CN112638041B - Manufacturing process of heat dissipation substrate - Google Patents
Manufacturing process of heat dissipation substrate Download PDFInfo
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- CN112638041B CN112638041B CN202011564156.4A CN202011564156A CN112638041B CN 112638041 B CN112638041 B CN 112638041B CN 202011564156 A CN202011564156 A CN 202011564156A CN 112638041 B CN112638041 B CN 112638041B
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- metal foil
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- electroplating
- heat dissipation
- glue
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 title claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 239000011888 foil Substances 0.000 claims abstract description 45
- 238000009713 electroplating Methods 0.000 claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 238000003475 lamination Methods 0.000 claims abstract description 5
- 239000002923 metal particle Substances 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 26
- 238000004140 cleaning Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 9
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 9
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 230000002378 acidificating effect Effects 0.000 claims description 6
- 229920006332 epoxy adhesive Polymers 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920001131 Pulp (paper) Polymers 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 239000011094 fiberboard Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000002893 slag Substances 0.000 claims description 3
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002023 wood Substances 0.000 claims description 3
- -1 phenolic aldehyde Chemical class 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 244000025254 Cannabis sativa Species 0.000 description 3
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 3
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 3
- 235000009120 camo Nutrition 0.000 description 3
- 235000005607 chanvre indien Nutrition 0.000 description 3
- 239000011487 hemp Substances 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明提供一种散热基板制作工艺，包括以下步骤，S1：预备用于进行散热基材制作的金属箔材；S2：在金属箔材上贴附或涂覆一层抗电镀层；S3：采用高温层压或直接手工贴附的方式增加贴附或涂覆的紧密型；S4：采用激光光束对金属箔材贴附或涂覆的一面/双面进行钻孔或挖槽；所述激光光束可以直接加工到金属箔材层，也可以将金属箔材层切穿或半穿；S5：电镀处理；使槽孔内电镀的金属粒子填满、填一半或其他填充高度；S6：去除抗电镀绝缘层；露出电镀散热柱体，通过采用在金属箔材上贴附抗电镀层，散热以金属为基底，上面布满了密密麻麻的柱形体，以提高散热板与空气与其它媒介(包含气体，空气，液体等)的接触面积，提高散热效率。
The present invention provides a process for manufacturing a heat-dissipating substrate, comprising the following steps: S1: preparing a metal foil for making a heat-dissipating substrate; S2: attaching or coating a layer of anti-electroplating layer on the metal foil; S3: using High-temperature lamination or direct manual attachment to increase the compactness of attachment or coating; S4: use a laser beam to drill or groove on one/both sides of the metal foil attached or coated; the laser beam It can be directly processed to the metal foil layer, or the metal foil layer can be cut through or half-through; S5: electroplating treatment; fill, half or other filling heights of the electroplated metal particles in the slot hole; S6: remove anti-plating Insulation layer; exposed electroplating heat dissipation cylinder, by attaching an anti-electroplating layer on the metal foil, the heat dissipation is based on metal, covered with dense cylinders, in order to improve the heat dissipation plate and air and other media (including gas, Air, liquid, etc.) contact area to improve heat dissipation efficiency.
Description
[ technical field ]
The invention relates to the technical field of manufacturing processes of radiating substrates, in particular to a manufacturing process of a radiating substrate with a prominent application effect.
[ background art ]
With the introduction of 5G, the heating condition of electronic products is more and more serious, and the traditional graphite heat sink cannot meet the heat dissipation requirement inside the electronic products, so a novel heat sink needs to be developed.
[ summary of the invention ]
In order to overcome the problems in the prior art, the invention provides a manufacturing process of a heat dissipation substrate with a remarkable application effect.
The invention provides a manufacturing process of a heat dissipation substrate, which comprises the following steps,
s1: preparing a metal foil for manufacturing a heat dissipation base material;
s2: attaching or coating a layer of anti-electroplating layer on the metal foil;
s3: the compact type of attachment or coating is increased by adopting a high-temperature lamination or direct manual attachment mode;
s4: drilling or grooving one side/two sides of the metal foil attached or coated by adopting a laser beam; the laser beam can be directly processed to the metal foil layer, and the metal foil layer can also be cut through or semi-penetrated;
s5: electroplating treatment; filling, half or other filling heights with the metal particles plated in the slot;
s6: removing the anti-electroplating insulating layer; exposing the plated heat dissipation post.
The heat dissipation takes metal as a substrate, and dense and hemp column-shaped bodies are fully distributed on the metal to improve the contact area of the heat dissipation plate and air and other media (including gas, air, liquid and the like) and improve the heat dissipation efficiency.
Preferably, the thickness of the metal foil is in the range of 2-2000 μm; the thickness of the plating resist layer ranges from 2 to 2000 μm.
Preferably, the metal foil in step S1 is copper, nickel, chromium, aluminum, silver, gold, tungsten, magnesium, and other metals and alloys that can conduct electricity.
Preferably, in the step S2; the method for attaching or coating the anti-electroplating layer on the metal foil specifically comprises the following steps: a. bonding the thermosetting insulating film material with the metal foil material through self bonding; b. placing or coating a layer of glue/film between the metal foil and the electroplating-resistant layer; c. coating a layer of printing ink or glue on one side or two sides of the metal foil; the ink or glue may be: acrylic adhesives, epoxy or modified epoxy adhesives, phenolic-butyral adhesives and other high molecular bonding adhesives, and various inks.
Preferably, the glue/film can be acrylic adhesive, epoxy or modified epoxy adhesive, phenolic aldehyde-butyl acetal adhesive and other polymer bonding glue, high-temperature glue-dissolving glue and UV photosensitive glue-dissolving glue/film.
Preferably, the laminating temperature in the step S3 is in the range of 0-320 degrees; the anti-electroplating layer is polyimide PI, PEEK, TPI, PTFE, PPS, PET, PP, nylon LCP Liquid Crystal Polymer (Liquid Crystal Polymer), pen, aluminum nitride and alumina ceramic or Teflon, wood, epoxy glass fiber of PCB, FR4 fiberboard, wood pulp board, phenolic board or other plastic film materials and Polymer film materials with insulating property.
Preferably, after the step S4, a cleaning process is performed: removing carbon slag, layering and foreign matters from the interior of the processed slotted hole so as to facilitate the subsequent combination degree of black hole and electroplating; the cleaning mode comprises water cleaning, acidic liquid cleaning, plasma cleaning, ultrasonic cleaning and traditional PCB copper plating and cleaning before a hole plating process.
Preferably, the removing manner in step S6 mainly includes: a, removing ink and glue on the surface in an alkaline and acidic manner; b, the colloid and the metal foil can lose the viscosity at a certain temperature, so that the purpose of removing the insulating layer is achieved; c, adopting a UV irradiation method to remove the glue by losing the bonding capability; d: and (4) removing and cleaning the electroplating resist by using a laser beam.
Compared with the prior art, the manufacturing process of the heat dissipation substrate has the advantages that the anti-electroplating layer is attached to the metal foil, the metal is used as the base for heat dissipation, and the dense and hemp columns are fully distributed on the metal foil, so that the contact area between the heat dissipation plate and air and other media (including gas, air, liquid and the like) is increased, and the heat dissipation efficiency is improved.
[ description of the drawings ]
Fig. 1 is a schematic flow chart of a manufacturing process of a heat dissipation substrate according to the present invention.
[ detailed description of the invention ]
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, a heat dissipation substrate manufacturing process 1 of the present invention includes the following steps,
s1: preparing a metal foil for manufacturing a heat dissipation base material;
s2: attaching or coating a layer of anti-electroplating layer on the metal foil;
s3: the compact type of attachment or coating is increased by adopting a high-temperature lamination or direct manual attachment mode;
s4: drilling or grooving one side/two sides of the metal foil attached or coated by adopting a laser beam; the laser beam can be directly processed to the metal foil layer, and the metal foil layer can also be cut through or semi-penetrated;
s5: electroplating treatment; filling, half or other filling heights with the metal particles plated in the slot;
s6: removing the anti-electroplating insulating layer; exposing the plated heat dissipation post.
Preferably, the thickness of the metal foil is in the range of 2-2000 μm; the thickness of the plating resist layer ranges from 2 to 2000 μm.
Preferably, the metal foil in step S1 is copper, nickel, chromium, aluminum, silver, gold, tungsten, magnesium, and other metals and alloys that can conduct electricity.
Preferably, in the step S2; the method for attaching or coating the anti-electroplating layer on the metal foil specifically comprises the following steps: a. bonding the thermosetting insulating film material with the metal foil material through self bonding; b. placing or coating a layer of glue/film between the metal foil and the electroplating-resistant layer; c. coating a layer of printing ink or glue on one side or two sides of the metal foil; the ink or glue may be: acrylic adhesives, epoxy or modified epoxy adhesives, phenolic-butyral adhesives and other high molecular bonding adhesives, and various inks.
Preferably, the glue/film can be acrylic adhesive, epoxy or modified epoxy adhesive, phenolic aldehyde-butyl acetal adhesive and other polymer bonding glue, high-temperature glue-dissolving glue and UV photosensitive glue-dissolving glue/film.
Preferably, the laminating temperature in the step S3 is in the range of 0-320 degrees; the anti-electroplating layer is polyimide PI, PEEK, TPI, PTFE, PPS, PET, PP, nylon LCP Liquid Crystal Polymer (Liquid Crystal Polymer), pen, aluminum nitride and alumina ceramic or Teflon, wood, epoxy glass fiber of PCB, FR4 fiberboard, wood pulp board, phenolic board or other plastic film materials and Polymer film materials with insulating property.
Preferably, after the step S4, a cleaning process is performed: removing carbon slag, layering and foreign matters from the interior of the processed slotted hole so as to facilitate the subsequent combination degree of black hole and electroplating; the cleaning mode comprises water cleaning, acidic liquid cleaning, plasma cleaning, ultrasonic cleaning and traditional PCB copper plating and cleaning before a hole plating process.
Preferably, the removing manner in step S6 mainly includes: a, removing ink and glue on the surface in an alkaline and acidic manner; b, the colloid and the metal foil can lose the viscosity at a certain temperature, so that the purpose of removing the insulating layer is achieved; c, adopting a UV irradiation method to remove the glue by losing the bonding capability; d: and (4) removing and cleaning the electroplating resist by using a laser beam.
Compared with the prior art, the heat dissipation substrate manufacturing process 1 disclosed by the invention has the advantages that the anti-electroplating layer is attached to the metal foil, the metal is used as the base for heat dissipation, and the dense and hemp columns are fully distributed on the metal foil, so that the contact area between the heat dissipation plate and air and other media (including gas, air, liquid and the like) is increased, and the heat dissipation efficiency is improved.
The above-described embodiments of the present invention do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (2)
1. A manufacturing process of a heat dissipation substrate is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
s1: preparing a metal foil for manufacturing a heat dissipation base material, wherein the thickness range of the metal foil is 2-2000 mu m;
s2: attaching or coating a layer of electroplating-resistant layer on the metal foil, wherein the thickness range of the electroplating-resistant layer is 2-2000 mu m, and the method for attaching or coating the electroplating-resistant layer on the metal foil specifically comprises the following steps: a. bonding the thermosetting insulating film material with the metal foil material through self bonding; b. placing or coating a layer of glue/film between the metal foil and the electroplating-resistant layer; c. coating a layer of printing ink or glue on one side or two sides of the metal foil; the glue may be: acrylic adhesives, epoxy or modified epoxy adhesives and phenolic aldehyde condensed adhesives, wherein the glue/film can be acrylic adhesives, epoxy or modified epoxy adhesives, phenolic aldehyde condensed aldehyde adhesives, high-temperature dispergation glue and UV photosensitive dispergation glue/film;
s3: the tightness of the attachment or coating is increased by adopting a high-temperature lamination or direct manual attachment mode, and the lamination temperature range is between 0 and 320 ℃; the anti-electroplating layer is polyimide PI, PEEK, TPI, PTFE, PPS, PET, PP, nylon, LCP Liquid Crystal Polymer (Liquid Crystal Polymer), PEN, aluminum nitride and alumina ceramics, wood, epoxy glass fiber of PCB, FR4 fiberboard, wood pulp board and phenolic aldehyde board;
s4: drilling or grooving one side/two sides of the metal foil attached or coated by adopting a laser beam; the laser beam cuts through or half-penetrates the metal foil layer, and after the step S4, cleaning is performed: removing carbon slag, layering and foreign matters from the interior of the processed slotted hole so as to facilitate subsequent black holes and improve the combination degree of electroplating; the cleaning mode comprises water cleaning, acidic liquid cleaning, plasma cleaning and ultrasonic cleaning;
s5: electroplating treatment; filling, half or other filling heights with the metal particles plated in the slot;
s6: removing the anti-plating layer; exposing the electroplated heat dissipation column, wherein the removing mode mainly comprises the following steps: a, removing ink and glue on the surface in an alkaline and acidic manner; b, the colloid and the metal foil can lose the viscosity at a certain temperature, so that the aim of removing the anti-electroplating layer is fulfilled; c, adopting a UV irradiation method to remove the glue by losing the bonding capability; d: and removing and cleaning the electroplating-resistant layer by using a laser beam.
2. The manufacturing process of a heat dissipation substrate as claimed in claim 1, wherein: the metal foil in step S1 is made of copper, nickel, chromium, aluminum, silver, gold, tungsten, or magnesium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011564156.4A CN112638041B (en) | 2020-12-25 | 2020-12-25 | Manufacturing process of heat dissipation substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011564156.4A CN112638041B (en) | 2020-12-25 | 2020-12-25 | Manufacturing process of heat dissipation substrate |
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| CN112638041B true CN112638041B (en) | 2022-03-08 |
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