CN104378954A - Radiator of electronic device - Google Patents
Radiator of electronic device Download PDFInfo
- Publication number
- CN104378954A CN104378954A CN201410538358.XA CN201410538358A CN104378954A CN 104378954 A CN104378954 A CN 104378954A CN 201410538358 A CN201410538358 A CN 201410538358A CN 104378954 A CN104378954 A CN 104378954A
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- China
- Prior art keywords
- radiator
- top board
- supporting bracket
- heat
- substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a radiator of an electronic device. The radiator comprises a base plate, a top plate and one to three supporting plates, wherein the supporting plates are fixedly connected to the base plate, the top plate is fixedly connected to the tops of the supporting plates and is parallel to the base plate, the supporting plates are used for supporting the top plate, and the base plate, the top plate and the supporting plates are formed integrally. Under the condition that the same heat radiation effect is achieved and compared with existing fin type radiators. The radiator of the electronic device is simple in structure and light in weight, and cost is reduced.
Description
Technical field
The present invention relates to a kind of radiator, particularly a kind of radiator of electronic device.
Background technology
Because current terminal electronic product integrated level is more and more higher, performance is become better and better, its caloric value corresponding is also in geometric increase, and the heat produced when the electronic device in product runs must be dispersed into rapidly in environment just can be avoided temperature too high and burn device.The transmission of heat has conduction heat exchange, heat convection and radiation heat transfer three kinds of modes, and in terminal equipment, these three kinds of heat exchange modes all exist.In same environment, the heat of heat sink radiates and the heat exchange area of radiator linear, namely the heat of heat sink radiates increases along with the increase of heat exchange area.
Radiator selected by general end product is wing radiator, and material is aluminium or copper, passes through extrusion modling.The advantage of wing heat spreader structures is strengthen its heat transfer sheet area by the quantity increasing fin in equal space, is distributed in air by the heat absorbed by large heat exchange area from chip.But we find in actual product, the radiating effect of wing radiator is not good especially, reason is that the inner space of electronic product is closed limited, the Natural Heat Convection of radiator is very faint, almost can not consider, therefore radiator can only be dispelled the heat by conduction heat exchange and radiation heat transfer in this case.
For heat loss through conduction and heat loss through radiation, it is also very ineffective that wing radiator increases heat exchange area by the quantity of increase fin.Reason is that the side between two fins contacts with air and carries out heat exchange, and this part air does not flow, and first by the air heat between two side, then can only be delivered in radiator ambient air by heat by the air of this part heating.The back side of radiator directly and chip fit, do not participate in heat exchange.As shown in Figure 1, effective heat-transfer surface of wing radiator can be reduced to two section A, two side B and end face C.
Summary of the invention
The technical problem to be solved in the present invention is the defect in order to overcome in prior art that wing radiator efficiently radiates heat area is little, radiating effect is not good etc., provides a kind of radiator of electronic device.
The present invention solves above-mentioned technical problem by following technical proposals:
A kind of radiator of electronic device, its feature is, it comprises a substrate, a top board and one to three supporting bracket, described supporting bracket is fixed on described substrate, described top board is fixed in described supporting bracket top, described top board is parallel to described substrate, and described supporting bracket is for supporting described top board, and described substrate, described top board and described supporting bracket are one-body molded.
In this programme, described substrate absorbs the heat that electronic device transmits, and the heat that described substrate absorbs by described supporting bracket is delivered to described top board rapidly.The upper and lower surface of described top board is all closely connected with surrounding air and forms effective radiating surface, and therefore described top board can well by heat conduction and radiateing.
Preferably, the area of described top board is greater than the area of described substrate.Larger radiating surface can be formed like this, accelerate heat radiation.
Preferably, described supporting bracket is two, and described supporting bracket is parallel to be fixed on described substrate.
Preferably, described top board forms a strip gab between described supporting bracket, and described strip gab is through described top board, and described strip gab is parallel to described substrate.Described top board does not superpose with described substrate, and the upper surface of described top board and portion lower surface all as efficiently radiates heat face, can substantially increase efficiently radiates heat face, improve radiating effect.
Preferably, described supporting bracket is three, and described supporting bracket is parallel to be fixed on described substrate.The number increasing described supporting bracket can increase the tie point between radiator base plate and top board, and the electronic device heat that substrate absorbs can be delivered to top board more rapidly, more uniformly by supporting bracket, improves radiating effect.
Preferably, the material of described radiator is aluminium or copper.
On the basis meeting this area general knowledge, above-mentioned each optimum condition, can combination in any, obtains the preferred embodiments of the invention.
Positive progressive effect of the present invention is: the present invention is simpler than the structure of existing wing radiator, efficiently radiates heat area large, good heat dissipation effect, when reaching same radiating effect, lightweight obviously than existing wing radiator of electronic-device radiator of the present invention, reduces cost.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the effective heat-transfer surface of prior art wing radiator.
Fig. 2 is the structural representation of the embodiment of the present invention 1 radiator.
Fig. 3 is the schematic diagram of the effective heat-transfer surface of the embodiment of the present invention 1 radiator.
Fig. 4 is the structural front view of the embodiment of the present invention 2 radiator.
Fig. 5 is the structural front view of the embodiment of the present invention 3 radiator.
Fig. 6 is the structural representation of the embodiment of the present invention 4 radiator.
Embodiment
Below by the mode of embodiment, and come by reference to the accompanying drawings clearlyer intactly the present invention to be described.
Embodiment 1
As shown in Figure 2, the radiator of the present embodiment electronic device, material is aluminium, by extrusion modling, it comprises substrate 1, supporting bracket 2 and top board 3, and supporting bracket 2 is fixed on substrate 1, top board 3 is fixed in supporting bracket 2 top, top board 3 is parallel to substrate 1, and supporting bracket 2 is for roof supporting 3, and described substrate 1, described supporting bracket 2 and described top board 3 are one-body molded.
As shown in Figure 3, effective heat-transfer surface of the present embodiment is two section A ', the upper surface C ' of two side B ', end face and the portion lower surface D ' that contacts completely with surrounding air.The heatsink weight of the present embodiment is 7g, is of a size of 35mm*29mm*10mm, and sectional area is 88mm
2, lateral area is 290mm
2, top surface area is 1015mm
2, the effective heat exchange area after simplification is 2234mm
2.
Comparative example 1
As shown in Figure 1, the weight of wing radiator is 13g, is of a size of 35mm*29mm*10mm, and sectional area is 139mm
2, lateral area is 350mm
2, the top of fin is arc surface, and therefore top surface area is greater than 35mm*29mm, is the area sum between all fin top circular arc areas and each fin bottom portion, and calculating top surface area is 1234mm
2.Therefore the effective heat exchange area after the simplification of wing radiator is 2212mm
2.
When ensureing that test environment is consistent, be installed on respectively by this two radiator with in a collection of electronic product processor chips, by embodiment 1 and comparative example 1 being contrasted, its contrast radiating effect is as shown in table 1.
Table 1 embodiment 1 radiator compares with the radiating effect of comparative example 1 radiator
As can be seen from above data, when same size, embodiment 1 is substantially identical with the effective heat exchange area of comparative example 1 radiator, and radiating effect is also substantially identical, but weight ratio comparative example 1 radiator of embodiment 1 radiator is light 46%, significantly reduce cost.
Embodiment 2
As shown in Figure 4, the radiator of the present embodiment electronic device comprises substrate 1, two supporting brackets 2 and top board 3, two supporting brackets 2 are parallel is fixed on substrate 1.Two place's tie points are had, good heat dissipation effect between substrate 1 and top board 3.
Embodiment 3
As shown in Figure 5, the radiator of the present embodiment electronic device comprises substrate 1, three supporting brackets 2 and top board 3, three supporting brackets 2 are parallel is fixed on substrate 1.Three place's tie points are had, good heat dissipation effect between substrate 1 and top board 3.
Embodiment 4
As shown in Figure 6, the radiator of the present embodiment electronic device comprises substrate 1, two supporting brackets 2 and top board 3, and top board 3 forms a strip gab between two supporting brackets 2, and described strip gab is through described top board 3, and described strip gab is parallel to substrate 1.Top board 3 does not superpose with substrate 1, and the upper surface of substrate 1 contacts completely with ambient air.Therefore the upper and lower surface of top board 3 all as efficiently radiates heat face, can substantially increase efficiently radiates heat face, improves radiating effect widely.The top board of the present embodiment is long, not easily fixes, and needs increase screw or buckle to be fixed on mainboard.
Although the foregoing describe the specific embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, protection scope of the present invention is defined by the appended claims.Those skilled in the art, under the prerequisite not deviating from principle of the present invention and essence, can make various changes or modifications to these execution modes, but these change and amendment all falls into protection scope of the present invention.
Claims (6)
1. the radiator of an electronic device, it is characterized in that, it comprises a substrate, a top board and one to three supporting bracket, described supporting bracket is fixed on described substrate, described top board is fixed in described supporting bracket top, described top board is parallel to described substrate, and described supporting bracket is for supporting described top board, and described substrate, described top board and described supporting bracket are one-body molded.
2. radiator as claimed in claim 1, it is characterized in that, the area of described top board is greater than the area of described substrate.
3. radiator as claimed in claim 1, it is characterized in that, described supporting bracket is two, and described supporting bracket is parallel to be fixed on described substrate.
4. radiator as claimed in claim 3, it is characterized in that, described top board forms a strip gab between described supporting bracket, and described strip gab is through described top board, and described strip gab is parallel to described substrate.
5. radiator as claimed in claim 1, it is characterized in that, described supporting bracket is three, and described supporting bracket is parallel to be fixed on described substrate.
6. radiator as claimed in claim 1, it is characterized in that, the material of described radiator is aluminium or copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410538358.XA CN104378954A (en) | 2014-10-13 | 2014-10-13 | Radiator of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410538358.XA CN104378954A (en) | 2014-10-13 | 2014-10-13 | Radiator of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104378954A true CN104378954A (en) | 2015-02-25 |
Family
ID=52557507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410538358.XA Pending CN104378954A (en) | 2014-10-13 | 2014-10-13 | Radiator of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104378954A (en) |
Citations (13)
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|---|---|---|---|---|
| CN1347264A (en) * | 2000-10-11 | 2002-05-01 | 广礼有限公司 | Heat radiator of heat-generating PTC element and PTC heater made of it |
| CN2624403Y (en) * | 2003-04-29 | 2004-07-07 | Tcl王牌电子(深圳)有限公司 | Semiconductor device radiator capable of combined using |
| US20050111195A1 (en) * | 2004-11-30 | 2005-05-26 | Silicon Integrated Systems Corp. | Heat dissipation mechanism for electronic apparatus |
| CN1819755A (en) * | 2005-02-08 | 2006-08-16 | 株式会社东芝 | Heat radiating apparatus in electronic device and heat radiating method |
| CN1822759A (en) * | 2005-02-18 | 2006-08-23 | 株式会社东芝 | Heat dissipation device and heat dissipation method for electronic equipment |
| US20080285224A1 (en) * | 2007-05-15 | 2008-11-20 | Ricoh Company, Ltd | Information processing apparatus |
| JP2010251634A (en) * | 2009-04-20 | 2010-11-04 | Ricoh Co Ltd | Heat transfer mechanism and information equipment |
| JP4952613B2 (en) * | 2008-02-26 | 2012-06-13 | 市光工業株式会社 | Vehicle lighting |
| CN103443944A (en) * | 2011-03-24 | 2013-12-11 | 株式会社神户制钢所 | Heat sink for led lighting |
| TW201422137A (en) * | 2012-09-07 | 2014-06-01 | Lg Innotek Co Ltd | Heat radiation member, heat radiation circuit board, and heat emission device package |
| CN203691835U (en) * | 2013-09-27 | 2014-07-02 | 上海广电电子科技有限公司 | Intelligent set top box |
| CN103917824A (en) * | 2011-12-07 | 2014-07-09 | 株式会社神户制钢所 | Led lighting heat sink and method for manufacturing same |
| CN204090421U (en) * | 2014-10-13 | 2015-01-07 | 上海仪电数字技术有限公司 | The radiator of electronic device |
-
2014
- 2014-10-13 CN CN201410538358.XA patent/CN104378954A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1347264A (en) * | 2000-10-11 | 2002-05-01 | 广礼有限公司 | Heat radiator of heat-generating PTC element and PTC heater made of it |
| CN2624403Y (en) * | 2003-04-29 | 2004-07-07 | Tcl王牌电子(深圳)有限公司 | Semiconductor device radiator capable of combined using |
| US20050111195A1 (en) * | 2004-11-30 | 2005-05-26 | Silicon Integrated Systems Corp. | Heat dissipation mechanism for electronic apparatus |
| CN1819755A (en) * | 2005-02-08 | 2006-08-16 | 株式会社东芝 | Heat radiating apparatus in electronic device and heat radiating method |
| CN1822759A (en) * | 2005-02-18 | 2006-08-23 | 株式会社东芝 | Heat dissipation device and heat dissipation method for electronic equipment |
| US20080285224A1 (en) * | 2007-05-15 | 2008-11-20 | Ricoh Company, Ltd | Information processing apparatus |
| JP4952613B2 (en) * | 2008-02-26 | 2012-06-13 | 市光工業株式会社 | Vehicle lighting |
| JP2010251634A (en) * | 2009-04-20 | 2010-11-04 | Ricoh Co Ltd | Heat transfer mechanism and information equipment |
| CN103443944A (en) * | 2011-03-24 | 2013-12-11 | 株式会社神户制钢所 | Heat sink for led lighting |
| CN103917824A (en) * | 2011-12-07 | 2014-07-09 | 株式会社神户制钢所 | Led lighting heat sink and method for manufacturing same |
| TW201422137A (en) * | 2012-09-07 | 2014-06-01 | Lg Innotek Co Ltd | Heat radiation member, heat radiation circuit board, and heat emission device package |
| CN203691835U (en) * | 2013-09-27 | 2014-07-02 | 上海广电电子科技有限公司 | Intelligent set top box |
| CN204090421U (en) * | 2014-10-13 | 2015-01-07 | 上海仪电数字技术有限公司 | The radiator of electronic device |
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Application publication date: 20150225 |