CN110055563A - A method of improving metal heat sink microchannel electroforming uniformity - Google Patents
A method of improving metal heat sink microchannel electroforming uniformity Download PDFInfo
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- CN110055563A CN110055563A CN201910378094.9A CN201910378094A CN110055563A CN 110055563 A CN110055563 A CN 110055563A CN 201910378094 A CN201910378094 A CN 201910378094A CN 110055563 A CN110055563 A CN 110055563A
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- electroforming
- microchannel
- uniformity
- substrate
- heat sink
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/08—Perforated or foraminous objects, e.g. sieves
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention proposes a kind of methods for improving metal heat sink microchannel electroforming uniformity, photoresist is coated on substrate first, then the resist coating on substrate is exposed into mistake from smooth, mask film covering plate, it dries, develop afterwards, obtain the film structure that can be used for microchannel electroforming；Then carry out electroforming to the glue film on substrate: electroforming process carries out in million acoustic environments, and using substrate as cathode, while cathode applies rotating operation, and to casting liquid circulating filtration, microchannel cast layer is formed in the channel of film structure；Glue film is finally removed, final radiator microchannel with good uniformity is formed: being put into glue after electroforming is impregnated, is taken out after the glue film in structure all removal, cast layer metallic micro channel structures in homogeneous thickness is obtained after rinsing using deionized water；The present invention significantly improves the uniformity of metallic micro channel cast layer.
Description
Technical field
The invention belongs to metal heat sink microchannel preparation method field, especially a kind of raising metal heat sink microchannel
The method of electroforming uniformity.
Background technique
With the development of electronic technology, the integrated level of electronic circuit is higher and higher, and heat flow density is also gradually increased, how high
Effect heat dissipation becomes the research hotspot of electronic field.Since the radiating efficiency that metallic micro channel has is higher, processing method is more next
More it is concerned by people.The production method of existing metal heat sink microchannel have traditional machining, the special process with
And micro- eletroforming based on UV-LIGA technology.Microelectroforming technology wherein based on UV-LIGA technology with its unique advantage at
For the reliable processing method for the metallic micro channel that production line width is small, side wall is smooth, surface roughness is small.However in metallic micro channel
Electroforming during, the edge effect of electric current will cause electric field line and be easy to concentrate in edge, and the metallic micro channel after electroforming is past
Toward there are the problem of non-uniform of cast layer edge thickness intermediate thin.This defect not only will affect the dimensional accuracy and surface matter of microchannel
Amount reduces electroforming efficiency, extends fabrication cycle, also adds the post-processing difficulty and cost of microchannel production." light laser with from
Beamlet " the 63-67 pages of 6 phase of volume 28 uniformity for proposing to be improved micro- electroforming mold using ultrasound was surpassed with no ultrasound contrast 2016 years
Sound effect enhances the effect of mass transmitting during micro- electroforming, improves ion distribution when micro-structure electroforming, mold uniformity mentions
It is high by about 30%.However for prolonged electroforming process, TRANSIENT HIGH TEMPERATURE, the high pressure that the strong cavitation of ultrasound generates can be to micro-moulds
Film structure in electroforming causes certain damage, influences the service performance of micro- electroforming mold.
Million sound can generate stronger acoustic streaming phenomenon when propagating in the solution, can improve the solution mass transfer in micrometer structure
Process, while the cavitation effect that million sound act in lower solution is smaller than under ultrasound condition, avoids the damage to micro-structure.In micro- electricity
Applying the effect of million sound during casting can be improved the mass transfer ability of casting liquid, improves the ion distribution of microstructure portion, is conducive to electricity
The improvement of casting process.4.1.3 and 4.1.4 in paper " several microelectromechanical systems developments and correlation LIGA technical study "
Section introduces million sound and promotes electroforming solution mass transfer, improve the electroforming yield rate of the big aspect ratio structures of the limit, and obtains big with the limit
The Cantilever structure of depth-to-width ratio.But the micro-structure uniformity under the effect of million sound is not evaluated in text.Simultaneously
Since the straightline propagation phenomenon of million sound in the solution is obvious, the acoustic streaming action direction that million sound generate is relatively simple, this is caused
Pattern is affected in single direction when acoustic streaming effect is to micro-structure electroforming.And for complicated electric casting micro structure, million sound
The advantage function of million sound can not be only given full play to the casting liquid generation effect of microstructure portion in a single direction.
Currently, research and application rare report of million sound in electroforming field, and there has been no documents to propose mega sonic wave
Technology is applied to the research in terms of the uniformity of metal heat sink microchannel.
Summary of the invention
The purpose of the present invention is to provide a kind of methods for improving metal heat sink microchannel electroforming uniformity, to improve gold
Belong to the uniformity of microchannel cast layer.
The technical solution for realizing the aim of the invention is as follows:
A method of improving metal heat sink microchannel electroforming uniformity, comprising the following steps:
Step S1, photoresist is coated on substrate, the resist coating on substrate, then into excessively from smooth, mask film covering plate
It is exposed, it is rear to dry, develop, obtain the film structure that can be used for microchannel electroforming；
Step S2, carry out electroforming to the glue film on substrate: electroforming process carries out in million acoustic environments, using substrate as yin
Pole, while cathode applies rotating operation, and to casting liquid circulating filtration, microchannel cast layer is formed in the channel of film structure；
Step S3, glue film is removed, final radiator microchannel with good uniformity is formed: being put into after electroforming is removed photoresist
It is impregnated in liquid, is taken out after the glue film in structure all removal, cast layer gold in homogeneous thickness is obtained after rinsing using deionized water
Belong to microchannel structure.
Compared with prior art, the present invention its remarkable advantage:
(1) method of the invention solves altitude under ultrasonication cause using the advantage of the million sound pitch sound intensitys, low latitude
Microstructure Fracture problem.
(2) method of the invention overcomes the single limitation in million sound straightline propagation directions, makes using rotating cathode method
Microchannel all directions are equably acted on by million sound, and microchannel all directions can make ion under uniform million sound stirring action
Concentration distribution is more uniform, so as to improve microchannel electroforming uniformity, has more on improving metallic micro channel uniformity
Efficient practicability.
(3) method of the invention significantly improves the uniform of metallic micro channel cast layer in conjunction with million sound and rotating cathode
Property.
Present invention is further described in detail with reference to the accompanying drawing.
Detailed description of the invention
Fig. 1 is the method for the present invention flow chart.
Fig. 2 is metallic micro channel structures schematic diagram in embodiment 1.
Fig. 3 is that photoresist schematic diagram is coated in substrate.
Fig. 4 is that negative photoresist exposes schematic diagram.
Fig. 5 is effect picture after photoresist exposure development.
Fig. 6 is electrocasting method schematic diagram.
Fig. 7 is electroforming effect picture.
Fig. 8 is result figure after removing photoresist.
Fig. 9 is the pictorial diagram obtained by 1 preferred embodiment of embodiment.
Figure 10 is microchannel cast layer thickness measurement locations schematic diagram.
Figure 11 is without microchannel cast layer thickness distribution map under million sound and different million acoustical powers.
Specific embodiment
In order to illustrate technical solution of the present invention and technical purpose, with reference to the accompanying drawing and specific embodiment is the present invention
It is further to introduce.
In conjunction with Fig. 1, a kind of method of raising metal heat sink microchannel electroforming uniformity of the invention, including following step
It is rapid:
Step S0, substrate is pre-processed: metal substrate is ground using precise grinding polisher first, is polished
Processing removes substrate surface defects, makes base plate surface roughness Ra less than 0.04 μm；Then it is wiped using acetone cotton balls, then
Successively substrate is cleaned by ultrasonic using acetone, ethyl alcohol, is rinsed after ultrasonic cleaning using deionized water, rinses after-blow well
It is dry, it is finally putting into vacuum drying oven and is dried for standby.
Step S1, photoresist is coated on substrate, the resist coating on substrate, then into excessively from smooth, mask film covering plate
It is exposed, it is rear to dry, develop, obtain the film structure that can be used for microchannel electroforming.
In some embodiments, photoresist is positive photoetching rubber, and exposure mask plate shape is identical as microchannel shape.
In some embodiments, photoresist is negative photoresist, and exposure mask plate shape and microchannel shape are on the contrary, i.e. microchannel
The part of groove, mask plate are shading light part, and the part of microchannel protrusion, mask plate is light transmission part.
Step S2, carry out electroforming to the glue film on substrate: electroforming process carries out in million acoustic environments, using substrate as yin
Pole, while cathode applies rotating operation, and to casting liquid circulating filtration, microchannel cast layer is formed in the channel of film structure；
Preferably, million acoustic frequencies are 1Mhz, power 60W；Electroforming solution uses 210~220g/L of copper sulphate, sodium chloride 60
~70mg/L, the concentrated sulfuric acid 55~60g/L solution；The process conditions of copper electroforming are as follows: pH value 0.8~1.0,20~30 DEG C of temperature, electricity
1~2A/dm of current density2；
Step S3, glue film is removed, final radiator microchannel with good uniformity is formed: being put into after electroforming is removed photoresist
It is impregnated in liquid, is taken out after the glue film in structure all removal, cast layer gold in homogeneous thickness is obtained after rinsing using deionized water
Belong to microchannel structure.
Embodiment 1.
In conjunction with Fig. 2, the metallic micro channel structures 2 of 1 production multiple periods side by side on copper base, metallic micro channel 2
With a thickness of 100 μm, minimum feature is 400 μm, and the size of copper base 1 is 63 × 63 × 5mm, the specific steps are as follows:
Step S0, substrate is pre-processed: copper base 1 is ground using precise grinding polisher first, is polished
Processing removes substrate surface defects, makes base plate surface roughness Ra less than 0.04 μm；Then it is wiped using acetone cotton balls, then
Ultrasonic cleaning 10min successively is carried out to substrate using acetone, ethyl alcohol, is rinsed, is rinsed well using deionized water after ultrasonic cleaning
After dry up, be finally putting into vacuum drying oven and be dried for standby, drying temperature be 100 DEG C, baking 2h remove steam.
Step S1, SU-8 photoresist 3 is coated on logical substrate, obtains the film structure that can be used for microchannel electroforming: coating
Technique carries out on desk-top sol evenning machine.The whirl coating parameter of SU-8 photoresist 3 are as follows: low speed rotation 600rpm, time 6s；High speed switchs to
1000rpm, time 30s obtain 150-160 μm of film thickness, as shown in Figure 3.Then from smooth 30min, then in baking oven
Middle progress front baking technique, pre-bake temperature are 85 DEG C, time 1h.Mask film covering plate 4 is exposed after cooling, is exposed on SUSS light
It is carried out on quarter machine, as shown in figure 4, light source is the ultraviolet light of 365nm wavelength, exposure dose 300mw/cm2, time 2min.
It is dried after being carried out on 85 DEG C of hot plate after exposure, time 3min.Develop after drying afterwards, developing time 5min, final
The SU-8 glue film structure arrived, as shown in Figure 5.By the way that different revolving speeds is arranged, the time obtains the SU-8 glue glue of different-thickness
Film.
Since SU-8 photoresist is negative photoresist, 4 shape of mask plate is opposite with microchannel shape；Mask plate 4 in figure
Middle black portions shield portions, white portion are light transmission part.
Step S2, electroforming is carried out to the glue film on substrate:
The electroforming of microchannel structure is directly carried out using the SU-8 glue film structure of production as cathode；Electroforming process is in million sound
It is carried out in environment.Using substrate as cathode 6, cathode 6 and anode 5 are opposite, and cathode 6 is placed in electroforming solution；Cathode 6 and rotary shaft
9 is fixed, to apply rotating operation to cathode 6；Megasonic transducer 8 is equipped with outside reaction tank, to apply million sound to electroforming process；Such as
Shown in Fig. 6；Million acoustic frequencies are 1Mhz, power 60W, while applying cathode rotary motion and casting liquid circulating filtration, cathode rotation
Speed is 30rpm；Electroforming casting in bronze formula of liquid are as follows: 210~220g/L of copper sulphate (preferably 215g/L), 60~70mg/L of sodium chloride
(preferably 65mg/L), 55~60g/L of the concentrated sulfuric acid (preferably 55g/L)；The process conditions of copper electroforming are as follows: pH value 0.8~1.0 is (preferably
0.9), 20~30 DEG C of temperature (preferably 25 DEG C), current density 2A/dm2；The electroforming time is 5h, and it is micro- to obtain copper radiator after electroforming
Channel cast layer 2, as shown in Figure 7.
Step S3, glue film is removed, final radiator microchannel with good uniformity is formed: metal to be removed photoresist is micro- logical
The SU-8 that road is immersed in 80~90 DEG C (preferably 85 DEG C) is gone in glue, is impregnated 10-15h (preferably 13h), clean to the removal of SU-8 glue
Cast layer metallic micro channel structures in homogeneous thickness are obtained after being rinsed afterwards with deionized water, as shown in Figure 8.Fig. 9 is excellent by embodiment 1
The metallic micro channel pictorial diagram for selecting scheme to obtain.
It includes two samples that micro- electroforming experiment, which is divided into two groups: first groups (influences of million sound to micro-structure cast layer the thickness uniformity),
Piece applies million sound of 90w respectively and does not apply million sound.Second group (influence of million acoustical powers to micro-structure cast layer the thickness uniformity) packet
Containing three prints, apply 0w, million sound of 60w, 90w respectively.The electroforming time is 5 hours, current density 2A/dm2, cathode revolving speed
For 30rpm.
The cast layer thickness of microchannel is measured, 11 points is chosen and measures.Measurement point is opposite in micro-structure
Position is as shown in Figure 10.Figure 11 gives without microchannel cast layer thickness distribution map under million sound and different million acoustical powers.It can by Figure 11
Know, under the effect of million sound, the cast layer thickness at microchannel cast layer edge reduces, and interior thickness increases, and the bigger cast layer of million acoustical powers
Edge thickness is smaller, and interior thickness is bigger, and edge and interior thickness more reach unanimity, and illustrates that the uniformity of cast layer thickness is better.
The uniformity that the cast layer of metallic micro channel can be significantly improved using method of the invention guarantees the use of microchannel
Performance.In current density 2A/dm2, under conditions of electroforming time 5h, relative to the conventional electroforming acted on without million sound, rotation electrode
The microchannel cast layer that process obtains, the acoustic streaming of million sound have good stirring action when acting on micro-structure electroforming, can be enhanced
The mass transfer of electroforming process intermediate ion；Rotating cathode makes micro-structure all directions by uniform stirring action.In the effect of the two
Under, when the electroforming of microchannel, the ion concentration distribution near electroforming face tends to uniformly, using million sound rotating cathode electroforming sides of the invention
The microchannel uniformity of method production improves 30.1%, it is seen then that can obtain thickness using this million sound rotating cathode method
More uniform microchannel cast layer.
Claims (6)
1. a kind of method for improving metal heat sink microchannel electroforming uniformity, which comprises the following steps:
Step S1, photoresist is coated on substrate, the resist coating on substrate, then into excessively from smooth, mask film covering plate progress
Exposure, it is rear to dry, develop, obtain the film structure that can be used for microchannel electroforming；
Step S2, carry out electroforming to the glue film on substrate: electroforming process carries out in million acoustic environments, using substrate as cathode, together
When cathode apply rotating operation, to casting liquid circulating filtration, in the channel of film structure formed microchannel cast layer；
Step S3, glue film is removed, forms final radiator microchannel with good uniformity: by being put into glue after electroforming
It impregnates, is taken out after the glue film in structure all removal, it is micro- that cast layer metal in homogeneous thickness is obtained after rinsing using deionized water
Channel design.
2. the method according to claim 1 for improving metal heat sink microchannel electroforming uniformity, which is characterized in that described
Photoresist is positive photoetching rubber, and exposure mask plate shape is identical as microchannel shape.
3. the method according to claim 1 for improving metal heat sink microchannel electroforming uniformity, which is characterized in that described
Photoresist is negative photoresist, and exposure mask plate shape is opposite with microchannel shape.
4. the method according to claim 1 for improving metal heat sink microchannel electroforming uniformity, which is characterized in that electroforming
Million acoustic frequencies are 1Mhz, power 60W in the process；Electroforming solution uses 210~220g/L of copper sulphate, 60~70mg/L of sodium chloride,
The concentrated sulfuric acid 55~60g/L solution；The process conditions of copper electroforming are as follows: pH value 0.8~1.0,20~30 DEG C of temperature, current density 1~
2A/dm2。
5. the method according to claim 1 for improving metal heat sink microchannel electroforming uniformity, which is characterized in that cathode
Apply rotation, applied by rotary shaft and rotated, megasonic transducer is equipped with outside reaction tank and applies million sound.
6. the method according to claim 1 for improving metal heat sink microchannel electroforming uniformity, which is characterized in that step
Before S1 further include: step S0, pre-processed to substrate: metal substrate is ground using precise grinding polisher first,
Then polishing treatment is cleaned and is dried.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110820023A (en) * | 2019-10-29 | 2020-02-21 | 苏州胜利精密制造科技股份有限公司 | Method for preparing ultra-precise microstructure radiating fin |
| CN112638041A (en) * | 2020-12-25 | 2021-04-09 | 深圳光韵达激光应用技术有限公司 | Manufacturing process of heat dissipation substrate |
| US11149937B2 (en) | 2020-01-30 | 2021-10-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Functionally graded manifold microchannel heat sinks |
| CN114250493A (en) * | 2021-12-21 | 2022-03-29 | 广西科技大学 | Method for processing high-temperature-resistant and smooth-side-wall-surface parts for vacuum devices |
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| CN114250493A (en) * | 2021-12-21 | 2022-03-29 | 广西科技大学 | Method for processing high-temperature-resistant and smooth-side-wall-surface parts for vacuum devices |
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Application publication date: 20190726 |