CN204011403U

CN204011403U - A kind of heat sink compound

Info

Publication number: CN204011403U
Application number: CN201420480591.2U
Authority: CN
Inventors: 常青保; 陈勇
Original assignee: SICHUAN HUALI ELECTRONIC CO Ltd
Current assignee: SICHUAN HUALI ELECTRONIC CO Ltd
Priority date: 2014-08-25
Filing date: 2014-08-25
Publication date: 2014-12-10
Anticipated expiration: 2024-08-25

Abstract

The utility model discloses a kind of heat sink compound, it comprises the heat absorption end (1), at the bottom of described heat absorption, (1) is copper aluminium compound integral structure, the heat absorption end (1) lower floor is copper layer (12), heat absorption (1) upper strata, the end is aluminium layer (11), on described aluminium layer (11), be processed with integrated heat radiation gear piece (2), at the bottom of described heat absorption, on (1), offer multiple pilot holes (3), at the bottom of described heat absorption, (1) lower surface is plane or is provided with groove (13) or is provided with raised step (14).The beneficial effects of the utility model are: it has advantages of that enforcement is easy, cost is low and thermal resistance is low.

Description

A kind of heat sink compound

Technical field

The utility model relates to wind-cooling heat dissipating field, particularly a kind of heat sink compound.

Background technology

Along with improving constantly of science and technology, electronic device in various electronic equipments is towards miniaturization, high integrated, at a high speed, high-effect, high power future development, these electronic devices unavoidably can produce than more hot before, if the heat dissipation problem of electronic device is not resolved, high temperature will directly cause electronic device usefulness to decline; For making the usefulness of its electronic device stable, it is of crucial importance that the design of the heat-sinking capability of electronic device becomes, therefore the various heat dissipating methods of electronic device also in response to and give birth to.Following is the development of making rapid progress, people have had more and more higher demand to the performance of heat sink material, extremely harsh service condition has even been proposed, as in industrial processes, just need to not affect under the prerequisite of materials'use performance, reduce the consumption of rare precious metal as far as possible, to reach the object reducing costs, single group element material is difficult to meet the demand of people to material combination property, composite material is different, they have well overcome the inadequate natural endowment of single group element material in performance, combine physics and the chemical property of different group element materials, especially take into account the price variance of different materials, in the hope of obtaining the complementation in price, reduce production costs, improve the benefit of producing.Therefore, making full use of the excellent properties of different group element materials, design and develop composite material fin, make it not only show better heat dispersion but also have cheap feature concurrently, is the huge advance made of our reasonable handy material.

Electronic devices and components, in the time of work, all have thermal property occurred frequently.Copper aluminium heat sink compound is in field of heat transfer, composite material copper base contact element device, the other aluminium composite material of copper base can be made heat radiation gear piece, the gear piece of making like this has in conjunction with the feature tight, thermal resistance is low, intensity is high, flow losses are little and conductivity of heat is high, particularly not yielding under long term high temperature operating mode.Ensure the components and parts stable performance that works long hours.

Utility model content

The purpose of this utility model is to overcome the shortcoming of prior art, and a kind of heat sink compound easy, cost is low and thermal resistance is low of implementing is provided.

The purpose of this utility model is achieved through the following technical solutions: a kind of heat sink compound, it comprises the heat absorption end, it at the bottom of described heat absorption, is copper aluminium compound integral structure, under heat absorption, layer is copper layer, heat absorption upper strata, the end is aluminium layer, on described aluminium layer, be processed with integrated heat radiation gear piece, offer multiple pilot holes at the bottom of described heat absorption, under described heat absorption, surface is for plane or be provided with groove or be provided with raised step.

At the bottom of described heat absorption, size is less than 15mm.

Described heat radiation tooth height is less than 130mm.

Described heat radiation gear piece is equally distributed on aluminium layer.

The utlity model has following advantage: heat sink compound of the present utility model has the following advantages:

1. implement easily: without increasing the relevant research and development times such as mould, can make fin according to thermal design demand condition.

2. cost is low: full copper radiating rib weight saving 30% on year-on-year basis, full aluminium radiator fin performance boost 35% on year-on-year basis, composite material light specific gravity, economical, volume production is without mold developing, copper aluminum composite material can be taken into account material price and characteristic in the hope of obtaining the complementation in price, makes it not only show better heat dispersion but also have cheap feature concurrently, reduces production costs;

3. thermal resistance is low: the utility model and the comparison of copper aluminium welding product, welding product aluminium flake need just can weld after electroplating, and scolding tin has a resistance and affects heat dispersion.The novel copper aluminium compound integral structure of this reality is without plating, not only conductivity is high, contact resistance is low and thermal conductivity is good, in field of heat transfer, can take into account the complementation of copper aluminium material material characteristic, have in conjunction with the feature tight, thermal resistance is low, intensity is high and conductivity of heat is high, fin heat dissipation is obviously improved.

Brief description of the drawings

Fig. 1 is perspective view of the present utility model;

Fig. 2 is schematic top plan view of the present utility model;

Fig. 3 is that master of the present utility model looks schematic diagram;

Fig. 4 is cross-sectional schematic of the present utility model;

Fig. 5 offers schematic diagram at the bottom of the heat absorption of groove;

Fig. 6 is provided with schematic diagram at the bottom of the heat absorption of raised step;

In figure, 1-absorbs heat at the end, the 2-gear piece that dispels the heat, 3-pilot hole, 11-aluminium layer, the copper layer of 12-, 13-groove, 14-raised step.

Embodiment

Below in conjunction with accompanying drawing, the utility model is further described, protection range of the present utility model is not limited to the following stated:

As Fig. 1, shown in Fig. 2 and Fig. 3, a kind of heat sink compound, it comprises the heat absorption end 1, at the bottom of described heat absorption, 1 is copper aluminium compound integral structure, its tension shock resistance is strong, be applicable to various environment, as shown in Figure 4, the heat absorption end 1 lower floor is copper layer 12, heat absorption upper strata, the end 1 is aluminium layer 11, at the bottom of described heat absorption, 1 size is less than 15mm, when when absorbing heat, thickness is 8mm at the end 1, copper layer thickness can reach 5mm, on described aluminium layer 11, be processed with integrated heat radiation gear piece 2, heat radiation gear piece 2 is integrated cutting forming, heat radiation gear piece 2 is highly less than 130mm, and heat radiation gear piece 2 is equally distributed on aluminium layer 11, at the bottom of described heat absorption, offer multiple pilot holes 3 on 1, pilot hole 3 profiles can design as required, as shown in Figure 5 and Figure 6, at the bottom of described heat absorption, 1 lower surface is plane or is provided with groove 13 or is provided with raised step 14, when when absorbing heat, lower surface is plane at the end 1, copper layer 12 and electronic devices and components contact area maximum, composite radiating screening radiating efficiency is the highest, before installation, be coated with the heat-conducting silicone grease of the about 0.1mm of thickness at copper layer 12 lower surface, its objective is in order to fall end thermal resistance, increase heat transfer sectional area.Some electronic devices and components is irregular, as shown in Figure 5, therefore the end 1 lower surface that absorbs heat will arrange groove 13, and groove 13 can be dodged the electronic devices and components electronic devices and components of also can fitting, thereby ensures the heat conduction at the heat absorption end, realize the heat radiation of electronic devices and components, as shown in Figure 6, the heat absorption end 1, also can arrange raised step 14 on lower surface, and raised step 14 and the heat absorption end 1 for to be structure as a whole without thermal resistance, realize the heat conduction of electric component, and then reach effect of heat radiation.

Claims

1. a heat sink compound, it is characterized in that: it comprises the heat absorption end (1), at the bottom of described heat absorption, (1) is copper aluminium compound integral structure, the heat absorption end (1) lower floor is copper layer (12), heat absorption (1) upper strata, the end is aluminium layer (11), on described aluminium layer (11), be processed with integrated heat radiation gear piece (2), at the bottom of described heat absorption, on (1), offer multiple pilot holes (3), at the bottom of described heat absorption, (1) lower surface is plane or is provided with groove (13) or is provided with raised step (14).

2. a kind of heat sink compound according to claim 1, is characterized in that: at the bottom of described heat absorption, (1) size is less than 15mm.

3. a kind of heat sink compound according to claim 1, is characterized in that: described heat radiation gear piece (2) is highly less than 130mm.

4. a kind of heat sink compound according to claim 1, is characterized in that: described heat radiation gear piece (2) is equally distributed on aluminium layer (11).