CN202474030U - Light-emitting diode (LED) supporting frame with heat dissipation plate and metal base plate integrated - Google Patents
Light-emitting diode (LED) supporting frame with heat dissipation plate and metal base plate integrated Download PDFInfo
- Publication number
- CN202474030U CN202474030U CN2012201011052U CN201220101105U CN202474030U CN 202474030 U CN202474030 U CN 202474030U CN 2012201011052 U CN2012201011052 U CN 2012201011052U CN 201220101105 U CN201220101105 U CN 201220101105U CN 202474030 U CN202474030 U CN 202474030U
- Authority
- CN
- China
- Prior art keywords
- heating panel
- heat dissipation
- metal substrate
- metal base
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
Provided is a light-emitting diode (LED) supporting frame with a heat dissipation plate and a metal base plate integrated. Several LED single supporting frames (2) are arranged on an oblong sheet metal base plate (1), wherein each LED single supporting frame (2) comprises an electrode supporting foot (11), the heat dissipation plate (12) and an insulation body (21). The LED supporting frame with the heat dissipation plate and the metal base plate integrated is characterized in that the heat dissipation plate (12) is integrated with the sheet metal base plate (1). The heat dissipation plate (12) is oblong, or square, or diamond, or round, and protrudes from one side of the sheet metal base plate (1). The LED supporting frame with the heat dissipation plate and the metal base plate integrated has the advantages that production process is simple, grouping mold complexity for injection molding of an insulation body can be simplified, electroplating cost can be reduced, electroplating process can be simplified, and production cost can be lowered.
Description
[technical field]
The utility model relates to the parts that are applicable to photoemissive semiconductor device that have a jump in potential potential barrier or surface potential barrier at least, refers to the incorporate led support of a kind of heating panel and metal substrate especially.Or the radiator punch forming is integrated, and to add injection mo(u)lding integrated. contact conductor angle and radiator are one.
[background technology]
Led support is on the sheet metal substrate of rectangle or diamond pattern, to arrange several LED support units, and the LED support unit comprises electrode leg, heating panel and is coated on the insulator on this support unit.Support unit in the led support of prior art; It is integrated that its electrode leg and sheet metal substrate are that plastic cement is connected, but heating panel and sheet metal substrate are split (not direct-connected), in manufacture process; Sheet metal substrate and heating panel will be distinguished punch forming; Cause production process complicated, the complexity of group mould makes production cost higher when also having increased the injection moulding insulator.
[summary of the invention]
To the shortcoming of prior art, the purpose of the utility model is to provide a kind of production process simple, group mould heating panel and the incorporate led support of metal substrate complexity, that can reduce the electrodeposit cost, simplify electrodeposit technology and can reduce production costs in the time of can simplifying the injection moulding insulator.
The utility model solves the technical scheme that its technical problem adopted: provide a kind of heating panel and metal substrate incorporate led support; Be furnished with several LED support units on the rectangular sheet metal substrate; The LED support unit comprises electrode leg, heating panel and insulator, it is characterized in that: said heating panel and sheet metal substrate are to fuse.
Said heating panel can be rectangle, square, rhombus, circle or other shapes, can be protruding, recessed or clear in a side of sheet metal substrate, and it is used to be used for packaging LED chips.On heating panel, can there be through hole to be used for location or other purposes.
Said heating panel can fuse through pin easy to break and sheet metal substrate, so that when separating the LED support unit, can easily said pin easy to break be fractureed, makes the electrode leg separate insulation with heating panel.Said pin easy to break can be some tiny feets.
Said heating panel can be a monomer one by one, can also be the strip that several monomers fuse.
As the expansion of the utility model, heating panel can be after the independent moulding of strip that fuses of several monomers with the integrated combination of metal substrate of moulding in addition.
Said sheet metal substrate can be copper sheet metal substrate, ferrous metal sheet substrate, aluminum metal sheet substrate or other sheet metal substrates.
The beneficial effect of the utility model is: with respect to prior art, production process is simple, in the time of can simplifying the injection moulding insulator group mould complexity, simplify electrodeposit technology simultaneously and improve electrodeposit efficient and reduce the electrodeposit cost, and can reduce the production cost.
[description of drawings]
Below in conjunction with accompanying drawing the utility model is done further to describe.
Fig. 1 is the structural representation that has the utility model of 2 moulding LED support units.
Fig. 2 is the left view of Fig. 1.
Fig. 3 is embodiment one structural representation of the utility model.
Fig. 4 is the left view of Fig. 3.
Fig. 5 is embodiment two structural representations of the utility model.
Fig. 6 is the left view of Fig. 5.
Fig. 7 is embodiment three structural representations of the utility model.
The embodiment four overall structure sketch mapes of Fig. 8 the utility model.
The cooling plate structure sketch map of the embodiment four of Fig. 9 the utility model.
Figure 10 is the vertical view of Fig. 9.
Among the figure: 1 is that sheet metal substrate, 2 is insulator for heating panel, 121 for the through hole on the heating panel, 21 for electrode leg 1,12 for LED support unit, 11.
[embodiment]
Referring to accompanying drawing 1, Fig. 2; A kind of heating panel of the utility model and the incorporate led support of metal substrate; Be furnished with several LED support units 2 on the rectangular sheet metal substrate 1; LED support unit 2 comprises electrode leg 11, heating panel 12 and insulator 21, it is characterized in that: said heating panel 12 fuses with sheet metal substrate 11.
In the embodiment of this practical full mold, heating panel 12 has rectangle, square, rhombus, circle, protrudes from a side of sheet metal 1 substrate.
In the embodiment one of this practical full mold, like Fig. 1, shown in Figure 3, heating panel 12 is rectangular.
In the embodiment two of this practical full mold, as shown in Figure 5, heating panel 12 has rectangular through holes 121.
In the embodiment three of this practical full mold, as shown in Figure 7, heating panel 12 has manhole 121.
Said heating panel 12 fuses through pin easy to break and sheet metal substrate 1, can when separating LED support unit 2, can easily said pin easy to break be fractureed, and makes the electrode leg separate insulation with heating panel.Said pin easy to break is 4 tiny feets.
In above embodiment, said heating panel 12 is monomers one by one,
In the embodiment four of this practical full mold, like Fig. 8, shown in 9, said heating panel 12 is strips that several monomers fuse.
In the embodiment four of the utility model, heating panel 12 be after the independent moulding of strip that fuses of several monomers with the metal substrate 1 integrated combination of moulding in addition.
In each embodiment of this practical full mold, said sheet metal substrate 1 has copper sheet metal substrate, ferrous metal sheet substrate and aluminum metal sheet substrate or other sheet metal substrates.At iron, aluminum metal sheet substrate electroplate.
Claims (5)
1. heating panel and the incorporate led support of metal substrate; Be furnished with several LED support units (2) on the rectangular sheet metal substrate (1); LED support unit (2) comprises electrode leg (11), heating panel (12) and insulator (21), it is characterized in that: said heating panel (12) fuses with sheet metal substrate (11).
2. heating panel according to claim 1 and the incorporate led support of metal substrate is characterized in that: heating panel (12) is rectangle, square, rhombus or circle, protrudes from a side of sheet metal (1) substrate.
3. heating panel according to claim 1 and the incorporate led support of metal substrate is characterized in that: through hole (121) is arranged on the heating panel (12).
4. heating panel according to claim 1 and the incorporate led support of metal substrate is characterized in that: heating panel (12) is the strip that one by one monomer or several monomers fuse.
5. heating panel according to claim 1 and the incorporate led support of metal substrate is characterized in that: heating panel (12) be after the independent moulding of strip that fuses of several monomers with the integrated combination of metal substrate (1) of moulding in addition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201011052U CN202474030U (en) | 2012-03-16 | 2012-03-16 | Light-emitting diode (LED) supporting frame with heat dissipation plate and metal base plate integrated |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201011052U CN202474030U (en) | 2012-03-16 | 2012-03-16 | Light-emitting diode (LED) supporting frame with heat dissipation plate and metal base plate integrated |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202474030U true CN202474030U (en) | 2012-10-03 |
Family
ID=46922172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201011052U Expired - Fee Related CN202474030U (en) | 2012-03-16 | 2012-03-16 | Light-emitting diode (LED) supporting frame with heat dissipation plate and metal base plate integrated |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202474030U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114256404A (en) * | 2021-12-08 | 2022-03-29 | 中山市木林森电子有限公司 | Reticular metal film, preparation process thereof and preparation method of microminiature component |
-
2012
- 2012-03-16 CN CN2012201011052U patent/CN202474030U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114256404A (en) * | 2021-12-08 | 2022-03-29 | 中山市木林森电子有限公司 | Reticular metal film, preparation process thereof and preparation method of microminiature component |
| CN114256404B (en) * | 2021-12-08 | 2023-11-17 | 中山市木林森电子有限公司 | Reticular metal film and preparation process thereof, and preparation method of microminiature component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20130316 |