CN203027590U - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN203027590U CN203027590U CN 201220570237 CN201220570237U CN203027590U CN 203027590 U CN203027590 U CN 203027590U CN 201220570237 CN201220570237 CN 201220570237 CN 201220570237 U CN201220570237 U CN 201220570237U CN 203027590 U CN203027590 U CN 203027590U
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- Prior art keywords
- substrate
- tack coat
- pcb board
- metal substrate
- hole
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Abstract
The utility model discloses a printed circuit board for realizing advantages of reduced weight and reduced fabricating cost under the premise of ensuring the quality of the printed circuit board. The printed circuit board comprises: a substrate (1) for bearing electronic components; a bonding layer (2), wherein one side of the bonding layer (2) is bonded with the substrate (1); and a metal matrix (3) which is bonded with the other side of the bonding layer (2); wherein the substrate (1), the bonding layer (2) and the metal matrix (3) are all provided with positioning through holes at designated positions. A printed circuit board fabricating method is further provided. In the fabricating process of the printed circuit board, pins which are made from Teflon are inserted into conductive adhesive, metal matrix and substrate positioning through holes, after the printed circuit board is subjected to the pressing process, the Teflon pins for positioning can be pulled out, so that the printed circuit board is formed, and the pins which are pulled out can be used repeatedly, so the printed circuit board fabricating cost can be reduced, and when the Teflon pins are pulled out, the damage on the printed circuit board structure can be avoided.
Description
Technical field
The utility model relates to a kind of pcb board manufacturing technology field and a kind of pcb board.
Background technology
Pcb board (Printed circuit board, printed circuit board (PCB)) claims again printed substrate, is important electronic unit, is the carrier of electronic devices and components.In recent years, high frequency microwave printed packaging density and integrated level are more and more higher, and power consumption is increasing, and the pcb board element over-temperature usually causes component ageing, inefficacy, the lost of life, thereby whole aircraft reliability is descended.The height heat radiation of components and parts requires the requirement of pcb board also just more and more higher, popularization along with 3G market, in recent years the copper base that rises has gradually obtained application more and more widely as the special pcb board that Heat sink and the high-frequency microwave wiring board of heat dispersion is combined in fields such as microwave, optical fiber, high-power circuit, power supplys.
At present, in printed circuit board industry, make special pcb board and mostly adopt Post-bonding technique, namely use conducting resinl such as conductive film CF3350 makes substrate (namely common pcb board) and copper base carry out bonding by special pressing condition, wherein, conducting resinl is a kind of bonding sheet with characteristics such as high conductivity, high heat radiations, that is to say, conducting resinl can also can conduct electricity in heat conduction, and is different from the prepreg that usually adopts in the pcb board industry.In Post-bonding technique, conducting resinl will have the through hole corresponding with the copper base etc., and substrate also will have the through hole corresponding with the copper base.
Pin is used for a lot of industries as a kind of link commonly used, in printed circuit board industry, usually adopts copper pin as the location between substrate and substrate, then carries out pressing.Due in the pressing process of HTHP, epoxy resin composition in substrate can with pin in copper material be bonded together, therefore be difficult to separate, increase the cost of manufacture of pcb board, also increase the weight of pcb board, as by force copper pin being extracted, can cause slight crack between the substrate layer after pressing, even separate, and then affect the quality of pcb board.And for positioning making in the efficient circuit zone of printed circuit board (PCB), for metal fragment/copper scale of avoiding producing shines into short circuit, do not allow normally to use that metal parts is auxiliary makes.
The utility model content
The utility model embodiment provides a kind of pcb board, in the situation that guarantee the pcb board quality, in order to save the cost of making pcb board, alleviates simultaneously the weight of pcb board.
The structure of the printing board PCB plate that the utility model embodiment provides is as follows:
A kind of printing board PCB plate comprises:
Substrate (1) is used for the carrying electronic devices and components;
Tack coat (2), the one side of described tack coat (2) bonds with substrate (1);
Metal Substrate (3), bonding with the another side of described tack coat (2);
Wherein, the assigned address on described substrate (1), described tack coat (2) and described Metal Substrate (3) all has positioning through hole.
In the utility model embodiment, a kind of manufacture method of pcb board is provided, the method is specially, first at the upper positioning through hole of making of substrate (1), tack coat (2) and Metal Substrate (3), again the Teflon pin is inserted in the through hole on substrate (1), tack coat (2) and Metal Substrate (3) and position, then will carry out process for pressing by substrate (1), tack coat (2) and Metal Substrate (3) that the Teflon pin links together, and after process for pressing is completed, extract the Teflon pin.Comprise by the pcb board that adopts above-mentioned manufacture method to generate: substrate (1) is used for the carrying electronic devices and components; Tack coat (2), the one side of tack coat (2) bonds with substrate (1); Metal Substrate (3), bonding with the another side of tack coat (2); Wherein, the assigned address on substrate (1), tack coat (2) and Metal Substrate (3) all has positioning through hole, and this positioning through hole is for forming after the Teflon pin is inserted and extracts.In the process that adopts said method making pcb board, the pcb board of making is through after process for pressing, bonding between the material Teflon of going back primary resin composition and pin that comprises in substrate is not strengthened because of aforementioned pressing, thereby, pcb board is through after process for pressing, the Teflon pin that is used for the location can be extracted, and the pin of extracting can reuse.The utility model has utilized the not viscosity of Teflon just, thermal endurance (generally can use continuously between 240 ℃ ~ 260 ℃) and good resistance to wear, so use the pin of this material, saved and made the cost of pcb board, and when extracting the Teflon pin, avoided the pcb board structure is damaged, can not cause interlayer slight crack, separation, guaranteed that the pcb board performance is unaffected, simultaneously, alleviated the weight of pcb board.
Description of drawings
Fig. 1 makes the detail flowchart of pcb board in the utility model embodiment;
Fig. 2 A is the first schematic diagram of pin in the utility model embodiment;
Fig. 2 B is the second schematic diagram of pin in the utility model embodiment;
Fig. 3 A is in the utility model embodiment, and substrate does not have when district Metal Substrate and the bonding schematic diagram of substrate of windowing;
Fig. 3 B is in the utility model embodiment, and substrate has when district Metal Substrate and the bonding schematic diagram of substrate of windowing.
Embodiment
In the situation that guarantee the pcb board quality, in order to realize saving the cost of making pcb board, alleviate simultaneously the weight of pcb board.The utility model embodiment provides a kind of pcb board.Below in conjunction with Figure of description, preferred embodiment of the present utility model is described, should be appreciated that preferred embodiment described herein only is used for description and interpretation the utility model, and be not used in restriction the utility model.And in the situation that do not conflict, embodiment and the feature in embodiment in the application can make up mutually.
Below in conjunction with accompanying drawing, the utility model preferred embodiment is elaborated.
Consult shown in Figure 1ly, the utility model embodiment provides the manufacture method of pcb board, and concrete operation step is as follows:
Step 100: make through hole on substrate 1, tack coat 2 and Metal Substrate 3.
In actual applications, usually adopt drilling machine to make through hole to substrate 1, tack coat 2 and Metal Substrate 3, wherein, the diameter of the through hole of tack coat 2 is large than the diameter of the through hole of Metal Substrate 3, is specially: the difference of the diameter of the through hole of the diameter of the through hole of tack coat 2 and Metal Substrate 3 is 1-2 μ m approximately; The diameter of the through hole of Metal Substrate 3 is large than the diameter of the through hole of substrate 1, is specially: the difference of the diameter of the through hole of the diameter of the through hole of Metal Substrate 3 and substrate 1 is 1-2 μ m approximately.
In the utility model embodiment, the number of the through hole on tack coat 2 and Metal Substrate 3 is identical, and, tack coat 2 is general relevant with size and/or shape Metal Substrate 3 with the number of through-holes on Metal Substrate 3, be specially: in general, the area of Metal Substrate 3 is large, and the number of through hole is more; The area of Metal Substrate 3 is little, and the number of through hole is less; And through hole need to be positioned at corner usually, is used for the location, turning.Have certain ductility during due to tack coat 2 pressing, tack coat 2 is slightly less than the area of its corresponding Metal Substrate 3 before pressing, such as the periphery is little by 2 ~ 4, or consistent size both.
In the utility model, tack coat 2 can be conducting resinl or prepreg, and Metal Substrate 3 can be the copper base.
Because the hardness of tack coat 2 is less, when tack coat 2 is holed, first bond release film for the protection of tack coat 2 on the two sides of tack coat 2, more all place backing plate at upper surface and the lower surface of tack coat 2, be used for further protection tack coat 2.After 2 borings are completed to tack coat, the backing plate on tack coat 2 two sides of first dismantling, then tear the release film on tack coat 2 two sides.
Step 110: with putting with Metal Substrate 3 pads of tack coat 2, simultaneously the Teflon pin is inserted in the through hole of tack coat 2 and Metal Substrate 3.
In the utility model embodiment, because tack coat 2 does not have cementation at normal temperatures, that is to say, at normal temperatures, the cohesive force of tack coat 2 and substrate 1 and Metal Substrate 3 can be similar to regards 0 as, therefore, before pcb board carries out process for pressing, the substrate 1 of putting together for fear of pad, tack coat 2 with Metal Substrate 3 during through process for pressing relative position be moved, after tack coat 2 and Metal Substrate 3 pads are put, the Teflon pin is inserted in the through hole of tack coat 2 and Metal Substrate 3, fixedly the relative position of tack coat 2 and Metal Substrate 3.
In the utility model embodiment, the Teflon pin is to adopt the plastic forming injection moulding to be made, and generally, the diameter range of Teflon pin is 2mm-5mm, and the diameter of pin is identical with the diameter of the through hole of substrate 1.
The chemical name of Teflon is: polytetrafluoroethylene (Polytetrafluoroetylene), and referred to as Teflon, PTFE, F4 etc.Polytetrafluoroethylene generally is called " non-sticking lining ", it is a kind of artificial synthesized polymer material that has used fluorine to replace all hydrogen atoms in polyethylene, this material has antiacid alkali resistant, resistance to wear and good thermal endurance, lower temperature resistance and significant thermal stability, can stand the high temperature of 300 ℃ of left and right within a certain period of time, generally the high temperature between 240 ℃ ~ 260 ℃ can use continuously, also can work and not embrittlement under cryogenic temperature.
In the utility model embodiment, the Teflon pin comprises pin cap and pin rod, and wherein, pin rod can not have through hole, and specifically as shown in Fig. 2 A, the Teflon pin comprises pin rod 20, pin cap 21; Also can be provided with the through hole that crosses the pin rod axis at the end of pin rod, be specially shown in Fig. 2 B, the Teflon pin comprises pin rod 22, pin cap 23 and through hole 24.And pin rod has various shape, can be for cylindrical, and also can be for square.
Step 120: will further put with substrate 1 pad with the Metal Substrate 3 of tack coat 2 combinations, and simultaneously the Teflon pin be inserted in the through hole of substrate 1.
In the utility model embodiment, because tack coat 2 does not have cementation at normal temperatures, therefore, after further putting with substrate 1 pad with the Metal Substrate 3 of tack coat 2 combinations, the Teflon pin is further inserted in the through hole of substrate 1, fixedly lead the relative position of substrate 1 and Metal Substrate 3.
In the utility model embodiment, can not have the district of windowing on substrate 1, also can have the district of windowing.When not having when district of windowing on substrate 1, Metal Substrate 3 is directly installed on the surface of substrate 1 by tack coat 2; When having on substrate 1 when district of windowing, Metal Substrate 3 can be arranged in the district of windowing of substrate 1 by tack coat 2, and wherein, the height in the district of windowing is less than the thickness of substrate 1.
Step 130: the pcb board that will comprise substrate 1, tack coat 2 and Metal Substrate 3 carries out process for pressing, and after pressing is completed, takes out the Teflon pin.
The concrete technology condition of the process for pressing in above-mentioned steps is comparative maturity, therefore, states no longer one by one at this.
in the utility model embodiment, due to the epoxy resin composition that comprises in substrate 1, after the process process for pressing, do not strengthen with the viscosity of the material Teflon of pin, therefore, pcb board is after the process process for pressing, can at an easy rate the Teflon pin be extracted, the Teflon pin of extracting has resistance to wear and can reuse, therefore, saved the cost of making pcb board, and, substrate 1, do not have cut on the hole wall of the positioning through hole of tack coat 2 and Metal Substrate 3, the through hole of tack coat 2 does not have slight crack yet, that is to say, when extracting pin, to substrate 1, the hole wall quality of the positioning through hole in tack coat 2 and Metal Substrate 3 is without impact, therefore, in the situation that guarantee the pcb board quality, alleviated the weight of pcb board.The making of pin can be completed by the Teflon shaping machine.
In the utility model embodiment, comprise that the pcb board of substrate 1, tack coat 2 and Metal Substrate 3 is through process for pressing, and after extracting from pcb board for the Teflon pin of location, substrate 1 is bonded together with the cementation of Metal Substrate 3 due to tack coat, simultaneously, the positioning through hole of existence through forming after the Teflon pin is inserted and extracts on pcb board.
After making flow process through above-mentioned pcb board, can form a kind of special pcb board, the utility model embodiment also provides a kind of pcb board that adopts above-mentioned making flow process to generate, and consults shown in Fig. 3 A, and this pcb board comprises: substrate 1, tack coat 2 and Metal Substrate 3, wherein, substrate 1 and Metal Substrate 3 are bonded together by tack coat 2, and, substrate 1 is common pcb board of the prior art, namely the pcb board of binding metal base not in prior art.Simultaneously, the assigned address of substrate 1, tack coat 2 and Metal Substrate 3, all has the positioning through hole through forming after the Teflon pin is inserted and extracts, wherein, the aperture of the through hole of tack coat 2 is bigger than the aperture of the through hole of Metal Substrate 3, and namely the aperture of the through hole of tack coat 2 deducts the about 1-2 μ m of difference in aperture of the through hole of Metal Substrate 3; The aperture of the through hole of Metal Substrate 3 is bigger than the aperture of the through hole of substrate 1, and namely the aperture of the through hole of Metal Substrate 3 deducts the about 1-2 μ m of difference in aperture of the through hole of substrate 1.
In the utility model embodiment, can not have the district of windowing on substrate 1, also can have the district of windowing.When not having when district of windowing on substrate 1, Metal Substrate 3 directly is bonded on the surface of substrate 1 by tack coat 2; When having on substrate 1 when district of windowing, Metal Substrate 3 can be bonded in the district of windowing of substrate 1 by tack coat 2, and wherein, the height in the district of windowing is less than the thickness of substrate 1.
For example, consult shown in Fig. 3 A, do not have the district of windowing on substrate 1, Metal Substrate 3 directly is bonded on the surface of substrate 1 by tack coat 2.When having on substrate 1 when district of windowing, Metal Substrate 3 is bonded in the district of windowing of substrate 1 by tack coat 2, specifically consults shown in Fig. 3 B, and wherein, the thickness of substrate 1 is 10mm, and the height in the district of windowing is 5mm.
In the utility model embodiment, the shape of Metal Substrate 3 can have any shape, and can think the shape of rule, as, circle, rectangle or square also can be irregular shape; The size of Metal Substrate 3 also has multiple, as, 50mm
2, 100mm
2, or 150mm
2, the shape of Metal Substrate 3 is relevant with the top circuit of arranging of Metal Substrate 3 with area.
Owing to making after Metal Substrate 3 completes, Metal Substrate 3 edges can have burr, and are better, for fear of Metal Substrate 3 marginal existence burrs, in the utility model embodiment, the burr at Metal Substrate 3 edges is processed, be specially make Metal Substrate 3 each drift angle all as chamfer shape.
Because tack coat 2 is used at high temperature with substrate 1 and Metal Substrate 3 bondings, and, shape and the size of Metal Substrate 3 have various ways, therefore, and in the utility model embodiment, the shape of tack coat 2 and size also have various ways, the shape of tack coat 2 can have any shape, and can think the shape of rule, as, circle, rectangle or square also can be irregular shape; The size of tack coat 2 also has multiple, as, 20mm
2, 50mm
2, or 70mm
2
In the utility model embodiment, the shape of the shape of tack coat 2 and Metal Substrate 3 can be identical, also can be fully different.For example, the square that is shaped as 15mm * 15mm of Metal Substrate 3, the shape of tack coat 2 is also the square of 15mm * 15mm.Again for example, Metal Substrate 3 be shaped as the circle that radius is 15mm, and the shape of tack coat 2 is also the square of 6mm * 6mm.
Because tack coat 2 also can be prepreg, therefore, as shop bolt, also can be applied in the scene with prepreg binding metal base and substrate with the Teflon pin.The main component of prepreg mostly is epoxy resin, and this material and conducting resinl have general character aspect caking property, and namely activity is stronger, easily because of other materials interlock formation secondary or physical bonds such as the extraneous factor such as the pressurization of being heated and metals, thereby plays cementation.The utility model has mainly utilized not adhesiveness and the thermal stability (namely not melting) of Teflon under hot conditions, replace metal pin to position with the Teflon pin, can pin be extracted in mode light and handy convenient and that do not damage the hole inwall again after pressing.And, extract the through hole of vacating after pin, can with motherboard on through hole share position, a hole, thereby save the plate space of planes, can not produce the adverse effects such as standing wave effect to the signal quality of transmission.
Metal Substrate in above-described embodiment can be the copper base, also may be other metal materials, depends on the design of printed circuit board (PCB).
Based on technique scheme, in the utility model embodiment, a kind of manufacture method of pcb board is provided, the method is specially, first make through hole on substrate 1, tack coat 2 and Metal Substrate 3, then with in the through hole on the insertion of Teflon pin substrate 1, tack coat 2 and Metal Substrate 3, then will carry out process for pressing by substrate 1, tack coat 2 and Metal Substrate 3 that the Teflon pin links together, and after process for pressing is completed, extract the Teflon pin.Comprise by the pcb board that adopts above-mentioned manufacture method to generate: substrate 1 is used for the carrying electronic devices and components; Tack coat 2, the one side of tack coat 2 and substrate 1 bonding; Metal Substrate 3, bonding with the another side of tack coat 2; Wherein, the assigned address on substrate 1, tack coat 2 and Metal Substrate 3 all has positioning through hole, and this positioning through hole is for forming after the Teflon pin is inserted and extracts.In the process that adopts said method making pcb board, the pcb board of making is through after process for pressing, bonding between the material Teflon of going back primary resin composition and pin that comprises in substrate is not strengthened, thereby, pcb board is through after process for pressing, the Teflon pin that is used for the location can be extracted, the pin of extracting can reuse, saved the cost of making pcb board, and when extracting the Teflon pin, the hole wall of through hole is not caused the impacts such as cut, slight crack, therefore, under the prerequisite that guarantees the pcb board quality, alleviated the weight of pcb board.
Although described preferred embodiment of the present utility model, in a single day those skilled in the art get the basic creative concept of cicada, can make other change and modification to these embodiment.So claims are intended to all changes and the modification that are interpreted as comprising preferred embodiment and fall into the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification and the spirit and scope that do not break away from the utility model embodiment to the utility model embodiment.Like this, if within these of the utility model embodiment are revised and modification belongs to the scope of claim of the present invention and equivalent technologies thereof, the utility model also is intended to comprise these changes and modification interior.
Claims (8)
1. a pcb board, is characterized in that, comprising:
Substrate (1) is used for the carrying electronic devices and components;
Tack coat (2), the one side of described tack coat (2) bonds with substrate (1);
Metal Substrate (3), bonding with the another side of described tack coat (2);
Wherein, the assigned address on described substrate (1), described tack coat (2) and described Metal Substrate (3) all has positioning through hole.
2. pcb board as claimed in claim 1, is characterized in that, described tack coat (2) is conducting resinl or prepreg.
3. pcb board as claimed in claim 1 or 2, is characterized in that, described Metal Substrate (3) is the copper base.
4. pcb board as claimed in claim 3, is characterized in that, each drift angle of described copper base is chamfer shape.
5. pcb board as claimed in claim 1, is characterized in that, described Metal Substrate (3) directly with the surface bonding of described substrate (1), perhaps, with the surface bonding of the windowed regions of described substrate (1), wherein, the height of described windowed regions is less than the thickness of described substrate (1).
6. pcb board as claimed in claim 1, is characterized in that, the number of the described positioning through hole on described substrate (1), described tack coat (2) and described Metal Substrate (3) all is at least 3.
7. pcb board as described in claim 2 or 6, is characterized in that, the large 1-2 μ of the diameter m of the positioning through hole of the more described Metal Substrate of diameter (3) of the positioning through hole of described tack coat (2).
8. pcb board as described in claim 1 or 6, is characterized in that, the large 1-2 μ of the diameter m of the positioning through hole of the more described substrate of diameter (1) of the positioning through hole of described Metal Substrate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220570237 CN203027590U (en) | 2012-10-31 | 2012-10-31 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220570237 CN203027590U (en) | 2012-10-31 | 2012-10-31 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203027590U true CN203027590U (en) | 2013-06-26 |
Family
ID=48651528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220570237 Expired - Fee Related CN203027590U (en) | 2012-10-31 | 2012-10-31 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203027590U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906379A (en) * | 2014-02-28 | 2014-07-02 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
-
2012
- 2012-10-31 CN CN 201220570237 patent/CN203027590U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906379A (en) * | 2014-02-28 | 2014-07-02 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
| CN103906379B (en) * | 2014-02-28 | 2017-01-25 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130626 Termination date: 20171031 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |