CN110891398B

CN110891398B - Micro heat pipe structure with heat insulation vacuum cavity

Info

Publication number: CN110891398B
Application number: CN201811054370.8A
Authority: CN
Inventors: 陈振贤
Original assignee: Guangzhou Lihe Thermal Management Technology Co ltd
Current assignee: Guangzhou Lihe Thermal Management Technology Co ltd
Priority date: 2018-09-11
Filing date: 2018-09-11
Publication date: 2021-04-06
Anticipated expiration: 2038-09-11
Also published as: CN110891398A

Abstract

A micro heat pipe structure with a heat insulation vacuum cavity comprises an upper cover, a heat insulation layer sheet and a lower cover. The upper cover is provided with a strip-shaped groove structure, and the strip-shaped groove structure is provided with a groove inner face and forms an arrangement space. The heat insulation layer sheet is provided with a vacuum cavity, the heat insulation layer sheet is contained in the setting space of the upper cover, and the heat insulation layer sheet is attached to the inner surface of part of the groove. The lower cover has a strip-shaped groove structure, and the strip-shaped groove structure is provided with a capillary structure. The lower cover is arranged in the arrangement space of the upper cover to form a cavity structure with a capillary structure on the inner side. The banded groove structure is partially attached to the thermally insulating sheet. Wherein, the cavity structure is provided with a working fluid, and the interior of the cavity structure is in a negative pressure state, so that the upper cover and the lower cover form a micro heat pipe structure. In a limited space, the invention has the effects of being light and thin, isolating the direct conduction of heat energy from a heating point and quickly guiding the heat energy to a specified area for heat dissipation.

Description

Micro heat pipe structure with heat insulation vacuum cavity

Technical Field

The invention provides a micro heat pipe structure, in particular to a micro heat pipe structure with a heat insulation vacuum cavity to avoid additionally installing a heat insulation sheet.

Background

The development trend of electronic and handheld communication devices is continuously towards thinning and high functionality, and demands on the operation speed and functions of a Microprocessor (Microprocessor) in the device are also increasing. The microprocessor is a core component of electronic and communication products, and is easy to generate heat under high-speed operation to become a main heating element of an electronic device, and if the heat cannot be dissipated instantly, a local processing Hot Spot (Hot Spot) is generated. Without a good thermal management scheme and a heat dissipation system, the microprocessor is often overheated and cannot perform its intended function, which may even affect the lifetime and reliability of the whole electronic device system. Therefore, electronic products need excellent heat dissipation design, and especially ultra-thin electronic devices such as smart phones (smartphones) and Tablet PCs (Tablet PCs) need excellent heat dissipation capability. An effective solution for Heat dissipation and Heat dissipation in the Hot Spot (Hot Spot) of electronic and communication products is to contact one side of a graphite sheet (graphite sheet) or a flat Micro Heat Pipe (flat Heat Pipe) or a Vapor Chamber (Vapor Chamber) with a Heat source and the other side with a housing of the electronic device.

However, because some electronic or communication products, such as smart phones, are very thin and light, the thickness space between the microprocessor and the chassis hub for accommodating the heat dissipation elements is often less than 1 mm. Therefore, the other side of the heat dissipating element in the heat source region is directly contacted with the cylindrical enclosure, and the high temperature generated by the hot spot is easily and directly conducted to the cylindrical enclosure, resulting in the excessive hot spot temperature on the cylindrical enclosure. Therefore, in order to avoid the hub temperature being too high, it is necessary to dispose a layer of insulation sheet between the hub of the hot spot region and the partial region of the heat dissipation element to prevent the conduction of the insulator heat flow. Meanwhile, a heat-insulating sheet is also needed to properly isolate the heat-generating components on the circuit board from other electronic or optoelectronic components that are sensitive to heat. However, in the prior art, the flattened micro heat pipe is disposed on the housing, and the heat insulating sheet is added, so that the occupied space of the micro heat pipe and the heat insulating sheet is increased, and the thickness of the electronic product is further increased.

Therefore, a solution to the problem of how to efficiently insulate heat in a limited thickness and space at a local position of a device is needed in a thin, small, light, and small electronic and communication device.

Disclosure of Invention

In view of the above, the present invention provides a Micro Heat Pipe (Micro Heat Pipe) structure with a thermal insulation vacuum Chamber to achieve the thermal insulation and Heat conduction effects, and the Micro Heat Pipe structure can also be referred to as a Vapor Chamber (Vapor Chamber) structure. The structure is completely different from the manufacturing and combination of the conventional micro-heat pipe, and can greatly improve the heat insulation, heat release and heat dissipation efficiency of a microprocessor hot spot in an electronic device system on the limited narrow thickness space provided by the electronic device system design. In practice, the invention further optimizes the heat dissipation management design and flexibility of the electronic device system.

In order to achieve the above object, the present invention discloses a micro heat pipe structure with a heat insulation vacuum cavity, which is characterized by comprising:

an upper cover having a band-shaped groove structure having a groove inner surface and forming a setting space;

the heat insulation layer sheet is provided with a vacuum cavity, is accommodated in the arrangement space of the upper cover and is attached to part of the inner surface of the groove; and

the lower cover is provided with a strip-shaped groove structure, the strip-shaped groove structure is provided with a capillary structure, the lower cover is arranged in the arrangement space of the upper cover to form a cavity structure with the capillary structure on the inner side, and the strip-shaped groove structure is partially attached to the heat insulation layer sheet;

wherein, the cavity structure is provided with a working fluid, and the interior of the cavity structure is in a negative pressure state so as to enable the upper cover and the lower cover to form a micro heat pipe structure.

The lower cover further has an outer surface and an inner surface, the outer surface has a heat source contact area, and the inner surface has the strip-shaped groove structure and the capillary structure.

Wherein the inner surface has a layer contact area for contacting the thermal insulating layer, the heat source contact area being located on the outer surface in an area opposite the layer contact area.

The upper cover is a flat upper cover, the heat insulation layer sheet is a flat heat insulation layer sheet, the lower cover is a flat lower cover, and the lower cover part is accommodated in the arrangement space.

The device further comprises N lower covers, wherein the upper cover is provided with N strip-shaped groove structures corresponding to the N lower covers, and N is a natural number greater than or equal to one.

Wherein, the lower cover is provided with M strip-shaped groove structures, a wall body is arranged between the M strip-shaped groove structures and is used for supporting the micro-heat pipe structure, and M is a natural number which is more than or equal to one.

The wall body is provided with a first wall structure and a second wall structure, the end part of the first wall structure is attached to the heat insulation layer sheet, and the end part of the second wall structure is attached to the inner surface of the groove.

The heat insulation layer sheet is provided with an upper surface and a lower surface, the upper surface is attached to the inner surface of the groove of the upper cover, and the first wall structure of the lower cover is attached to the lower surface.

The shape and size of the lower cover correspond to the shape and size of the inner face of the groove, and the size of the heat insulation layer sheet is smaller than the size of the inner face of the groove.

The upper cover is a back cover of an electronic device, and further the back cover is a back cover of a smart phone, a notebook computer, a portable computer, a tablet computer, a music player, a media player, a navigator, a game console or a display.

In summary, the present invention directly forms the micro-thermal conduit structure on the upper cover and embeds the thermal insulation layer sheet with vacuum inner cavity, so as to reduce height and weight and have better horizontal thermal conduction effect than the prior art. Therefore, in the limited narrow space, the micro-thermal conduit structure has the effects of being light and thin, covering and protecting internal elements, isolating heat energy from directly and vertically radiating from a heating point to the upper surface of the upper cover, and quickly guiding the heat energy to a specified area for radiating.

Drawings

FIG. 1A: a schematic diagram of an electronic device system is shown.

FIG. 1B: there is shown a schematic diagram of the structure of the micro heat pipe with the insulated vacuum chamber of the present invention corresponding to fig. 1A.

FIG. 1C: a cross-sectional view of the micro heat pipe structure with the insulated vacuum chamber according to section A-A of FIG. 1B is shown.

FIG. 2A: a schematic diagram of the top lid according to an embodiment of the invention is shown.

FIG. 2B: a schematic diagram of an embodiment of the thermal barrier layer of the present invention is shown.

FIG. 2C: a schematic view of the lower cover according to an embodiment of the present invention is shown.

FIG. 3A: a schematic view of the outer surface of the lower cover according to an embodiment of the present invention is shown.

FIG. 3B: a schematic view of the inner surface of the lower cover corresponding to fig. 3A is shown.

FIG. 4A: a schematic view of another embodiment of the section A-A according to FIG. 1B is shown.

FIG. 4B: a schematic diagram of one embodiment of a section B-B according to FIG. 1B is shown.

Fig. 5A to 5F: the appearance of the thermal barrier layer sheet in different embodiments of the present invention is illustrated.

Fig. 6A to 6D: the schematic diagrams of the structural appearance of the micro thermal conduit in different embodiments of the present invention are respectively shown.

FIG. 7A: the schematic diagram of the micro heat pipe structure with the heat insulation vacuum cavity of the present invention is shown.

FIG. 7B: a schematic diagram of a micro heat pipe structure with an insulated vacuum chamber according to an embodiment of the present invention is shown.

Detailed Description

In order that the advantages, spirit and features of the invention will be readily understood and appreciated, embodiments thereof will be described and illustrated with reference to the accompanying drawings. It is to be understood that these embodiments are merely representative examples of the present invention, and that no limitations are intended to the scope of the invention or its corresponding embodiments, particularly in terms of the specific methods, devices, conditions, materials, and so forth.

In the description of the present invention, it is to be understood that the terms "longitudinal, transverse, upper, lower, front, rear, left, right, top, bottom, inner, outer" and the like refer to orientations or positional relationships based on those shown in the drawings, which are merely for convenience of description and simplicity of description, and do not indicate that the described devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

In addition, the indefinite articles "a", "an" and "an" preceding an apparatus or element of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the apparatus or element. Thus, "a" or "an" should be read to include one or at least one, and the singular form of a device or element also includes the plural form unless the number clearly indicates the singular form.

In this specification, the dot-filled region is a structure showing the thermal insulating sheet 4; the area filled with the mesh is the structure of the lower cover 3. The vertical heat conduction refers to the up-and-down conduction of heat energy at an angle as shown in fig. 1C, and the horizontal heat conduction or the lateral heat conduction refers to the up-and-down and left-and-right conduction of heat energy at an angle as shown in fig. 1B.

Please refer to fig. 7A. FIG. 7A is a schematic view of the micro heat pipe structure with the insulated vacuum chamber according to the present invention. The present invention relates to a micro heat pipe structure 1 with a heat insulation vacuum chamber, which comprises an upper cover 2, a heat insulation layer 4 and a lower cover 3. The upper lid 2 has a band-shaped groove structure having a groove inner face 23 and forming a disposition space. The heat insulating layer sheet 4 has a vacuum cavity 45, the heat insulating layer sheet 4 is accommodated in the setting space of the upper cover 2, and the heat insulating layer sheet 4 is attached to part of the inner surface 23 of the groove. The lower cover 3 has a strip-shaped groove structure with a capillary structure thereon. The lower cap 3 is disposed in the disposition space of the upper cap 2 to form a cavity structure 35 having a capillary structure inside. The belt-like groove structure is partly applied to the insulating layer sheet 4. Wherein, the cavity structure 35 contains a working fluid therein, and the interior of the cavity structure 35 is in a negative pressure state, so that the upper cover 2 and the lower cover 3 form the micro heat pipe structure 1. The micro heat pipe structure 1 of the present invention can be disposed in an electronic device, and the capillary structure of the cavity structure 35 can rapidly conduct heat horizontally, and the vacuum cavity 45 of the heat insulating layer 4 can reduce vertical heat conduction. In addition, the concept of the prior art will be to assemble the micro heat pipe and the heat insulation sheet into the electronic device separately, and the micro heat pipe structure 1 of the present invention is pre-formed, so as to omit the process of assembling the two into the electronic device. Furthermore, the thermal insulation layer sheet 4 is arranged in the micro heat pipe structure 1, and the possibility that the thermal insulation layer sheet and the micro heat pipe are respectively displaced is avoided.

On the other hand, the proportion of the inner cavity space to the surface layer thickness after the micro heat conducting tube is flattened in the prior art is low, the convection space is small, and the heat conducting efficiency is poor. The micro-heat pipe structure formed by the strip-shaped groove structure with the capillary structure can be designed to have a higher ratio of the inner cavity space to the surface layer thickness, so that the convection space is large and the heat conduction efficiency is better.

Please refer to fig. 1A to 1C. FIG. 1A is a schematic diagram of an electronic device system. FIG. 1B is a schematic diagram of the micro heat pipe structure with the insulated vacuum chamber of the present invention corresponding to FIG. 1A. FIG. 1C is a cross-sectional view of the micro heat pipe structure of the vacuum chamber according to section A-A of FIG. 1B. The electronic device system 5 shown in fig. 1A does not have a housing, but only some of the internal circuit elements are shown. In practical applications, the upper cover 2 of the micro thermal pipe structure 1 with the thermal insulation vacuum chamber of the present invention can also be used for increasing the length and width for other applications. For example, in general, the portable electronic device system 5 includes at least a battery 58, a circuit board 59, and a hot spot 50. The hot spot 50, typically a microprocessor, is disposed on the circuit board 59, and the thickness of the battery 58 is typically greater than the thickness of the circuit board 59, so that a small gap is typically maintained adjacent the circuit board 59. Therefore, the protruding portion of the micro heat pipe structure 1 in fig. 1C corresponds to the position of the circuit board and one end of the lower cover 3 is attached to the hot spot 50. And the size of the upper cover 2 of the micro thermal pipe structure 1 is matched with the electronic device system 5, and the upper cover 2 covers the electronic device system 5 with the inner surface 22 facing the electronic device system 5, so that the upper cover 2 can be directly used as a part of the housing of the electronic device system 5, such as a back cover. The top cover 2 mentioned in the following description may include the shapes and applications of the top cover 2 shown in fig. 7A and fig. 1C with reasonable combination and transformation.

Because the capillary structure is formed on the strip-shaped groove structure, and the working fluid is contained in the closed negative-pressure cavity structure 35, the structure formed by the upper cover 2 and the lower cover 3 has strong heat conduction capability, can replace the function of the traditional thin micro-heat pipe, and can conduct heat energy quickly and transversely.

In the prior art, a thin micro-thermal conduit is additionally installed in the electronic device system to conduct heat rapidly, and the thermal insulation layer is usually a solid material with a certain thickness and low thermal conductivity. However, since the internal space of the electronic device system is extremely small, it is difficult to provide a thermal insulating sheet for thermal insulation. The micro heat pipe structure 1 of the present invention can be directly used as a housing, i.e. the housing has the function of a heat pipe, so that a thin micro heat pipe does not need to be additionally arranged in an electronic device system, and the use space is saved. Furthermore, an extremely thin and vacuum thermal insulating layer 4 is also included between the upper lid 2 and the lower lid 3, so that heat is not easily conducted to the outer surface 21 of the upper lid 2 by convection or conduction through the negative pressure space in the thermal insulating layer 4. And the heat energy is guided to the position without the heat insulation layer sheet 4 and then is vertically conducted to the designated area of the upper cover 2, and finally the outer surface 21 is radiated to the atmosphere, so that the damage of parts which are overheated and difficult to hold by hands or do not resist high temperature is avoided.

Please refer to fig. 2A to fig. 2C. FIG. 2A is a schematic diagram of an upper lid according to an embodiment of the invention. FIG. 2B is a schematic view of a thermal insulating layer sheet according to an embodiment of the present invention. FIG. 2C is a schematic view of the lower cover according to an embodiment of the invention. Wherein the upper cover 2 is a flat upper cover. The insulating layer sheet 4 is a flat insulating layer sheet. The lower cover 3 is a flat lower cover. The lower cover 3 is partially accommodated in the installation space, and the insulating sheet 4 is entirely accommodated in the installation space and sandwiched between the upper cover 2 and the lower cover 3. The upper cover 2, the heat insulation layer sheet 4 and the lower cover 3 are overlapped at corresponding positions, and the thickness of the upper cover, the heat insulation layer sheet and the lower cover is less than 1.5 mm. Therefore, in a narrow limited space, the micro-thermal conduit structure 1 is light and thin, and has the effects of isolating heat energy from a heating point to directly and vertically radiate the heat energy to the upper surface of the upper cover and rapidly guiding the heat energy to a designated area for radiating the heat energy, and if the upper cover 2 is a shell, the micro-thermal conduit structure also has the effect of covering and protecting internal elements.

Further, the shape and size of the lower cap 3 correspond to the shape and size of the inner surface of the groove, and in a preferred embodiment, the outer diameter of the lower cap 3 exactly matches the inner diameter of the inner surface of the groove, so that the lower cap 3 can be engaged and simply clamped on the upper cap 2. Then, welding points 10 or adhesive points may be formed by welding or gluing to fix the lower cover 3 and the upper cover 2, as shown in fig. 1C and 7A. The heat insulating layer sheet 4 needs to be disposed in the accommodating space of the upper cover 2, and therefore the size of the heat insulating layer sheet 4 is smaller than or equal to the size of the groove inner surface 23. The length of the insulating layer 4 is usually smaller than the groove inner surface 23 of the upper cover 2 and the lower cover 3, so that heat energy is directly conducted from the lower cover 3 to a designated area of the upper cover 2 without containing the insulating layer 4, and is radiated by the upper cover 2 in the area.

Please refer to fig. 1C, fig. 2B, fig. 3A and fig. 3B. FIG. 3A is a schematic diagram of the outer surface of the lower cover according to an embodiment of the invention. Fig. 3B shows a schematic view of the inner surface of the lower cover corresponding to fig. 3A. The lower cover 3 further has an outer surface 31 and an inner surface 32. The outer surface 31 has a heat source contact area 310 corresponding to a hot spot contacting the electronic device system. The inner surface 32 has a band groove structure and a capillary structure, which are pre-formed and combined with the upper lid 2. In addition, in one embodiment, lower cover 3 has a perforated seal 36 formed between outer surface 31 and inner surface 32. The perforation seal 36 may also be a sealed tube. During the manufacturing process, the lower cover 3 has a through hole penetrating through the outer surface 31 and the inner surface 32. After the upper cover 2, the lower cover 3 and the heat insulating layer sheet 4 are assembled, the working fluid is filled into the accommodating space 35 between the upper cover 2 and the lower cover 3 through the through hole, the air in the accommodating space 35 between the upper cover 2 and the lower cover 3 is pumped out, and the through hole is sealed to form the through hole sealing 36, so that the accommodating space 35 with negative pressure is formed.

Wherein the inner surface 32 of the lower cover 3 has a layer contact area 320 contacting the thermal insulating layer 4; the heat source contact area 310 is located on the outer surface 31 in an area opposite the ply contact area 320. Accordingly, the heat source contact region 310 of the outer surface 31 of the lower cover 3 contacts the hot spot and receives heat energy, which is vertically conducted to the sheet contact region 320 of the inner surface 32, and then to the thermal insulation sheet 4. Since the thermal insulating layer 4 has a vacuum characteristic, thermal energy cannot be efficiently conducted directly and vertically to the upper cover 2, and can be conducted only horizontally to the lower cover 3 or other regions of the thermal insulating layer 4. Therefore, the heat energy of the hot spot is prevented from being directly transmitted to the vertical corresponding area of the upper cover 2, so that the heat energy is concentrated or the hand is scalded.

Please refer to fig. 3B, fig. 4A, fig. 4B and fig. 7B. FIG. 4A is a schematic view of another embodiment of the section A-A shown in FIG. 1B. FIG. 4B is a schematic diagram illustrating an embodiment of a section B-B according to FIG. 1B. The lower cover 3 has M strip-shaped groove structures, and at least one wall 34 is arranged between the M strip-shaped groove structures for supporting the micro heat pipe structure 1, wherein M is a natural number greater than or equal to one. In one embodiment, the lower cover 3 has two strip-like groove structures separated by a wall 34. However, the wall 34 does not completely block the flow of the space between the two banded trench structures, as shown in FIG. 3B. By forming the wall 34, the micro heat pipe structure 1 formed by the upper cover 2 and the lower cover 3 can be supported, and the structure is easy to be sunken and deformed when the external force collides.

In one embodiment, the wall 34 has a first wall 341 and a second wall 342, or the wall 34 is formed by combining the first wall 341 and the second wall 342. The first wall structure 341 and the second wall structure 342 may be connected to form a complete structure without interruption, such as shown in fig. 3B; or may be arranged in a dotted line with disconnected breaks. As described above, the length of the thermal insulating layer sheet 4 is shorter than the length of the groove inner face 23 of the upper cover 2 and the length of the lower cover 3. Therefore, the heat insulating sheet 4 is interposed between the upper cover 2 and the lower cover 3 in a partial region, and the heat insulating sheet 4 is not interposed in a partial region. In the region where the heat insulating sheet 4 is interposed, the wall 34 of the lower cover 3 is a first wall structure 341 having a small height, and the end of the first wall structure 341 is bonded to the heat insulating sheet 4. In the region where the thermal insulating layer sheet 4 is not interposed, the wall 34 of the lower cover 3 is a second wall structure 342 having a high height, and the end of the second wall structure 342 is fitted to the groove inner surface 23. By means of the walls 34 with different heights, the micro heat pipe structure 1 can be stably supported, and the appearance and stability of the lower cover 3 are consistent.

The insulating layer 4 has an upper surface 41 and a lower surface 42, the upper surface 41 is attached to the inner surface 23 of the groove of the upper cover 2, and the first wall structure 341 of the lower cover 3 is attached to the lower surface 42. Thereby forming a robust micro thermal pipe structure 1 of the present invention. In addition, a supporting wall or a supporting pillar 44 similar to the wall 34 may be disposed in the vacuum cavity 45 of the thermal insulating layer 4, as shown in fig. 7B, one end of which is against the upper surface 41 and the other end of which is against the lower surface 42, so as to support the structure of the thermal insulating layer 4 and prevent deformation. Moreover, in a preferred embodiment, the supporting columns 44 are located corresponding to the first wall structures 341 of the bottom cover 3, and the protruding portions on both sides of the bottom cover 3 and attached to the lower surfaces 42 of the thermal insulating layer sheets 4 correspond to the supporting walls around the thermal insulating layer sheets 4, so that the supporting force is vertically continuous to prevent the bottom cover 3 and the thermal insulating layer sheets 4 from being deformed by pressing each other.

In various embodiments, the top cover 2 is a back cover of an electronic device, and further, the back cover is a back cover of any electronic device such as a smartphone, a notebook, a laptop, a tablet, a music player, a media player, a navigator, a game console, or a display.

Please refer to fig. 5A to 5F. Fig. 5A-5F are schematic views of the appearance of the thermal barrier layer sheet according to various embodiments of the present invention. Due to the different insulation requirements, the insulating layer sheet 4 may be disposed between the upper cover 2 and the lower cover 3. To meet various objectives, the thermal barrier sheet 4 may be designed in a variety of appearances, the same being centered on the vacuum cavity 45. The appearance of the thermal barrier sheet 4 is not limited to the drawings.

Please refer to fig. 6A to 6D. Fig. 6A to 6D are schematic views respectively illustrating the structural appearance of the micro heat pipe according to different embodiments of the present invention. In one embodiment, the micro heat pipe structure 1 with the insulated vacuum chamber further comprises N lower covers 3, but only one upper cover 2. And the upper cover 2 has N band-shaped groove structures corresponding to the N lower covers 3, where N is a natural number greater than or equal to one. For example, in fig. 6A and 6C, when the upper cover 2 is a housing, the upper cover 2 has a strip-shaped groove structure, so that a lower cover 3 can be fixed on the upper cover 2. For example, in fig. 6B and 6D, an upper cover 2 has two strip-shaped groove structures, so that two lower covers 3 can be fixed on the upper cover 2. Then, because the strip-shaped groove structure can be formed into various shapes only by milling, the design is very flexible. Therefore, the electronic device system may have a plurality of heat generating points, and the lower cover 3 may also have a plurality of heat source contact areas 310. For example, there are two heat source contact zones 310 in fig. 6B, three heat source contact zones 310 in fig. 6C, and five heat source contact zones 310 in fig. 6D. Therefore, the design can dissipate the heat energy of a plurality of heat sources.

Compared with the prior art that the flattened thin micro heat pipe and the thicker and heavier heat insulation sheet are additionally assembled on the circuit board or the back shell, the invention omits the process from assembling the two to the electronic device, avoids the possibility that the heat insulation sheet and the micro heat pipe can respectively shift, and even can directly use the upper cover as the shell to form the shell which comprises the micro heat pipe structure and is internally provided with the heat insulation sheet with a vacuum inner cavity, thereby achieving the effects of height reduction and weight reduction, and even having better horizontal heat conduction effect than the prior art. Therefore, in the limited narrow space, the micro-thermal conduit structure 1 has the effects of being light and thin, isolating the direct vertical heat dissipation of the heat energy from the heat generating point, and rapidly guiding the heat energy to the designated area for heat dissipation.

The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the claims. The scope of the claims is thus to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.

Claims

1. A micro heat pipe structure with a heat insulation vacuum cavity is characterized by comprising:

the upper cover is a flat upper cover and is provided with a strip-shaped groove structure, and the strip-shaped groove structure is provided with a groove inner face and forms an arrangement space;

the heat insulation layer sheet is a flat heat insulation layer sheet and is provided with a vacuum cavity, the heat insulation layer sheet is contained in the arrangement space of the upper cover, the size of the heat insulation layer sheet is smaller than that of the inner surface of the groove, and the heat insulation layer sheet is attached to part of the inner surface of the groove; and

the lower cover is a flat lower cover and is provided with a banded groove structure, the banded groove structure is provided with a capillary structure, the shape and the size of the lower cover correspond to the shape and the size of the inner surface of the groove, the lower cover is arranged in the arrangement space of the upper cover, the lower cover part is accommodated in the arrangement space, a cavity structure with the capillary structure on the inner side is formed, and the banded groove structure is partially attached to the heat insulation layer sheet;

2. The micro heat pipe structure with vacuum chamber for heat insulation according to claim 1, wherein the bottom cover further has an outer surface having a heat source contact area and an inner surface having the belt-shaped groove structure and the capillary structure.

3. The structure of claim 2, wherein the inner surface has a sheet contacting area for contacting the insulating sheet, and the heat source contacting area is located on the outer surface at an area opposite to the sheet contacting area.

4. The micro heat pipe structure with vacuum chamber for insulation according to claim 1, further comprising N lower covers, wherein the upper cover has N strip-shaped groove structures corresponding to the N lower covers, and N is a natural number greater than or equal to one.

5. The micro heat pipe structure with vacuum chamber for insulation of claim 1, wherein the bottom cover has M strip-shaped groove structures, M strips-shaped groove structures have a wall therebetween for supporting the micro heat pipe structure, M is a natural number greater than or equal to one.

6. The micro heat pipe structure with vacuum insulation chamber of claim 5, wherein the wall has a first wall structure and a second wall structure, the end of the first wall structure is attached to the heat insulation layer sheet, and the end of the second wall structure is attached to the inner surface of the groove.

7. The micro heat pipe structure with vacuum insulation chamber as claimed in claim 6, wherein the thermal insulation layer sheet has an upper surface and a lower surface, the upper surface is attached to the inner surface of the groove of the upper lid, and the first wall structure of the lower lid is attached to the lower surface.

8. The micro heat pipe structure with vacuum chamber for insulation according to claim 1, wherein the top cover is a back cover of an electronic device.