communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Message Service (SMS), and the like.

The memory 502 may be used to store applications and data. Memory 502 stores applications containing executable code. The application programs may constitute various functional modules. The processor 508 executes various functional applications and data processing by executing application programs stored in the memory 502. The memory 502 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required by at least one function (such as a sound playing function, an image playing function, etc.), and the like; the stored data area may store data (such as audio data, a phonebook, etc.) created according to the use of the electronic device 10, and the like. Further, the memory 502 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device. Accordingly, the memory 502 may also include a memory controller to provide the processor 508 and the input unit 503 access to the memory 502.

The input unit 503 may be used to receive input numbers, character information, or user characteristic information (such as a fingerprint), and generate a keyboard, mouse, joystick, optical, or trackball signal input related to user setting and function control. In particular, in one particular embodiment, the input unit 503 may include a touch-sensitive surface as well as other input devices. The touch-sensitive surface, also referred to as a touch display screen or a touch pad, may collect touch operations by a user (e.g., operations by a user on or near the touch-sensitive surface using a finger, a stylus, or any other suitable object or attachment) thereon or nearby, and drive the corresponding connection device according to a predetermined program. Alternatively, the touch sensitive surface may comprise two parts, a touch detection means and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 508, and can receive and execute commands sent by the processor 508.

The display unit 504 may be used to display information input by or provided to the user as well as various graphical user interfaces of the electronic device 10, which may be made up of graphics, text, icons, video, and any combination thereof. The display unit 504 may include a display panel. Alternatively, the Display panel may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like. Further, the touch-sensitive surface may overlay the display panel, and when a touch operation is detected on or near the touch-sensitive surface, the touch operation is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in FIG. 12 the touch sensitive surface and the display panel are two separate components to implement input and output functions, in some embodiments the touch sensitive surface may be integrated with the display panel to implement input and output functions.

The electronic device 10 may also include at least one sensor 505, such as light sensors, motion sensors, and other sensors. Specifically, the light sensor may include an ambient light sensor that adjusts the brightness of the display panel based on the intensity of ambient light, and a proximity sensor that turns off the display panel and/or backlight when the electronic device 10 is moved to the ear. As one of the motion sensors, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally, three axes), can detect the magnitude and direction of gravity when the mobile phone is stationary, and can be used for applications of recognizing the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like; as for other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which may be further configured to the electronic device 10, detailed descriptions thereof are omitted.

The audio circuitry 506 may provide an audio interface between the user and the electronic device 10 through a speaker, microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit the electrical signal to a speaker, and convert the electrical signal into a sound signal to output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, which is then processed by the audio data output processor 508 and then sent to, for example, another electronic device 10 via the rf circuit 501, or output to the memory 502 for further processing. The audio circuitry 506 may also include an earphone jack to provide communication of a peripheral earphone with the electronic device 10.

Wireless fidelity (WiFi) belongs to short-range wireless transmission technology, and the electronic device 10 can help the user send and receive e-mail, browse web pages, access streaming media and the like through the wireless fidelity module 507, and provides wireless broadband internet access for the user. Although fig. 12 shows the wireless fidelity module 507, it is understood that it does not belong to the essential constitution of the electronic device 10, and may be omitted entirely as needed within the scope not changing the essence of the invention.

The processor 508 is a control center of the electronic device 10, connects various parts of the whole electronic device 10 by various interfaces and lines, performs various functions of the electronic device 10 and processes data by running or executing an application program stored in the memory 502 and calling up the data stored in the memory 502, thereby performing overall monitoring of the electronic device 10. Optionally, processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor, which primarily handles operating systems, user interfaces, application programs, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 508.

The electronic device 10 also includes a power supply 509 to power the various components. Preferably, the power supply 509 may be logically connected to the processor 508 through a power management system, so that the power management system may manage charging, discharging, and power consumption. The power supply 509 may also include any component such as one or more dc or ac power sources, recharging systems, power failure detection circuitry, power converters or inverters, power status indicators, and the like.

Although not shown in fig. 12, the electronic device 10 may further include a bluetooth module or the like, which is not described in detail herein. In specific implementation, the above modules may be implemented as independent entities, or may be combined arbitrarily to be implemented as the same or several entities, and specific implementation of the above modules may refer to the foregoing method embodiments, which are not described herein again.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (12)

1. A heat sink, comprising:

a first metal sheet; and

a second metal sheet stacked with the first metal sheet, a gap being formed between the first metal sheet and the second metal sheet; the first metal sheet is provided with a heat collection groove separated from the gap, and the heat collection groove extends to the surface of the first metal sheet, which is back to the second metal sheet.

2. The heat sink of claim 1, wherein the second metal sheet is provided with a through hole communicating with the gap.

3. The heat sink as recited in claim 2, wherein said heat collection slot extends through opposite sides of said first metal sheet, said second metal sheet covering one end of said heat collection slot.

4. The heat sink of claim 3, wherein the heat sink includes a support disposed between the first and second metal sheets, the support separating the first and second metal sheets to form the gap.

5. The heat sink of claim 4, wherein said heat collection slot extends through opposite sides of said support member.

6. The heat sink of any one of claims 1-5, wherein one of the first and second metal sheets forms a protrusion into the gap, the protrusion being connected to the other of the first and second metal sheets.

7. The heat sink of any one of claims 1-5, wherein a surface of at least one of the first metal sheet and the second metal sheet is provided with a heat dissipating ceramic coating.

8. The heat sink as recited in claim 7, wherein said first metal sheet is provided with heat dissipation holes communicating with said gaps.

9. The heat sink of any one of claims 1-5, comprising any one of:

the first metal sheet comprises a first part and a second part which are integrally formed, and the thickness of the first part is larger than that of the second part;

the second metal sheet comprises a third part and a fourth part which are integrally formed, and the thickness of the third part is larger than that of the fourth part.

10. The heat sink of any one of claims 1-5, wherein the first metal sheet is bent to form a first bend, the second metal sheet is bent to form a second bend, the first bend is disposed opposite the second bend, and the gap extends between the first bend and the second bend.

11. An electronic device, comprising a circuit board and the heat sink of any one of claims 1-10, wherein the circuit board is provided with a heat generating device, and the heat collecting slot covers at least a portion of the heat generating device.

12. The electronic device according to claim 11, characterized by comprising any of the following:

the first metal sheet is abutted against the heating device so that the heating device covers the opening of the heat collecting groove;

the first metal sheet abuts against the circuit board, and the heating device is accommodated in the heat collection groove.

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