CN207519062U - A kind of chassis shell body - Google Patents

Abstract

The present application discloses a chassis shell, which is used to carry electronic components, and further includes: a heat conduction patch that is in contact with the exposed surface of the electronic component; a heat conduction device connected with the heat conduction patch; connected with the heat conduction device, for The heat conduction device dissipates heat from the chassis shell. By arranging the heat conduction device on the chassis shell, the heat dissipation is carried out through the chassis shell, the heat dissipation area is increased, and the heat dissipation efficiency is enhanced, and the shell undertakes the heat dissipation function, so the total manufacturing cost of the shell and the heat dissipation device can be reduced, and the product competition can be improved. force.

Description

a chassis shell

technical field

The present application relates to the field of heat dissipation of electronic components, in particular to a chassis shell.

Background technique

With the development of technology and the improvement of people's needs, the performance of electronic components is constantly improving, and with the improvement of performance, the heat generated during work is also constantly increasing. The temperature of electronic components seriously affects the working status of electronic components, especially precision components such as CPU and GPU. When the temperature exceeds the preset temperature, it will stop working at least, and damage the physical characteristics of the original price.

Therefore, it is common to install heat sinks on such electronic components, but such heat sinks are generally installed inside the case, and the heat dissipation surface is too narrow for the reason mentioned in the case, which is not conducive to large-area heat dissipation. When the calorific value of electronic components increases further, further heat dissipation cannot be performed.

Therefore, how to better dissipate heat from electronic components is a key issue that those skilled in the art pay attention to.

Contents of the invention

The purpose of this application is to provide a chassis shell. By arranging the heat conduction device on the chassis shell, the heat dissipation is performed through the chassis shell, the heat dissipation area is increased, and the heat dissipation efficiency is enhanced, and the shell has assumed the heat dissipation function so that the shell can be reduced. The total manufacturing cost of the body and the cooling device improves product competitiveness.

In order to solve the above technical problems, the present application provides a case housing for carrying electronic components, which also includes:

a thermally conductive patch that is in close contact with the exposed surface of the electronic component;

a heat conduction device connected to the heat conduction patch;

Connected with the heat conduction device, it is used to dissipate heat from the heat conduction device.

Optionally, also include:

A heat dissipation device arranged on the chassis shell and connected to the heat conduction device for dissipating heat from the heat conduction device;

It is connected with the heat dissipation device and is used for controlling the controller of the heat dissipation device.

Optionally, the heat conduction device is a copper tube.

Optionally, the cooling device includes:

Connected with the heat conduction device, a heat sink for displacing heat;

The heat dissipation fan is arranged on the heat dissipation fin and is used to drive the air flow through the rotation of the fan blade to dissipate heat from the heat dissipation fin.

Optionally, the heat conduction device is a liquid heat conduction pipe.

Optionally, the heat dissipation device is a liquid heat displacement machine.

Optionally, the heat conduction device is a semiconductor cooling chip; the cold end of the semiconductor cooling chip is connected to the heat conduction patch, and the hot end of the semiconductor cooling chip is connected to the heat sink.

Optionally, the heat dissipation device is a semiconductor heat displacement machine.

Optionally, the controller includes:

A control chip, used as a controller for controlling the cooling device according to the received temperature data;

A temperature sensor that is connected with the controller and is used to measure the temperature in the casing to obtain the temperature data and send the temperature data.

A chassis shell provided by the present application is used to carry electronic components, and further includes: a heat conduction patch that is in contact with the exposed surface of the electronic component; a heat conduction device connected with the heat conduction patch; The heat conduction device is connected to the chassis shell for dissipating heat from the heat conduction device.

By arranging the heat conduction device on the chassis shell, the heat dissipation is carried out through the chassis shell, the heat dissipation area is increased, and the heat dissipation efficiency is enhanced, and the shell undertakes the heat dissipation function, so the total manufacturing cost of the shell and the heat dissipation device can be reduced, and the product competition can be improved. force.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present application, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.

FIG. 1 is a schematic structural diagram of a case housing provided by an embodiment of the present application.

In Figure 1:

1 is the chassis shell, 2 is the electronic component, 3 is the heat conduction patch, and 4 is the heat conduction device.

Detailed ways

The core of the present application is to provide a chassis shell. By arranging the heat conduction device on the chassis shell, the heat dissipation is performed through the chassis shell, the heat dissipation area is increased, and the heat dissipation efficiency is enhanced, and the shell undertakes the heat dissipation function so that the shell can be reduced. The total manufacturing cost of the body and the cooling device improves product competitiveness.

In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a chassis shell provided by an embodiment of the present application.

This embodiment provides a chassis shell, which can increase the heat dissipation area and enhance the heat dissipation efficiency. The device includes:

A heat conduction patch 3 that is in contact with the exposed surface of the electronic component 2;

Wherein, the thermal conduction patch 3 may refer to a cooling platform connected to a heating element in a general chassis heat dissipation device, and its main function is to receive the heat emitted by the heating element and transfer it to the heat conduction device. Further, since both the heat conduction patch and the heat conduction device are used for heat conduction, the heat conduction patch in this embodiment can also be a part with a larger contact area in the heat conduction device, so as to realize the integration of the heat conduction device and the heat conduction patch Shaped to improve heat transfer efficiency and conduct efficient heat conduction.

Wherein, bonding contact means that the exposed surface of the electronic component and the contact surface of the heat conduction patch are bonded and contacted, and the two are bonded to exclude air as much as possible during contact. Moreover, since the contact surface between the two cannot be completely smooth, there will still be a vacant space for air to enter, which will affect the heat conduction efficiency. Therefore, a heat-conducting medium can be filled between the contact surfaces to fill the gap between the contact surfaces. Wherein, the heat conduction medium may be heat conduction silicone grease, liquid metal and other heat conduction materials.

A heat conduction device 4 connected to the heat conduction patch 3;

Wherein, the heat conduction patch 3 and the heat conduction device 4 can be embedded and connected, can also be welded to each other, or can be integrally formed of the same material, all for improving the heat conduction efficiency between the heat conduction patch 3 and the heat conduction device 4 . Further, if there is a certain gap between the heat-conducting patch 3 and the heat-conducting device 4, a heat-conducting medium should be filled in the gap to eliminate the gap and improve heat conduction efficiency.

Among them, the heat conduction device 4 is used to conduct the heat of the heat conduction patch 3 to the chassis shell 1, so the heat conduction device 4 can be divided into one end for receiving heat and one end for dissipating heat. Heat, the latter is connected with the chassis shell 1 for heat dissipation to dissipate the absorbed heat. Usually, the heat conduction device 4 is a pipeline filled with a heat conduction medium, which transfers heat from one end to the other end through thermal changes and flow states of the heat conduction medium. Specifically, the heat conduction device can be a heat conduction copper tube, a liquid heat conduction pipe, or a semiconductor cooling chip, as long as a device that can conduct heat from one end to the other end can be used as the heat conduction device 4 in the embodiment of the present application.

It is connected with the heat conduction device 4 and is used for the chassis shell 1 for dissipating heat from the heat conduction device 4 .

In the technical solution of the present application, the heat conduction device 4 is connected to the chassis shell 1, that is, the heat dissipation end of the heat conduction device 4 is connected to the chassis shell 1, so that the heat in the heat conduction device 4 can be dissipated through the chassis shell 1, and also That is to say, the chassis shell 1 in the present embodiment has realized the heat dissipation function to the electronic component 2 in the chassis, that is, the shell of the chassis itself is the heat dissipation device of the chassis element, and also the heat dissipation device has assumed the function of the chassis shell, so The direct effect is to reduce the total cost of the cooling device and the chassis shell 1, and improve product competitiveness.

Simultaneously, because the heat dissipation area of general chassis heat dissipation is subject to the restriction of chassis structure, heat dissipation area is less, and heat dissipation area is exactly the surface area of chassis shell 1 in the present embodiment, has increased heat dissipation area greatly compared with prior art, has improved cooling power.

It should be noted that in this embodiment, the heat conduction device 4 and the chassis shell 1 can be inlaid, welded, or integrally formed. The air enters to improve the heat conduction efficiency between the heat conduction device and the chassis shell, and improve the heat dissipation efficiency. Furthermore, the heat dissipation area will affect the heat dissipation efficiency, so the contact surface between the heat conduction device and the chassis shell can be increased as much as possible to improve the heat dissipation efficiency. Specifically, the part of the heat conduction device in contact with the chassis shell can be set in a coiled shape, or it can be set in other shapes, and any shape that can increase the contact surface can be used as the shape of the heat conduction device in the embodiment of the application. Do limited.

Optionally, the foregoing embodiments may also include:

A heat dissipation device arranged on the chassis shell 1 and connected to the heat conduction device 4 for dissipating heat from the heat conduction device 4;

It is connected with the heat dissipation device and is used for controlling the controller of the heat dissipation device.

Since the heat dissipation through the chassis shell 1 is passive heat dissipation, when the heat in the chassis exceeds the heat dissipation threshold of passive heat dissipation, the heat cannot be replaced well. Therefore, in this embodiment, a heat dissipation device is provided on the chassis shell 1 to replace the heat on the heat conducting device 4 and the chassis shell 1 .

Wherein, the heat dissipation device will use different heat dissipation devices according to the difference of the heat conduction device. Generally, it can be a fan, a liquid heat displacer, etc. Any device that can actively dissipate heat can be used as the heat dissipating device in this embodiment, and will not be described in detail here.

Wherein, the heat dissipation device mainly actively dissipates heat, so there will be a related control device to control it to dissipate heat, that is, the controller mentioned in this embodiment. Its main function is to control the cooling device to dissipate heat. What kind of controller is specific depends on the difference of the cooling device and is not specifically limited here. Moreover, the controller can also make corresponding judgments according to different information data obtained, and issue or change the heat dissipation state of the heat dissipation device, so as to achieve a more suitable and efficient heat dissipation effect.

Optionally, the heat conduction device 4 in this embodiment can be a copper tube, and the heat dissipation device can include:

Connected to the heat conduction device 4, a heat sink for exchanging heat;

The heat dissipation fan is arranged on the heat dissipation fin and is used to drive the air flow through the rotation of the fan blade to dissipate heat from the heat dissipation fin.

Among them, the copper pipe is a device that conducts heat through the thermal change of the heat-conducting medium in the pipe. The heat-absorbing section of the copper pipe is connected to the heat-conducting patch, and the heat-dissipating section is connected to the heat sink provided on the chassis shell 1. , the heat sink can displace heat into the air through the area in contact with the air, and then cooperate with the cooling fan to drive the airflow for directional flow, and can continuously displace heat through the heat sink, so as to achieve the purpose of active heat dissipation.

It should be noted that a heat dissipation fan can also be directly installed on the case shell 1 so that the directional airflow can take away the heat above the case, and the purpose of active heat dissipation can also be achieved.

Optionally, the heat conduction device 4 in this embodiment may be a liquid heat conduction pipe, and the heat dissipation device may be a liquid heat displacement machine.

Among them, the purpose of the liquid heat pipe is to make the liquid flow in the pipe drive the transfer of heat, and the specific heat capacity of the liquid is relatively large, so it is easier to replace a large amount of heat. Usually, during implementation, at a section where the liquid heat pipe is in contact with the heat conduction patch 3, the liquid is directly in contact with the heat conduction patch 3, which can improve the efficiency of heat transfer. One end of the heat dissipation is connected with a liquid heat displacement machine for heat dissipation.

Wherein, the liquid heat displacer may be a fan that takes away the heat in the heat conduction device through directional flow of air, or a refrigerator that cools the liquid, or dissipates heat through fins, which are not specifically limited here.

Optionally, the heat conduction device in this embodiment may be a semiconductor cooling chip; the cold end of the semiconductor cooling chip is connected to the heat conduction patch 3, and the hot end of the semiconductor cooling chip is connected to the heat dissipation device; the heat dissipation device It can be a semiconductor heat displacement machine.

Among them, the semiconductor cooling chip is also called a thermoelectric cooling chip, which is a kind of heat pump. Its advantage is that there are no sliding parts, and it is used in some occasions where the space is limited, the reliability is high, and there is no refrigerant pollution. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple, which can achieve the purpose of cooling.

The heat is displaced through the heat dissipation device connected to the hot end to dissipate the heat in the chassis. Therefore, the purpose of the semiconductor heat displacement machine is to dissipate heat from the hot end to reduce the temperature.

Optionally, the controller in this embodiment may include:

A control chip, used as a controller for controlling the cooling device according to the received temperature data;

A temperature sensor that is connected to the controller and is used to measure the temperature inside the chassis shell 1 to obtain the temperature data and send the temperature data.

Among them, the control chip refers to a device that mainly performs logic judgment and signal output, and can output corresponding control signals according to the input signal data and the preset logic processing flow in the chip. The corresponding cooling device is the receiving control signal module. Further, the control chip and the controller can output control status information, for example, the operating parameters of the cooling module, which is not limited here.

The embodiment of the present application provides a chassis shell, which can dissipate heat through the chassis shell by arranging the heat conduction device on the chassis shell, increase the heat dissipation area, and enhance the heat dissipation efficiency, and the shell undertakes the heat dissipation function, thus reducing the The total manufacturing cost of the housing and heat sink improves product competitiveness.

Each embodiment in the description is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and for the related information, please refer to the description of the method part.

Professionals can further realize that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, computer software or a combination of the two. In order to clearly illustrate the possible For interchangeability, in the above description, the composition and steps of each example have been generally described according to their functions. Whether these functions are executed by hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may use different methods to implement the described functions for each specific application, but such implementation should not be regarded as exceeding the scope of the present application.

The steps of the methods or algorithms described in connection with the embodiments disclosed herein may be directly implemented by hardware, software modules executed by a processor, or a combination of both. Software modules can be placed in random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other Any other known storage medium.

The above is a detailed introduction to the chassis shell provided by the present application. In this paper, specific examples are used to illustrate the principles and implementation methods of the present application, and the descriptions of the above embodiments are only used to help understand the methods and core ideas of the present application. It should be pointed out that those skilled in the art can make some improvements and modifications to the application without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.

Claims (9)

1. a kind of chassis shell body, for carrying electronic component (2), which is characterized in that further include：

The heat-conducting patch (3) contacted with the exposure fitting of the electronic component (2)；

The heat-transfer device (4) being connect with the heat-conducting patch (3)；

It is connect with the heat-transfer device (4), for the chassis shell body (1) to radiate to heat-transfer device (4).

2. chassis shell body according to claim 1, which is characterized in that further include：

It is arranged in the chassis shell body (1), is connected with the heat-transfer device (4), for being dissipated to the heat-transfer device (4) The radiator of heat；

It is connect with the radiator, for controlling the controller of the radiator.

3. chassis shell body according to claim 2, which is characterized in that the heat-transfer device (4) is copper pipe.

4. chassis shell body according to claim 3, which is characterized in that the radiator includes：

It is connected with the heat-transfer device (4), for replacing the cooling fin of heat；

It is arranged on the cooling fin, the rotation for passing through flabellum drives air-flow flowing to be dissipated to what the cooling fin radiated Hot-air fan.

5. chassis shell body according to claim 2, which is characterized in that the heat-transfer device (4) is liquid thermal conductivity pipe.

6. chassis shell body according to claim 5, which is characterized in that the radiator is liquid heat replacing machine.

7. chassis shell body according to claim 2, which is characterized in that the heat-transfer device (4) is semiconductor chilling plate；Institute The cold end for stating semiconductor chilling plate is connect with the heat-conducting patch (3), and the hot junction of the semiconductor chilling plate is filled with the heat dissipation Put connection.

8. chassis shell body according to claim 7, which is characterized in that the radiator is semiconductor heat replacing machine.

9. according to claim 2 to 8 any one of them chassis shell body, which is characterized in that the controller includes：

Control chip, the controller controlled for the temperature data according to reception the radiator；

It is connect with the controller, for measuring to obtain the temperature data to the temperature in the chassis shell body (1), and Send the temperature sensor of the temperature data.