CN202713864U - Heat radiation apparatus for cabinet - Google Patents
Heat radiation apparatus for cabinet Download PDFInfo
- Publication number
- CN202713864U CN202713864U CN 201220161637 CN201220161637U CN202713864U CN 202713864 U CN202713864 U CN 202713864U CN 201220161637 CN201220161637 CN 201220161637 CN 201220161637 U CN201220161637 U CN 201220161637U CN 202713864 U CN202713864 U CN 202713864U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat abstractor
- hole
- cabinet
- buckle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat radiation apparatus for a cabinet, comprising a circuit board, and a heat radiation apparatus, wherein the circuit board is provided with a chip and a through hole, the heat radiation apparatus is uniformly provided with heat radiation fins, the heat radiation apparatus is fixed on the circuit board through a metal elastic piece and a fastener, the heat radiation apparatus is closely attached to the chip, and the fastener passes through the circular hole of the metal elastic piece and the through hole of the circuit board. The heat radiation apparatus for a cabinet is good in heat conduction effect and heat radiation effect, and long in service life, and can work under a bad environment.
Description
Technical field
The utility model relates to a kind of heat abstractor of cabinet, the application in merging based on the radiating effect between chip and the radiator.
Background technology
Heat abstractor is a kind of device of accelerating the heater dissipation of heat.Whether the quality of a heat abstractor of measurement, mainly contains 2 points: heat radiation and quiet.A large amount of integrated circuits that use in the 3U parts.As everyone knows, high temperature is the formidable enemy of integrated circuit, and high temperature not only can cause system's operation unstable, and shorten useful life, even some parts is burnt.The heat that causes high temperature is not from outside the cabinet, but cabinet inside, or perhaps IC interior.The effect of heat abstractor is exactly with these heat absorption, then diffuse in the cabinet or cabinet outside, guarantee that housing temperature is normal.Most heat abstractors are by contacting with chip surface, and absorbing heat is delivered to heat at a distance by the whole bag of tricks again, and in the air in the cabinet, then cabinet passes to these hot-airs outside the cabinet, finishes the heat radiation of cabinet.Like this, radiating effect is not fine.
For thermal diffusivity and the thermal conductivity that improves heat abstractor, at first should increase the radiating effect of chip, to satisfy the heat radiation requirement of cabinet; Under rugged environment, heat abstractor can not obtain infringement, and the radiation effect of heat abstractor is good; A kind of heat abstractor based on the radiating effect fusion application between chip and the heat abstractor of preferred design.
The utility model content
The purpose of this utility model is to overcome the above problem that prior art exists, and the heat abstractor of the splendid cabinet of a kind of radiating effect is provided.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the utility model is achieved through the following technical solutions:
A kind of heat abstractor of cabinet, comprise circuit board, radiator, be provided with chip on the described circuit board, be provided with through hole on the described circuit board, evenly be covered with radiation tooth on the described radiator, described radiator is fixed on the circuit board by metal clips and buckle, and the chip on circuit board is close to, and described buckle penetrates the circular hole of metal clips and the through hole of circuit board.
Further, described buckle is the plastic cement integral structure of reverse buckling type, and the buckle lower end is provided with resilient barb.
Further, described metal clips is provided with the breach that radiation tooth passes, and is used for reinforcing radiator, more increases the close property of radiator bottom and chip chamber, and the breach size on the described metal clips and the shape of shape and radiation tooth and size be coupling mutually.
Further, the through hole on the described circuit board is for interting reverse buckling type, the diameter the when diameter of described through hole is slightly less than elasticity back-off on the buckle and opens.
Preferably, described radiator is preferentially selected the aluminium alloy of black anodizing processing and extrusion molding.
Further, scribble silica gel between described radiator bottom and the chip, to increase further the bonding reliability in surface and to strengthen heat-conducting effect.
The beneficial effects of the utility model are:
The application of the heat abstractor of the utility model cabinet, has comparatively outstanding advantage, be embodied in: utilize buckle that radiator is fixed in circuit board, be close to chip, and scribble silica gel at chip surface, thermal diffusivity and thermal conductivity have been improved in the held against heat sink bottom further, have satisfied the heat radiation requirement of cabinet; Simultaneously, under rugged environment, radiator can be protected.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, below with preferred embodiment of the present utility model and cooperate accompanying drawing to be described in detail as follows.Embodiment of the present utility model is provided in detail by following examples and accompanying drawing thereof.
Description of drawings
Accompanying drawing described herein is used to provide further understanding of the present utility model, consists of the application's a part, and illustrative examples of the present utility model and explanation thereof are used for explaining the utility model, do not consist of improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is the construction for heat radiating device schematic diagram.
Number in the figure explanation: 1, circuit board, 11, chip, 12, through hole, 2, radiator, 21, radiation tooth, 3, metal clips, 31, circular hole, 32, breach, 4, buckle, 41, resilient barb.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the utility model in detail.
For heat dispersion and the heat conductivility of the heat abstractor that improves cabinet, the utility model proposes a kind of heat abstractor of cabinet.With reference to shown in Figure 1, a kind of heat abstractor of cabinet comprises circuit board 1, radiator 2, is provided with chip 11 on the described circuit board 1, is provided with through hole 12 on the described circuit board 1, evenly is covered with radiation tooth 21 on the described radiator 2.Be different from prior art: the designed radiator 2 of this programme is fixed on the circuit board 1 by metal clips 3 and buckle 4, and chip 11 surfaces on circuit board 1 are close to, and described buckle 4 penetrates the circular hole 31 of metal clips 3 and the through hole 12 of circuit board 1.In addition, the plastic cement integral structure that described buckle 4 is reverse buckling types, buckle 4 lower ends are provided with resilient barb 41.
In the technique scheme, described metal clips 3 is provided with the breach 32 that radiation tooth 21 passes, be used for reinforcing radiator 2, more increase the close property of 11 of radiator 2 bottoms and chips, breach 32 sizes on the described metal clips 3 and the shape of shape and radiation tooth 21 and size be coupling mutually.Scribble silica gel between described radiator 2 bottoms and the chip 11, to increase further the bonding reliability in surface and to strengthen heat-conducting effect.
Through hole 12 on the described circuit board 1 is for interting reverse buckling type, the diameter the when diameter of described through hole 12 is slightly less than elasticity back-off on the buckle 4 and opens.
As the further optimization of technique scheme, described radiator 2 is preferentially selected the aluminium alloy of black anodizing processing and extrusion molding, to improve thermal conductivity, thermal diffusivity and the useful life of radiator 2.
The above is preferred embodiment of the present utility model only, is not limited to the utility model, and for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (6)
1. the heat abstractor of a cabinet, comprise circuit board, radiator, be provided with chip on the described circuit board, be provided with through hole on the described circuit board, evenly be covered with radiation tooth on the described radiator, it is characterized in that: described radiator is fixed on the circuit board by metal clips and buckle, and the chip on circuit board is close to, and described buckle penetrates the circular hole of metal clips and the through hole of circuit board.
2. the heat abstractor of a kind of cabinet according to claim 1, it is characterized in that: described buckle is the plastic cement integral structure of reverse buckling type, and the buckle lower end is provided with resilient barb.
3. the heat abstractor of a kind of cabinet according to claim 1, it is characterized in that: described metal clips is provided with the breach that radiation tooth passes, and the breach size on the described metal clips and the shape of shape and radiation tooth and size be coupling mutually.
4. the heat abstractor of a kind of cabinet according to claim 1 is characterized in that: the through hole on the described circuit board is for interting reverse buckling type, the diameter the when diameter of described through hole is slightly less than elasticity back-off on the buckle and opens.
5. the heat abstractor of a kind of cabinet according to claim 1, it is characterized in that: described radiator is preferentially selected the aluminium alloy of black anodizing processing and extrusion molding.
6. the heat abstractor of a kind of cabinet according to claim 1 is characterized in that: scribble silica gel between described radiator bottom and the chip, to increase further the bonding reliability in surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220161637 CN202713864U (en) | 2012-04-17 | 2012-04-17 | Heat radiation apparatus for cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220161637 CN202713864U (en) | 2012-04-17 | 2012-04-17 | Heat radiation apparatus for cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202713864U true CN202713864U (en) | 2013-01-30 |
Family
ID=47594114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220161637 Expired - Lifetime CN202713864U (en) | 2012-04-17 | 2012-04-17 | Heat radiation apparatus for cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202713864U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105277037A (en) * | 2015-10-26 | 2016-01-27 | 重庆盛镁镁业有限公司 | Buckling-type flow-guide type aluminum alloy heat dissipating profile |
| CN112367450A (en) * | 2020-11-09 | 2021-02-12 | 重庆市天实精工科技有限公司 | DMS camera |
-
2012
- 2012-04-17 CN CN 201220161637 patent/CN202713864U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105277037A (en) * | 2015-10-26 | 2016-01-27 | 重庆盛镁镁业有限公司 | Buckling-type flow-guide type aluminum alloy heat dissipating profile |
| CN112367450A (en) * | 2020-11-09 | 2021-02-12 | 重庆市天实精工科技有限公司 | DMS camera |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SUZHOU HUAQI INTELLIGENT TECHNOLOGY CO., LTD. Free format text: FORMER NAME: EASYWAY (SUZHOU) INTELLIGENT SYSTEM CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 215000 Jiangsu city of Suzhou province science and Technology City high tech Zone Qingcheng Road No. 350 Patentee after: SUZHOU HUAQI INTELLIGENT TECHNOLOGY CO., LTD. Address before: 215000, No. 189, Kunlun mountain road, hi tech Zone, Suzhou, Jiangsu, Suzhou Patentee before: Yi Cheng (Suzhou) Intelligent System Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000 Jiangsu city of Suzhou province science and Technology City high tech Zone Qingcheng Road No. 350 Patentee after: SUZHOU HUAQI INTELLIGENT TECHNOLOGY CO., LTD. Address before: 215000 Jiangsu city of Suzhou province science and Technology City high tech Zone Qingcheng Road No. 350 Patentee before: SUZHOU HUAQI INTELLIGENT TECHNOLOGY CO., LTD. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130130 |
|
| CX01 | Expiry of patent term |