CN202134529U - Graphite radiator device - Google Patents
Graphite radiator device Download PDFInfo
- Publication number
- CN202134529U CN202134529U CN201120260281U CN201120260281U CN202134529U CN 202134529 U CN202134529 U CN 202134529U CN 201120260281 U CN201120260281 U CN 201120260281U CN 201120260281 U CN201120260281 U CN 201120260281U CN 202134529 U CN202134529 U CN 202134529U
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- Prior art keywords
- copper
- heat
- graphite
- pedestal
- fins
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Abstract
The utility model relates to a graphite radiator device, which comprises a copper pedestal and a plurality of heat conductive graphite fins, wherein the heat conductive graphite fins are embedded into a slot in the surface of the copper pedestal, chemical copper plating layers are clad on the surfaces of the heat conductive graphite fins, the heat conductive graphite fins extend upwards from the upper surface of the copper pedestal, and the copper pedestal is composed of a pure copper plate. The graphite radiator device has the beneficial effects that heat conductive graphite fins are employed to replace copper materials, the copper pedestal is arranged at the bottom of the radiator, the copper pedestal is contacted with heat source wafers so as to rapidly diffuse heat generated in operation and transmit the heat to a graphite heat radiation fin set, a largest effective surface area is created via copper clad on the surface of graphite heat radiation fins, and on the copper surface, the heat is transferred via an external cooling medium; graphite and the copper are combined so as to form an optimal heat radiation material, thus an optimal heat radiation effect is achieved, and the graphite radiator device has the characteristics of clean and bright surface, decoration performance, excellent physical mechanical performance, low heat resistance, light weight, high heat conduction coefficient, and the like.
Description
Technical field
The utility model relates to a kind of radiator, relates in particular to a kind of graphite radiating apparatus that is applied to the heat radiation of printed circuit board (PCB) wafer.
Background technology
At present, any device all has certain loss on the printed circuit board (PCB) when work, and most loss becomes heat, and the low-power device loss is little, need not heat abstractor; And the high power device loss is big, if do not take cooling measure, then the temperature of wafer can meet or exceed the junction temperature of permission; Device will be damaged; Therefore must add heat abstractor, the most frequently used is installed in power device on the radiator exactly, utilizes radiator that heat is loose to surrounding space; Add radiator fan in case of necessity, strengthen cooling heat dissipation with certain wind speed.Radiator at first needs to transmit heat fast, and (wherein Q represents heat, the heat that just heat conduction produced or conducted according to heat conducting fundamental formular " Q=K * A * Δ T/ Δ L "; K is the coefficient of heat conduction of material, the area that the A representative is conducted heat or the contact area of two articles, and Δ T represents the temperature difference at two ends; Δ L then is the distance at two ends), can know according to formula, promote the amount Q of heat transfer; Then need promote the K, A, the Δ T that are directly proportional with it, or reduce the numerical value of Δ L; For radiator, Δ L is constant, and A can not be bigger than the area of CPU top cover more greatly, and what can change has only K.The conductive coefficient of metal material is constant, and about 420W/m-k and 220W/m-k, therefore from heat transfer rate, copper is compared aluminium and improved at least 70%, a better choice that yes respectively for the about 390-402W/m-k of the conductive coefficient of fine copper, silver and aluminium; The unit of specific heat capacity is burnt every kilogram degree centigrade, that is to say that specific heat capacity should be relevant with the quality rather than the volume of material, can be much heavier and seem the copper of same volume than the aluminium of same volume, because the density of copper is 8.9g/cm
3, and aluminium is 2.7g/cm
3Can know 1000cm according to formula
3Copper, specific heat capacity is 3.47; And the aluminium of same volume, specific heat capacity has only 2.43, is equivalent to 70% of copper.Therefore can reach a conclusion, copper can the fast Absorption heat and is stored great amount of heat energy, is the best material of making fin.When selecting fin, should select copper reaching best radiating effect, but that copper is worth is higher and heavier.
To sum up analyze; Copper aluminium combination at present is a radiator solution; And popular copper aluminium combined process (do the heat absorbing end of radiator bottom with copper, do radiating end with aluminium) mainly contains " embedding copper ", " pressing solidly ", " gear shaping ", " forging " etc. in the market, and several kinds of technologies all are through changing diffusing heat absorption capacity at aluminium radiator bottom copper heat absorbing sheet of adding or copper core; " embedding copper " wherein mainly is with filling in the copper post after the aluminium radiator heating; After waiting for the aluminium cooling copper post is tightly embraced, this technology cost is lower, and actual effect is also good; Wherein " pressing solidly " then is through screw copper billet to be combined with aluminium radiator, and cost is low, but combines the interface thermal resistance to be difficult to control; " gear shaping " wherein is to increase area of dissipation through the aluminium matter fin of plugging One's name is legion at the bottom of the copper; " forging " wherein is high-end relatively, mainly is that aluminium radiator is pressurized to yield point, combines closely with it at the bottom of adding copper then, and effect preferably but cost is the highest.The conductive graphite sheet is also claimed the graphite radiating sheet; Be a kind of brand-new heat conduction and heat radiation material, have unique grain orientation, along the both direction uniform heat conduction; Laminar structuredly can adapt to any surface well, the performance of shielding thermal source improvement consumer electronics product the time with assembly.The graphite radiating sheet can smoothly be attached to any plane and curved surface, and can do any type of cutting according to client's demand, and its main coefficient comprises: low thermal resistance: thermal resistance is lower by 40% than aluminium, than copper low 20%; In light weight: weight ratio aluminium is light by 25%, and is lighter by 75% than copper; High thermal conductivity coefficient: graphite radiating sheet 300-1500W/mK (aluminium 200W/mK, copper 380W/mK).But because the self-characteristic of graphite material material; Profile is not attractive in appearance; Be difficult to realize that the graphite radiating material is connected with the tight of metal base; Own bad mechanical strength simultaneously the accident that comes off of graphite radiating sheet possibly occur during heat sink material such as load fan, thereby influence the usefulness of entire heat dissipation equipment on fin.Therefore, comprehensive quality, effect and three factors of price, copper and graphite combine a good radiator solution, can improve prior art according to this direction.
The utility model content
To above defective, the utility model provides a kind of graphite radiating apparatus, makes it can either effectively promote radiating effect, also can significantly reduce the manufacturing cost of entire heat dissipation device.
For realizing above-mentioned purpose, the utility model adopts following technical scheme:
A kind of graphite radiating apparatus comprises a copper pedestal and some conductive graphite fins, and said conductive graphite fin is intercalated in the copper base-plates surface groove, and this conductive graphite fin surface coats one deck chemical plating copper layer.Said conductive graphite fin extends upward from the upper surface of this copper pedestal, and said copper pedestal is made up of the fine copper plate.The plating mode that whole device adopted is an electroless copper, and preparation method mainly comprises: copper pedestal and the assembling of composite graphite fin, whole device electro-coppering is handled.
The beneficial effect of the described graphite radiating apparatus of the utility model is: replace copper material through adopting the conductive graphite sheet; One bronze medal pedestal is set in the bottom of radiator; This copper pedestal contacts with the thermal source wafer, and the heat that produces during with operation spreads apart and conduct to the graphite radiating fins group rapidly, through the surface coated copper of graphite radiating sheet; Create maximum effective surface area, and heat is moved away by extraneous cooling media on this copper surface; This graphite is superior performance and Heat Conduction Material with low cost; And copper is best heat sink material; Both combinations can reach best radiating effect, have that cleaning surfaces light, decorate properties, physical and mechanical properties are good, characteristics such as low thermal resistance, in light weight, conductive coefficient height.
Description of drawings
According to accompanying drawing the utility model is done further explain below.
Fig. 1 is the structural representation of the said graphite radiating apparatus of the utility model embodiment.
Among the figure:
1, chemical plating copper layer; 2, conductive graphite fin; 3, copper pedestal.
Embodiment
As shown in Figure 1; The described graphite radiating apparatus of the utility model embodiment; Comprise a copper pedestal 3 and plurality of compound conductive graphite fin 2; Said conductive graphite fin 2 be spaced and be intercalated in copper pedestal 3 surface and certainly the upper surface of this copper pedestal 3 extend upward, copper pedestal 3 wherein is made up of the fine copper plate, conductive graphite fin 2 surface coating one deck chemical plating copper layers 1 wherein; Said conductive graphite fin 2 is intercalated in the groove on these copper pedestal 3 surfaces.
The described graphite radiating apparatus of above the utility model embodiment, the making of graphite heat radiator dress may further comprise the steps: 1. heat conduction fin matrix is made, by the specification requirement moulding of product and cut into satisfactory graphite radiating material; 2. graphite radiating material matrix surface treatment, the dust and the greasy dirt of removing substrate surface improve the adhesive force between coating and base material; 3. on the heat sink material matrix of a last step, make sensitization and activation processing; 4. carrying out electroless copper handles; 5. intercalation composite graphite radiating fin group on the copper matrix; 6. the electro-coppering of entire heat dissipation device is handled; 7. check.
Above embodiment is more preferably embodiment a kind of of the utility model, and common variation that those skilled in the art carry out in present technique scheme scope and replacement should be included in the protection range of the utility model.
Claims (3)
1. graphite radiating apparatus; Comprise a copper pedestal (3) and some conductive graphite fins (2); It is characterized in that: said conductive graphite fin (2) is intercalated in copper pedestal (3) Surface Groove, and this conductive graphite fin (2) surface coats one deck chemical plating copper layer (1).
2. graphite radiating apparatus according to claim 1 is characterized in that: said conductive graphite fin (2) upper surface of this copper pedestal (3) certainly extends upward.
3. graphite radiating apparatus according to claim 1 is characterized in that: said copper pedestal (3) is made up of the fine copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120260281U CN202134529U (en) | 2011-07-22 | 2011-07-22 | Graphite radiator device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120260281U CN202134529U (en) | 2011-07-22 | 2011-07-22 | Graphite radiator device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202134529U true CN202134529U (en) | 2012-02-01 |
Family
ID=45523291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120260281U Expired - Fee Related CN202134529U (en) | 2011-07-22 | 2011-07-22 | Graphite radiator device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202134529U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489836A (en) * | 2013-09-26 | 2014-01-01 | 天津安品有机硅材料有限公司 | Radiator based on high-density graphene and manufacturing method thereof |
| CN107278092A (en) * | 2017-06-05 | 2017-10-20 | 深圳市鸿富诚屏蔽材料有限公司 | Fin and its manufacture method |
| EP3644354A1 (en) * | 2018-10-25 | 2020-04-29 | Thales | Thermal diffusion interface |
| CN112638041A (en) * | 2020-12-25 | 2021-04-09 | 深圳光韵达激光应用技术有限公司 | Manufacturing process of heat dissipation substrate |
| CN113594109A (en) * | 2021-07-16 | 2021-11-02 | 深圳市立凡硅胶制品有限公司 | Hot press forming heat conducting film |
-
2011
- 2011-07-22 CN CN201120260281U patent/CN202134529U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489836A (en) * | 2013-09-26 | 2014-01-01 | 天津安品有机硅材料有限公司 | Radiator based on high-density graphene and manufacturing method thereof |
| CN103489836B (en) * | 2013-09-26 | 2016-09-07 | 天津安品有机硅材料有限公司 | Radiator based on high-density graphite alkene and preparation method thereof |
| CN107278092A (en) * | 2017-06-05 | 2017-10-20 | 深圳市鸿富诚屏蔽材料有限公司 | Fin and its manufacture method |
| CN107278092B (en) * | 2017-06-05 | 2023-08-29 | 深圳市鸿富诚新材料股份有限公司 | Heat sink and method of manufacturing the same |
| EP3644354A1 (en) * | 2018-10-25 | 2020-04-29 | Thales | Thermal diffusion interface |
| FR3087938A1 (en) * | 2018-10-25 | 2020-05-01 | Thales | THERMAL DIFFUSION INTERFACE |
| CN112638041A (en) * | 2020-12-25 | 2021-04-09 | 深圳光韵达激光应用技术有限公司 | Manufacturing process of heat dissipation substrate |
| CN112638041B (en) * | 2020-12-25 | 2022-03-08 | 深圳光韵达激光应用技术有限公司 | Manufacturing process of heat dissipation substrate |
| CN113594109A (en) * | 2021-07-16 | 2021-11-02 | 深圳市立凡硅胶制品有限公司 | Hot press forming heat conducting film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120201 Termination date: 20140722 |
|
| EXPY | Termination of patent right or utility model |