CN110582180A - Electronic device casing with micro-heat pipe function - Google Patents
Electronic device casing with micro-heat pipe function Download PDFInfo
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- CN110582180A CN110582180A CN201810587291.7A CN201810587291A CN110582180A CN 110582180 A CN110582180 A CN 110582180A CN 201810587291 A CN201810587291 A CN 201810587291A CN 110582180 A CN110582180 A CN 110582180A
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- Prior art keywords
- electronic device
- heat
- micro
- cavity structure
- heat pipe
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Abstract
The invention provides an electronic device shell with a micro-heat pipe function, which is used for covering an electronic device system and a heating element contained in the electronic device system. It includes an outer surface, an inner surface and a cavity structure. The inner surface is used for contacting a heating element of the electronic device system. The outer surface contacts air to radiate heat generated by the electronic system into the air. The inner surface has a first surface and a second surface. The second surface has a heat source contact area. The cavity structure is formed in the housing between the second surface and its corresponding outer surface. An inner wall of the cavity structure forms a capillary structure. And injecting working fluid into the cavity structure, and vacuumizing to form a micro-heat guide pipe structure in the electronic device shell. The invention integrates the functions of a common shell and a micro-heat pipe element to form the shell with the function of the micro-heat pipe, greatly increases the design flexibility of the heat dissipation of the electronic device system, and obviously improves the efficiency of the heat dissipation of the hot spot of the ultrathin electronic device.
Description
Technical Field
The present invention relates to a casing, and more particularly, to a casing of an electronic device, which integrates the structure and function of a heat pipe to increase the heat conduction and dissipation efficiency in a limited space of a heat dissipation system.
Background
the development trend of electronic products is continuously towards thinning and refinement, and people have higher and higher requirements on the operation speed. A Micro Processor (Micro Processor) is a core element of electronic and communication products, and is a main heating element of an electronic device, which is easily heated at a high speed. Without a good thermal management scheme and a heat dissipation system, the proper functions cannot be performed, and even the lifetime and reliability of the whole electronic device system are affected. Therefore, electronic products also need to have better heat dissipation capability. At present, an effective way for Heat dissipation and Heat release of Hot spots (Hot spots) in electronic and communication products is to contact one surface of a Micro Heat Pipe (Micro Heat Pipe) or a Vapor Chamber (Vapor Chamber) with a Heat source and the other surface with a casing of the electronic device, so as to effectively conduct the high Heat generated by a microprocessor to the casing and radiate the high Heat to the air.
The micro-heat pipe or the temperature equalizing plate is basically a closed cavity containing working fluid, and the surface of the cavity presents the characteristic of quick temperature equalization to achieve the purpose of heat transfer through the liquid-gas two-phase change of the continuous circulation of the working fluid in the cavity and the gas-liquid back-flow of gas and liquid between the heat absorption end and the heat release end. Generally, the micro heat pipe is in a long cylindrical shape, and the larger the inner cavity space is, the faster the convection speed is, and the better the heat conduction and the heat dissipation are. However, in order to meet the requirement of thinning electronic products, the current technology needs to process the heat pipe into a flat and long shape to be disposed in a space with a narrow height in the casing, and even needs to use an ultra-thin micro heat pipe with a thickness less than 0.5 mm.
At present, smart phones with a thickness of only 5mm are already on the market. The thickness of the back cover of the mobile phone is only 1.0mm, and the space of about 0.4mm left on the surface of the microprocessor on the circuit board and the inner surface shell of the back cover of the mobile phone can be plugged into the flat micro-heating conduit. If the ultra-thin micro-heating conduit is manufactured by flattening a copper pipe with the pipe diameter of 2mm, the height of the inner cavity of the flat micro-heating conduit can be only about 0.24mm by deducting the thicknesses of the upper wall and the lower wall. The heat pipe cavity width is then relatively compressed by about 3 mm. The cross-sectional area of the heat pipe cavity is only about 0.72mm2. Such a small convection space results in poor heat dissipation.
For the fast-leap-forward chip processing speed, the cross-sectional area of the conventional heat pipe obviously cannot meet the heat-clearing and heat-dissipating requirements of the whole electronic and communication device. Therefore, how to conduct and dissipate heat quickly in the limited thickness and space of the electronic product is a problem to be solved.
Disclosure of Invention
In view of the above, the present invention provides a fast heat-clearing and heat-dissipating casing integrating and combining a back cover of an electronic product and a heat pipe, which greatly improves heat-clearing and heat-dissipating efficiency of a system hotspot of an electronic device in a limited thickness and space. In addition, the invention simplifies the heat dissipation management design of the electronic device system and the supply chain of the industry.
The invention relates to an electronic device casing with a micro-heat pipe function, which is used for covering an electronic device system and radiating M heating elements contained in the electronic device system. It includes an outer surface, an inner surface and N cavity structures. The outer surface is configured to contact air to radiate heat. The inner surface is used for covering the electronic device system and contacting M heating elements of the electronic device system. The inner surface has a first surface and N second surfaces. The N second surfaces have M heat source contact areas and at least N vacuum seals. Each heat source contact area is used for contacting with the corresponding heating element. In the N cavity structures, each cavity structure is formed between the second surface and the corresponding outer surface area, and one inner wall of each cavity structure forms a capillary structure. And injecting working fluid into the N cavity structures, and vacuumizing to form N micro-heat pipe structures in the electronic device shell. Wherein, N and M are 1 or natural numbers larger than 1.
The electronic device shell with the function of the micro heat pipe is a back cover of the electronic device with the flat display screen. Further, the back cover is a back cover of a smart phone, a notebook computer, a portable computer, a tablet computer, a music player, a media player, a navigator, a game console or a display, etc.
In addition, the volume, shape, layout, capillary structure, working fluid injection amount and vacuum degree of the N cavity structures can be flexibly designed according to the overall design of the electronic device system and the heat clearing and dissipating requirements of the M heating elements.
The N micro heat pipe structures can be further temperature equalizing plates or loop heat pipes, and the total area of the N second surfaces is smaller than that of the outer surface of the electronic device casing.
The N vacuum seals project or extend from the N second surfaces of the inner surface away from the outer surface.
Wherein, the outer surface is a smooth surface or a surface with a fin structure.
in one embodiment, the shell of the first surface, which is continuous from the outer surface to the inner surface, and the shells of the N second surfaces may be made of the same metal or metal alloy material, or may be made of different metals or metal alloy materials.
In another embodiment, the shell of the first surface whose outer surface continues to the inner surface and the shells of the N second surfaces may be made of the same glass material, ceramic material or fiber composite material, or may be made of different glass materials, ceramic materials or fiber composite materials.
In another embodiment, the shell with the outer surface continuing to the first surface of the inner surface and the shells with the N second surfaces are integrally formed, or are tightly connected by welding or fusing.
In one embodiment, the first surface further has a hole through the outer surface and the inner surface. The space of the hole is a vent hole of the electronic device shell for accommodating an electronic element or an optoelectronic element, and the hole is filled with glass or other non-metallic materials.
In one embodiment, the thickness between the first surface and the second surface is less than or equal to 1.5mm, the height of the cavity structure is greater than or equal to 0.3mm, and the sectional area of the cavity structure is greater than or equal to 1.0mm2And the volume of the cavity structure is more than or equal to 100mm3。
In summary, in the conventional heat-clearing and heat-dissipating technology for high-integration density and ultra-thin electronic devices, the formed round heat pipe is flattened and is closely arranged between the long surface of the electronic device housing and the heat-generating element in combination with the copper heat sink having a large area. The present invention directly designs and manufactures the structure and function of flat micro-thermal conduits in an electronic device enclosure, taking into account the placement and hot spot areas of the heating elements in the electronic device system when designing and manufacturing the electronic device enclosure. Therefore, a larger convection cavity with the heat pipe structure can be obtained in the same limited space as the prior art, the thermal contact resistance of the whole heat dissipation system is reduced layer by layer, and the heat clearing and heat dissipation efficiency of the whole electronic device system is greatly improved.
Drawings
FIG. 1A shows a schematic diagram of an electronic device system.
Fig. 1B shows a schematic view of the inner surface of a housing of a prior art electronic device corresponding to fig. 1A.
Fig. 1C is a schematic diagram of an inner surface of a housing of an electronic device according to an embodiment of the invention corresponding to fig. 1A.
FIG. 2A is a cross-sectional view of the conventional electronic device housing and a portion of the electronic device system taken along section A1-A2 of FIG. 6A.
FIG. 2B is a cross-sectional view of an electronic device housing and a portion of an electronic device system according to an embodiment of the invention along section C1-C2 of FIG. 6B.
FIG. 3A is a cross-sectional view of a conventional electronic device housing and a portion of the electronic device system taken along section B1-B2 of FIG. 6A.
FIG. 3B is a cross-sectional view of the electronic device housing and a portion of the electronic device system according to one embodiment of the invention along section D1-D2 of FIG. 6B.
Fig. 4A, 4B and 4C are schematic diagrams illustrating an electronic device housing according to an embodiment of the invention.
Fig. 5A, 5B, 5C and 5D are schematic diagrams illustrating a chassis of an electronic device according to an embodiment of the invention.
Fig. 6A is a schematic diagram of a chassis of an electronic device known in the prior art.
FIG. 6B is a schematic diagram of an electronic device housing according to an embodiment of the invention.
The reference numbers are as follows:
1: electronic device casing
31: outer surface
2: electronic device system
32: inner surface
3: casing of well-known electronic device
121: first surface
11: outer surface
122: second surface
11 (a): smooth outer surface
150: capillary structure
11 (b): outer surface of fin
151: support column
12: inner surface
154: welding point
15: cavity structure
322: thin type micro-heating conduit
20: heating element
1210: hole(s)
21: copper sheet
1220: heat source contact area
28: battery with a battery cell
1221: vacuum seal
29: circuit board
Detailed Description
In order that the advantages, spirit and features of the invention will be readily understood and appreciated, reference will now be made in detail to the embodiments and accompanying drawings. It is to be understood that these embodiments are merely representative examples of the present invention, and that no limitations are intended to the scope of the invention or its corresponding embodiments, particularly in terms of the specific methods, devices, conditions, materials, and so forth.
In the description of the present invention, it is to be understood that the terms "longitudinal, transverse, upper, lower, front, rear, left, right, top, bottom, inner, outer" and the like refer to orientations or positional relationships based on those shown in the drawings, which are merely for convenience of description and simplicity of description, and do not indicate that the described devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In addition, the indefinite articles "a", "an" and "an" preceding an apparatus or element of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the apparatus or element. Thus, "a" or "an" should be read to include one or at least one, and the singular form of a device or element also includes the plural form unless the number clearly indicates the singular form.
Please refer to fig. 1A, fig. 1B, fig. 1C, fig. 2A, fig. 2B, fig. 3A, fig. 3B, fig. 6A and fig. 6B. Fig. 1A shows a schematic diagram of an electronic device system 2. Fig. 1B shows a schematic view of the inner surface 32 of the housing 3 of the electronic device corresponding to the prior art of fig. 1A. Fig. 1C shows a schematic view of the inner surface 12 of the electronic device housing 1 according to the embodiment of the invention shown in fig. 1A. FIG. 2A shows a cross-sectional view of the conventional electronic device housing 3 and a portion of the electronic device system 2 taken along section A1-A2 of FIG. 6A. FIG. 2B is a cross-sectional view of the electronic device housing 1 and a portion of the electronic device system 2 according to an embodiment of the invention along section C1-C2 of FIG. 6B. FIG. 3A is a cross-sectional view of the conventional electronic device housing 3 and a portion of the electronic device system 2 taken along section B1-B2 of FIG. 6A. FIG. 3B is a cross-sectional view of the electronic device housing 1 and a portion of the electronic device system 2 according to an embodiment of the invention along section D1-D2 of FIG. 6B. Fig. 6A shows a schematic view of a known electronic device housing 3 in the prior art. Fig. 6B is a schematic diagram of the electronic device housing 1 according to an embodiment of the invention. The invention relates to an electronic device casing 1 with a micro heat pipe function, which is used for covering an electronic device system 2 and radiating M heating elements 20 contained in the electronic device system 2. It includes an outer surface 11, an inner surface 12 and N cavity structures 15. The outer surface 11 is intended to contact air to radiate heat. The inner surface 12 is used to cover the electronic device system 2 and M heating elements contacting the electronic device. The inner surface 12 has a first surface 121 and N second surfaces 122. The N second surfaces 122 have M heat source contact areas 1220 and at least N vacuum seals 1221. Each heat source contact region 1220 is used for contacting with the corresponding heat generating element 20. Each cavity structure 15 is formed between the second surface 122 and the corresponding region of the outer surface 11, and an inner wall of each cavity structure 15 forms a capillary structure 150. After the working fluid is injected into the N cavity structures 15 and vacuum is pumped, N micro thermal pipe (HeatPipe) structures are formed in the shell of the electronic device 1. Wherein, N and M are 1 or natural numbers larger than 1.
In the prior art, the electronic device housing 3 has an upper surface 31 and a lower surface 32. The heat conducting element of the conventional electronic device housing 3 is usually a micro heat pipe with a diameter of 2mm, 3mm, 4mm … 12mm, etc., and the micro heat pipe is bent or flattened to form a thin micro heat pipe 322, and then is attached to the lower surface 32 of the conventional electronic device housing 3. Since the thin micro heat pipe 322 is formed by flattening a cylindrical heat pipe, the thickness of the heat pipe is limited by the thickness of the heat pipe wall and the extensibility of the material, and thus the height and width of the thin micro heat pipe 322 are limited by the ratio. As shown in fig. 1B, 2A and 3A, the thin micro heat pipe 322 has a certain limitation in width and height. In the currently preferred manufacturing process for manufacturing the thin micro heat pipe 322 by flattening the micro heat pipe with a diameter of 2mm and a length of 100mm, the thickness of the ultra-thin micro heat pipe 322 is about 0.4mm, the height of the inner cavity is about 0.20mm, and the width is about 2.0mm, as described in the prior art in the specification.
however, the present invention utilizes the way of integral forming or welding, etc. to further process and form the cavity structure 15 with fast heat exchange capability while manufacturing the casing 1 of the electronic device, and the structure and effect thereof are similar to those of a heat pipe. The height and width of the cavity structure 15 can be designed reasonably and arbitrarily. For example, in the case that the thickness between the outer surface 11 of the electronic device casing 1 and the second surface 122 of the heat source contact area is limited to 1.4mm, in one embodiment, the height of the cavity structure 15 is 0.4mm, and the width thereof is 8.0 mm. In another embodiment, the cavity structure 15 has a height of 0.5mm and a width of 10.0 mm. The larger the sectional area of the inner cavity of the micro-heating conduit is, the better the steam convection efficiency is, and the heat exchange capacity is relatively better. Therefore, the cavity structure 15 with heat exchange capability of the present invention can be easily designed to have a heat exchange efficiency much higher than that of the heat pipe in the prior art, with the same limitation of the distance from the outer surface of the housing to the heat generating element.
In one embodiment, the inner surface 12 of the electronic device housing 1 of the present invention can be embossed by forming the cavity structure 15 to form the second surface 122; in contrast, the first surface 121 is not embossed where the cavity structure 15 is not formed on the inner surface 12. In another embodiment, the first surface 121 and the second surface 122 have no undulation difference.
In one embodiment, the total area of the N second surfaces 122 is smaller than the total area of the outer surface 11 of the electronic device housing 1. This also means that the electronic device enclosure 1 with micro heat pipe function of the present invention is provided in which the micro heat pipe structure is only a part of the whole electronic device enclosure 1.
In one embodiment, the cavity structure 15 of the electronic device housing 1 of the present invention has supporting pillars 151 between the two ends thereof, which are respectively facing the outer surface 11, i.e. the inner surface 12, so as to enhance the housing strength of the electronic device housing 1. The support posts 151 may be single point supports or elongated wall supports. In another embodiment, there may be no support posts between the cavity structures 15.
In one embodiment, the inner wall of the cavity Structure 15 of the electronic device housing 1 of the present invention is a metal or non-metal capillary Structure (Wick Structure) with high thermal conductivity, such as copper or copper alloy.
In the prior art, manufacturers of heat pipes require the manufacturers of heat pipes to process, flatten, and bend the long-strip-shaped heat pipes into thin micro heat pipes 322 according to the specifications of the manufacturers of electronic devices. The electronic device manufacturer further attaches a copper heat sink 21 with a large area and a proper thickness to the thin micro heat pipe 322 to attach the heat generating component 20.
In the invention, the casing can be manufactured and the structure with the flat micro heat pipe can be manufactured at the same time according to the design requirement of the electronic device manufacturer, the heat source contact area with larger second surface area is directly attached to the heating element 20, a copper radiating fin can be omitted, and the thermal resistance can be reduced.
The electronic device casing 1 with the function of micro heat pipe is a casing of an electronic device, and can be a back cover. Further, the back cover is a back cover of a smart phone, a notebook computer, a portable computer, a tablet computer, a music player, a media player, a navigator, a game console or a display, etc. That is, the electronic device casing 1 of the present invention can be used in various electronic devices to achieve integration of the whole system of the electronic device in Thermal management (Thermal management) design, and achieve efficient heat removal and dissipation effects.
In the prior art, the thermal conductive element of the casing 3 of the conventional electronic device is a round-tube elongated micro thermal conductive tube, which is flattened and then attached to the formed casing, so that the height and width thereof are limited. However, the height and width of the cavity structure of the flat heat pipe structure of the electronic device housing with the function of micro heat pipe can be designed flexibly, so the invention is particularly suitable for the electronic device with a flat display screen to meet the requirements of the electronic device with the screen for large screen and small thickness. The electronic device casing 1 of the present invention may be a back cover of a smart phone, a notebook computer, a tablet computer, etc. relative to a flat panel display, or may be a casing of a non-screen area in an electronic device, such as a keyboard area lower casing of a notebook computer.
Please refer to fig. 1, fig. 4A to fig. 4C. Fig. 4A, 4B and 4C are schematic diagrams illustrating an electronic device housing according to an embodiment of the invention. In one embodiment, N vacuum seals 1221 protrude or extend from N second surfaces 122 of inner surface 12 away from outer surface 11, as shown in fig. 4A. The process of the invention is that after the cavity structure 15 and the capillary structure 150 on the electronic device casing 1 are formed, the cavity structure 15 is injected with working fluid and vacuumized to form a micro-heat pipe structure. Generally, a vacuum port is required to communicate between the inside and the outside of the cavity structure 15 during vacuum pumping. When the external vacuum pumping device pumps out the internal air, the vacuum port needs to be closed in a very short time to maintain the negative pressure of the cavity structure 15. In one embodiment, the vacuum port protrudes from the second surface 122, and when the internal air is evacuated, the vacuum port is instantly sealed to form the vacuum seal 1221. Thereafter, the protruding vacuum seals 1221 may be cut, ground, or retained as appropriate. In one embodiment, the protruding portion of the vacuum seal 1221 that abuts or contacts the electronic device system may also be a support point or latch of the electronic device housing 1.
In one embodiment, the outer surface 11 is a smooth surface or a surface formed with a fin structure. In some electronic devices requiring better aesthetics, such as smart phones or tablet computers, a smooth outer surface 11 may be designed, as shown in fig. 4A as a smooth outer surface 11 (a). In some electronic devices requiring more heat dissipation and less attention to appearance, the outer surface 11 with fin structure may be designed, as shown in the fin outer surface 11(B) of fig. 4B.
In one embodiment, the shell of the outer surface 11 continuing to the first surface 121 of the inner surface 12 and the shell of the N second surfaces 122 may be the same material, such as both being the same copper alloy, or both being the same ceramic material. In another embodiment, the shell of the first surface 121, which continues from the outer surface 11 to the inner surface 12, and the shell of the N second surfaces 122 may be of different material types, such as copper alloy and aluminum alloy, and both may be one of a glass material, a ceramic material, a fiber composite material, a metal or a metal alloy.
In another embodiment, the shell of the first surface 121 extending from the outer surface 11 to the inner surface 12 and the shells of the N second surfaces 122 may be made of the same glass material or fiber composite material, or may be made of different glass materials, ceramic materials or fiber composite materials. In another embodiment, the shell of the outer surface 11 continuing to the first surface 121 of the inner surface 12 and the shells of the N second surfaces 122 may be made of the same metal or metal alloy material, or may be made of different metals or metal alloy materials.
In one embodiment, the shell of the first surface 121 continuing from the outer surface 11 to the inner surface 12 and the shells of the N second surfaces 122 are integrally formed, or are tightly joined by welding or fusing. In the specific manufacturing method, the whole electronic device casing 1 can be completely printed in a 3D printing mode; or forming a shell with the outer surface 11 continuing to the first surface 121 of the inner surface 12 by stamping or turning, and printing N shells with the second surface 122 by using a 3D printing technology to form the electronic device housing 1; alternatively, the housing with the first surface 121 continuing from the outer surface 11 to the inner surface 12 and the housings with the N second surfaces 122 may be formed by stamping or milling, and then the two may be tightly joined by welding or fusing. At this time, a welding point 154 may be formed between the first surface 121 and the second surface 122, as shown in fig. 4C.
In one embodiment, the wicking structure 150 within the cavity structure 15 is formed on the upper and lower edges of the inner wall, as shown in FIG. 4B. In another embodiment, the wicking structure 150 in the cavity structure 15 is formed on each side of the inner wall, as shown in FIG. 4C. In yet another embodiment, the capillary structure 150 in the cavity structure 15 is formed on the lower edge of the inner wall, as shown in FIG. 4C. Since the capillary structure 150 will pull the low temperature region to work as the fluid diffusion, the capillary structure 150 should be designed to be close to the heat absorption region. The lower edge of the cavity structure 15 is closest to the heat generating element, and therefore the capillary structure 150 is required at the lower edge of the cavity structure 15 corresponding to the heat source contact area 1220.
Please refer to fig. 1, 5A to 5D. Fig. 5A, 5B, 5C and 5D are schematic diagrams illustrating a chassis of an electronic device according to an embodiment of the invention. The volume, shape, layout, capillary structure 150, injection amount of working fluid, and vacuum degree of the N cavity structures 15 can be flexibly designed according to the overall design of the electronic device and the heat dissipation and dissipation requirements of the M heat generating elements 20. In one embodiment, the electronic device is a smart phone, the electronic device housing 1 is a back housing of the smart phone, and the electronic device system 2 is a system and module component of the smart phone and includes the circuit board 29. The second surface 122 is embossed in the first surface 121. Since the thickness of the circuit board 29 and the heating element 20 inside the smart phone is relatively small, and the thickness of the battery 28 is relatively large, a space for the battery 28 needs to be reserved when the electronic device case 1 is distributed on the second surface in design. For example, the electronic device housing 1 has a heat source contact region 1220 therein, and the second surface 122 may be arranged as shown in fig. 5A. In another embodiment, the electronic device housing 1 has two heat source contact areas 1220, and the layout of the second surface 122 can be as shown in fig. 5B. In another embodiment, the electronic device housing 1 has three heat source contact areas 1220, and the layout of the second surface 122 can be as shown in fig. 5C. In another embodiment, the electronic device housing 1 has five heat source contact areas 1220, and the layout of two second surfaces 122 can be as shown in fig. 5D. Based on the limitation of the electronic device system 2, when the volume, shape, layout, capillary structure 150, injection amount of the working fluid, and vacuum degree of the cavity structure 15 are relatively changed, the N micro Heat Pipe structures may further be Vapor chambers (Vapor chambers) or Loop Heat pipes (Loop Heat pipes).
In one embodiment, the first surface 121 further has a hole 1210 extending through the outer surface 11 and the inner surface 12. The space of the hole 1210 is a vent hole of the electronic device case 1, and can be used for accommodating an electronic element or an optoelectronic element, and the hole 1210 can also be filled with glass or other non-metallic materials. In one embodiment, the camera and the fingerprint sensor are disposed on the back of the electronic device system 2, so the hole 1210 of the electronic device housing 1 is used to expose the camera and the fingerprint sensor. In one embodiment, the first surface 121 further has a plurality of holes 1210 to allow the heat generated by the heat generating element 20 to directly leave the electronic device system 2 by thermal convection or thermal radiation.
When the electronic device casing 1 is a back shell of a smart phone, the thickness between the first surface 121 and the second surface 122 contacting the heat generating element may be designed to be less than or equal to 1.5 mm; the height of the cavity structure 15 can be designed to be greater than or equal to 0.3 mm; the sectional area of the cavity structure 15 can be designed to be 1.0mm or more2(ii) a And the volume of the cavity structure 15 can be designed to be 100mm or more3. As mentioned above, the cavity structure 15 of the present invention can be the same length as the thin micro heat pipe 322 of the prior art. However, with the limited thickness, the upper limit of the cross-sectional area formed by the width and height of the thin micro heat pipe 322 in the prior art is 0.4mm2In the same thickness limitation, in an embodiment of the present invention, the height of the cavity structure 15 can be flexibly designed to be 0.5mm, and the width can be flexibly designed to be 8.0mm, so that the cross-sectional area of the cavity structure of the micro heat pipe is 40.0mm2More than 10 times of the prior art.
Compared with the prior art, the heat clearing and radiating technology for the high-integration density and ultrathin electronic device is to process and flatten the formed round pipe heat pipe and match the copper radiating fins with larger areas to be tightly arranged between the long surface in the shell of the electronic device and the heating element. The present invention directly designs and manufactures the structure and function of flat micro-thermal conduits in the back cover of an electronic device chassis, taking into account the arrangement of heating elements and hot spot zones in the electronic device system when designing and manufacturing the chassis. Therefore, a larger convection cavity with the heat pipe structure can be obtained in the same limited space as the prior art, the thermal contact resistance of the whole heat dissipation system is reduced layer by layer, and the heat clearing and heat dissipation efficiency of the whole electronic device system is greatly improved.
The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims. The scope of the claims of the present invention should therefore be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is appropriate.
Claims (10)
1. An electronic device enclosure with micro heat pipe function for covering an electronic device system and dissipating heat of M heating elements included in the electronic device system, comprising:
An outer surface for contacting air to radiate heat;
An inner surface for covering the electronic device system and contacting the M heating elements of the electronic device system, the inner surface having a first surface and N second surfaces, the N second surfaces having M heat source contact areas and at least N vacuum seals, and each heat source contact area for contacting the corresponding heating element; and
N cavity structures, wherein each cavity structure is respectively formed between the second surface and the corresponding outer surface area, a capillary structure is respectively formed on an inner wall of each cavity structure, and N micro-heat conduit structures are formed in the electronic device shell after working fluid is injected into the N cavity structures and vacuum pumping is carried out on the N cavity structures;
wherein, N and M are 1 or natural numbers larger than 1.
2. The electronic device housing of claim 1, wherein the electronic device housing is a back cover of an electronic device, further wherein the back cover is a back cover of any electronic device such as a smart phone, a notebook computer, a laptop computer, a tablet computer, a music player, a media player, a navigator, a game console, or a display.
3. The electronic device enclosure of claim 1, wherein the volume, shape, layout, capillary structure, working fluid injection amount and vacuum degree of the N cavity structures are flexibly designed according to the overall design of the electronic device system and the heat dissipation and cooling requirements of the M heat generating elements.
4. The electronic device housing of claim 1, wherein a total area of the N second surfaces is less than a total area of the outer surface of the electronic device housing.
5. The electronic device enclosure of claim 1, wherein the N vacuum seals protrude or extend from the N second surfaces of the inner surface away from the outer surface.
6. The electronic device casing of claim 1, wherein the casing of the first surface and the casings of the N second surfaces, which are continuous from the outer surface to the inner surface, may be the same metal or metal alloy material or may be different metals or metal alloy materials.
7. The electronic device casing of claim 1, wherein the shell of the first surface and the shells of the N second surfaces, which are continuous from the outer surface to the inner surface, are made of the same glass material, ceramic material or fiber composite material, or different glass materials, ceramic materials or fiber composite materials.
8. The electronic device casing of claim 1, wherein the housing of the first surface and the housings of the N second surfaces, which are continuous from the outer surface to the inner surface, are integrally formed or are tightly joined by welding or fusing.
9. The electronic device housing as claimed in claim 1, wherein the first surface further has a hole penetrating through the outer surface and the inner surface, the hole is a vent hole of the electronic device housing for accommodating an electronic component or for accommodating an optoelectronic component, and the hole is filled with glass or other non-metallic materials.
10. The electronic device enclosure of claim 1, wherein the thickness between the first surface and the second surface is less than or equal to 1.5mm, the height of the cavity structure is greater than or equal to 0.3mm, and the cross-sectional area of the cavity structure is greater than or equal to 1.0mm2And the volume of the cavity structure is more than or equal to 100mm3。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810587291.7A CN110582180A (en) | 2018-06-08 | 2018-06-08 | Electronic device casing with micro-heat pipe function |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810587291.7A CN110582180A (en) | 2018-06-08 | 2018-06-08 | Electronic device casing with micro-heat pipe function |
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| CN110582180A true CN110582180A (en) | 2019-12-17 |
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| CN201810587291.7A Pending CN110582180A (en) | 2018-06-08 | 2018-06-08 | Electronic device casing with micro-heat pipe function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140830A (en) * | 2020-01-20 | 2021-07-20 | 广州力及热管理科技有限公司 | Temperature-equalizing plate element with heating function and power battery module applying same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101029802A (en) * | 2006-03-02 | 2007-09-05 | 奇鋐科技股份有限公司 | Production of planar hot pipe |
| US20120307453A1 (en) * | 2011-05-31 | 2012-12-06 | Foxconn Technology Co., Ltd. | Electronic device with heat pipe chamber cover for dissipating heat |
| CN203206599U (en) * | 2013-02-25 | 2013-09-18 | 讯凯国际股份有限公司 | Casing structure of hand-held device |
| CN204335247U (en) * | 2014-11-20 | 2015-05-13 | 奇鋐科技股份有限公司 | Mobile electronic device radiator structure |
| CN204810737U (en) * | 2015-06-12 | 2015-11-25 | 联想(北京)有限公司 | Equipment casing and electronic equipment |
| CN105517406A (en) * | 2014-09-24 | 2016-04-20 | 富瑞精密组件（昆山）有限公司 | Electronic device and radiating casing thereof |
-
2018
- 2018-06-08 CN CN201810587291.7A patent/CN110582180A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101029802A (en) * | 2006-03-02 | 2007-09-05 | 奇鋐科技股份有限公司 | Production of planar hot pipe |
| US20120307453A1 (en) * | 2011-05-31 | 2012-12-06 | Foxconn Technology Co., Ltd. | Electronic device with heat pipe chamber cover for dissipating heat |
| CN203206599U (en) * | 2013-02-25 | 2013-09-18 | 讯凯国际股份有限公司 | Casing structure of hand-held device |
| CN105517406A (en) * | 2014-09-24 | 2016-04-20 | 富瑞精密组件（昆山）有限公司 | Electronic device and radiating casing thereof |
| CN204335247U (en) * | 2014-11-20 | 2015-05-13 | 奇鋐科技股份有限公司 | Mobile electronic device radiator structure |
| CN204810737U (en) * | 2015-06-12 | 2015-11-25 | 联想(北京)有限公司 | Equipment casing and electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140830A (en) * | 2020-01-20 | 2021-07-20 | 广州力及热管理科技有限公司 | Temperature-equalizing plate element with heating function and power battery module applying same |
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Application publication date: 20191217 |