CN105127526A - Disc type scanning electrode mask film microelectrolysis electrical discharge machining system and machining method - Google Patents

Disc type scanning electrode mask film microelectrolysis electrical discharge machining system and machining method Download PDF

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CN105127526A
CN105127526A CN201510560682.6A CN201510560682A CN105127526A CN 105127526 A CN105127526 A CN 105127526A CN 201510560682 A CN201510560682 A CN 201510560682A CN 105127526 A CN105127526 A CN 105127526A
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electrode
workpiece
disc
mask
working fluid
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CN201510560682.6A
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Chinese (zh)
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郭钟宁
吴明
黄志刚
刘江文
张永俊
罗红平
王亚坤
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广东工业大学
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Abstract

The invention discloses a disc type scanning electrode mask film microelectrolysis electrical discharge machining system. The system comprises a workpiece, a disc type electrode and working fluid, the machining surface of the workpiece is covered with a mask film, machining windows are formed in the mask film, the workpiece is placed in the working fluid, the disc type electrode is located in the part, above the workpiece, of the working fluid, and the workpiece and the disc type electrode are connected with a power source through wires. The machining system and machining method have the advantages that the workpiece is covered with the structurally-insulating mask film, the mask film shape can be precisely copied, the large-scale textured microstructure machining is conducted, the machining is only conducted in areas which are uncovered by the mask film, and the high locality is achieved; the tool electrode which is used is a large-area electrode, and relative movement exists between the tool electrode and the workpiece; losses of all areas of the tool electrode can be made to tend to be balanced by planning a special movement curve, and all machining gaps are made to maintain unified; the electrolysis only serves for the polishing effect, and the main removal form is spark discharge removal; the working fluid is supplied in a mode from top to bottom and sprayed out of the center of the disc type electrode from inside to outside, so that the working fluid renewal is made to be more effective.

Description

一种盘型扫描电极掩膜微电解放电加工系统及加工方法 A disk scanning electrodes mask micro-electrolysis method for electrical discharge machining system and processing

技术领域 FIELD

[0001] 本发明涉及电加工技术领域,具体是指一种盘型扫描电极掩膜微电解放电加工系统及加工方法。 [0001] The present invention relates to the field of electrical processing technology, in particular to a disk-type mask microelectrolysis scan electrode discharge machining systems and processing methods.

背景技术 Background technique

[0002] 随着微电子技术、纳米技术、微纳加工技术、激光技术、微化学技术、新材料新工艺等技术的进步,微机械系统(MEMS)技术得到不断提升和发展。 [0002] With advances in microelectronics, nanotechnology, micro nanofabrication technology, laser technology, chemical micro-technology, new materials, new technology and other technologies, micro-mechanical systems (MEMS) technology has been rising and development. 微流控芯片在生物、化学和医学等领域具有极大潜力。 Microfluidic chip has a great potential in the fields of biology, chemistry and medicine. 聚合物材料由于具有成本低、性能良好、选择范围广等优点,通过模具易于实现微流控芯片的快速、低成本、大批量生产,正日益成为制作微流控芯片的主要材料(见:刘莹.基于微流控芯片的微结构制品注塑成型工艺技术研究.大连:大连理工大学,2012)。 Since the polymer material has a low cost, good performance, a wide range of options, etc., through the mold easy to achieve rapid, low-cost, mass production of the microfluidic chip, it is increasingly becoming a material mainly made of micro-fluidic chip (see: Liu Ying molding technology based microstructured article injection microfluidic chip Dalian: Dalian University of technology, 2012).

[0003] 聚合物微流控芯片一般采用热压成型法、模塑法、注塑成型法、激光烧蚀法等加工方法成型(见:常宏玲.注塑成型PMMA微流控芯片热压键合研究[D].大连:大连理工大学,2012)。 [0003] Polymer microfluidic chip generally used compression molding method, molding processing method, injection molding method, a laser ablation method or the like molding (see: Chang Hong Ling injection molding PMMA microfluidic chip thermocompression bonding Research [D] Dalian: Dalian University of Technology, 2012). 前三种方法利用模具制造微流控芯片,成本低、周期短、自动化程度高,是目前最常用的微流控芯片成型方法。 The first three methods using a mold for manufacturing a micro-fluidic chip, low cost, short cycle, high degree of automation, is the most commonly used method of forming a micro-fluidic chip. 所以,研究一种高效制备优质的金属表面大面积微结构模具的方法和工艺是关键。 Therefore, an efficient preparation of high-quality research large surface area of ​​the metal mold microstructure is the key method and process.

[0004] 微流控芯片微通道的特征尺寸一般为:高50〜100 μ m、宽30〜200 μ m,表面质量和尺寸精度要求严格,在金属模具上表现为凸起的结构,用传统机械加工很难满足加工要求(见:宋满仓,于超,张建磊等.聚合物微流控芯片模具制造关键技术研究进展[J].模具工业,2012,(02):1-6)。 [0004] The characteristic dimension microfluidic microchannel generally: high 50~100 μ m, width of 30~200 μ m, surface quality and dimensional accuracy demanding performance convex structure on the mold, conventional machining difficult to meet the processing requirements (see: Song Mancang, ultra, Zhang Jianlei other key technologies progress polymer microfluidic chip manufacturing mold [J] mold industry, 2012, (02): 1-6). 聚合物微流控芯片模具的制造技术主要有:LIGA技术、UV-LIGA技术、微铣削技术、激光微加工、化学蚀刻、电火花加工技术等技术。 Polymer microfluidic chip die manufacturing technology mainly: LIGA technology, UV-LIGA technology, micro-milling, laser micromachining, chemical etching, EDM techniques. 其中与本发明最相似的方法是:化学蚀刻技术和电火花加工技术。 Wherein the present invention is most similar methods: chemical etching techniques and electro-discharge machining techniques.

[0005] 光刻技术(Lithography)采用X射线或紫外线为曝光源,经过曝光显影等工序,将掩膜板上设计好的图案转移至附着在基底材料的光刻胶上,形成凹凸的图案(见:陈大鹏,叶甜春.现代光刻技术[J].核技术,2004,27 (2):81-86)。 [0005] photolithography technique (Lithography) using X-rays or ultraviolet rays as the exposure source, through exposure and development processes, the mask pattern is transferred to a panel designed adhered to the base material of the photoresist forming a pattern of irregularities ( see: Chen Dapeng, sweet leaf spring modern lithography techniques [J] nuclear technology, 2004, 27 (2): 81-86). 首先在基底上涂覆一层抗蚀光刻胶,固化后用曝光技术通过掩膜板在透射区将抗蚀层曝光,曝光的光刻胶发生变质,再通过显影液清洗后,去除变质的光刻胶(正性胶)或未变质的光刻胶(负性胶),露出基底材料,形成与掩膜板上相同的图案。 First, a resist is coated on a substrate and patterned by mask exposure technique by exposing the resist layer in the transmissive area after curing, the exposed resist spoilage, and then cleaned by the developer, the deterioration of the removal photoresist (positive photoresist) or deterioration of the photoresist (negative photoresist), exposing the base material to form a pattern identical to the mask plate.

[0006] 电解电火花复合加工技术(ECDM),选择合适电导率的工作液,该溶液具有出一定的介电性能,可以产生电火花放电,同时还具有一定的导电性能产生电化学作用(见:尹青峰,王宝瑞,张勇斌等.弱电解质溶液EDM/ECM复合加工机理研究[J].机械设计与制造,2014,(5):85-88)。 [0006] Electrolytic composite processing technology EDM (ECDM), select the appropriate conductivity of the working fluid, the solution has a certain dielectric properties, electrical discharge may be generated, but also has a certain conductivity electrochemical effect (see Study Yinqing Feng, Wang Baorui, Zhang Yongbin other weak electrolyte solution EDM / ECM composite working mechanism [J] mechanical design and manufacturing, 2014, (5):: 85-88). 工具电极接负极,工具接正极,接通电源后首先产生阳极电解作用,产生金属离子在电场作用下向工具电极运动。 Tools negative electrode, a positive electrode bonding tool, an anode electrolysis generated first after the power generation of metal ions to the tool electrode movement in the electric field. 在合适电压下,当工具电极与工件的间隙进给到火花放电的临界值时,产生电火花放电,放电产生瞬间高温将工件材料去除,实现工件材料的加工。 At a suitable voltage, when the gap of the tool electrode and the workpiece is fed to the critical value of spark discharge, spark discharge, the instant high temperature discharge the workpiece material removal to achieve workpiece material. 工具电极也会伴有一定程度的瞬间高温蚀除,而吸附在工具电极附近的金属离子得到电子还原反应,沉积在工具电极表面会补偿电极损耗。 Also the tool electrode with a certain degree of instantaneous high temperature erosion, and adsorbed in the vicinity of the tool electrode to obtain a metal ion-electron reduction reaction compensation electrode is deposited on the electrode surface will loss tool.

[0007]化学蚀刻技术(见:Zhang C,Rentsch R,Brinksmeie E.Advances in microultrasonic assisted lapping of microstructures in hard-brittle materials:abrief review and outlook[J].nternat1nal Journal of Machine Tools&Manufacture,2005,(45):881-890)是利用被加工材料在特定腐蚀溶液或气体中发生化学反应而溶解或腐蚀的原理去除加工区的材料,由于工件表面利用光刻技术制作了一定图案的防蚀层,蚀刻形成具有相似图案的凹凸结构或镂空效果。 [0007] The chemical etching technique (see: Zhang C, Rentsch R, Brinksmeie E.Advances in microultrasonic assisted lapping of microstructures in hard-brittle materials: abrief review and outlook [J] .nternat1nal Journal of Machine Tools & Manufacture, 2005, (45) : 881-890) using the principle is dissolved or erosion machining materials in a particular chemical reaction in the etching solution or gas to remove the material processing zone, since the surface of the workpiece produced by photolithography a pattern of a corrosion protection layer, etching a pattern having a concavo-convex structure or similar hollow effect. 化学蚀刻包括干法蚀刻和湿法蚀刻两种,微米级尺寸结构一般较多采用湿法蚀刻技术。 Chemical etching including dry etching and wet etching are two, more generally micron sized structures using wet etching techniques. 湿法化学蚀刻的缺点是:腐蚀液对机床及相关零部件抗腐蚀能力要求比较高,加工过程常常因产生化学雾气和有毒性气体而不利于环保,化学蚀刻原理上的侧腐蚀现象会导致加工尺寸不易精确控制、微通道侧壁垂直性不好和截面形状难以控制。 The disadvantage is that wet chemical etching: etching solution for machine tools and related parts corrosion resistance requirements are relatively high, because the process often produces chemical vapors and toxic gases and not conducive to environmental protection, side erosion phenomenon on principle leads to chemical etching process difficult to precisely control the size of the microchannel side wall and a vertical cross-sectional shape is not good it is difficult to control.

[0008] 电火花加工技术是利用电极和工件之间高压脉冲产生火花放电时的电蚀作用去除材料的加工方法,加工微流控芯片模具可以采用微细电火花铣削法和电火花仿形加工法。 [0008] The EDM uses high-voltage pulse between the electrode and the workpiece galvanic action when the spark discharge material removing machining methods, mold processing microfluidic chip method may be employed and micro-EDM milling EDM profiling method . 电火花仿形加工法需要预先制作微流控芯片母模作为工具电极,通过纵向进给加工出所需深度的微流控芯片模具。 EDM profiling method requires microfluidic chip prepared in advance as a master mold tool electrode, through the longitudinal feeding microfluidic chip die to a desired depth. 电火花加工技术加工表面微结构的方法有微细电火花铣削法和电火花仿形加工法,与本发明相近的是电火花仿形加工法,其缺点是:由于工具电极损耗严重,会影响成形精度和使用寿命,并且加工存在热影响区,使工件表面产生变质层,微细结构易产生热变形。 The method of EDM machining a surface having a fine microstructure of the milling process and the EDM spark profiling method of the present invention is similar to profiling electric discharge machining method, the disadvantages are: since the tool electrode serious loss will affect the forming accuracy and service life, and the presence of the heat affected zone and processing the workpiece surface generating affected layer, a fine structure is easy to produce heat deformation.

[0009] 上述现有技术均存在通孔部位加工不足、加工深度不均匀的问题,由于采用中间开通孔的圆柱状电极作为工具阴极,加工中电极不作平动,通孔位置对应的工件表面某一区域电场微弱,这一区域因加工量极少而产生的微结构深度很浅,表现出加工深度不均匀。 [0009] The prior art deficiencies are processed through hole portion, the depth of processing unevenness problems, since the opening of the cylindrical bore of the intermediate electrode as a tool cathode, the electrode is not processed in translation, the position corresponding to the through hole a surface of the workpiece a weak electric field area, the depth of the microstructure due to process a very small amount of this area is very shallow generated, exhibit uneven machining depth. 并且该方法只能加工小面积范围内的微结构,对于更大面积微结构的加工不适用。 And the method only worked microstructure of small areas, a larger area for processing microstructures NA. 因为如果只是增加电极底面积,又会带来加工电流过大或流场分布不均匀的问题。 If only the electrode increases because the bottom area, will bring machining current is too large or the problem of uneven flow distribution.

[0010]目前电解电火花复合加工技术在掩膜工件加工微结构方面未见报道。 [0010] It EDM electrolytic composite processing technology have not been reported in the mask workpiece microstructure structure. 米用微小电极进行电解电火花加工,对于大面积微通道凸起结构的加工效率很低。 M electrolysis minute EDM electrode for large-area micro-channel low processing efficiency of the raised structures. 仿形电火花加工技术也可以大面积加工,但需要预先制作互补的模具并且电极损耗严重,而该方法只需要制作工件掩膜,具有成本低、周期短和工具损耗率低的优势。 Profiling EDM machining area may be larger, but the need to pre-prepared mold and the electrodes complementary serious loss, and the method only requires making a mask piece, low cost, short cycle and low loss advantages of the tool. 湿法化学蚀刻,也使用了光刻掩膜的手段,但是蚀刻的微结构侧壁垂直性很差,不能满足微通道的垂直性要求。 Wet chemical etching, photolithographic masking means is also used, but the microstructure etched vertical sidewalls poor, can not meet the requirements of the vertical microchannel.

[0011 ] 另外,现有电解放电加工还存在电极面积小,工具电极的各区域的损耗不均衡,不利于工作液更新,加工间隙不稳定,加工表面质量差等缺陷。 [0011] Further, the conventional electrolytic discharge machining there is a small area of ​​the electrode, each region of the tool electrode loss is not balanced, the working fluid is not conducive to update machining gap instability, poor surface quality defects.

发明内容 SUMMARY

[0012] 本发明的目的在于克服上述现有技术中存在的不足,提供一种工具电极损耗小,加工表面精度高,且可以进行大面积电火花表面加工的盘型扫描电极掩膜微电解放电加工系统。 [0012] The object of the present invention is to overcome the above-described deficiencies present in the prior art, there is provided a tool electrode loss, high precision machined surface, and may be a disk type mask scanning electrodes microelectrolysis large discharge surface machining EDM processing system.

[0013] 本发明的第二目的是提供一种盘型扫描电极掩膜微电解放电加工方法。 [0013] The second object of the present invention is to provide a disk type mask microelectrolysis scan electrode discharge machining process.

[0014] 本发明的目的通过以下技术方案实现:盘型扫描电极掩膜微电解放电加工系统,包括工件、盘型电极和工作液,所述工件的加工表面覆盖掩膜,所述掩膜上设置有加工窗口,所述工件置于工作液中,所述盘型电极位于所述工件上方的工作液中,所述工件和盘型电极通过导线与电源连接。 [0014] The object of the present invention is achieved by the following technical solution: a disk type mask microelectrolysis scan electrode discharge machining system, comprising a workpiece, a disk-type electrode and a working fluid, the mask covering the surface of the workpiece, the upper mask is provided with a processing window, the working fluid is placed in the workpiece, the disc-shaped electrode is located above the workpiece in the working fluid, the workpiece and a disk-type electrode is connected to the power source through a wire.

[0015] 所述盘型电极包括旋转面和固定在旋转面上的连接轴组成,所述旋转面设置有中央出液口,所述中央出液口连通于所述连接轴的内腔。 [0015] The disc-shaped electrodes comprising a fixed surface and a rotating shaft connected to the surface of the composition, the rotating surface is provided with a central outlet port, said outlet port communicating with the central lumen of the connecting shaft.

[0016] 其中,所述盘型电极与工件间的距离为掩膜厚度再加上15-30um。 [0016] wherein, the distance between the electrode and the workpiece is a disc-shaped mask thickness plus 15-30um.

[0017] 优选的,所述盘型电极与工件间的距离为掩膜厚度再加上20um,这样有利于工作液更新,提高加工精度。 [0017] Preferably, the distance between the disc-shaped electrode and the workpiece is coupled to the mask thickness 20um, it is a good working fluid updated to improve machining accuracy.

[0018] 盘型扫描电极掩膜微电解放电加工方法,包括工件、盘型电极和工作液,所述工件的加工表面覆盖掩膜,所述掩膜上设置有加工窗口,所述工件置于工作液中,最少一个所述盘型电极位于所述工件上方的工作液中,所述工件和盘型电极通过导线与电源连接,所述盘型电极在工作液中自转,并且所述盘型电极相对于所述工件做相对整体转动。 [0018] Scanning electrodes mask disc microelectrolysis discharge machining, comprising a workpiece, a disk-type electrode and a working fluid, said mask covering the surface of the workpiece, it is provided with a window on the mask processing, the workpiece is placed the working fluid, at least one of said disc-shaped electrode is located above the working fluid in the workpiece, the workpiece and the disc-shaped electrode connected by a wire to the power source, the electrode plate being rotatable in the working fluid, and the disc-shaped electrode relative to the workpiece is rotated relative to do the whole.

[0019] 其中,所述盘型电极整体转动的转速为5-20r/min。 [0019] wherein rotation of the disc-shaped electrodes of the overall speed of 5-20r / min.

[0020] 优选的,所述盘型电极整体转动的转速为10r/min。 [0020] Preferably, the disc-shaped electrode integrally rotating speed is 10r / min.

[0021 ] 其中,所述盘型电极自转的转速为1500-5000r/min,优选的,自转的转速为3000r/mino [0021] wherein the disc rotation speed of electrode 1500-5000r / min, preferably, the rotation speed of 3000r / mino

[0022] 本发明通过让工具电极运动,让工具电极参与加工的区域一直变化,从而使加工局域的间隙一直稳定,有效的克服电火花会对工具电极有损耗,而这损耗会引起极间间隙变化,不稳定等缺陷。 [0022] The present invention has been varied by the electrode so that the tool motion, so that the region involved in the processing tool electrode so that the gap has a stable local processing, effectively overcome the EDM tool electrode will have losses which cause loss interpole gap changes, instability and other defects.

[0023]总的来说,现有技术相比,本发明的有益效果是:在工件上覆盖结构性绝缘掩膜,可精密复制掩膜形状,进行大规模微织构加工,并使加工只发生在掩膜未覆盖区域,有较高的定域性;使用的工具电极为大面积电极,并与工件间有相对运动;可通过规划特殊的运动轨迹(自转与工件进给轨迹),让工具电极的各区域的损耗趋于均衡,使各加工间隙保持统一;电解作用仅作抛光作用,主要去除为火花放电去除;工作液供给方式为自上而下,从盘型电极中央自内向外的中央出液口喷出,使工作液更新更为有效。 [0023] In general, compared to the prior art, the beneficial effects of the present invention is: covering a structural insulating mask, the mask is replicated precise shape on the workpiece, large-scale micro-texture processing, and processing only occurs in areas not covered by the mask, with high locality; tool electrode used for the large-area electrode, and between the workpiece and the relative movement; by special planning trajectory (trajectory of rotation and workpiece feed), so that loss of each region tend to balance the tool electrode, the machining gap holding each unity; only for electrolysis polishing action, mainly to remove the spark discharge is removed; working fluid is supplied to the top-down mode, from the inside outward from the central disc-shaped electrode a central liquid outlet discharge, the working fluid is more efficient updates.

附图说明 BRIEF DESCRIPTION

[0024]图1为本发明盘型扫描电极掩膜微电解放电加工系统横截面示意图; The disk scanning electrode discharge machining mask micro-electrolysis system schematic cross-section [0024] Figure 1 of the present invention;

[0025]图2为本发明盘型扫描电极掩膜微电解放电加工系统立体结构示意图; [0025] FIG. 2 is a perspective structural diagram of the electric discharge machining system disk scanning electrodes mask microelectrolysis invention;

[0026] 图3为本发明盘型电极的轨迹图。 [0026] FIG disc 3 track-type electrode of the present invention.

具体实施方式 Detailed ways

[0027] 以下结合附图和具体实施例对本发明进行详细的说明。 [0027] The following specific embodiments and examples of the present invention will be described in detail in conjunction with the accompanying drawings.

[0028] 盘型扫描电极掩膜微电解放电加工系统,如图1-图2所示,包括工件4、盘型电极5和工作液6,所述工件4的加工表面覆盖掩膜3,所述掩膜3上按照加工要求设置有加工窗口,所述工件4置于工作液6中,所述盘型电极5位于所述工件4上方的工作液6中,所述工件4和盘型电极5通过导线与电源I连接。 [0028] The scan electrode plate type mask micro-electrolysis discharge machining system, as shown in Figures 1 2, the workpiece 4 comprises a disc-type electrode 5 and the working fluid 6, the processing surface of the workpiece 4 covering mask 3, the processing said mask in accordance with claim 3 is provided with a processing window, the workpiece 4 is placed in the working fluid 6, the disc-shaped electrodes 5 of the workpiece 4 in the working solution in above 6, the disc-shaped electrode and the workpiece 4 5 is connected by a wire to the power supply I. 加工时气泡2从加工窗口溢出。 2 the bubbles escape from the processing window during processing. 所述盘型电极包括旋转面51和固定在旋转面上的连接轴53组成,所述旋转面51设置有中央出液口52,所述中央出液口52连通于所述连接轴53的内腔。 The disc-shaped electrode 51 includes a rotating surface and the stationary surface of the connecting shaft 53. The rotation of surface 51 is provided with a central outlet port 52, the central outlet port 52 communicates with the inside of the connecting shaft 53 cavity. 所述中央出液口52直径为盘型电极外圆直径的0.1-0.12倍。 The central diameter of the fluid outlet 52 of the disc-shaped electrode 0.1-0.12 times the outer diameter. 盘型电极的旋转面的外圆面积为待加工面积的0.10-0.02倍,最大直径不超过20CM,最小不小于5CM。 Outer area of ​​the surface of the rotating disk-type electrode is 0.10-0.02 times the area to be machined, a maximum diameter not exceeding 20CM, is not less than the minimum 5CM.

[0029] 所述盘型电极5包括旋转面为圆形,其直径1cm到2cm之间。 [0029] The disc-shaped rotary electrode 5 comprises a circular surface having a diameter of between 1cm to 2cm. 优选的,盘型电极5与工件4表面距离为200-400 μ m。 Preferably, the disc-type electrode 4 and the workpiece 5 from the surface to 200-400 μ m. 其中,所述盘型电极的旋转面51下表面与工件4间的距离为掩膜厚度再加上16-29um。 Wherein the distance between the plane of rotation of the lower. 4 51 and the workpiece surface of the disc-shaped electrode as a mask thickness plus 16-29um. 优选的,所述盘型电极旋转面51下表面与工件间的距离为掩膜厚度再加上20um,这样有利于工作液更新,提高加工精度。 Preferably, the distance between the lower surface 51 of the workpiece rotating disc electrode surface as a mask to a thickness of 20um plus, it is a good working fluid updated to improve machining accuracy.

[0030] 盘型扫描电极掩膜微电解放电加工方法,包括工件4、盘型电极5和工作液6,所述工件4的加工表面覆盖掩膜3,所述掩膜3上设置有加工窗口,所述工件置于工作液6中,所述盘型电极5位于所述工件4上方的工作液中,所述工件4和盘型电极5通过导线与电源I连接,所述盘型电极5在工作液中自转,并且所述盘型电极5相对于所述工件做相对整体转动。 [0030] Scanning electrodes mask disc microelectrolysis discharge machining method, the workpiece 4 comprises a disc-type electrode 5 and the working fluid 6, the processing surface of the workpiece 4 covering mask 3 is provided with the mask processing window 3 the workpiece 6 placed in the working fluid, the said disc-type electrode 5 is located above the workpiece 4 in the working fluid, the workpiece 4 and the disc-shaped electrode 5 is connected by a wire to the power supply I, the disc-shaped electrodes 5 rotation of the working fluid, and the disc-shaped electrode 5 relative to the workpiece for relative rotation integrally. 其中,如图3所示,所述盘型电极整体转动的转速V2为5-20r/min。 Wherein, as shown in Figure 3, the speed of rotation of the entire electrode plate type V2 is 5-20r / min. 优选的,所述盘型电极整体转动的转速V2为10r/min。 Preferably, the disc-shaped rotation speed of the entire electrode V2 is 10r / min. 其中,所述盘型电极自转的转速Vl为1500_5000r/min,优选的,自转的转速Vl为3000r/min。 Wherein the speed Vl of the rotation disc electrode 1500_5000r / min, preferably, the rotation speed Vl is 3000r / min.

[0031] 本发明通过让工具电极运动,让工具电极参与加工的区域一直变化,从而使加工局域的间隙一直稳定,有效的克服电火花会对工具电极有损耗,而这损耗会引起极间间隙变化,不稳定等缺陷。 [0031] The present invention has been varied by the electrode so that the tool motion, so that the region involved in the processing tool electrode so that the gap has a stable local processing, effectively overcome the EDM tool electrode will have losses which cause loss interpole gap changes, instability and other defects.

[0032] 以上详细描述了本发明的较佳具体实施例,应当理解,本领域的普通技术无需创造性劳动就可以根据本发明的构思做出诸多修改和变化。 [0032] The above detailed description of particular preferred embodiments of the present invention, it should be understood that the ordinary skill in the art without creative labor can make many modifications and variations of the inventive concept. 因此,凡本技术领域中技术人员依本发明构思在现有技术基础上通过逻辑分析、推理或者根据有限的实验可以得到的技术方案,均应该在由本权利要求书所确定的保护范围之中。 Therefore, any person skilled in the art under this prior art the inventive concept on the basis of logical analysis, reasoning or limited experiments according to the technical solution can be obtained, are to be within the scope of the present claims in determined.

Claims (9)

1.盘型扫描电极掩膜微电解放电加工系统,其特征在于,包括工件、盘型电极和工作液,所述工件的加工表面覆盖掩膜,所述掩膜上设置有加工窗口,所述工件置于工作液中,所述盘型电极位于所述工件上方的工作液中,所述工件和盘型电极通过导线与电源连接。 1. Scanning electrode plate mask micro-electrolysis discharge machining system, characterized in that includes a workpiece, a disk-type electrode and a working fluid, said mask covering the surface of the workpiece, is provided with a window on the mask processing, the a workpiece placed in the working fluid, the working fluid is disc-shaped electrode is located above the workpiece, the workpiece and a disk-type electrode is connected to the power source through a wire.
2.按照权利要求1所述的盘型扫描电极掩膜微电解放电加工系统,其特征在于,所述盘型电极包括旋转面和固定在旋转面上的连接轴组成,所述旋转面设置有中央出液口,所述中央出液口连通于所述连接轴的内腔。 2. The disc as claimed in claim scanning electrodes mask microelectrolysis discharge machining system of claim 1, wherein said surface comprises a rotating disc-type electrode is connected and fixed to the rotary shaft surface composition, the rotating surface is provided with a central liquid outlet, said liquid outlet communicating with the central lumen of the connecting shaft.
3.按照权利要求1所述的盘型扫描电极掩膜微电解放电加工系统,其特征在于,其中,所述盘型电极与工件间的距离为掩膜厚度再加上15-30um。 3. The disc as claimed in claim scanning electrodes mask microelectrolysis discharge machining system of claim 1, wherein, wherein the distance between the electrode and the workpiece is a disc-shaped mask thickness plus 15-30um.
4.按照权利要求1所述的盘型扫描电极掩膜微电解放电加工系统,其特征在于,所述盘型电极与工件间的距离为掩膜厚度再加上20um。 4. The disc as claimed in claim scanning electrodes mask microelectrolysis discharge machining system of claim 1, characterized in that the distance between the disc-shaped electrode and the workpiece plus the thickness of the mask 20um.
5.盘型扫描电极掩膜微电解放电加工方法,其特征在于,包括工件、盘型电极和工作液,所述工件的加工表面覆盖掩膜,所述掩膜上设置有加工窗口,所述工件置于工作液中,所述盘型电极位于所述工件上方的工作液中,所述工件和盘型电极通过导线与电源连接,所述盘型电极在工作液中自转,并且所述盘型电极相对于所述工件做相对整体转动。 The mask disc scanning electrodes microelectrolysis discharge machining method comprising the workpiece, a disk-type electrode and a working fluid, said mask covering the surface of the workpiece, is provided with a window on the mask processing, the a workpiece placed in the working fluid, the working fluid is disc-shaped electrode is located above the workpiece, the workpiece and the disc-shaped electrode connected by a wire to the power source, the electrode plate being rotatable in the working fluid, and said disk electrode for relative rotation with respect to the entire workpiece.
6.按照权利要求5所述的盘型扫描电极掩膜微电解放电加工方法,其特征在于,所述盘型电极整体转动的转速为5-20r/min。 6. The disc as claimed in claim scanning electrodes mask microelectrolysis discharge machining method of claim 5, wherein said disc-shaped rotation speed of the entire electrode 5-20r / min.
7.按照权利要求6所述的盘型扫描电极掩膜微电解放电加工方法,其特征在于,所述盘型电极整体转动的转速为10r/min。 7. The disc as claimed in claim scanning electrodes mask microelectrolysis discharge machining method of claim 6, wherein said disc-shaped rotation speed of the entire electrode 10r / min.
8.按照权利要求6或者7所述的盘型扫描电极掩膜微电解放电加工方法,其特征在于,所述盘型电极自转的转速为1500-5000r/min。 8. The disc as claimed in claim scanning electrode 6 or the mask microelectrolysis discharge machining method of claim 7, wherein said disk rotation speed of electrode 1500-5000r / min.
9.按照权利要求8所述的盘型扫描电极掩膜微电解放电加工方法,其特征在于,所述盘型电极自转的转速为3000r/min。 The disk scanning electrode 9. The mask as claimed in claim microelectrolysis discharge machining method of claim 8, wherein said disk rotation speed of electrode 3000r / min.
CN201510560682.6A 2015-09-02 2015-09-02 Disc type scanning electrode mask film microelectrolysis electrical discharge machining system and machining method CN105127526A (en)

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