CN214751770U

CN214751770U - a CPU cooler

Info

Publication number: CN214751770U
Application number: CN202120860945.6U
Authority: CN
Inventors: 刘奕
Original assignee: Suzhou Vocational University
Current assignee: Suzhou Vocational University
Priority date: 2021-04-25
Filing date: 2021-04-25
Publication date: 2021-11-16
Anticipated expiration: 2031-04-25

Abstract

The utility model discloses a CPU radiator, including heat-conducting plate, heat conduction copper pipe, fin and heat dissipation fan, the heat conduction copper with the heat-conducting plate bottom is connected, the fin is located the heat-conducting plate top, the setting of heat dissipation fan is in the fin top, the heat conduction copper is with a plurality of heat conduction copper pipe structure as an organic whole, just the heat conduction copper pipe all is located heat conduction copper lateral part, the heat conduction copper pipe upwards extend to with the fin is connected. The CPU radiator is provided with the heat-conducting copper plate and the heat-conducting copper plate which are of an integrated structure, and the heat-conducting copper plate is in contact with the CPU, so that the heat transfer efficiency can be greatly improved, and the heat dissipation efficiency of the CPU radiator is effectively improved.

Description

CPU radiator

Technical Field

The utility model relates to a computer hardware technical field, more accurate saying so relates to a CPU radiator.

Background

When the host computer of the desktop computer works, each part on the mainboard can generate a large amount of heat, and the heat in the case needs to be timely dissipated by using the radiator, so that the overhigh temperature in the case is prevented, and the normal and stable work of the computer is ensured. In general, a CPU mounted on a motherboard generates the largest amount of heat, and a CPU heat sink dedicated to heat dissipation needs to be mounted on the CPU.

The existing CPU radiator is usually arranged on a mainboard, the CPU radiator transfers heat by contacting a heat-conducting metal body and a plurality of heat-conducting copper pipes with a CPU, and the heat transfer rate of the radiator with the structure is general, so that the heat dissipation efficiency of the CPU radiator is not ideal.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides a CPU heat sink, and the CPU heat sink has a high heat dissipation efficiency.

In order to achieve the above object, the utility model provides a CPU radiator, including heat-conducting plate, heat conduction copper pipe, fin and heat dissipation fan, the heat conduction copper with the heat-conducting plate bottom is connected, the fin is located the heat-conducting plate top, the heat dissipation fan sets up the fin top, the heat conduction copper is with a plurality of heat conduction copper pipe structure as an organic whole, just heat conduction copper pipe all is located heat conduction copper lateral part, heat conduction copper pipe upwards extend to with the fin is connected.

Preferably, the heat conducting plate has heat dissipating ribs on two opposite sides, and the heat dissipating ribs extend outwards from the sides of the heat conducting plate.

Preferably, four corners of the lower part of the heat sink are respectively provided with a fixed supporting foot.

Preferably, the heat dissipation fan is fixedly connected with the heat dissipation fin.

Preferably, the bottom of the heat radiating fin is connected with the upper part of the heat conducting plate through a clamping groove.

Preferably, the heat dissipation fan central point puts and has the support frame, support frame central point puts the installation motor, a plurality of flabellums are connected to the output of motor, the motor is direct current motor.

Preferably, the thickness of the heat conduction copper pipe is 1mm, and the inner diameter of the heat conduction copper pipe is 4 mm.

Compared with the prior art, the utility model discloses a CPU radiator's advantage lies in: the CPU radiator is provided with the heat-conducting copper plate and the heat-conducting copper plate which are of an integrated structure, and the heat-conducting copper plate is in contact with the CPU, so that the heat transfer efficiency can be greatly improved, and the heat dissipation efficiency of the CPU radiator is effectively improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a front view of a CPU heat sink according to the present invention.

Fig. 2 is a top view of a CPU heat sink according to the present invention.

Fig. 3 is a bottom view of the heat-conducting plate, the heat-conducting copper plate and the heat-conducting copper tube of the CPU heat sink of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1 to 3, the utility model relates to a CPU radiator includes heat-conducting plate 1, heat conduction copper 9, heat conduction copper pipe 2, fin 3 and heat dissipation fan 5, heat conduction copper 9 is connected with 1 bottom of heat-conducting plate, fin 3 is located 1 top of heat-conducting plate, heat dissipation fan 5 sets up at fin 3 top, heat conduction copper 9 and a plurality of heat conduction copper pipe 2 structure as an organic whole, and heat conduction copper pipe 2 all is located 2 lateral parts of heat conduction copper, heat conduction copper pipe 2 upwards extends to and is connected with fin 3. The CPU radiator is combined with the mainboard for installation, the heat conduction copper plate 9 contacts with the CPU, and the integrated heat conduction copper plate 9 and the heat conduction copper pipe 2 form an integral heat conduction surface, so that the heat transfer speed can be improved, the heat radiating fins 3 obtain more heat, and the heat of the heat radiating fins 3 is timely radiated through the heat radiating fan 5, and further the heat conduction efficiency is improved.

Specifically, the heat-conducting copper plate 9 is a square plate, and the two opposite side edges of the heat-conducting copper plate 9 are respectively provided with a plurality of heat-conducting copper pipes 2. The heat conducting plate 1 has heat dissipating ribs 10 on two opposite sides, the heat dissipating ribs 10 extend outwards from the sides of the heat conducting plate 1, and a part of heat can be dissipated through the heat dissipating ribs 10.

The thickness of the heat-conducting copper plate 9 is preferably set to be 1mm, and the inner diameter of the heat-conducting copper pipe 2 is preferably set to be 4 mm. The heat conducting copper plate 9 is thin, which is beneficial to improving the heat conducting rate.

Furthermore, four corners of the lower part of the radiating fin 3 are respectively provided with fixed supporting legs 4, and the CPU radiator and the main board can be installed in a combined manner through the fixed supporting legs 4. The bottom of the radiating fin 3 is connected with the upper part of the heat conducting plate 1 through a clamping groove. Preferably, the heat dissipation fan 5 is fixedly connected with the heat dissipation fins 3, so that the stability of the heat dissipation fan 5 in the working process is kept.

Specifically, 5 central point puts and has support frame 7 in the heat dissipation fan, and 7 central point puts installation motor 8 in the support frame, and motor 8 passes through the screw to be connected with support frame 7, and motor 8 is direct current motor, and a plurality of flabellums 6 are connected to motor 8's output. The motor 8 drives the fan blades 6 to rotate, and heat transferred to the radiating fins 3 is taken away in an air cooling mode.

When the CPU radiator is installed, the CPU radiator is fixedly connected with bolt fixing feet around a CPU in a case through the four fixing supporting feet 4, so that the heat-conducting copper plate 9 is tightly contacted with the CPU, and the heat-conducting efficiency can be ensured. The heat conduction copper plate 9 and the heat conduction copper pipe 2 of integration form whole heat conduction face, can improve thermal transmission rate, and then improve heat conduction efficiency, and fin 3 can obtain more heats, can dispel the heat more high-efficiently under the effect of heat dissipation fan 5.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A CPU radiator, characterized in that it comprises a heat-conducting plate, a heat-conducting copper plate, a heat-conducting copper pipe, a heat sink and a heat-dissipating fan, the heat-conducting copper plate is connected to the bottom of the heat-conducting plate, and the heat-dissipating fin is located on the heat-conducting plate On the top, the cooling fan is arranged on the top of the heat sink, the thermally conductive copper plate is integrated with a plurality of the thermally conductive copper tubes, and the thermally conductive copper tubes are located on the side of the thermally conductive copper plate, and the thermally conductive copper tubes are upward extends to connect with the heat sink.

2 . The CPU heat sink according to claim 1 , wherein two opposite sides of the heat conducting plate respectively have heat dissipation ribs, and the heat dissipation ribs extend outward from the sides of the heat conducting plate. 3 .

3 . The CPU heat sink according to claim 1 , wherein four corners of the lower part of the heat sink are respectively provided with fixed support feet. 4 .

4 . The CPU heat sink of claim 1 , wherein the cooling fan is fixedly connected to the cooling fin. 5 .

5 . The CPU heat sink according to claim 1 , wherein the bottom of the heat sink is connected to the upper part of the heat conducting plate through a slot. 6 .

6 . The CPU heat sink according to claim 1 , wherein a support frame is provided at the center of the cooling fan, a motor is installed at the center of the support frame, an output end of the motor is connected to a plurality of fan blades, and the motor for a DC motor.

7 . The CPU heat sink according to claim 1 , wherein the thickness of the thermally conductive copper plate is 1 mm, and the inner diameter of the thermally conductive copper pipe is 4 mm. 8 .