CN203466182U - Ceramic cooling fin having advantages of good heat conduction performance and light weight - Google Patents

Ceramic cooling fin having advantages of good heat conduction performance and light weight Download PDF

Info

Publication number
CN203466182U
CN203466182U CN201320569976.1U CN201320569976U CN203466182U CN 203466182 U CN203466182 U CN 203466182U CN 201320569976 U CN201320569976 U CN 201320569976U CN 203466182 U CN203466182 U CN 203466182U
Authority
CN
China
Prior art keywords
heat
dissipating layer
light weight
heat dissipating
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320569976.1U
Other languages
Chinese (zh)
Inventor
陈沛珊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Ziitek Electronic Material & Techunology Co Ltd
Original Assignee
Dongguan Ziitek Electronic Material & Techunology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Ziitek Electronic Material & Techunology Co Ltd filed Critical Dongguan Ziitek Electronic Material & Techunology Co Ltd
Priority to CN201320569976.1U priority Critical patent/CN203466182U/en
Application granted granted Critical
Publication of CN203466182U publication Critical patent/CN203466182U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a ceramic cooling fin having advantages of good heat conduction performance and light weight. The ceramic cooling fin comprises a first cooling layer (1) and a second cooling layer (2). A cooling diversion tube (4) is arranged between the first cooling layer (1) and the second cooling layer (2). The second cooling layer (2) is provided with a sheet-like body (3) for cooling. The first cooling layer (1) and the second cooling layer (2) are made from a ceramic material having a microvoid structure. The ceramic cooling fin of the utility model has the advantage of better heat conduction effect, and has the advantage of light weight at the same time.

Description

The ceramic radiating fin of a kind of good heat conductivity and light weight
Technical field:
The utility model relates to fin technical field, more specifically to the ceramic radiating fin of a kind of good heat conductivity and light weight.
Background technology:
At electronic technology field, as computer chip or light-emitting diode etc., because its electronic devices and components can produce heat in the process of work, in order to ensure it, can work normally, need on the electronic equipment being formed by electronic devices and components, be equipped with heat abstractor, in prior art, many employings is metal fin, sometimes even need to coordinate fan to assist heat extraction, and the coefficient of heat conduction of the fin of most of metal material is not fine, the poor effect of heat conduction, and structure is also more auxiliary, there is metal-made to obtain heat sink mass heavier simultaneously, can bring inconvenience in the use.
Utility model content:
The purpose of this utility model is just to provide the ceramic radiating fin of a kind of good heat conductivity and light weight, and it has better heat-conducting effect, and it also has the feature that quality is light simultaneously.
For achieving the above object, the ceramic radiating fin of a kind of good heat conductivity of the present utility model and light weight comprises the first heat dissipating layer and the second heat dissipating layer, between described the first heat dissipating layer and the second heat dissipating layer, be provided with heat radiation mozzle, on described the second heat dissipating layer, be provided with the plates of heat transmission, described the first heat dissipating layer and the second heat dissipating layer are the ceramic material with micro-Cavitated structure.
As technique scheme preferably, described heat radiation mozzle is web-like structure.
As technique scheme preferably, on the upper surface of described the second heat dissipating layer, be provided with equably some plates, the S-shaped shape of described plates.
As technique scheme preferably, described plates are by welding or be adhesively fixed on the upper surface of the second heat dissipating layer.
As technique scheme preferably, described plates are to have the ceramic material of micro-Cavitated structure and one-body molded with the second heat dissipating layer.
As technique scheme preferably, the lower surface of described the second heat dissipating layer is provided with one deck heat radiating metallic layer.
As technique scheme preferably, described layer heat radiating metallic layer is copper plate.
As technique scheme preferably, described heat radiation mozzle is made by copper pipe.
Compared with prior art, the beneficial effects of the utility model are: the utility model carries out heat conduction by having micro-Cavitated structure, and the plates of heat conduction are set thereon, increase the area of heat radiation, heat radiation mozzle is set simultaneously between two-layer heat dissipating layer, by air heat exchange, realize heat radiation, its heat conductivility is outstanding, and quality of the present utility model is lighter.
Accompanying drawing explanation:
Below in conjunction with accompanying drawing, the utility model is described further:
Fig. 1 is perspective exploded view of the present utility model
In figure: 1, the first heat dissipating layer; 2, the second heat dissipating layer; 3, plates; 4, heat radiation mozzle
Embodiment:
Therefore the following stated only, for embodying the preferred embodiment of the utility model principle, does not limit protection range of the present utility model
Be illustrated in figure 1 the embodiment of the ceramic radiating fin of a kind of good heat conductivity of the utility model and light weight, it comprises the first heat dissipating layer 1 and the second heat dissipating layer 2, between described the first heat dissipating layer 1 and the second heat dissipating layer 2, be provided with heat radiation mozzle 4, on described the second heat dissipating layer 2, be provided with the plates 3 of heat transmission, described the first heat dissipating layer 1 and the second heat dissipating layer 2 are for having the ceramic material of micro-Cavitated structure.
In the present embodiment, heat radiation mozzle 4 is made by copper pipe, some circular copper pipe and straight copper pipes of being mutually connect and make web-like structure heat radiation mozzle 4, in this heat radiation mozzle 4, there is passage of heat, and web-like structure can arrange more heat dissipation channel as far as possible, make it there is better heat sinking function.
In addition, on the upper surface of the second heat dissipating layer 2, be provided with equably some plates 3, the S-shaped shape of described plates 3, the plates 3 of this S shape can increase the heat exchange area with air, can effectively improve heat exchange sales volume, in the present embodiment, plates 3 are by welding or be adhesively fixed on the upper surface of the second heat dissipating layer 2, and plates 3 can be also by having the ceramic material of micro-Cavitated structure and one-body molded with the second heat dissipating layer 2.
And in the present embodiment, the lower surface of the second heat dissipating layer 2 is provided with one deck heat radiating metallic layer, layer heat radiating metallic layer is copper plate or silver coating.
The utility model when in use, the first heat dissipating layer 1 is for contacting with the electric elements of the heating such as computer chip or light-emitting diode, the heat that electric elements come out passes to heat radiation mozzle 4 by the first heat dissipating layer 1, heat radiation mozzle 4 is realized the exchange of heat by tiny heat dissipation channel and air, and second be provided with plates 3 on heat dissipating layer 2, these plates 3 have the effect of auxiliary heat dissipation.

Claims (8)

1. the ceramic radiating fin of a good heat conductivity and light weight, its characteristic value is: it comprises the first heat dissipating layer (1) and the second heat dissipating layer (2), between described the first heat dissipating layer (1) and the second heat dissipating layer (2), be provided with heat radiation mozzle (4), on described the second heat dissipating layer (2), be provided with the plates (3) of heat transmission, described the first heat dissipating layer (1) and the second heat dissipating layer (2) are for having the ceramic material of micro-Cavitated structure.
2. the ceramic radiating fin of a kind of good heat conductivity according to claim 1 and light weight, is characterized in that: heat radiation mozzle (4) is web-like structure.
3. the ceramic radiating fin of a kind of good heat conductivity according to claim 1 and light weight, is characterized in that: on the upper surface of the second heat dissipating layer (2), be provided with equably some plates (3), the S-shaped shape of described plates (3).
4. according to a kind of good heat conductivity described in claim 1 or 3 and the ceramic radiating fin of light weight, it is characterized in that: plates (3) are by welding or be adhesively fixed on the upper surface of the second heat dissipating layer (2).
5. according to a kind of good heat conductivity described in claim 1 or 3 and the ceramic radiating fin of light weight, it is characterized in that: plates (3) are for having the ceramic material of micro-Cavitated structure and one-body molded with the second heat dissipating layer (2).
6. the ceramic radiating fin of a kind of good heat conductivity according to claim 2 and light weight, is characterized in that: the lower surface of the second heat dissipating layer (2) is provided with one deck heat radiating metallic layer.
7. the ceramic radiating fin of a kind of good heat conductivity according to claim 6 and light weight, is characterized in that: layer heat radiating metallic layer is copper plate.
8. the ceramic radiating fin of a kind of good heat conductivity according to claim 1 and 2 and light weight, is characterized in that: heat radiation mozzle (4) is made by copper pipe.
CN201320569976.1U 2013-09-14 2013-09-14 Ceramic cooling fin having advantages of good heat conduction performance and light weight Expired - Fee Related CN203466182U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320569976.1U CN203466182U (en) 2013-09-14 2013-09-14 Ceramic cooling fin having advantages of good heat conduction performance and light weight

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320569976.1U CN203466182U (en) 2013-09-14 2013-09-14 Ceramic cooling fin having advantages of good heat conduction performance and light weight

Publications (1)

Publication Number Publication Date
CN203466182U true CN203466182U (en) 2014-03-05

Family

ID=50178527

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320569976.1U Expired - Fee Related CN203466182U (en) 2013-09-14 2013-09-14 Ceramic cooling fin having advantages of good heat conduction performance and light weight

Country Status (1)

Country Link
CN (1) CN203466182U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104007797A (en) * 2014-06-04 2014-08-27 吉首大学 Computer cooling device
CN107172859A (en) * 2017-06-19 2017-09-15 电子科技大学 A kind of MCA

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104007797A (en) * 2014-06-04 2014-08-27 吉首大学 Computer cooling device
CN104007797B (en) * 2014-06-04 2017-05-10 吉首大学 Computer cooling device
CN107172859A (en) * 2017-06-19 2017-09-15 电子科技大学 A kind of MCA

Similar Documents

Publication Publication Date Title
CN103796491A (en) Heat dissipation device for portable type electronic device
CN203466182U (en) Ceramic cooling fin having advantages of good heat conduction performance and light weight
CN205071462U (en) Multilayer circuit board heat conduction radiation structure
CN203618272U (en) Novel thermal insulating structure
CN201726633U (en) Hollow laminar type cooling plate unit structure
CN103648253B (en) A kind of Novel heat-conducting insulation system
CN205028894U (en) Gear shaping formula welding heat pipe cooling ware
CN211129871U (en) Heat dissipation device and helmet using same
CN202151035U (en) Heat radiator
CN208369929U (en) A kind of aluminum substrate wiring board
CN207460694U (en) A kind of graphite composite sheet of high-heat conductive efficency
CN209627785U (en) A kind of high efficiency and heat radiation circuit board
CN203376679U (en) CPU radiating sheet
CN208175089U (en) A kind of heavy current circuit plate convenient for heat dissipation
CN207340281U (en) A kind of high heat conduction type high power device circuit substrate
CN202197491U (en) Heat dissipating plate formed by aluminum material and copper material in embedded manner and used for heating module
CN206620350U (en) A kind of wiring board for being easy to radiate
CN201819608U (en) Section bar for radiator
CN204011403U (en) A kind of heat sink compound
CN205017775U (en) Copper and aluminium welding connects radiator
CN204994206U (en) Disc radiator
CN217306486U (en) Double-sided heat dissipation aluminum substrate
CN204906956U (en) Radiator
CN203369034U (en) Heat conduction and dissipation device
CN202853438U (en) Laminated heat dissipation device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140305

Termination date: 20140914

EXPY Termination of patent right or utility model