CN113676573B

CN113676573B - Electronic equipment

Info

Publication number: CN113676573B
Application number: CN202110907979.0A
Authority: CN
Inventors: 高云; 涂海; 徐贵祥; 郭春; 朱永昌
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-08-09
Filing date: 2021-08-09
Publication date: 2023-08-29
Anticipated expiration: 2041-08-09
Also published as: CN113676573A

Abstract

The application relates to an electronic device, which comprises a middle frame, a main board, a battery, a vibration assembly, an interface module and a flexible circuit board, wherein a gap is arranged between the vibration assembly and the middle board of the middle frame; the flexible circuit board comprises a first leveling section, a bending section and a second leveling section which are sequentially connected, wherein the first leveling section is arranged in a gap and is electrically connected with the electric connection end, the first leveling section and the second leveling section are both extended flatly along a first direction and have a height difference in a second direction, the first direction is perpendicular to the second direction, the thickness direction of the electronic equipment is defined in the second direction, the bending section is opposite to the side wall of the battery, and the second leveling section is attached to the surface of the battery. According to the electronic equipment, under the condition that the whole volume of the electronic equipment is unchanged, more space can be provided for the battery, so that the battery capacity is increased, and further the cruising performance of the electronic equipment is improved while the miniaturization of the electronic equipment is maintained.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

With the development of electronic technology, electronic devices such as mobile phones and tablet computers have become an integral part of daily life and work of people. The battery is used as a power supply element of the electronic equipment, and the cruising performance and the user experience of the electronic equipment are directly affected.

However, as the functions of the electronic devices are improved, the number of components is increased, resulting in a smaller space for disposing the battery. The battery capacity is increased, and the whole volume of the electronic equipment is easily increased, which is not beneficial to miniaturization of the electronic equipment.

Disclosure of Invention

The application provides electronic equipment, which aims to solve the technical problem of improving the cruising ability of the electronic equipment while maintaining the miniaturization of the electronic equipment.

The present application provides an electronic device including:

the middle frame comprises a frame and a middle plate, wherein the frame is connected to the periphery of the middle plate, jacks are formed in the frame, and a mounting groove is formed in the middle plate;

the main board is connected with the middle frame;

the battery is arranged in the mounting groove and is electrically connected with the main board;

the vibration assembly is connected with the middle plate, and a gap is arranged between the vibration assembly and the middle plate;

the interface module is provided with a plug-in end and an electric connection end, and the plug-in end is matched with the jack;

the flexible circuit board is used for enabling the interface module to be electrically connected with the main board, the flexible circuit board comprises a first leveling section, a bending section and a second leveling section which are sequentially connected, the first leveling section is arranged in the gap and is electrically connected with the electric connection end, the first leveling section and the second leveling section evenly extend along a first direction, a height difference exists between the first leveling section and the second leveling section in a second direction, the first direction is perpendicular to the second direction, the second direction is defined by the thickness direction of the electronic equipment, the bending section is opposite to the side wall of the battery, and the second leveling section is attached to the surface of the battery.

In one embodiment, the middle plate is provided with a first wire passing groove, the vibration assembly is spaced from the bottom wall of the first wire passing groove to form the gap, and at least part of the first flat section is accommodated in the first wire passing groove.

In one embodiment, a side wall of the mounting groove, which is close to one side of the vibration assembly, is provided with an empty avoiding groove, and the bending section is accommodated in the empty avoiding groove.

In one embodiment, in the first direction, the depth of the void-avoidance groove is equal to the thickness of the bending section.

In one embodiment, the middle plate is provided with a second wire passing groove, the bottom wall of the second wire passing groove is connected with the bottom wall of the first wire passing groove through the bottom wall of the void preventing groove, and the second flat section is accommodated in the second wire passing groove.

In one embodiment, the depth of the first wire passing groove is equal to the thickness of the first flat section, and/or the depth of the second wire passing groove is equal to the thickness of the second flat section.

In one embodiment, the vibration assembly includes a bracket coupled to the midplane and a motor coupled to the bracket.

In one embodiment, the vibration assembly includes a backing layer through which the motor is coupled to the bracket.

In one embodiment, a damping fin is disposed between the bracket and the middle plate, and the first flat section and the damping fin do not overlap each other.

In one embodiment, the number of the damping fins is 2 or more, and the damping fins are respectively located at two sides of the first flat section in the first direction.

The electronic equipment comprises the flexible circuit board, wherein the flexible circuit board comprises the first leveling section, the bending section and the second leveling section which are sequentially connected, the first leveling section is arranged at a gap between the vibration assembly and the middle plate and extends flatly along the first direction, and the jack installation position of the frame corresponding to the interface module is determined by the volume of the interface module, so that the vibration assembly can be arranged close to the interface module along the first leveling section as much as possible in a flatly extending mode of the first leveling section, and accordingly space is vacated in the first direction, and battery capacity is improved as much as possible. In addition, the first leveling section and the second leveling section are both leveled and extend along the first direction, and have the difference in height between each other in the second direction, first direction with the second direction is perpendicular, the thickness direction of electronic equipment defines the second direction, the bending section with the lateral wall of battery is relative, the second leveling section with the surface of battery is laminated mutually, in the thickness direction of electronic equipment like this, can provide sufficient space for the battery for flexible circuit board can reduce the bending as far as possible when satisfying interface module and mainboard electric connection needs, promotes the compactness such as interface module, vibration subassembly and battery of electronic equipment inside, promotes space utilization, thereby under the unchangeable circumstances of electronic equipment whole volume, can have more space to set up the battery, in order to increase battery capacity, has realized in turn that the continuation of the journey performance of electronic equipment is promoted when keeping electronic equipment miniaturized.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of an electronic device according to an embodiment;

FIG. 2 is a schematic diagram of an internal structure of an electronic device according to an embodiment;

FIG. 3 is a partially enlarged schematic illustration of the dashed box portion of the electronic device shown in FIG. 2;

FIG. 4 is a schematic cross-sectional view along section line I-I of FIG. 3;

FIG. 5 is a partially exploded schematic view of an electronic device;

FIG. 6 is a schematic diagram illustrating connection between a flexible circuit board and an interface module in an electronic device according to an embodiment;

fig. 7 is a schematic side view of the connection state of the flexible circuit board and the interface module of the electronic device shown in fig. 6;

fig. 8 is an assembled state schematic view of a partial structure of the electronic device shown in fig. 5;

FIG. 9 is an exploded view of a vibration assembly of an electronic device according to an embodiment;

fig. 10 is a schematic structural view of a bracket of a vibration assembly of an electronic device according to an embodiment;

FIG. 11 is a schematic layer structure of a damping fin on a bracket of a vibration module of an electronic device according to an embodiment;

fig. 12 is a schematic structural diagram of an electronic device according to an embodiment.

Detailed Description

In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

As used herein, "electronic device" refers to a device capable of receiving and/or transmitting communication signals that includes, but is not limited to, a device connected via any one or several of the following connections:

(1) Via a wireline connection, such as via a public-switched telephone network (Public Switched Telephone Networks, PSTN), a digital subscriber line (Digital Subscriber Line, DSL), a digital cable, a direct cable connection;

(2) Via a wireless interface, such as a cellular network, a wireless local area network (Wireless Local Area Network, WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter.

An electronic device arranged to communicate over a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1) Satellite phones or cellular phones;

(2) A personal communications system (Personal Communications System, PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities;

(3) A radiotelephone, pager, internet/intranet access, web browser, notepad, calendar, personal digital assistant (Personal Digital Assistant, PDA) equipped with a global positioning system (Global Positioning System, GPS) receiver;

(4) Conventional laptop and/or palmtop receivers;

(5) Conventional laptop and/or palmtop radiotelephone transceivers, and the like.

Referring to fig. 1, in an electronic device 100 provided by the embodiment of the application, the electronic device 100 may be a mobile phone or a bracelet, or may be a tablet computer, which is not limited herein.

As shown in conjunction with fig. 2 and 3, the electronic device 100 includes a center 110, a main board (not shown), a battery 120, a vibration assembly 130, an interface module 140, and a flexible circuit board 150 (Flexible Printed Circuit, FPC).

The middle frame 110 includes a frame 111 and a middle plate 112, the frame 111 is connected to a peripheral side of the middle plate 112, and the frame 111 is provided with a jack 110a. The jack 110a serves as a charging port or data port that can meet the mating requirements of a data line or charging line with a USB type c connector, a Micro USB connector, or a Lightning connector.

Specifically, as shown in fig. 2 to 4, the interface module 140 has a plugging end 141 and an electrical connection end 142, the plugging end 141 is matched with the jack 110a, the electrical connection end 142 is electrically connected with the motherboard through the flexible circuit board 150, so that when the connector of the data line or the charging line is plugged into the jack 110a of the frame 111 to be electrically connected with the plugging end 141, the data line or the charging line can be used to adapt to the data transmission or the charging requirement of the electronic device 100.

The middle plate 112 is formed with a mounting groove 110b, the battery 120 is disposed in the mounting groove 110b, and the battery 120 is electrically connected to the main board. The battery 120 provided in the mounting groove 110b supplies power to various components of the electronic device 100 such as a main board, a display 160 (see fig. 1), a camera, a speaker, and a microphone. In some embodiments, the main board is connected to the middle frame 110, specifically, the main board may be connected to the middle board 112 or connected to the frame 111, and further, the main board may be directly connected to the middle frame 110 or indirectly connected to the middle frame through other elements, which is not limited herein.

Vibration assembly 130 is coupled to midplane 112 with a gap provided between vibration assembly 130 and midplane 112 with which the placement requirements of flexible circuit board 150 may be accommodated.

Specifically, as shown in fig. 5 to 7, the flexible circuit board 150 includes a first flat section 151, a bending section 152 and a second flat section 153 sequentially connected, the first flat section 151 is disposed in the gap and electrically connected to the electrical connection terminal 142, the first flat section 151 and the second flat section 153 both extend flatly along a first direction (i.e. an arrow X direction shown in fig. 5) and have a height difference therebetween in a second direction (i.e. an arrow Y direction shown in fig. 5), the first direction is perpendicular to the second direction, a thickness direction of the electronic device 100 defines the second direction, the bending section 152 is opposite to a sidewall of the battery 120, and the second flat section 153 is attached to a surface of the battery 120.

In the above electronic device 100, since the mounting position of the interface module 140 corresponding to the jack 110a of the frame 111 is determined by the volume of the interface module 140, the vibration assembly 130 may be disposed along the first flat section 151 as close to the interface module 140 as possible in the flat extension manner of the first flat section 151, so as to make room in the first direction, so as to increase the capacity of the battery 120 as much as possible. In addition, the first leveling segment 151 and the second leveling segment 153 extend flatly along the first direction, and have a height difference in the second direction, the first direction is perpendicular to the second direction, the thickness direction of the electronic device 100 defines the second direction, the bending segment 152 is opposite to the side wall of the battery 120, and the second leveling segment 153 is attached to the surface of the battery 120, so that in the thickness direction of the electronic device 100, enough space can be provided for the battery 120, so that the flexible circuit board 150 can reduce bending as much as possible while meeting the electrical connection requirement of the interface module 140 and the main board, the compactness of structures such as the interface module 140, the vibration assembly 130 and the battery 120 inside the electronic device 100 is improved, and the space utilization is improved, so that under the condition that the whole volume of the electronic device 100 is unchanged, more space can be provided for the battery 120 to increase the capacity of the battery 120, and further, the endurance performance of the electronic device 100 is improved while maintaining the miniaturization of the electronic device 100 is realized.

Referring to fig. 4, the frame 111 includes a plastic frame 1111 and a metal frame 1112, the metal frame 1112 is sleeved on the outer side of the plastic frame 1111, and the plastic frame 1111 and the middle plate 112 are integrally formed by injection molding, wherein the middle plate 112 is made of metal or plastic. In this embodiment, the metal frame 1112 is used as an appearance member of the frame 111, and can provide a metal appearance texture to enhance the overall texture of the electronic device 100. Meanwhile, a good buffering effect can be achieved by using the plastic frame 1111 to improve the anti-falling performance of the electronic device 100. In addition, the plastic frame 1111 and the middle plate 112 are integrally formed by injection molding, so that the process is simple, the cost is low, and the overall structure of the middle frame 110 is stable, so that the battery 120, the main board and other structural members in the electronic device 100 can be stably supported.

As shown in fig. 5 and 8, the middle plate 112 is provided with a first wire passing groove 111a, the vibration assembly 130 is spaced from the bottom wall of the first wire passing groove 111a to form a gap, and at least a part of the structure of the first flat section 151 is accommodated in the first wire passing groove 111a, so that the stacked thickness of the middle plate 112 and the first flat section 151 in the thickness direction of the electronic device 100 is reduced, so as to facilitate the thinning of the electronic device 100.

The side wall of the installation groove 110b, which is close to the vibration component 130, is provided with a clearance groove 111b, and the bending section 152 is accommodated in the clearance groove 111b, so that the bending section 152 can be prevented from scratching the battery 120 in the installation groove 110b to damage the battery core of the battery 120, and the use safety of the battery 120 is effectively ensured.

Further, in the first direction, the depth of the void groove 111b is equal to the thickness of the bending section 152, so that the bending section 152 is compactly disposed between the middle plate 112 and the battery 120 without scratching the battery 120.

With continued reference to fig. 5 and 8, the middle plate 112 is provided with a second wire passing groove 111c, the bottom wall of the second wire passing groove 111c is connected with the bottom wall of the first wire passing groove 111a through the bottom wall of the hollow avoiding groove 111b, and the second flat section 153 is accommodated in the second wire passing groove 111c, so as to facilitate the overall light and thin electronic device 100.

In some embodiments, the depth of the first via groove 111a is equal to the thickness of the first leveling segment 151, so as to improve the compactness of the first leveling segment 151 in the electronic device 100, reduce the space waste, and facilitate the light and thin of the electronic device 100.

The depth of the second wire passing groove 111c is equal to the thickness of the second flat section 153, so as to improve the compactness of the second flat section 153 in the electronic device 100, reduce the space waste, and facilitate the light and thin of the electronic device 100.

As shown in fig. 5, 8 and 9, the vibration assembly 130 includes a bracket 131 and a motor 132, the bracket 131 is connected to the middle plate 112, and the motor 132 is connected to the bracket 131. The motor 132 is connected with the middle plate 112 by the bracket 131 so as to form a space for arranging the first leveling section 151 between the bracket 131 and the middle plate 112, and meanwhile, the bracket 131 can ensure the installation stability of the motor 132, so that when the electronic equipment 100 carries out vibration prompt, the vibration of the motor 132 in the working state can be transmitted to the middle frame 110 by the bracket 131, and a user can obtain vibration feeling.

Further, the vibration assembly 130 includes a backing layer 133, and the motor 132 is connected to the bracket 131 through the backing layer 133. This connection is simple and easy to maintain for the motor 132. For example, when the motor 132 is abnormal and requires maintenance or replacement, the motor 132 may be separated from the bracket 131.

It should be noted that, as further shown in fig. 5, 8 and 9, the middle plate 112 is provided with a mounting hole 110c, the bracket 131 is provided with a through hole 130a corresponding to the mounting hole 110c, and a screw 130b passing through the through hole 130a is connected with the mounting hole 110c to connect the bracket 131 with the middle plate 112.

In some embodiments, the bracket 131 is made of stainless steel or 7-series aluminum alloy, so that the bracket 131 has enough structural strength, so that the motor 132 can directly drive the middle plate 112 to vibrate through the bracket 131, but the bracket 131 cannot vibrate relative to the middle plate 112, and then the bracket 131 is forced to vibrate to generate noise when the motor 132 transmits vibration to the middle frame 110 through the bracket 131.

A damper 1321 is provided between the bracket 131 and the middle plate 112, and the first flat section 151 and the damper 1321 do not overlap each other, so that vibration of the bracket 131 relative to the middle plate 112 is suppressed by the damper 1321.

Further, the number of the damping fins 1321 is 2 or more, and the damping fins are respectively located at two sides of the first leveling section 151 in the first direction, so that when the motor 132 vibrates, the vibration energy transferred from two sides of the bracket 131 to the middle plate 112 is relatively consistent, the vibration effect is improved, and vibration compression is not generated on the first leveling section 151, so as to maintain the electrical performance of the flexible circuit board 150.

The damping sheet 1321 includes at least one of a PET (Polyethylene terephthalate ) tape and a silicone sheet. Such a damping sheet 1321 has a good buffering effect in order to suppress the bracket 131 from vibrating with respect to the middle plate 112 by the motor 132.

As shown in fig. 11, one side of the damping sheet 1321 may be adhered with an adhesive layer 1322 to be connected between the bracket 131 and the middle plate 112 by the adhesive layer 1322, this assembly is simple, and pre-fixing of the bracket 131 and the middle plate 112 may be achieved to connect the bracket 131 and the middle plate 112 using the screw 130 b.

Referring to fig. 12, fig. 12 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application. The electronic device 100 may include Radio Frequency (RF) circuitry 501, memory 502 including one or more computer readable storage media, an input unit 503, a display unit 504, a sensor 505, audio circuitry 506, a wireless fidelity (WiFi, wireless Fidelity) module 507, a processor 508 including one or more processing cores, and a power supply 509, as those skilled in the art will appreciate that the configuration of the electronic device 100 shown in fig. 12 does not constitute a limitation of the electronic device 100, and may include more or fewer components than shown, or a combination of certain components, or a different arrangement of components.

The radio frequency circuit 501 may be used to send and receive information, or receive and send signals during a call, specifically, after receiving downlink information of a base station, the downlink information is processed by one or more processors 508; in addition, data relating to uplink is transmitted to the base station. Typically, the radio frequency circuitry 501 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM, subscriber Identity Module) card, a transceiver, a coupler, a low noise amplifier (LNA, low Noise Amplifier), a duplexer, and the like. In addition, the radio frequency circuit 501 may also communicate with networks and other devices via wireless communications. The wireless communication may use any communication standard or protocol including, but not limited to, global system for mobile communications (GSM, global System of Mobile communication), general packet radio service (GPRS, general Packet Radio Service), code division multiple access (CDMA, code Division Multiple Access), wideband code division multiple access (WCDMA, wideband Code Division Multiple Access), long term evolution (LTE, long Term Evolution), email, short message service (SMS, short Messaging Service), and the like.

Memory 502 may be used to store applications and data. The memory 502 stores application programs including executable code. Applications may constitute various functional modules. The processor 508 executes various functional applications and data processing by running application programs stored in the memory 502. The memory 502 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program (such as a sound playing function, an image playing function, etc.) required for at least one function, and the like; the storage data area may store data (such as audio data, phonebooks, etc.) created according to the use of the electronic device 100, and the like. In addition, memory 502 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, the memory 502 may also include a memory controller to provide access to the memory 502 by the processor 508 and the input unit 503.

The input unit 503 may be used to receive input numbers, character information or user characteristic information such as fingerprints, and to generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function control. In particular, in one particular embodiment, the input unit 503 may include a touch-sensitive surface, as well as other input devices. The touch-sensitive surface, also referred to as a touch display screen or a touch pad, may collect touch operations thereon or thereabout by a user (e.g., operations thereon or thereabout by a user using any suitable object or accessory such as a finger, stylus, etc.), and actuate the corresponding connection means according to a predetermined program. Alternatively, the touch-sensitive surface may comprise two parts, a touch detection device and a touch controller. The touch detection device detects the touch azimuth of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device and converts it into touch point coordinates, which are then sent to the processor 508, and can receive commands from the processor 508 and execute them.

Further, the touch-sensitive surface may cover the liquid crystal panel, and when the touch-sensitive surface detects a touch operation thereon or thereabout, the touch-sensitive surface is transferred to the processor 508 to determine the type of touch event, and the processor 508 then provides a corresponding visual output on the liquid crystal panel based on the type of touch event.

The display unit 504 may be used to display information entered by a user or provided to a user as well as various graphical user interfaces of the electronic device 100, which may be composed of graphics, text, icons, video, and any combination thereof. The display unit 504 may include the liquid crystal panel described above.

Although in fig. 12 the touch sensitive surface and the liquid crystal panel are implemented as two separate components for input and output functions, in some embodiments the touch sensitive surface may be integrated with the liquid crystal panel to implement the input and output functions. It is understood that the display screen 160 may include an input unit 503 and a display unit 504.

The electronic device 100 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor that may adjust the brightness of the liquid crystal panel according to the brightness of ambient light, and a proximity sensor that may turn off the liquid crystal panel and/or the backlight when the electronic device 100 moves to the ear. As one of the motion sensors, the gravity acceleration sensor can detect the acceleration in all directions (generally three axes), and can detect the gravity and the direction when the mobile phone is stationary, and can be used for applications of recognizing the gesture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer gesture calibration), vibration recognition related functions (such as pedometer and knocking), and the like; other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc. that may also be configured with the electronic device 100 are not described in detail herein.

Audio circuitry 506 may provide an audio interface between the user and electronic device 100 through speakers, microphones, and so forth. The audio circuit 506 may convert the received audio data into an electrical signal, transmit to a speaker, and convert the electrical signal into a sound signal for output by the speaker; on the other hand, the microphone converts the collected sound signals into electrical signals, which are received by the audio circuit 506 and converted into audio data, which are processed by the audio data output processor 508 for transmission to, for example, another electronic device 100 via the radio frequency circuit 501, or which are output to the memory 502 for further processing. The audio circuit 506 may also include a headset base to provide communication of the peripheral headset with the electronic device 100.

Wireless fidelity (WiFi) belongs to a short-range wireless transmission technology, and the electronic device 100 can help a user to send and receive e-mail, browse web pages, access streaming media and the like through the wireless fidelity module 507, so that wireless broadband internet access is provided for the user. Although fig. 12 shows the wireless fidelity module 507, it is understood that it is not a necessary component of the electronic device 100 and may be omitted entirely as desired within the scope of not changing the essence of the application.

The processor 508 is a control center of the electronic device 100, connects various parts of the entire electronic device 100 using various interfaces and lines, and performs various functions of the electronic device 100 and processes data by running or executing application programs stored in the memory 502 and calling data stored in the memory 502, thereby performing overall monitoring of the electronic device 100. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor that primarily handles operating systems, user interfaces, applications, etc., with a modem processor that primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 508.

The electronic device 100 also includes a power supply 509 that provides power to the various components. Preferably, the power supply 509 may be logically connected to the processor 508 through a power management system, so as to perform functions of managing charging, discharging, and power consumption management through the power management system. The power supply 509 may also include one or more of any of a direct current or alternating current power supply, a recharging system, a power failure detection circuit, a power converter or inverter, a power status indicator, and the like.

Although not shown in fig. 12, the electronic device 100 may further include a bluetooth module or the like, which is not described herein. In the implementation, each module may be implemented as an independent entity, or may be combined arbitrarily, and implemented as the same entity or several entities, and the implementation of each module may be referred to the foregoing method embodiment, which is not described herein again.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims

1. An electronic device, comprising:

the main board is connected with the middle frame;

2. The electronic device of claim 1, wherein the middle plate defines a first wire-passing slot, the vibration assembly is spaced from a bottom wall of the first wire-passing slot to form the gap, and at least a portion of the first flat section is received in the first wire-passing slot.

3. The electronic device according to claim 2, wherein a side wall of the mounting groove near the vibration component is provided with a clearance groove, and the bending section is accommodated in the clearance groove.

4. The electronic device of claim 3, wherein the void-avoidance groove has a depth equal to a thickness of the bend section in the first direction.

5. The electronic device of claim 3 or 4, wherein the middle plate is provided with a second wire passing groove, a bottom wall of the second wire passing groove is connected with a bottom wall of the first wire passing groove through a bottom wall of the void space, and the second flat section is accommodated in the second wire passing groove.

6. The electronic device of claim 5, wherein a depth of the first wire-passing groove is equal to a thickness of the first flat section and/or a depth of the second wire-passing groove is equal to a thickness of the second flat section.

7. The electronic device of claim 1, wherein the vibration assembly comprises a bracket coupled to the midplane and a motor coupled to the bracket.

8. The electronic device of claim 7, wherein the vibration assembly comprises a backing layer, the motor being coupled to the bracket through the backing layer.

9. The electronic device of claim 7, wherein a damper is disposed between the bracket and the middle plate, the first flattened section and the damper not overlapping each other.

10. The electronic device of claim 9, wherein the number of damping fins is 2 or more and is located on both sides of the first flat section in the first direction, respectively.