CN204131895U - Heat transfer catalysis heat dissipation structure - Google Patents
Heat transfer catalysis heat dissipation structure Download PDFInfo
- Publication number
- CN204131895U CN204131895U CN201420403619.2U CN201420403619U CN204131895U CN 204131895 U CN204131895 U CN 204131895U CN 201420403619 U CN201420403619 U CN 201420403619U CN 204131895 U CN204131895 U CN 204131895U
- Authority
- CN
- China
- Prior art keywords
- heat
- carrier
- heat dissipation
- carbon
- thermal source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 28
- 238000006555 catalytic reaction Methods 0.000 title claims abstract description 15
- 238000012546 transfer Methods 0.000 title abstract description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 27
- 229910021392 nanocarbon Inorganic materials 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 239000002994 raw material Substances 0.000 abstract description 6
- 238000013459 approach Methods 0.000 description 10
- 230000001737 promoting effect Effects 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat transfer catalysis heat dissipation structure comprises a carrier; a heat source disposed on one side of the carrier; and the six-membered ring carbon-based nano carbon heat dissipation film is at least arranged on the other surface of the carrier. Therefore, after absorbing the heat source, the carrier can dissipate heat by the six-membered ring carbon-based nano carbon heat dissipation film, and the six-membered ring carbon-based nano carbon heat dissipation film effectively guides heat to the air so as to avoid heat transfer fall between the carrier and the air, thereby achieving the effects of improving heat transfer efficiency, effectively reducing heat transfer bottleneck, needing no heat dissipation fins, greatly reducing heat dissipation cost, reducing volume and weight, reducing raw material consumption, saving energy and reducing carbon.
Description
Technical field
The utility model has about a kind of heat trnasfer catalysis radiator structure, after espespecially one can make carrier absorption thermal source, dispelled the heat by hexatomic ring carbon-based nano carbon heat dissipation film, and utilize hexatomic ring carbon-based nano carbon heat dissipation film effectively to guide heat trnasfer in air, to avoid producing heat trnasfer drop between carrier and air, and reach the effect promoting heat transfer effectiveness, effectively reduce heat trnasfer bottleneck, do not need use radiating fin, significantly reduce heat radiation cost, alleviate volume weight, reduce raw material consumption and carbon reduction.
Background technology
General cooling mechanism utilizes a thermal paste or high heat conduction layer, is placed between a radiator and a thermal source, and is provided with radiating fin further on radiator, use and utilize radiator to dispel the heat.
Modern with above-mentioned cooling mechanism, because the coefficient of heat conduction of veneer is less, therefore, method utilizes high radiating insulating layer (its coefficient of heat conduction is larger) to replace veneer, but due to bottleneck and the barrier of heat trnasfer, not betide the interface of thermal source and radiator, but betide the interface that radiator contacts with air, because this interface exists very large heat trnasfer drop, (namely the heat trnasfer of radiator is large, right air heat trnasfer is little), though the high radiating insulating layer that this cooling mechanism utilizes the coefficient of heat conduction larger is to replace veneer, attempt to promote heat transfer effectiveness, right heat is via heat trnasfer approach in radiator, when being delivered between radiator and air, by the huge drop because of heat transfer effectiveness, and produce the hot reflux of heat trnasfer approach in radiator, therefore, cause bottleneck and the barrier of heat trnasfer.Therefore cooling mechanism is the method without positive effect, because high heat conduction layer is placed between the two by it, though contribute to promoting heat trnasfer, limited success, because basic heat trnasfer bottleneck and barrier, be not resolved, therefore, bad problem of dispelling the heat there is no method and is effectively improved; And except above-mentioned carried shortcoming, the setting of this radiating fin more can cause the disappearance increasing heat radiation cost, increase the volume weight of equipment and waste raw material simultaneously.
In view of this, the designer spy of this case has used utility model problem further investigated for aforementioned, and in for a long time, and under rigorous actual test, find bottleneck and the barrier of heat trnasfer, not between radiator and thermal source, but be present in radiator and contact part with air, therefore, the applicant of this case is by research and development and the manufacturing experience of being engaged in related industry for many years, actively seek solution, through the research and development of long-term endeavour, finally successfully the utility model is developed, propose from the most basic, the bottleneck of direct elimination or reduction heat radiation and the method for barrier, use improvement variety of problems.
Utility model content
The utility model main purpose is, after carrier absorption thermal source can be made, dispelled the heat by hexatomic ring carbon-based nano carbon heat dissipation film, and utilize hexatomic ring carbon-based nano carbon heat dissipation film effectively to guide heat trnasfer in air, to avoid producing heat trnasfer drop between carrier and air, and reach the effect promoting heat transfer effectiveness, effectively reduce heat trnasfer bottleneck, do not need use radiating fin, significantly reduce heat radiation cost, alleviate volume weight, reduce raw material consumption and carbon reduction.
For reaching above-mentioned purpose, a kind of heat trnasfer catalysis of the utility model radiator structure, it includes: a hot body; One is located at the thermal source in carrier one side; And the hexatomic ring carbon-based nano carbon heat dissipation film be at least located on carrier another side.
In the above embodiments, combine with veneer between this carrier and thermal source.
In the above embodiments, between this carrier and thermal source, be combined with a high radiating insulating layer.
In the above embodiments, this carrier includes but not limited to fin, fan and water-filled radiator.
In the above embodiments, another hexatomic ring carbon-based nano carbon heat dissipation film between this thermal source and carrier, can be provided with further.
Accompanying drawing explanation
Fig. 1 is the profile status schematic diagram of the utility model first embodiment.
Fig. 2 is the heat trnasfer view of the utility model first embodiment.
Fig. 3 is the profile status schematic diagram of the utility model second embodiment.
Fig. 4 is the profile status schematic diagram of the utility model the 3rd embodiment.
Reference numerals contrasts:
Carrier 1;
Veneer 11;
Heat trnasfer approach 111 in veneer;
Heat trnasfer approach 112 in carrier;
Heat trnasfer approach 113 in heat dissipation film;
Heat trnasfer approach 114 in air after catalysis;
Thermal source 2;
Hexatomic ring carbon-based nano carbon heat dissipation film 3,3a;
High radiating insulating layer 4.
Embodiment
Refer to shown in Fig. 1 and Fig. 2, be respectively the profile status schematic diagram of the utility model first embodiment and the heat trnasfer view of the utility model first embodiment.As shown in the figure: the utility model is a kind of heat trnasfer catalysis radiator structure, it is at least made up of carrier 1, thermal source 2 and a hexatomic ring carbon-based nano carbon heat dissipation film 3.
Above-mentioned carried carrier 1 includes but not limited to fin, fan and water-filled radiator.
This thermal source 2 is located in the one side of carrier 1, and combines with veneer 11 between this carrier 1 and thermal source 2.
This hexatomic ring carbon-based nano carbon heat dissipation film 3 is at least located on the another side of carrier 1 (i.e. carrier 1 contact with air one side).In this way, the heat trnasfer catalysis radiator structure that the Structure composing one of above is brand-new.
When the utility model is in time using, heat to be manufactured by thermal source 2 and starts outwards transmission (this thermal source 2 includes but not limited to processor CPU, drawing chip, LED chip, solar chip and engine internal combustion ... Deng), and absorb by carrier 1 heat energy that thermal source 2 sends, and dispel the heat with hexatomic ring carbon-based nano carbon heat dissipation film 3, and the heat produced due to thermal source 1 is when outwards transmitting, because the conductive coefficient of veneer 11 is less, therefore the heat transfer effectiveness of heat trnasfer approach 111 is lower in veneer, after heat enters carrier 1, conductive coefficient then because of carrier 1 is larger, therefore the heat transfer effectiveness of heat trnasfer approach 112 is higher in carrier, because heat transfer effectiveness in air is extremely low, therefore at interface, the highest with minimum heat trnasfer drop causes heat trnasfer obstacle, hexatomic ring carbon-based nano carbon heat dissipation film 3 set by the utility model, can as the pedal of heat trnasfer bottleneck or barrier between carrier 1 and air, effectively heat trnasfer is guided with heat trnasfer approach 113 in its heat dissipation film, and coordinate carrier 1 to transfer heat in air, reach the effect effectively promoting heat transfer effectiveness, the heat transfer effectiveness of heat trnasfer approach 114 in air after catalysis, close to the heat transfer efficiency of heat transfer interface 2, therefore do not need use radiating fin and significantly can reduce heat radiation cost, and alleviate the volume weight of equipment, in addition more can reduce raw material consumption and meet effect of carbon reduction.
Referring to shown in Fig. 3, is the profile status schematic diagram of the utility model second embodiment.As shown in the figure: the utility model is carried except structural form except above-mentioned first embodiment, more can be the structural form of this second embodiment, and its difference is, is combined with a high radiating insulating layer 4 between this carrier 1 and thermal source 2; So, the heat penetration that thermal source 1 can be made to produce is crossed high radiating insulating layer 4 and is passed to carrier 1, after carrier 1 absorbs thermal source, coordinate hexatomic ring carbon-based nano carbon heat dissipation film 3 to dispel the heat simultaneously, and reach the effect promoting heat transfer effectiveness and effectively reduce heat trnasfer bottleneck equally.
Referring to shown in Fig. 4, is that the section of the utility model the 3rd embodiment shows that state is intended to.As shown in the figure: the utility model is carried except structural form except first and second embodiment above-mentioned, more can be the structural form of this 3rd embodiment, and its difference is, another hexatomic ring carbon-based nano carbon heat dissipation film 3a between this thermal source 2 and carrier 1, can be provided with further; So, the heat penetration that thermal source 2 can be made to produce is crossed first hexatomic ring carbon-based nano carbon heat dissipation film 3a and is passed to carrier 1, after carrier 1 absorbs thermal source, coordinate second hexatomic ring carbon-based nano carbon heat dissipation film 3 to dispel the heat simultaneously, and reach the effect promoting heat transfer effectiveness and effectively reduce heat trnasfer bottleneck equally, use make the utility model can more realistic use time needed for.
In sum, the utility model heat trnasfer catalysis radiator structure effectively can improve various shortcoming, after carrier absorption thermal source can be made, dispelled the heat by hexatomic ring carbon-based nano carbon heat dissipation film, and utilize hexatomic ring carbon-based nano carbon heat dissipation film effectively to guide heat trnasfer in air, to avoid producing heat trnasfer drop between carrier and air, and reach the effect promoting heat transfer effectiveness, effectively reduce heat trnasfer bottleneck, do not need use radiating fin, significantly reduce heat radiation cost, alleviate volume weight, reduce raw material consumption and carbon reduction; And then make generation of the present utility model more progressive, more practical, more can meet institute's palpus of consumer's use, indeed meet utility application important document, whence proposes patent application in accordance with the law.
Only the above, be only preferred embodiment of the present utility model, when can not limit the scope of the utility model enforcement with this; Therefore, all simple equivalence changes done according to the utility model claims and utility model description with modify, all should still belong in scope that the utility model patent contains.
Claims (5)
1. a heat trnasfer catalysis radiator structure, it includes a carrier; One thermal source is located in the one side of carrier; It is characterized in that, a hexatomic ring carbon-based nano carbon heat dissipation film is at least located on the another side of carrier.
2. heat trnasfer catalysis radiator structure according to claim 1, is characterized in that, combine between this carrier and thermal source with veneer.
3. heat trnasfer catalysis radiator structure according to claim 1, is characterized in that, is combined with a high radiating insulating layer between this carrier and thermal source.
4. heat trnasfer catalysis radiator structure according to claim 1, it is characterized in that, this carrier includes but not limited to fin, fan and water-filled radiator.
5. heat trnasfer catalysis radiator structure according to claim 1, is characterized in that, is provided with another hexatomic ring carbon-based nano carbon heat dissipation film between this thermal source and carrier further.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102223395 | 2013-12-11 | ||
| TW102223395U TWM483543U (en) | 2013-12-11 | 2013-12-11 | Heat transfer catalysis and heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204131895U true CN204131895U (en) | 2015-01-28 |
Family
ID=51793214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420403619.2U Expired - Fee Related CN204131895U (en) | 2013-12-11 | 2014-07-21 | Heat transfer catalysis heat dissipation structure |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20150159969A1 (en) |
| CN (1) | CN204131895U (en) |
| TW (1) | TWM483543U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110491846A (en) * | 2019-07-16 | 2019-11-22 | 广东埃文低碳科技股份有限公司 | A kind of chip using low-grade fever generator |
| CN111148943A (en) * | 2017-08-01 | 2020-05-12 | 昕诺飞控股有限公司 | Lighting device and method of manufacturing a lighting device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11676880B2 (en) | 2016-11-26 | 2023-06-13 | Texas Instruments Incorporated | High thermal conductivity vias by additive processing |
| US11004680B2 (en) | 2016-11-26 | 2021-05-11 | Texas Instruments Incorporated | Semiconductor device package thermal conduit |
| US10811334B2 (en) | 2016-11-26 | 2020-10-20 | Texas Instruments Incorporated | Integrated circuit nanoparticle thermal routing structure in interconnect region |
| US10529641B2 (en) * | 2016-11-26 | 2020-01-07 | Texas Instruments Incorporated | Integrated circuit nanoparticle thermal routing structure over interconnect region |
| US10861763B2 (en) | 2016-11-26 | 2020-12-08 | Texas Instruments Incorporated | Thermal routing trench by additive processing |
| US10256188B2 (en) | 2016-11-26 | 2019-04-09 | Texas Instruments Incorporated | Interconnect via with grown graphitic material |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5339214A (en) * | 1993-02-12 | 1994-08-16 | Intel Corporation | Multiple-fan microprocessor cooling through a finned heat pipe |
| US7542290B2 (en) * | 2006-09-26 | 2009-06-02 | Hewlett-Packard Development Company, L.P. | Computer device cooling system |
-
2013
- 2013-12-11 TW TW102223395U patent/TWM483543U/en not_active IP Right Cessation
-
2014
- 2014-05-28 US US14/288,516 patent/US20150159969A1/en not_active Abandoned
- 2014-07-21 CN CN201420403619.2U patent/CN204131895U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148943A (en) * | 2017-08-01 | 2020-05-12 | 昕诺飞控股有限公司 | Lighting device and method of manufacturing a lighting device |
| CN111148943B (en) * | 2017-08-01 | 2022-07-01 | 昕诺飞控股有限公司 | Lighting device and method of manufacturing a lighting device |
| CN110491846A (en) * | 2019-07-16 | 2019-11-22 | 广东埃文低碳科技股份有限公司 | A kind of chip using low-grade fever generator |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM483543U (en) | 2014-08-01 |
| US20150159969A1 (en) | 2015-06-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151126 Address after: Taiwan, Taipei, China Fuxing North Road, No. 2, building 1, 1 Patentee after: In Yang Engineering Development Co. Ltd. Address before: 4, Lane 14, 557 lane, Ming Shui Road, Zhongshan District, Taipei, Taiwan, China Patentee before: Zhong Yang power limited company |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150128 Termination date: 20180721 |