CN205158261U - Computer CPU heat dissipation sheet - Google Patents
Computer CPU heat dissipation sheet Download PDFInfo
- Publication number
- CN205158261U CN205158261U CN201520870684.0U CN201520870684U CN205158261U CN 205158261 U CN205158261 U CN 205158261U CN 201520870684 U CN201520870684 U CN 201520870684U CN 205158261 U CN205158261 U CN 205158261U
- Authority
- CN
- China
- Prior art keywords
- heat
- radiating
- radiating substrate
- basal plate
- computer cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000010521 absorption reaction Methods 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims description 38
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 13
- 230000005855 radiation Effects 0.000 abstract description 5
- 108091023288 HOTAIR Proteins 0.000 abstract 1
- 238000009423 ventilation Methods 0.000 abstract 1
- 230000001788 irregular Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a computer CPU heat dissipation sheet, radiating basal plate including U style of calligraphy shape, radiating basal plate's outside extension of both sides limit slope, set up a plurality of perpendicular heat radiation fins that upwards distribute in the radiating basal plate inner wall side, each heat radiation fins's top flushes with the top on radiating basal plate both sides limit, all be equipped with the 2nd heat radiation fins that horizontal laterad extends on the outer wall on radiating basal plate both sides limit, each the 2nd heat radiation fins's tip and the tip that corresponds the radiating basal plate side that inclines are point -blank, be equipped with a plurality of ventilation heat dissipation hole on radiating basal plate's the base, still be equipped with one deck heat absorption copper sheet below the radiating basal plate base, be equipped with two parallel arrangement's draw -in groove on the heat absorption copper sheet. The utility model discloses can improve effect of thermal conductivity, be equipped with two parallel arrangement's draw -in groove on the heat absorption copper sheet, it is convenient to fix, and the fin out -of -shape makes things convenient for the hot -air to flow, improves the radiating effect, easy realization, and simple structure has good application prospect.
Description
Technical field
The utility model belongs to electronic product radiating technical field, is specifically related to a kind of computer CPU heat radiator.
Background technology
In recent years, the continuous increase of computer processing power, when CPU chip of computer runs up, can produce a large amount of heats, if dispel the heat not in time, greatly can affect the travelling speed of cpu chip.At present, computer is all adopt fan to join heat radiator to dispel the heat to cpu chip substantially, therefore, require higher to the heat dispersion of heat radiator, make to save the existing heat radiator of cost many employings aluminium, but, heat-conducting effect is general, due to cpu chip surface contact place, directly have influence on radiating effect, also gelled shape matching is regular, be not easy to the heat loss through convection of hot-air, and, heat radiator will be fixed on the mainboard of cpu chip by the securing member of screw and so on, time fixing, all need manually to be screwed on, workload is larger, production efficiency is low.
Utility model content
The technical matters that the utility model solves is that existing heat radiator many employings aluminium is made, and shape matching is regular, and heat conduction and heat radiation effect is general, and, heat radiator be by the securing member of screw and so on by being fixed on the mainboard of cpu chip, waste time and energy.Computer CPU heat radiator of the present utility model, heat absorption copper sheet is provided with computer CPU contact position bottom aluminum material, improve heat-conducting effect, heat absorption copper sheet is provided with two draw-in grooves be arranged in parallel, convenient fixing, fin shape is irregular, facilitate hot-air to flow, improve radiating effect, easily realize, structure is simple, has a good application prospect.
To achieve the above object, the technical scheme that the utility model adopts is:
A kind of computer CPU heat radiator, it is characterized in that: the heat-radiating substrate comprising U-shaped shape, the dual-side of described heat-radiating substrate is tilted to extension, described heat-radiating substrate inwall side is arranged some the first radiating fins distributed vertically upward, the top of each first radiating fin flushes with the top of heat-radiating substrate dual-side, the outer wall of described heat-radiating substrate dual-side is equipped with the second radiating fin that level extends to side, the end of each second radiating fin and the end of respective side heat-radiating substrate side are point-blank, the base of described heat-radiating substrate is provided with several ventilating heat dissipating holes, one deck heat absorption copper sheet is also provided with below described heat-radiating substrate base, described heat absorption copper sheet is provided with two draw-in grooves be arranged in parallel.
Aforesaid a kind of computer CPU heat radiator, is characterized in that: described heat absorption copper sheet is bonded in the base of heat-radiating substrate by heat-conducting glue.
Aforesaid a kind of computer CPU heat radiator, is characterized in that: the described size of heat absorption copper sheet and the measure-alike of computer CPU.
Aforesaid a kind of computer CPU heat radiator, is characterized in that: described heat-radiating substrate, the first radiating fin, the second radiating fin are one-body molded by aluminum material.
Aforesaid a kind of computer CPU heat radiator, is characterized in that: the quantity of described ventilating heat dissipating hole is three, is spacedly distributed on heat-radiating substrate base.
Aforesaid a kind of computer CPU heat radiator, is characterized in that: the angle of described heat-radiating substrate dual-side and vertical direction is 30 °.
The beneficial effects of the utility model are: computer CPU heat radiator of the present utility model, heat absorption copper sheet is provided with computer CPU contact position bottom aluminum material, improve heat-conducting effect, heat absorption copper sheet is provided with two draw-in grooves be arranged in parallel, convenient fixing, fin shape is irregular, facilitate hot-air to flow, improve radiating effect, easily realize, structure is simple, has a good application prospect.
Accompanying drawing explanation
Fig. 1 is the structural representation of computer CPU heat radiator of the present utility model.
Fig. 2 is the structural representation of heat absorption copper sheet of the present utility model.
The implication marked in accompanying drawing is as follows:
1: heat-radiating substrate; 2: the first radiating fins; 3: the second radiating fins; 4: ventilating heat dissipating hole; 5: heat absorption copper sheet; 6: draw-in groove.
Embodiment
Below in conjunction with Figure of description, the utility model is further described.
As shown in Figures 1 and 2, computer CPU heat radiator of the present utility model, comprise the heat-radiating substrate 1 of U-shaped shape, the dual-side of heat-radiating substrate 1 is tilted to extension, heat-radiating substrate 1 inwall side is arranged some the first radiating fins 2 distributed vertically upward, the top of each first radiating fin 2 flushes with the top of heat-radiating substrate 1 dual-side, the outer wall of described heat-radiating substrate 1 dual-side is equipped with the second radiating fin 3 that level extends to side, the end of each second radiating fin 3 and the end of respective side heat-radiating substrate 1 side are point-blank, heat-radiating substrate 1, first radiating fin 2, the shape direction of the second radiating fin 3 three is inconsistent, hot-air is facilitated to flow, improve radiating effect, the base of heat-radiating substrate 1 is provided with several ventilating heat dissipating holes 4, the quantity of ventilating heat dissipating hole 4 is three, be spacedly distributed on heat-radiating substrate 1 base, one deck heat absorption copper sheet 5 is also provided with below described heat-radiating substrate 1 base, described heat absorption copper sheet 5 is provided with two draw-in grooves be arranged in parallel 6, convenient fixing, time saving and energy saving.
Described heat absorption copper sheet 5 is bonded in the base of heat-radiating substrate 1 by heat-conducting glue, the heat absorption size of copper sheet 5 and the measure-alike of computer CPU, improve heat-conducting effect, accelerates heat radiation, here the size of heat absorption copper sheet 6 and the measure-alike of cpu chip, without the need to wasting unnecessary material.
The angle of described heat-radiating substrate 1 dual-side and vertical direction is 30 °, described heat-radiating substrate 1, first radiating fin 2, second radiating fin 3 is one-body molded by aluminum material, and rule is different, can accelerate the flowing of hot-air, coordinate ventilating heat dissipating hole 4, can radiating effect be improved.
In sum, computer CPU heat radiator of the present utility model, is provided with heat absorption copper sheet with computer CPU contact position bottom aluminum material, improves heat-conducting effect, heat absorption copper sheet is provided with two draw-in grooves be arranged in parallel, convenient fixing, fin shape is irregular, facilitates hot-air to flow, improve radiating effect, easy realization, structure is simple, has a good application prospect.
More than show and describe ultimate principle of the present utility model, principal character and advantage.The technician of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and instructions just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (6)
1. a computer CPU heat radiator, it is characterized in that: the heat-radiating substrate (1) comprising U-shaped shape, the dual-side of described heat-radiating substrate (1) is tilted to extension, described heat-radiating substrate (1) inwall side is arranged some the first radiating fins (2) distributed vertically upward, the top of each first radiating fin (2) flushes with the top of heat-radiating substrate (1) dual-side, the second radiating fin (3) that level that the outer wall of described heat-radiating substrate (1) dual-side is equipped with extends to side, the end of each second radiating fin (3) and the end of respective side heat-radiating substrate (1) side are point-blank, the base of described heat-radiating substrate (1) is provided with several ventilating heat dissipating holes (4), one deck heat absorption copper sheet (5) is also provided with below described heat-radiating substrate (1) base, described heat absorption copper sheet (5) is provided with two draw-in grooves be arranged in parallel (6).
2. a kind of computer CPU heat radiator according to claim 1, is characterized in that: described heat absorption copper sheet (5) is bonded in the base of heat-radiating substrate (1) by heat-conducting glue.
3. a kind of computer CPU heat radiator according to claim 2, is characterized in that: the described size of heat absorption copper sheet (5) and the measure-alike of computer CPU.
4. a kind of computer CPU heat radiator according to claim 1, is characterized in that: described heat-radiating substrate (1), the first radiating fin (2), the second radiating fin (3) are one-body molded by aluminum material.
5. a kind of computer CPU heat radiator according to claim 1, is characterized in that: the quantity of described ventilating heat dissipating hole (4) is three, is spacedly distributed on heat-radiating substrate (1) base.
6. a kind of computer CPU heat radiator according to claim 1, is characterized in that: the angle of described heat-radiating substrate (1) dual-side and vertical direction is 30 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520870684.0U CN205158261U (en) | 2015-11-04 | 2015-11-04 | Computer CPU heat dissipation sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520870684.0U CN205158261U (en) | 2015-11-04 | 2015-11-04 | Computer CPU heat dissipation sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205158261U true CN205158261U (en) | 2016-04-13 |
Family
ID=55693932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520870684.0U Expired - Fee Related CN205158261U (en) | 2015-11-04 | 2015-11-04 | Computer CPU heat dissipation sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205158261U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864594A (en) * | 2017-11-09 | 2018-03-30 | 昆山普克特金属制品有限公司 | The aluminium section bar that a kind of radiator slides |
| CN108187786A (en) * | 2017-12-29 | 2018-06-22 | 明光市海春米业有限公司 | A kind of cold rice device of conveying type high efficiency |
| CN115128889A (en) * | 2022-08-12 | 2022-09-30 | 湖南创科光电有限责任公司 | High-brightness full-sealed optical machine and projector |
| WO2023241580A1 (en) * | 2022-06-17 | 2023-12-21 | 中兴通讯股份有限公司 | Heat dissipation device, circuit board, and communication base station |
-
2015
- 2015-11-04 CN CN201520870684.0U patent/CN205158261U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864594A (en) * | 2017-11-09 | 2018-03-30 | 昆山普克特金属制品有限公司 | The aluminium section bar that a kind of radiator slides |
| CN108187786A (en) * | 2017-12-29 | 2018-06-22 | 明光市海春米业有限公司 | A kind of cold rice device of conveying type high efficiency |
| WO2023241580A1 (en) * | 2022-06-17 | 2023-12-21 | 中兴通讯股份有限公司 | Heat dissipation device, circuit board, and communication base station |
| CN115128889A (en) * | 2022-08-12 | 2022-09-30 | 湖南创科光电有限责任公司 | High-brightness full-sealed optical machine and projector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160413 Termination date: 20171104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |