CN204090421U - The radiator of electronic device - Google Patents
The radiator of electronic device Download PDFInfo
- Publication number
- CN204090421U CN204090421U CN201420590421.XU CN201420590421U CN204090421U CN 204090421 U CN204090421 U CN 204090421U CN 201420590421 U CN201420590421 U CN 201420590421U CN 204090421 U CN204090421 U CN 204090421U
- Authority
- CN
- China
- Prior art keywords
- radiator
- top board
- supporting bracket
- substrate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 13
- 239000003570 air Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000012080 ambient air Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a kind of radiator of electronic device, it comprises a substrate, a top board and one to three supporting bracket, described supporting bracket is fixed on described substrate, described top board is fixed in described supporting bracket top, described top board is parallel to described substrate, described supporting bracket is for supporting described top board, and described substrate, described top board and described supporting bracket are one-body molded.When reaching same radiating effect, compared with existing wing radiator, electronic-device radiator structure of the present utility model is simple, lightweight, reduces cost.
Description
Technical field
The utility model relates to a kind of radiator, particularly a kind of radiator of electronic device.
Background technology
Because current terminal electronic product integrated level is more and more higher, performance is become better and better, its caloric value corresponding is also in geometric increase, and the heat produced when the electronic device in product runs must be dispersed into rapidly in environment just can be avoided temperature too high and burn device.The transmission of heat has conduction heat exchange, heat convection and radiation heat transfer three kinds of modes, and in terminal equipment, these three kinds of heat exchange modes all exist.In same environment, the heat of heat sink radiates and the heat exchange area of radiator linear, namely the heat of heat sink radiates increases along with the increase of heat exchange area.
Radiator selected by general end product is wing radiator, and material is aluminium or copper, passes through extrusion modling.The advantage of wing heat spreader structures is strengthen its heat transfer sheet area by the quantity increasing fin in equal space, is distributed in air by the heat absorbed by large heat exchange area from chip.But we find in actual product, the radiating effect of wing radiator is not good especially, reason is that the inner space of electronic product is closed limited, the Natural Heat Convection of radiator is very faint, almost can not consider, therefore radiator can only be dispelled the heat by conduction heat exchange and radiation heat transfer in this case.
For heat loss through conduction and heat loss through radiation, it is also very ineffective that wing radiator increases heat exchange area by the quantity of increase fin.Reason is that the side between two fins contacts with air and carries out heat exchange, and this part air does not flow, and first by the air heat between two side, then can only be delivered in radiator ambient air by heat by the air of this part heating.The back side of radiator directly and chip fit, do not participate in heat exchange.As shown in Figure 1, effective heat-transfer surface of wing radiator can be reduced to two section A, two side B and end face C.
Utility model content
The technical problems to be solved in the utility model is the defect in order to overcome in prior art that wing radiator efficiently radiates heat area is little, radiating effect is not good etc., provides a kind of radiator of electronic device.
The utility model solves above-mentioned technical problem by following technical proposals:
A kind of radiator of electronic device, its feature is, it comprises a substrate, a top board and one to three supporting bracket, described supporting bracket is fixed on described substrate, described top board is fixed in described supporting bracket top, described top board is parallel to described substrate, and described supporting bracket is for supporting described top board, and described substrate, described top board and described supporting bracket are one-body molded.
In this programme, described substrate absorbs the heat that electronic device transmits, and the heat that described substrate absorbs by described supporting bracket is delivered to described top board rapidly.The upper and lower surface of described top board is all closely connected with surrounding air and forms effective radiating surface, and therefore described top board can well by heat conduction and radiateing.
Preferably, the area of described top board is greater than the area of described substrate.Larger radiating surface can be formed like this, accelerate heat radiation.
Preferably, described supporting bracket is two, and described supporting bracket is parallel to be fixed on described substrate.
Preferably, described top board forms a strip gab between described supporting bracket, and described strip gab is through described top board, and described strip gab is parallel to described substrate.Described top board does not superpose with described substrate, and the upper surface of described top board and portion lower surface all as efficiently radiates heat face, can substantially increase efficiently radiates heat face, improve radiating effect.
Preferably, described supporting bracket is three, and described supporting bracket is parallel to be fixed on described substrate.The number increasing described supporting bracket can increase the tie point between radiator base plate and top board, and the electronic device heat that substrate absorbs can be delivered to top board more rapidly, more uniformly by supporting bracket, improves radiating effect.
Preferably, the material of described radiator is aluminium or copper.
On the basis meeting this area general knowledge, above-mentioned each optimum condition, can combination in any, obtains each preferred embodiments of the utility model.
Positive progressive effect of the present utility model is: the utility model is simpler than the structure of existing wing radiator, efficiently radiates heat area large, good heat dissipation effect, when reaching same radiating effect, lightweight obviously than existing wing radiator of electronic-device radiator of the present utility model, reduces cost.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the effective heat-transfer surface of prior art wing radiator.
Fig. 2 is the structural representation of the utility model embodiment 1 radiator.
Fig. 3 is the schematic diagram of the effective heat-transfer surface of the utility model embodiment 1 radiator.
Fig. 4 is the structural front view of the utility model embodiment 2 radiator.
Fig. 5 is the structural front view of the utility model embodiment 3 radiator.
Fig. 6 is the structural representation of the utility model embodiment 4 radiator.
Embodiment
Lift preferred embodiment below, and come by reference to the accompanying drawings clearlyer intactly the utility model to be described.
Embodiment 1
As shown in Figure 2, the radiator of the present embodiment electronic device, material is aluminium, by extrusion modling, it comprises substrate 1, supporting bracket 2 and top board 3, and supporting bracket 2 is fixed on substrate 1, top board 3 is fixed in supporting bracket 2 top, top board 3 is parallel to substrate 1, and supporting bracket 2 is for roof supporting 3, and described substrate 1, described supporting bracket 2 and described top board 3 are one-body molded.
As shown in Figure 3, effective heat-transfer surface of the present embodiment is two section A ', the upper surface C ' of two side B ', end face and the portion lower surface D ' that contacts completely with surrounding air.The heatsink weight of the present embodiment is 7g, is of a size of 35mm*29mm*10mm, and sectional area is 88mm
2, lateral area is 290mm
2, top surface area is 1015mm
2, the effective heat exchange area after simplification is 2234mm
2.
Comparative example 1
As shown in Figure 1, the weight of wing radiator is 13g, is of a size of 35mm*29mm*10mm, and sectional area is 139mm
2, lateral area is 350mm
2, the top of fin is arc surface, and therefore top surface area is greater than 35mm*29mm, is the area sum between all fin top circular arc areas and each fin bottom portion, and calculating top surface area is 1234mm
2.Therefore the effective heat exchange area after the simplification of wing radiator is 2212mm
2.
When ensureing that test environment is consistent, be installed on respectively by this two radiator with in a collection of electronic product processor chips, by embodiment 1 and comparative example 1 being contrasted, its contrast radiating effect is as shown in table 1.
Table 1 embodiment 1 radiator compares with the radiating effect of comparative example 1 radiator
As can be seen from above data, when same size, embodiment 1 is substantially identical with the effective heat exchange area of comparative example 1 radiator, and radiating effect is also substantially identical, but weight ratio comparative example 1 radiator of embodiment 1 radiator is light 46%, significantly reduce cost.
Embodiment 2
As shown in Figure 4, the radiator of the present embodiment electronic device comprises substrate 1, two supporting brackets 2 and top board 3, two supporting brackets 2 are parallel is fixed on substrate 1.Two place's tie points are had, good heat dissipation effect between substrate 1 and top board 3.
Embodiment 3
As shown in Figure 5, the radiator of the present embodiment electronic device comprises substrate 1, three supporting brackets 2 and top board 3, three supporting brackets 2 are parallel is fixed on substrate 1.Three place's tie points are had, good heat dissipation effect between substrate 1 and top board 3.
Embodiment 4
As shown in Figure 6, the radiator of the present embodiment electronic device comprises substrate 1, two supporting brackets 2 and top board 3, and top board 3 forms a strip gab between two supporting brackets 2, and described strip gab is through described top board 3, and described strip gab is parallel to substrate 1.Top board 3 does not superpose with substrate 1, and the upper surface of substrate 1 contacts completely with ambient air.Therefore the upper and lower surface of top board 3 all as efficiently radiates heat face, can substantially increase efficiently radiates heat face, improves radiating effect widely.The top board of the present embodiment is long, not easily fixes, and needs increase screw or buckle to be fixed on mainboard.
Although the foregoing describe embodiment of the present utility model, it will be understood by those of skill in the art that these only illustrate, protection range of the present utility model is defined by the appended claims.Those skilled in the art, under the prerequisite not deviating from principle of the present utility model and essence, can make various changes or modifications to these execution modes, but these change and amendment all falls into protection range of the present utility model.
Claims (6)
1. the radiator of an electronic device, it is characterized in that, it comprises a substrate, a top board and one to three supporting bracket, described supporting bracket is fixed on described substrate, described top board is fixed in described supporting bracket top, described top board is parallel to described substrate, and described supporting bracket is for supporting described top board, and described substrate, described top board and described supporting bracket are one-body molded.
2. radiator as claimed in claim 1, it is characterized in that, the area of described top board is greater than the area of described substrate.
3. radiator as claimed in claim 1, it is characterized in that, described supporting bracket is two, and described supporting bracket is parallel to be fixed on described substrate.
4. radiator as claimed in claim 3, it is characterized in that, described top board forms a strip gab between described supporting bracket, and described strip gab is through described top board, and described strip gab is parallel to described substrate.
5. radiator as claimed in claim 1, it is characterized in that, described supporting bracket is three, and described supporting bracket is parallel to be fixed on described substrate.
6. radiator as claimed in claim 1, it is characterized in that, the material of described radiator is aluminium or copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420590421.XU CN204090421U (en) | 2014-10-13 | 2014-10-13 | The radiator of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420590421.XU CN204090421U (en) | 2014-10-13 | 2014-10-13 | The radiator of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204090421U true CN204090421U (en) | 2015-01-07 |
Family
ID=52183083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420590421.XU Expired - Fee Related CN204090421U (en) | 2014-10-13 | 2014-10-13 | The radiator of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204090421U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378954A (en) * | 2014-10-13 | 2015-02-25 | 上海仪电数字技术有限公司 | Radiator of electronic device |
-
2014
- 2014-10-13 CN CN201420590421.XU patent/CN204090421U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378954A (en) * | 2014-10-13 | 2015-02-25 | 上海仪电数字技术有限公司 | Radiator of electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |