CN202629991U - Heat radiation component of LED lamp - Google Patents
Heat radiation component of LED lamp Download PDFInfo
- Publication number
- CN202629991U CN202629991U CN2012202756880U CN201220275688U CN202629991U CN 202629991 U CN202629991 U CN 202629991U CN 2012202756880 U CN2012202756880 U CN 2012202756880U CN 201220275688 U CN201220275688 U CN 201220275688U CN 202629991 U CN202629991 U CN 202629991U
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- Prior art keywords
- led lamp
- radiation component
- heat radiation
- heat
- substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a heat radiation component of an LED lamp. The heat radiation component comprises a copper substrate (1), an aluminum substrate (2) and heat radiating fins (3); and the copper substrate (1) and the aluminum substrate (2) are combined by adopting a half-melting state technology, and the heat radiating fins (3) are formed by a backing-off cutting technology. The heat radiation component disclosed by the utility model has the characteristics of high heat uniformity, high heat conductivity, high cost performance and low design difficulty.
Description
Technical field
The utility model relates to LED lamp field, specifically is a kind of thermal component of the LED of being used for lamp.
Background technology
Along with the continuous development of LED industry, the LED lamp trends towards integrated, and soaking has become the high-powered LED lamp design difficulty.The high-power LED lamp pearl can provide the more light source of high-quality; But but can produce a large amount of heat; Though the chip of LED etc. bears the performance of heat and increases; But in the prior art, the chip of most of LED etc. still is easy to receive the influence of too high heat, thereby reduces the service life of LED lamp.
The utility model content
The utility model purpose is to solve deficiency of the prior art, and a kind of perfect heat-dissipating promptly is provided, the thermal component of the LED lamp that stability is high.
The utility model comprises copper substrate 1, aluminum substrate 2, radiating fin 3; It is characterized in that copper substrate 1 and aluminum substrate 2 adopt fritting attitude technology be combined into, radiating fin 3 adopts the backing-off cutting technology to process.
Compare with prior art, the utlity model has following advantage:
1,, thereby better improves the capacity of heat transmission of LED lamp thermal component because the utility model adopts copper substrate 1 and aluminum substrate 2 to adopt fritting attitude technology be combined into.
Description of drawings
Fig. 1: the overall structure figure that is the utility model.
The specific embodiment
With reference to Fig. 1, a kind of thermal component of LED lamp comprises copper substrate 1, aluminum substrate 2, radiating fin 3; Copper substrate 1 adopts fritting attitude technology be combined into aluminum substrate 2, and radiating fin 3 adopts the backing-off cutting technology to process, and this radiating fin 3 and copper substrate 1, aluminum substrate 2 two parts adopt seamless compound connection.The height of radiating fin 3, thickness and spacing can be adjusted as required.Radiating fin 3 parts are used 6063 aluminium alloys always, and the Rockwell hardness of aluminium alloy is not more than 5, and silicon content is not more than 0.2%, and magnesium content is not more than 0.35%, and copper substrate 1 is mainly fine copper (copper content 99.95%-99.97%).
The thermal component thermal conductivity factor of the LED lamp of the utility model is between copper, aluminium; Promptly greater than 200W/m.K less than 460W/m.K; Copper main with the heater members applying, utilize the high advantage of thermal conductivity factor of copper, the heat of device is passed at in-plane and thickness direction rapidly.The thermal resistance that aluminium alloy and copper are seamless no medium is compound between making diminishes, and heat also can be transmitted to the aluminium alloy part faster.
Claims (2)
1. the thermal component of a LED lamp comprises copper substrate (1), aluminum substrate (2), radiating fin (3); It is characterized in that copper substrate (1) and aluminum substrate (2) adopt fritting attitude technology be combined into, radiating fin (3) adopts the backing-off cutting technology to process.
2. the thermal component of a kind of LED lamp according to claim 1 is characterized in that radiating fin (3) and copper substrate (1), aluminum substrate (2), adopts seamless compound connection; Height, thickness and the spacing of this radiating fin (3) can be adjusted as required.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202756880U CN202629991U (en) | 2012-06-12 | 2012-06-12 | Heat radiation component of LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202756880U CN202629991U (en) | 2012-06-12 | 2012-06-12 | Heat radiation component of LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202629991U true CN202629991U (en) | 2012-12-26 |
Family
ID=47383186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202756880U Expired - Fee Related CN202629991U (en) | 2012-06-12 | 2012-06-12 | Heat radiation component of LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202629991U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781335A (en) * | 2013-12-31 | 2014-05-07 | 江苏嘉钰新能源技术有限公司 | Natural cooling heat radiator |
| CN104159404A (en) * | 2014-07-31 | 2014-11-19 | 简玉苍 | Manufacturing method for discrete thermo-electricity separated ALPCB (Aluminum Printed Circuit Board) |
-
2012
- 2012-06-12 CN CN2012202756880U patent/CN202629991U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781335A (en) * | 2013-12-31 | 2014-05-07 | 江苏嘉钰新能源技术有限公司 | Natural cooling heat radiator |
| CN104159404A (en) * | 2014-07-31 | 2014-11-19 | 简玉苍 | Manufacturing method for discrete thermo-electricity separated ALPCB (Aluminum Printed Circuit Board) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20150612 |
|
| EXPY | Termination of patent right or utility model |