CN203466182U - Ceramic cooling fin having advantages of good heat conduction performance and light weight - Google Patents
Ceramic cooling fin having advantages of good heat conduction performance and light weight Download PDFInfo
- Publication number
- CN203466182U CN203466182U CN201320569976.1U CN201320569976U CN203466182U CN 203466182 U CN203466182 U CN 203466182U CN 201320569976 U CN201320569976 U CN 201320569976U CN 203466182 U CN203466182 U CN 203466182U
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- CN
- China
- Prior art keywords
- heat
- dissipating layer
- light weight
- heat dissipating
- ceramic
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- Expired - Fee Related
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- 239000000919 ceramic Substances 0.000 title claims abstract description 17
- 238000001816 cooling Methods 0.000 title abstract 13
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Abstract
The utility model discloses a ceramic cooling fin having advantages of good heat conduction performance and light weight. The ceramic cooling fin comprises a first cooling layer (1) and a second cooling layer (2). A cooling diversion tube (4) is arranged between the first cooling layer (1) and the second cooling layer (2). The second cooling layer (2) is provided with a sheet-like body (3) for cooling. The first cooling layer (1) and the second cooling layer (2) are made from a ceramic material having a microvoid structure. The ceramic cooling fin of the utility model has the advantage of better heat conduction effect, and has the advantage of light weight at the same time.
Description
Technical field:
The utility model relates to fin technical field, more specifically to the ceramic radiating fin of a kind of good heat conductivity and light weight.
Background technology:
At electronic technology field, as computer chip or light-emitting diode etc., because its electronic devices and components can produce heat in the process of work, in order to ensure it, can work normally, need on the electronic equipment being formed by electronic devices and components, be equipped with heat abstractor, in prior art, many employings is metal fin, sometimes even need to coordinate fan to assist heat extraction, and the coefficient of heat conduction of the fin of most of metal material is not fine, the poor effect of heat conduction, and structure is also more auxiliary, there is metal-made to obtain heat sink mass heavier simultaneously, can bring inconvenience in the use.
Utility model content:
The purpose of this utility model is just to provide the ceramic radiating fin of a kind of good heat conductivity and light weight, and it has better heat-conducting effect, and it also has the feature that quality is light simultaneously.
For achieving the above object, the ceramic radiating fin of a kind of good heat conductivity of the present utility model and light weight comprises the first heat dissipating layer and the second heat dissipating layer, between described the first heat dissipating layer and the second heat dissipating layer, be provided with heat radiation mozzle, on described the second heat dissipating layer, be provided with the plates of heat transmission, described the first heat dissipating layer and the second heat dissipating layer are the ceramic material with micro-Cavitated structure.
As technique scheme preferably, described heat radiation mozzle is web-like structure.
As technique scheme preferably, on the upper surface of described the second heat dissipating layer, be provided with equably some plates, the S-shaped shape of described plates.
As technique scheme preferably, described plates are by welding or be adhesively fixed on the upper surface of the second heat dissipating layer.
As technique scheme preferably, described plates are to have the ceramic material of micro-Cavitated structure and one-body molded with the second heat dissipating layer.
As technique scheme preferably, the lower surface of described the second heat dissipating layer is provided with one deck heat radiating metallic layer.
As technique scheme preferably, described layer heat radiating metallic layer is copper plate.
As technique scheme preferably, described heat radiation mozzle is made by copper pipe.
Compared with prior art, the beneficial effects of the utility model are: the utility model carries out heat conduction by having micro-Cavitated structure, and the plates of heat conduction are set thereon, increase the area of heat radiation, heat radiation mozzle is set simultaneously between two-layer heat dissipating layer, by air heat exchange, realize heat radiation, its heat conductivility is outstanding, and quality of the present utility model is lighter.
Accompanying drawing explanation:
Below in conjunction with accompanying drawing, the utility model is described further:
Fig. 1 is perspective exploded view of the present utility model
In figure: 1, the first heat dissipating layer; 2, the second heat dissipating layer; 3, plates; 4, heat radiation mozzle
Embodiment:
Therefore the following stated only, for embodying the preferred embodiment of the utility model principle, does not limit protection range of the present utility model
Be illustrated in figure 1 the embodiment of the ceramic radiating fin of a kind of good heat conductivity of the utility model and light weight, it comprises the first heat dissipating layer 1 and the second heat dissipating layer 2, between described the first heat dissipating layer 1 and the second heat dissipating layer 2, be provided with heat radiation mozzle 4, on described the second heat dissipating layer 2, be provided with the plates 3 of heat transmission, described the first heat dissipating layer 1 and the second heat dissipating layer 2 are for having the ceramic material of micro-Cavitated structure.
In the present embodiment, heat radiation mozzle 4 is made by copper pipe, some circular copper pipe and straight copper pipes of being mutually connect and make web-like structure heat radiation mozzle 4, in this heat radiation mozzle 4, there is passage of heat, and web-like structure can arrange more heat dissipation channel as far as possible, make it there is better heat sinking function.
In addition, on the upper surface of the second heat dissipating layer 2, be provided with equably some plates 3, the S-shaped shape of described plates 3, the plates 3 of this S shape can increase the heat exchange area with air, can effectively improve heat exchange sales volume, in the present embodiment, plates 3 are by welding or be adhesively fixed on the upper surface of the second heat dissipating layer 2, and plates 3 can be also by having the ceramic material of micro-Cavitated structure and one-body molded with the second heat dissipating layer 2.
And in the present embodiment, the lower surface of the second heat dissipating layer 2 is provided with one deck heat radiating metallic layer, layer heat radiating metallic layer is copper plate or silver coating.
The utility model when in use, the first heat dissipating layer 1 is for contacting with the electric elements of the heating such as computer chip or light-emitting diode, the heat that electric elements come out passes to heat radiation mozzle 4 by the first heat dissipating layer 1, heat radiation mozzle 4 is realized the exchange of heat by tiny heat dissipation channel and air, and second be provided with plates 3 on heat dissipating layer 2, these plates 3 have the effect of auxiliary heat dissipation.
Claims (8)
1. the ceramic radiating fin of a good heat conductivity and light weight, its characteristic value is: it comprises the first heat dissipating layer (1) and the second heat dissipating layer (2), between described the first heat dissipating layer (1) and the second heat dissipating layer (2), be provided with heat radiation mozzle (4), on described the second heat dissipating layer (2), be provided with the plates (3) of heat transmission, described the first heat dissipating layer (1) and the second heat dissipating layer (2) are for having the ceramic material of micro-Cavitated structure.
2. the ceramic radiating fin of a kind of good heat conductivity according to claim 1 and light weight, is characterized in that: heat radiation mozzle (4) is web-like structure.
3. the ceramic radiating fin of a kind of good heat conductivity according to claim 1 and light weight, is characterized in that: on the upper surface of the second heat dissipating layer (2), be provided with equably some plates (3), the S-shaped shape of described plates (3).
4. according to a kind of good heat conductivity described in claim 1 or 3 and the ceramic radiating fin of light weight, it is characterized in that: plates (3) are by welding or be adhesively fixed on the upper surface of the second heat dissipating layer (2).
5. according to a kind of good heat conductivity described in claim 1 or 3 and the ceramic radiating fin of light weight, it is characterized in that: plates (3) are for having the ceramic material of micro-Cavitated structure and one-body molded with the second heat dissipating layer (2).
6. the ceramic radiating fin of a kind of good heat conductivity according to claim 2 and light weight, is characterized in that: the lower surface of the second heat dissipating layer (2) is provided with one deck heat radiating metallic layer.
7. the ceramic radiating fin of a kind of good heat conductivity according to claim 6 and light weight, is characterized in that: layer heat radiating metallic layer is copper plate.
8. the ceramic radiating fin of a kind of good heat conductivity according to claim 1 and 2 and light weight, is characterized in that: heat radiation mozzle (4) is made by copper pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320569976.1U CN203466182U (en) | 2013-09-14 | 2013-09-14 | Ceramic cooling fin having advantages of good heat conduction performance and light weight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320569976.1U CN203466182U (en) | 2013-09-14 | 2013-09-14 | Ceramic cooling fin having advantages of good heat conduction performance and light weight |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203466182U true CN203466182U (en) | 2014-03-05 |
Family
ID=50178527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320569976.1U Expired - Fee Related CN203466182U (en) | 2013-09-14 | 2013-09-14 | Ceramic cooling fin having advantages of good heat conduction performance and light weight |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203466182U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104007797A (en) * | 2014-06-04 | 2014-08-27 | 吉首大学 | Computer cooling device |
| CN107172859A (en) * | 2017-06-19 | 2017-09-15 | 电子科技大学 | A kind of MCA |
-
2013
- 2013-09-14 CN CN201320569976.1U patent/CN203466182U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104007797A (en) * | 2014-06-04 | 2014-08-27 | 吉首大学 | Computer cooling device |
| CN104007797B (en) * | 2014-06-04 | 2017-05-10 | 吉首大学 | Computer cooling device |
| CN107172859A (en) * | 2017-06-19 | 2017-09-15 | 电子科技大学 | A kind of MCA |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140305 Termination date: 20140914 |
|
| EXPY | Termination of patent right or utility model |