CN203352967U - Carrier dedicated for SMT process - Google Patents
Carrier dedicated for SMT process Download PDFInfo
- Publication number
- CN203352967U CN203352967U CN 201320447873 CN201320447873U CN203352967U CN 203352967 U CN203352967 U CN 203352967U CN 201320447873 CN201320447873 CN 201320447873 CN 201320447873 U CN201320447873 U CN 201320447873U CN 203352967 U CN203352967 U CN 203352967U
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- CN
- China
- Prior art keywords
- carrier plate
- carrier
- base
- circuit board
- smt
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a carrier dedicated for an SMT process. The carrier comprises a seat on which a carrier plate is mounted. The seat is peripherally provided with carrier plate positioning pins, and the carrier plate is peripherally provided with carrier plate positioning holes corresponding to the carrier plate positioning pins. A silicone layer is formed on the upper surface of the carrier plate by high-temperature hot pressing. A plurality of circuit board positioning pins are arranged on the upper surface of the carrier plate, and protrude out of the silicone layer. According to the utility model, the carrier has the advantages of high-temperature resistance, deformation resistance, high planar precision, high vibration absorption, accuracy in positioning, low thermal conductivity, and good insulating, anti-static and safety properties, and is reusable and recoverable, thereby reducing the cost of material, and being suitable for the processing and manufacturing of easily deformable PCBs and flexible circuit boards.
Description
Technical field
The utility model relates to a kind of carrier, especially relates to the special-purpose high temperature resistant silica gel carrier of a kind of yielding PCB and flexible PCB.
Background technology
Yielding, flexible PCB requires high adding man-hour, for example MT thin plate and flexible printed circuit board, when needs carry out trickle processing or welding to certain position, product need to be positioned over to normal place, carry out next operating procedure after alignment, now just need a kind of product carrier, come to product orientation and clamp, that this carrier requires to have is high temperature resistant, not yielding, absorbing strong, low heat conductivity, insulating properties and antistatic behaviour good, and requirement can accurately be located, there is no at present the special-purpose carrier in this field.
The utility model content
Technical problem to be solved in the utility model is: provide a kind of SMT processing procedure special-purpose carrier, possess high temperature resistant, not yielding, pollution-free, there is high tackness, plane precision is high, absorbing is strong, registration, low thermal strain, low heat capacity, low heat conductivity, uniform temperature is good, and pressing layer is incrust, and insulating properties, antistatic behaviour and fail safe are good, can reuse continuously and reclaiming, reduce consumables cost, be applicable to the processing and manufacturing of yielding or flexible PCB, be particularly suitable for the processing of SMT thin plate and flexible printed circuit board.
For solving the problems of the technologies described above, the technical solution of the utility model is: the special-purpose carrier of SMT processing procedure, comprise base, the carrier plate is installed on described base, the surrounding of described base is respectively equipped with carrier plate positioning pin column, the surrounding of described carrier plate is respectively equipped with the carrier plate location hole corresponding with described carrier plate positioning pin column, the upper surface high temperature hot pressing of described carrier plate is provided with layer of silica gel, described carrier plate upper surface is provided with some posts of the circuit board locating pin for locating circuit board, and described circuit board locating pin post stretches out described layer of silica gel.
Preferably, described base is any in bakelite base, aluminum alloy base, FR4 base or steel base.
Preferably, described carrier plate is any in aluminium alloy carrier plate, FR5 carrier plate or synthetic stone carrier plate.
Adopted technique scheme, the beneficial effects of the utility model are: the special-purpose carrier of this SMT processing procedure, possess high temperature resistant, not yielding, pollution-free, there is high tackness, plane precision is high, and absorbing is strong, registration, low thermal strain, low heat capacity, low heat conductivity, uniform temperature is good, pressing layer is incrust, insulating properties, antistatic behaviour and fail safe are good, can reuse continuously and reclaiming, reduce consumables cost, be applicable to the processing and manufacturing of yielding or flexible PCB, be particularly suitable for the processing of SMT thin plate and flexible printed circuit board.
The accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment;
Wherein: 1, base; 2, carrier plate; 3, carrier plate positioning pin column; 4, carrier plate location hole; 5, layer of silica gel; 6, circuit board locating pin post.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further illustrated.
As shown in Figure 1, the special-purpose carrier of SMT processing procedure, comprise base 1, carrier plate 2 is installed on base 1, the surrounding of base 1 is respectively equipped with carrier plate positioning pin column 3, and the surrounding of carrier plate 2 is respectively equipped with the carrier plate location hole 4 corresponding with carrier plate positioning pin column 3, and the upper surface high temperature hot pressing of carrier plate 2 is provided with layer of silica gel 5, carrier plate 2 upper surfaces are provided with some posts of the circuit board locating pin for locating circuit board 6, and circuit board locating pin post 6 stretches out layer of silica gel 5.
In the present embodiment, described base is any in bakelite base, aluminum alloy base, FR4 base or steel base.Described carrier plate is any in aluminium alloy carrier plate, FR5 carrier plate or synthetic stone carrier plate.
The special-purpose carrier of this SMT processing procedure, possess high temperature resistant, not yielding, pollution-free, there is high tackness, plane precision is high, absorbing is strong, registration, low thermal strain, low heat capacity, low heat conductivity, uniform temperature is good, pressing layer is incrust, and insulating properties, antistatic behaviour and fail safe are good, can reuse continuously and reclaiming, reduce consumables cost, be applicable to the processing and manufacturing of yielding or flexible PCB, be particularly suitable for the processing of SMT thin plate and flexible printed circuit board.
The utility model is not limited to above-mentioned concrete execution mode, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion of having done, within all dropping on protection range of the present utility model.
Claims (3)
1.SMT the special-purpose carrier of processing procedure, it is characterized in that, comprise base, the carrier plate is installed on described base, the surrounding of described base is respectively equipped with carrier plate positioning pin column, and the surrounding of described carrier plate is respectively equipped with the carrier plate location hole corresponding with described carrier plate positioning pin column, and the upper surface high temperature hot pressing of described carrier plate is provided with layer of silica gel, described carrier plate upper surface is provided with some posts of the circuit board locating pin for locating circuit board, and described circuit board locating pin post stretches out described layer of silica gel.
2. the special-purpose carrier of SMT processing procedure as claimed in claim 1, is characterized in that, described base is any in bakelite base, aluminum alloy base, FR4 base or steel base.
3. the special-purpose carrier of SMT processing procedure as claimed in claim 1, is characterized in that, described carrier plate is any in aluminium alloy carrier plate, FR5 carrier plate or synthetic stone carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320447873 CN203352967U (en) | 2013-07-26 | 2013-07-26 | Carrier dedicated for SMT process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320447873 CN203352967U (en) | 2013-07-26 | 2013-07-26 | Carrier dedicated for SMT process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203352967U true CN203352967U (en) | 2013-12-18 |
Family
ID=49752808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320447873 Expired - Fee Related CN203352967U (en) | 2013-07-26 | 2013-07-26 | Carrier dedicated for SMT process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203352967U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103974557A (en) * | 2014-05-27 | 2014-08-06 | 苏州市易德龙电器有限公司 | Method and jig for attaching bare chip to IC (Integrated Circuit) substrate |
| CN106044055A (en) * | 2016-07-12 | 2016-10-26 | 安徽协创物联网技术有限公司 | Transport carrier for netbook |
-
2013
- 2013-07-26 CN CN 201320447873 patent/CN203352967U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103974557A (en) * | 2014-05-27 | 2014-08-06 | 苏州市易德龙电器有限公司 | Method and jig for attaching bare chip to IC (Integrated Circuit) substrate |
| CN103974557B (en) * | 2014-05-27 | 2017-10-03 | 苏州易德龙科技股份有限公司 | The method and tool of bare crystalline piece attachment are carried out to IC support plates |
| CN106044055A (en) * | 2016-07-12 | 2016-10-26 | 安徽协创物联网技术有限公司 | Transport carrier for netbook |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131218 Termination date: 20160726 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |